KR101540047B1 - Apparatus and method for attaching substrates - Google Patents

Abstract

In order to provide a substrate adhering apparatus and a substrate adhering method capable of performing a plurality of adhesion processes on a substrate on which an OLED is formed and a protective film placed on the substrate to protect the OLED, A plurality of first process substrates having a first protective film seated on a first substrate, a chamber in which a plurality of first heat transfer units disposed between the plurality of first process substrates are stacked and carried, A first heating plate on which a plurality of first heat transfer parts are respectively disposed, the first heat transfer plate being disposed between the plurality of first process substrates, and a second heating plate disposed on the first heating plate, The plate and the first heating plate are transferred to the pressing plate so that the first substrates and the first protective films are thermally adhered to each other And a conveying portion. Accordingly, a plurality of adhesion processes can be performed on the substrate on which the OLED is supported and the protective film on the substrate to protect the OLED, thereby improving the productivity of the display device.

Description

[0001] APPARATUS AND METHOD FOR ATTACHING SUBSTRATES [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate adhering apparatus and a substrate adhering method, and more particularly, to a substrate adhering apparatus and a substrate adhering method for adhering a substrate on which an OLED is formed and a protective substrate for protecting the OLED.

A so-called touch panel display device in which a simple input device is mounted is used for a mobile device such as a smart phone or a smart pad. Such a touch panel display device can be classified into an in-cell type and an on-cell type.

Here, the in-cell type is manufactured by bonding a cell having a touch function to the cell itself between the substrates. In the on-cell type, a cell is coupled between the upper and lower substrates, . ≪ / RTI >

Cells of the in-cell type or on-cell type touch panel display device are made of OLED (Organic Light Emitting Diodes) which are thin, light in weight, simple in structure and manufacturing process, .

Particularly, interest in a flexible display device having higher utility than that of a conventional display device is increasing, and active development of a flexible display device using an OLED is progressing. A manufacturing method of such a flexible display device has already been disclosed in Korean Patent Laid-Open Publication No. 2011-0065777 (flexible organic light emitting diode display device and manufacturing method thereof, June 16, 2011).

In order to realize a flexible organic light emitting diode display device including a flexible substrate and an organic light emitting diode, the OLED may be protected after the resin material is cured after applying the resin material on the OLED.

Thus, in the prior art including the aforementioned patents, the resin material is cured on the OLED or the protective substrate is cemented to protect the OLED. However, there is a problem that the productivity of the touch panel display device is lowered due to the hardening of the resin material or the delay of the process time due to the adhesion of the protective substrate.

Korean Patent Laid-Open Publication No. 2011-0065777 (Flexible organic light emitting diode display device and manufacturing method thereof, June 16, 2011)

It is an object of the present invention to provide a substrate adhering apparatus and a substrate adhering method capable of performing a plurality of adhering processes for a substrate on which an OLED is formed and a protective film adhered to the substrate for protecting the OLED.

A substrate coalescing apparatus according to the present invention includes a plurality of first process substrates having a first substrate on which an OLED is formed and a first protective film seated on the first substrate, A plurality of first process substrates and a plurality of first heat transfer units disposed between the plurality of first process substrates, the first heat transfer plates being disposed inside the chamber, And a transfer plate disposed inside the chamber so as to face the first heating plate and transferring the first heating plate to the pressure plate so that the first substrates and the first protective films are thermally adhered to each other .

As the first heating plate is transported toward the presser plate, the presser plate may heat the plurality of first process substrates and the plurality of first heat transfer parts.

Wherein the substrate cementing apparatus comprises a plurality of second processing substrates disposed between the first heating plate and the pressing plate and having a second substrate on which the OLED is supported and a second protective film seated on the second substrate, And a second heating plate on which a plurality of second heat transfer parts disposed between the two process substrates are stacked and seated.

As the first heating plate is transported toward the pressure plate, the second heating plate is transported toward the pressure plate together with the first heating plate, and the second substrates and the second protective films are transported toward the pressure plate, So as to be thermally pressed between the second heating plates.

 Wherein the substrate cohesion apparatus is disposed in a frame region inside the chamber and includes a guide shaft for guiding the conveyance of the first and second heating plates and a guide shaft disposed between the first conveyance plate and the second conveyance plate, And a stopper for preventing the plate from being transported toward the first heating plate.

