JP2005053076A - Manufacturing method of multilayered substrate and hot press - Google Patents

Manufacturing method of multilayered substrate and hot press Download PDF

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JP2005053076A
JP2005053076A JP2003286145A JP2003286145A JP2005053076A JP 2005053076 A JP2005053076 A JP 2005053076A JP 2003286145 A JP2003286145 A JP 2003286145A JP 2003286145 A JP2003286145 A JP 2003286145A JP 2005053076 A JP2005053076 A JP 2005053076A
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hot press
laminate
plate
auxiliary plate
multilayer substrate
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JP4311120B2 (en
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Toshiichi Harada
敏一 原田
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Denso Corp
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Denso Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayered substrate capable of shortening a heating time, and a hot press. <P>SOLUTION: A laminate 50, which is obtained by laminating an insulating layer and a conductor layer, is arranged between a pair of the hot press plates 20a and 20b of the hot press 10 and heated and pressed from both upper and under surfaces thereof by the hot press plates 20a and 20b to manufacture the multilayered substrate. At this time, the laminate 50 is heated and pressed in a state that an auxiliary plate 30, which is excellent in heat conductivity and has length not obstructing the pressure to the laminate 50 by the hot press plates 20a and 20b, is arranged to the side surface of the laminate 50 and first cushioning materials 40, which are excellent in heat conductivity and can be deformed upon the reception of the pressure from the hot press plates 20a and 20b, are arranged between the end surfaces of the auxiliary plate 30 and the hot press plates 20a and 20b. By this constitution, the heat of the hot press plates 20a and 20b is transmitted to the laminate 50 from the side surface thereof through the first cushioning materials 40 and the auxiliary plate 30 to shorten a heating time. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、絶縁層と導体層とを積層してなる積層体を、熱プレス機により加熱・加圧してなる多層基板の製造方法及び当該方法を用いて多層基板を製造する熱プレス機に関するものである。   The present invention relates to a method for producing a multilayer substrate obtained by heating and pressurizing a laminate formed by laminating an insulating layer and a conductor layer with a hot press, and a heat press for producing a multilayer substrate using the method. It is.

従来、絶縁層と導体層とを積層して積層体を形成し、当該積層体を熱プレス機により加熱・加圧してなる多層基板が知られている。このような多層基板の製造方法として、コア基板の上下両表面に1層ずつ片面銅箔付きフィルムを積層接着して多層基板を形成する方法、導体パターンを有する樹脂フィルムを一度に積層して一括で多層基板を形成する方法等がある。いずれの場合にも、一般的に熱プレス機を用いて積層体の上下両面から加熱・加圧を行い、樹脂同士を接着及び金属同士を接合させて多層基板を形成する。   2. Description of the Related Art Conventionally, there has been known a multilayer substrate in which an insulating layer and a conductor layer are laminated to form a laminated body, and the laminated body is heated and pressurized with a hot press. As a method for producing such a multilayer substrate, a method of forming a multilayer substrate by laminating and bonding a single-sided copper foil film on each of the upper and lower surfaces of the core substrate, and laminating resin films having conductor patterns at once And a method of forming a multilayer substrate. In either case, generally, a multilayer press substrate is formed by heating and pressurizing from the upper and lower surfaces of the laminate using a hot press machine, bonding the resins and bonding the metals together.

その際、熱プレス機の熱プレス板間に1つの積層体のみを配置して加熱・加圧を行っても良いが、一対の熱プレス板間に、緩衝材や離型フィルム等を介して複数の積層体を上下方向に重ねて配置することで、一度の加熱・加圧により複数の多層基板を製造し、トータルでの製造時間短縮を図ることができる。   At that time, only one laminate may be placed between the hot press plates of the hot press machine to perform heating and pressurization, but between the pair of hot press plates, a cushioning material, a release film, etc. By arranging a plurality of laminated bodies in the vertical direction, a plurality of multilayer substrates can be manufactured by one heating and pressurization, and the total manufacturing time can be reduced.

しかしながら、積層体の上下両面から熱プレス板により加熱・加圧するので、熱プレス板から遠い位置にある積層体ほど熱伝導に時間を要する。すなわち、1つの積層体を加熱する場合よりも加熱時間が長くなる。   However, since heat and pressure are applied from the upper and lower surfaces of the laminate by the hot press plate, the laminate at a position farther from the hot press plate requires more time for heat conduction. That is, the heating time is longer than when one laminate is heated.

本発明は上記問題点に鑑み、加熱時間を短縮できる多層基板の製造方法及び熱プレス機を提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a multilayer substrate manufacturing method and a hot press machine capable of shortening the heating time.

上記目的を達成する為に請求項1に記載の多層基板の製造方法は、絶縁層と導体層とを積層して積層体を形成する積層工程と、積層体を熱プレス板間に配置し、当該熱プレス板により積層体を上下両面から加熱・加圧する加熱・加圧工程とを備えている。そして、加熱・加圧工程において、積層体の側面側に、熱プレス板による積層体への加圧を妨げない長さを有しつつ熱伝導性に優れる補助板と、熱伝導性に優れるとともに熱プレス板からの圧力を受けて変形可能な第1の緩衝材とが配置された状態で加熱・加圧がなされ、熱プレス板の熱が補助板及び第1の緩衝材を介して側面側から積層体に伝達されることを特徴とする。   In order to achieve the above object, the method for producing a multilayer substrate according to claim 1 includes a laminating step in which an insulating layer and a conductor layer are laminated to form a laminate, and the laminate is disposed between hot press plates. A heating / pressurizing step of heating / pressurizing the laminate from above and below by the hot press plate. And in the heating and pressurizing step, on the side surface side of the laminate, an auxiliary plate having excellent thermal conductivity while having a length that does not interfere with pressurization to the laminate by the hot press plate, and excellent in thermal conductivity Heat and pressure are applied in a state where the first shock-absorbing material that can be deformed by receiving pressure from the heat-pressing plate is disposed, and the heat of the heat-pressing plate is transferred to the side surface via the auxiliary plate and the first shock-absorbing material. Is transmitted to the laminate.

このように、本発明の多層基板の製造方法によると、積層体の側面側に、熱伝導性に優れる補助板と第1の緩衝材が配置された状態で、熱プレス板を用いて積層体の加熱・加圧がなされるので、熱プレス板からの熱が、補助板及び第1の緩衝材を介して積層体の側面に効率良く伝達される。従って、従来のように、積層体の上下両面のみから熱プレス板の熱が伝達される場合よりも、積層体への熱伝導時間を短縮できるので、加熱時間を短縮することができる。すなわち多層基板の製造時間を短縮することができる。   Thus, according to the method for producing a multilayer substrate of the present invention, a laminated body using a hot press plate in a state in which the auxiliary plate having excellent thermal conductivity and the first buffer material are arranged on the side surface side of the laminated body. Therefore, the heat from the hot press plate is efficiently transmitted to the side surface of the laminate through the auxiliary plate and the first buffer material. Therefore, the heat conduction time to the laminated body can be shortened compared to the conventional case where the heat of the hot press plate is transmitted only from the upper and lower surfaces of the laminated body, so that the heating time can be shortened. That is, the manufacturing time of the multilayer substrate can be shortened.

また、真空中で多層基板の製造がなされない場合には、積層体の側面側に配置された補助板により、積層体からの放熱が抑制されるので、それによっても加熱時間が短縮される。   In addition, when the multilayer substrate is not manufactured in a vacuum, the auxiliary plate disposed on the side surface of the stacked body suppresses heat radiation from the stacked body, thereby reducing the heating time.