The substrate adhering apparatus may further include a gas supply unit connected to the chamber and supplying an inert gas into the chamber.

Wherein the plurality of first process substrates and the first heat transfer unit are sequentially stacked in advance, and the substrates are transferred into the chamber through the transfer robot, .

(A) a plurality of first process substrates having a first substrate on which an OLED is formed and one protective film seated on the first substrate, and a plurality of second process substrates disposed between the plurality of first process substrates (B) a plurality of the first process substrates and a plurality of the first heat transfer units respectively disposed between the plurality of first process substrates are carried into the chamber, And (c) being transported toward the subscription plate facing the first heating plate, wherein the first substrate and the first protective film are thermally pressed.

In the step (c), the pressing plate may heat the plurality of first process substrates and the plurality of first heat transfer parts as the first heating plate is transferred toward the pressing plate.

The method according to any one of claims 1 to 3, further comprising a second heating plate disposed between the first heating plate and the pressing plate, wherein the step (b) includes a second substrate on which the OLED is supported, A plurality of second process substrates having a protective film and a plurality of second heat transfer units disposed between the plurality of second process substrates and stacked on the second heating plate.

Wherein the step (c) is performed such that as the first heating plate is transported toward the pressure plate, the second heating plate is transported toward the pressure plate together with the first heating plate, and the second substrates and the second The protective films can be thermally pressed.

And supplying an inert gas into the chamber.

The substrate adhering apparatus and the substrate adhering method according to the present invention can improve the productivity of a display device because a plurality of adhering processes can be performed on the substrate on which the OLED is supported and the protective film seated on the substrate to protect the OLED .

The technical effects of the present invention are not limited to the effects mentioned above, and other technical effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a perspective view showing a laminated structure of a process substrate and a heat transfer part according to the present embodiment,
FIG. 2 is a cross-sectional view of the substrate sticking apparatus according to the present embodiment,
3 is a block diagram showing a method of attaching a substrate according to the present embodiment,
Figs. 4 to 7 are sectional views showing the operation of the substrate adhering apparatus according to the present embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the disclosed embodiments, but may be implemented in various forms, and the present embodiments are not intended to be exhaustive or to limit the scope of the invention to those skilled in the art. It is provided to let you know completely. The shape and the like of the elements in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the drawings.

1 is a perspective view showing a laminated structure of a process substrate and a heat transfer part according to the present embodiment.

1, the process substrate S3 and the heat transfer unit 10 will be described before describing the substrate adhering apparatus (hereinafter, referred to as a adhering apparatus) according to the present embodiment.

First, the process substrate SS may be composed of the substrate S1 and the protective film S2. Here, the substrate S1 may be a flexible substrate, or an OLED (Organic Light Emitting Diode) including an in-cell type touch cell may be deposited on one side . The protective film S2 is for protecting the OLED of the substrate S1 and may be in a state of being mounted on one surface of the substrate S1 on which the OLED is formed.

In addition, the substrate S1 and the protective film S2 of the present embodiment may be respectively supported on a transfer substrate (not shown) for transfer convenience. For example, the substrate S1 may be seated on the upper surface of the transfer substrate, and the protective film S2 may be seated on the upper surface of the substrate S1 while being supported by the lower surface of the transfer substrate . Such a transfer substrate may be separated from the substrate S1 and the protective film S2 after the laminating process for the substrate S1 and the protective film S2 is completed.

The substrate S1 and the protective film S2 may be coated with a resin between the substrate S1 and the protective film S2.

However, the laminating apparatus of the present embodiment is for advancing a plurality of laminating processes for the substrate S1 and the protective film S2, and a plurality of process substrates S3 may be provided and stacked in advance.

The heat transfer unit 10 may be disposed between the plurality of process substrates S3. The heat transfer unit 10 may be provided in the form of a plate and may have the same area as the process substrate S3 or may have a larger area than the process substrate S3. The heat transfer unit 10 may be provided as a heat conductive member to transfer heat to the substrate S1 and the protective film S2 in a process of attaching the substrate S1 and the protective film S2.

Accordingly, the heat transfer portion 10 of the present embodiment may be formed of a plate made of stainless steel, but this is only one example for explaining the present embodiment. The heat transfer portion 10 may be made of various materials As shown in FIG.