請求項2に記載のように、加熱・加圧工程において、熱プレス板間に複数の積層体が配置されても良い。熱プレス板間に配置される積層体は1つでも良い。しかしながら、複数の積層体を配置することにより、一括で複数の多層基板を形成し、多層基板の製造時間を短縮することができる。その際、熱プレス板から離れた位置にある積層体であっても、第1の緩衝材及び補助板を介して、側面側から積層体に熱プレスの熱が伝達されるので、積層体に側面から熱の伝達がない場合よりも加熱時間が短縮され、多層基板の製造時間をより短縮することができる。   As described in claim 2, in the heating / pressurizing step, a plurality of laminated bodies may be arranged between the hot press plates. One laminate may be disposed between the hot press plates. However, by arranging a plurality of stacked bodies, a plurality of multilayer substrates can be formed at once, and the manufacturing time of the multilayer substrates can be shortened. At that time, even if the laminate is located away from the hot press plate, the heat of the heat press is transmitted from the side surface to the laminate via the first cushioning material and the auxiliary plate. The heating time is shortened compared with the case where heat is not transferred from the side surface, and the manufacturing time of the multilayer substrate can be further shortened.

補助板は、熱プレス板からの熱を積層体側面に伝達するため、熱伝導性に優れる材料から構成されれば良い。そのような材料として例えば請求項3に記載のように金属をあげることができる。   The auxiliary plate may be made of a material having excellent thermal conductivity in order to transfer heat from the hot press plate to the side surface of the laminate. An example of such a material is a metal as described in claim 3.

また、補助板は、熱プレス板による積層体への加圧を妨げない長さをもって積層体の側面側に配置されるものであれば、その形状は特に限定されるものではないが、請求項4に記載のように積層体の側面に沿って環状に設けられていることが好ましい。その場合、補助板と積層体との接触面積が増加するので、熱プレス板からの伝熱経路が増加し、より加熱時間を短縮することができる。   In addition, the shape of the auxiliary plate is not particularly limited as long as the auxiliary plate is arranged on the side surface side of the laminated body with a length that does not interfere with the pressurization to the laminated body by the hot press plate. 4 is preferably provided in an annular shape along the side surface of the laminate. In this case, since the contact area between the auxiliary plate and the laminate increases, the heat transfer path from the hot press plate increases and the heating time can be further shortened.

また、補助板は、請求項5に記載のように加熱手段を有し、加熱・加圧工程において、自ら積層体を加熱しても良い。補助板が加熱手段を有すれば、熱プレス板の熱を積層体に伝達するだけでなく、自らが発熱して積層体を加熱することができる。この場合、側面側から積層体に伝達される熱量が増加するので、さらに加熱時間を短縮することができる。   Further, the auxiliary plate may have heating means as described in claim 5 and may heat the laminate itself in the heating / pressurizing step. If the auxiliary plate has a heating means, not only can the heat of the hot press plate be transferred to the laminate, but it can also generate heat and heat the laminate. In this case, since the amount of heat transferred from the side surface to the laminate increases, the heating time can be further shortened.

第1の緩衝材の配置位置は、補助板が積層方向に複数に分割されてなる場合には、請求項6に記載のように補助板間に配置されても良い。また、補助板の分割有無に関わらず、請求項7に記載のように、補助板の端面と熱プレス板との間に配置されても良い。いずれの場合でも、熱プレス板からの圧力を受けて第1の緩衝材が変形し、補助板間或いは補助板の端面と熱プレス板との間の隙間を埋める(第1の緩衝材が広い接触面積をもって補助板、熱プレス板と接する)ので、伝熱経路が増加し、熱プレス板からの熱を積層体の側面に効率よく伝達することができる。   When the auxiliary plate is divided into a plurality of positions in the stacking direction, the first buffer material may be arranged between the auxiliary plates as described in claim 6. Moreover, irrespective of the presence or absence of the division | segmentation of an auxiliary | assistant board, as described in Claim 7, you may arrange | position between the end surface of an auxiliary | assistant board, and a hot press board. In any case, the first buffer material is deformed by receiving pressure from the hot press plate, and fills a gap between the auxiliary plates or between the end surface of the auxiliary plate and the hot press plate (the first buffer material is wide). Since the contact area is in contact with the auxiliary plate and the hot press plate), the heat transfer path is increased, and the heat from the hot press plate can be efficiently transferred to the side surface of the laminate.

第1の緩衝材は、熱伝導性に優れるとともに熱プレス板からの圧力を受けて変形可能な材料から構成されれば良い。そのような材料としては、例えば請求項8に記載のように金属繊維をあげることができる。   The first buffer material may be made of a material that is excellent in thermal conductivity and can be deformed by receiving pressure from a hot press plate. Examples of such a material include metal fibers as described in claim 8.

また、第1の緩衝材は補助板と独立して別個に配置されても良いが、請求項9に記載のように、一体に設けられても良い。熱伝導性に優れ、熱プレス板による積層体への加圧を妨げないように熱プレス板からの圧力を受けて変形可能な材料から構成されるものであれば第一の緩衝材と補助板とを一体に設けることができる。この場合、部品点数を削減することができる。   In addition, the first cushioning material may be disposed separately from the auxiliary plate, but may be provided integrally as described in claim 9. The first cushioning material and auxiliary plate if they are made of a material that has excellent thermal conductivity and can be deformed by receiving pressure from the hot press plate so as not to interfere with pressurization to the laminate by the hot press plate Can be provided integrally. In this case, the number of parts can be reduced.

請求項10に記載のように、加熱・加圧工程において、補助板と積層体との間に、熱伝導性に優れるとともに、積層体側面の凹凸に合わせて変形可能な第2の緩衝材が配置された状態で加熱・加圧がなされることが好ましい。   As described in claim 10, in the heating / pressurizing step, a second cushioning material that is excellent in thermal conductivity and can be deformed in accordance with the unevenness of the side surface of the laminate is provided between the auxiliary plate and the laminate. It is preferable that heating and pressurization are performed in the arranged state.

積層時の位置ずれや寸法誤差等により積層体の側面には凹凸が生じる。従って、補助板と積層体の側面との間にも、熱伝導性に優れるとともに、積層体側面の凹凸に合わせて変形可能な第2の緩衝材を配置することにより、補助板から積層体側面への伝熱経路が増すので、加熱時間を短縮することができる。その際、第2の緩衝材の材料としては、例えば請求項11に記載のように、金属繊維をあげることができる。   Concavities and convexities are formed on the side surfaces of the laminate due to misalignment or dimensional errors during lamination. Therefore, by arranging the second cushioning material that is excellent in thermal conductivity and can be deformed according to the unevenness of the side surface of the laminated body between the auxiliary plate and the side surface of the laminated body, Since the heat transfer path to is increased, the heating time can be shortened. In that case, as a material of the second buffer material, for example, as described in claim 11, a metal fiber can be used.

また、第2の緩衝材は第1の緩衝材と独立して別個に配置されても良いが、請求項12に記載のように、一体に設けられても良い。第2の緩衝材は、補助板と積層体との間に配置されるとともに、補助板の端面と熱プレス板との間にも回り込んで配置される。この場合、部品点数を削減できる。   Further, the second cushioning material may be disposed separately from the first cushioning material, but may be provided integrally as described in claim 12. The second cushioning material is disposed between the auxiliary plate and the laminated body, and is also disposed so as to wrap around between the end surface of the auxiliary plate and the hot press plate. In this case, the number of parts can be reduced.