The plurality of process substrates S3 and the heat transfer units 10 may be stacked in advance and set in advance and then transferred to the chamber 100 (see FIG. 2) by the transfer robot 200 (see FIG. 2) And the adhesion process for the substrate S1 and the protective film S2 may proceed. Hereinafter, a lacquering apparatus 100 for performing a laminating process on a substrate S1 and a protective film S2 will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view showing a substrate adhering apparatus according to the present embodiment.

As shown in FIG. 2, the lacquering apparatus according to the present embodiment may include the chamber 100 and the transfer robot 200.

First, the chamber 100 forms a process space in which a laminating process is performed on the first process substrate S3a and the second process substrate S3b. At this time, the body of the chamber 100 may be provided with an insulating material to prevent heat generated in the processing space from being discharged to the outside of the chamber 100.

A first heating plate 110, a pressing plate 130, a second heating plate 150, and a conveyance guide unit 170 may be disposed inside the chamber 100.

First, a plurality of first process substrates S3a pre-set and a first heat transfer unit 10a disposed between the plurality of first process substrates S3a are seated on the first heating plate 110 . The first heating plate 110 includes a heating unit (not shown) for providing heat to the first substrate S1a, the first protective film S2a, and the first heat transfer portion 10a in the laminating process. can do. Here, the heating unit may be disposed inside the first heating plate 110 in various forms such as a heating cable and a heating coil, or may be provided in the same shape in the pressing plate 130 and the second heating plate 150 .

The first heating plate 110 may be transported inside the chamber 100 by the transfer unit 120. Here, the transfer unit 120 is disposed outside the chamber 100. The transfer unit 120 may be connected to the first heating plate 110 so that the first heating plate 110 may be moved up and down inside the chamber 100.

The pressure plate 130 may be disposed to face the first heating plate 110 inside the chamber 100. At this time, the pressing plate 130 may be supported at the upper inside of the chamber 100, and the pressing plate 130 may be provided with a heating unit as described above.

The second heating plate 150 is disposed between the first heating plate 110 and the pressing plate 130. The second heating plate 150 may be provided with a plurality of second process substrates S3b and a second heat transfer unit 10b disposed between the plurality of second process substrates S3b . Here, the second heating plate 150 may be provided with a heating unit for providing heat to the second substrate S1b, the second protective film S2b, and the second heat transfer unit 10b, as described above have.

When the first heating plate 110 rises toward the pressing plate 130, the second heating plate 150 contacts the first processing substrate S2a placed on the first heating plate 110, 1 < / RTI > Accordingly, the second substrate S1b and the second protective film S3b, which are seated on the second heating plate 150, can be thermally pressed.

That is, when the first heating plate 110 is raised by the transfer unit 120, the first process substrate S3a and the second process substrate S3a, which are seated on the first heating plate 110 by the elevation of the first heating plate 110, The lower surface of the heating plate 130 is contacted. The second heating plate 150 is supported by the first heating plate 110 and is raised toward the pressing plate 130 by the continuous elevation of the first heating plate 110. [

The first process substrate S3a and the first heat transfer unit 10a mounted on the first heating plate 110 are thermally pressed between the first and second heating plates 110 and 150, The second process substrate S 3 b and the second heat transfer unit 10 b mounted on the second heating plate 150 may be thermally pressed between the second heating plate 150 and the pressing plate 130.

The heat transfer parts 10a and 10b heat the heat emitted from the first heating plate 110, the pressing plate 130 and the second heating plate 150 to a plurality of first process substrates S3a and a plurality of Process substrate S3b so that the first substrate S1a and the first protective film S2a and the second substrate S1b and the second protective film S2b are thermally adhered to each other.

However, in this embodiment, a second heating plate 150 is disposed between the first heating plate 110 and the pressing plate 130 to perform a laminating process on the first and second process substrates S3a and S3b It is also possible to perform only the adhesion process for the first process substrate S3a with the first heating plate 110 and the pressure plate 130 without the second heating plate 150. [

Meanwhile, the conveyance guide unit 170 may include a guide shaft 171 and a stopper 175.

First, the guide shaft 171 may be disposed in the inner edge region of the chamber 100. More specifically, a plurality of guide shafts 171 may be provided on the inner edge of the chamber 100, respectively. At this time, the edges of the first and second heating plates 150 may be connected to and supported by the plurality of guide shafts 171, respectively.