尚、絶縁層と導体層は、熱プレス板の加熱・加圧により多層基板が形成される組み合わせであれば、その構成材料や形成方法は特に限定されるものではない。例えば、絶縁層は熱硬化性樹脂や、ガラス布に樹脂を含浸し、加熱・乾燥してBステージとした樹脂シートであっても良いし、導体層はメッキや導電性ペーストにより形成されるものであっても良い。従って、請求項13に記載のように、絶縁層は樹脂フィルムであり、導体層は樹脂フィルム表面に設けられた導体パターンであっても良い。   In addition, if the insulating layer and the conductor layer are a combination in which a multilayer substrate is formed by heating and pressing a hot press plate, the constituent materials and the forming method are not particularly limited. For example, the insulating layer may be a thermosetting resin or a resin sheet in which a glass cloth is impregnated with resin, heated and dried to form a B stage, and the conductor layer is formed by plating or conductive paste. It may be. Therefore, as described in claim 13, the insulating layer may be a resin film, and the conductor layer may be a conductor pattern provided on the surface of the resin film.

その際、請求項14に記載のように、加熱・加圧工程において、少なくとも一方の積層体表面と熱プレス板との間に、積層体表面の凹凸に合わせて変形しつつ熱プレス板から積層体に加圧力を伝達する第3の緩衝材が配置された状態で、加熱・加圧がなされると良い。   At that time, as described in claim 14, in the heating and pressurizing step, the laminate is formed from the hot press plate while being deformed according to the unevenness of the laminate surface between at least one laminate surface and the hot press plate. Heating and pressurization may be performed in a state in which the third cushioning material that transmits the pressing force to the body is disposed.

積層体を構成する樹脂フィルム表面に凹凸があっても、第3の緩衝材がその凹凸に応じて変形するため、樹脂フィルム各部における圧力差を縮小でき、導体層である導体パターンの位置ずれを防止することができる。   Even if the surface of the resin film constituting the laminate is uneven, the third buffer material is deformed according to the unevenness, so the pressure difference in each part of the resin film can be reduced, and the displacement of the conductor pattern as the conductor layer can be reduced. Can be prevented.

尚、第3の緩衝材は第1の緩衝材と独立して別個に配置されても良いが、請求項15に記載のように、一体に設けられても良い。第3の緩衝材は積層体表面と熱プレス板との間に配置されるとともに、補助板の端面と熱プレス板との間にも配置される。この場合、部品点数を削減できる。さらには、第1,2,3の緩衝材が一体に設けられても良い。   The third cushioning material may be arranged separately from the first cushioning material, but may be provided integrally as described in claim 15. The third cushioning material is disposed between the laminate surface and the hot press plate, and is also disposed between the end surface of the auxiliary plate and the hot press plate. In this case, the number of parts can be reduced. Further, the first, second, and third cushioning materials may be provided integrally.

尚、請求項13〜15に記載の樹脂フィルム(積層体を構成する)としては熱可塑性樹脂をあげることができる。   In addition, a thermoplastic resin can be mention | raise | lifted as a resin film (structured laminated body) of Claims 13-15.

次に、本発明の熱プレス機について以下に説明する。請求項17に記載の熱プレス機は、複数の熱プレス板を備え、当該熱プレス板間に絶縁層と導体層とを積層してなる積層体を配置し、積層体の上下両面から熱プレス板により加熱・加圧して多層基板を製造する熱プレス機である。そして、熱プレス板間であって、積層体の側面側に、熱プレス板による積層体への加圧を妨げない長さを有しつつ熱伝導性に優れる材料からなる補助板と、熱伝導性に優れつつ熱プレス板からの圧力を受けて変形可能な第1の緩衝材とを備えることを特徴とする。   Next, the hot press of the present invention will be described below. The hot press machine according to claim 17 is provided with a plurality of hot press plates, a laminate formed by laminating an insulating layer and a conductor layer is disposed between the hot press plates, and hot press is performed from above and below the laminate. This is a hot press machine for producing a multilayer substrate by heating and pressing with a plate. An auxiliary plate made of a material excellent in thermal conductivity while having a length that does not prevent pressurization of the laminated body by the hot pressed plate on the side surface side of the laminated body between the hot pressed plates, and heat conduction And a first cushioning material that is deformable by receiving pressure from a hot press plate while being excellent in performance.