The first heating plate 130 and the second heating plate 150 are disposed so as to penetrate the guide shaft 171 and are guided along the guide shaft 171 to be guided or guided by the first and second heating plates 130 may be connected to the guide shaft 171 in various manners such as a method in which the rollers disposed at the edges of the guide shafts 130, 150 are rotated along the rails formed on the guide shafts 171 and guided by the guide shafts 171.

And a stopper 173 may be provided between the first heating plate 110 and the second heating plate 130. Here, the stopper 173 may protrude from the inner wall of the chamber 100. The stopper 173 maintains a distance between the first heating plate 110 and the second heating plate 150.

That is, the stopper 173 supports the second heating plate 150 disposed between the first heating plate 110 and the pressing plate 130, so that the second heating plate 150 is supported by the first heating plate 150, And can be prevented from descending toward the main body 110. The stopper 173 may protrude from the inner wall of the chamber 100 as shown in FIG. 2, and may be provided as a separate stopper device if necessary.

Meanwhile, the gas supply unit 190 may be connected to the chamber 100. The gas supply unit 190 supplies an inert gas into the chamber 100. Here, nitrogen gas may be used as the inert gas. When inert gas is discharged from the first and second heating plates 110 and 150 and the pressing plate 130, the temperature of the interior of the chamber 100 is uniformly maintained, The first protective film S2a, and the second substrate S1b and the second protective film S2b can be quickly and accurately bonded together.

On the other hand, the transfer robot 200 is disposed on one side of the chamber 100. Here, a plurality of pre-set process substrates S3 and the heat transfer unit 10 can be transferred to the transfer robot 200 as described above. The transfer robot 200 provides the plurality of process substrates S3 and the heat transfer unit 10 which are set through the gate G to the first heating plate 110 and the second heating plate 150 The process substrate S3 and the heat transfer unit 10 may be seated on the first and second heating plates 110 and 150, respectively.

At this time, the transfer robot 200 can transfer the process substrate S3 and the heat transfer unit 10 in the x-, y-, and z-axis directions, and the configuration of the transfer robot 200 can be understood by a known technique Therefore, the detailed description will be omitted.

Hereinafter, a method of attaching a substrate according to the present embodiment will be described in detail with reference to the accompanying drawings.

FIG. 3 is a block diagram showing a method of attaching a substrate according to the present embodiment, and FIGS. 4 to 7 are sectional views showing the operation of the substrate sticking apparatus according to the present embodiment.

As shown in FIGS. 3 to 7, in the substrate bonding method according to the present embodiment, a plurality of process substrates S3 and heat transfer parts 10 may be provided and set. For example, the process substrate S3 may be stacked in twelve, and the heat transfer portions 10 may be arranged between the twelve process substrates S3, respectively, so as to be prepared in advance as one set. but. Here, the number of process substrates S3 is one example for describing the present embodiment, and the number of process substrates S3 may be changed.

The set process substrate S3 and the heat transfer unit 10 are provided to the transfer robot 200. 4, the transfer robot 200 seats the process substrate S3 and the heat transfer unit 10 on the first and second heating plates 110 and 150 through the gate G, And then exits from the chamber 100 (S100). Then, the gate (G) is closed.

Thereafter, inert gas is introduced into the chamber 100, and the first heating plate 110 is lifted and raised toward the second heating plate 150 as shown in FIG. At this time, the plurality of first process substrates S3a and the first heat transfer unit 10a placed on the first heating plate 110 are moved to the first process substrate S3a along with the elevation of the first heating plate 110 The upper surface of the second heating plate 150 is brought into contact with the lower surface of the second heating plate 150. 6, the second heating plate 150 is supported by the first heating plate 110 and is raised toward the pressing plate 130 as the first heating plate 110 is continuously lifted and lowered .

The plurality of first process substrates S3a and the first heat transfer unit 10a mounted on the first heating plate 110 are heated and pressed between the first and second heating plates 110 and 150, So that the first substrate S1a and the first protective film S2a are bonded together. The plurality of second process substrates S3b and the second heat transfer unit 10b mounted on the second heating plate 150 are thermally pressed between the third heating plate 150 and the pressing plate 130, 2 substrate (S1b) and the second protective film (S2b). At this time, the temperatures of the first and second heating plates 110 and 150 and the pressing plate 130 are maintained at about 110 to 130 ° C, and the laminating process can be performed on the process substrate S3 (S200) .

The heat transfer units 10 disposed between the plurality of substrates S1 uniformly supply the heat emitted from the first and second heating plates 110 and 150 and the pressure plate 130 to the process substrate S3. The first substrate S1a and the first protective film S2a and the second substrate S1b and the second protective film S2b may be thermally cemented together.

Thereafter, when the laminating process for the process substrate S3 is completed, the first heating plate 110 is lowered. At this time, the second heating plate 150 is lowered along with the lowering of the first heating plate 110. 7, the lowering of the second heating plate 150 is stopped first by the stopper 173, the first heating plate 110 is separated from the second heating plate 150, .

As described above, the substrate adhering apparatus and the substrate adhering method can improve the productivity of the display device by performing a plurality of adhesion processes for the substrate on which the OLED is supported and the protective film that is seated on the substrate for protecting the OLED.

An embodiment of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

S1: Substrate S2: Protective film
10: heat transfer part 100: chamber
110: first heating plate 130: pressure plate
150: second heating plate 170: conveying guide part

Claims (12)

A plurality of first process substrates having a first substrate on which an OLED is formed and a first protective film seated on the first substrate, and a plurality of first heat transfer units disposed between the plurality of first process substrates, ;
A first heating plate disposed in the chamber and having a plurality of first process substrates and a plurality of first heat transfer units disposed between the plurality of first process substrates, respectively;
A pressing plate disposed inside the chamber so as to face the first heating plate;
A transfer unit for transferring the first heating plate to the pressing plate to heat-bond the first substrates and the first protective films; And
And a gas supply unit connected to the chamber and supplying an inert gas into the chamber to maintain a uniform temperature inside the chamber.
The method according to claim 1,
As the first heating plate is transported toward the pressing plate,
Wherein the pressing plate heats the plurality of first process substrates and the plurality of first heat transfer units.
The method according to claim 1,
A plurality of second processing substrates disposed between the first heating plate and the pressing plate and having a second substrate on which the OLED is supported and a second protective film seated on the second substrate, Further comprising a second heating plate on which a plurality of second heat transfer parts to be disposed are stacked and seated.
The method of claim 3,
As the first heating plate is transported toward the pressing plate,
Wherein the second heating plate is conveyed together with the first heating plate toward the pressing plate such that the second substrates and the second protective films are thermally pressed between the pressing plate and the second heating plate. Lid device.
5. The method of claim 4,
A guide shaft disposed in a rim region inside the chamber and guiding the conveyance of the first and second heating plates,
Further comprising a stopper disposed between the first transfer plate and the second transfer plate to prevent the second heating plate from being transferred toward the first heating plate.
delete The method according to claim 1,
Further comprising a transfer robot disposed on one side of the chamber,
Wherein the plurality of first process substrates and the first heat transfer unit are sequentially stacked in advance and carried into the chamber through the transfer robot.
(a) a plurality of first process substrates having a first substrate on which an OLED is formed and a first protective film seated on the first substrate, and a plurality of first heat transfer parts disposed between the plurality of first process substrates, step;
(b) a plurality of the first process substrates and a plurality of the first heat transfer units, which are respectively disposed between the plurality of first process substrates, are carried into the chambers and are seated on the first heating plates; And
(c) the first heating plate is transported toward a pressing plate facing the first substrate, and the first substrate and the first protective film are thermally pressed,
Wherein the step (c) is performed while an inert gas is supplied into the chamber and the temperature inside the chamber is uniformly maintained.
9. The method of claim 8,
The step (c)
As the first heating plate is transported toward the pressing plate,
Wherein the pressing plate heats the plurality of first process substrates and the plurality of first heat transfer parts.
9. The method of claim 8,
Further comprising a second heating plate disposed between the first heating plate and the pressure plate,
The step (b)
A plurality of second process substrates having a second substrate on which the OLED is supported and a second protective film seated on the second substrate, and a plurality of second heat transfer parts disposed between the plurality of second process substrates, Lt; RTI ID = 0.0 > 2 < / RTI > heating plate.
10. The method of claim 9,
The step (c)
As the first heating plate is transported toward the pressing plate,
Wherein the second heating plate is conveyed together with the first heating plate toward the pressing plate so that the second substrates and the second protective films are thermally pressed.





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