この作用効果は、請求項1に記載の作用効果と同様であるので、その記載を省略する。   Since this effect is the same as the effect described in claim 1, the description thereof is omitted.

補助板は、熱プレス板からの熱を積層体側面に伝達するため、熱伝導性に優れる材料から構成されれば良いが、そのような材料として例えば請求項18に記載のように金属をあげることができる。   The auxiliary plate may be made of a material having excellent thermal conductivity in order to transfer heat from the hot press plate to the side surface of the laminate, and as such a material, for example, a metal is used as described in claim 18. be able to.

また、補助板は、熱プレス板による積層体への加圧を妨げない長さをもって積層体の側面に配置されるものであれば、その形状は特に限定されるものではないが、請求項19に記載のように積層体の側面に沿って環状に設けられていることが好ましい。この場合、補助板と積層体との接触面積が増加するので、熱プレス板からの熱の伝達経路が増加し、より加熱時間を短縮することができる。   Further, the shape of the auxiliary plate is not particularly limited as long as the auxiliary plate is arranged on the side surface of the laminated body with a length that does not hinder the pressurization to the laminated body by the hot press plate, but the shape is not particularly limited. It is preferable that it is provided annularly along the side surface of the laminate as described in. In this case, since the contact area between the auxiliary plate and the laminate increases, the heat transfer path from the hot press plate increases and the heating time can be further shortened.

また、補助板は、請求項20に記載のように、加熱手段を有しても良い。補助板自体が加熱手段を有すれば、熱プレス板の熱を積層体に伝達するだけでなく、自らが発熱して積層体を加熱することができる。この場合、側面から積層体に伝達される熱量が増加するので、さらに加熱時間を短縮することができる。   The auxiliary plate may have a heating means as described in claim 20. If the auxiliary plate itself has a heating means, not only can the heat of the hot press plate be transmitted to the laminated body, but it can also generate heat and heat the laminated body. In this case, since the amount of heat transferred from the side surface to the laminate increases, the heating time can be further shortened.

第1の緩衝材の配置位置は、補助板が積層方向に分割されてなる場合には、請求項21に記載のように補助板間に配置されても良い。また、補助板の分割有無に関わらず、請求項22に記載のように、補助板の端面と熱プレス板との間に配置されても良い。いずれの場合でも、熱プレス板からの圧力を受けて第1の緩衝材が変形し、補助板間或いは補助板の端面と熱プレス板との間の隙間を埋める(第1の緩衝材が広い接触面積をもって接する)ので、伝熱経路が増加し、熱プレス板からの熱を積層体の側面に効率よく伝達することができる。   When the auxiliary plate is divided in the stacking direction, the first buffer material may be arranged between the auxiliary plates as described in claim 21. Moreover, irrespective of the presence or absence of the division | segmentation of an auxiliary plate, as described in Claim 22, you may arrange | position between the end surface of an auxiliary plate and a hot press board. In any case, the first buffer material is deformed by receiving pressure from the hot press plate, and fills a gap between the auxiliary plates or between the end surface of the auxiliary plate and the hot press plate (the first buffer material is wide). Therefore, the heat transfer path is increased, and the heat from the hot press plate can be efficiently transferred to the side surface of the laminate.

また、第1の緩衝材は、熱伝導性に優れるとともに熱プレス板からの圧力を受けて変形可能な材料から構成されれば良い。そのような材料としては、例えば請求項23に記載のように金属繊維をあげることができる。   The first buffer material may be made of a material that has excellent thermal conductivity and can be deformed by receiving pressure from the hot press plate. Examples of such a material include metal fibers as described in claim 23.

また、第1の緩衝材は補助板と独立して別個に設けられても良いが、請求項24に記載のように、一体に設けられても良い。熱伝導性に優れ、熱プレス板による積層体への加圧を妨げないように熱プレス板からの圧力を受けて変形可能な材料から構成されるものであれば第一の緩衝材と補助板とを一体に設けることができる。   The first buffer material may be provided separately from the auxiliary plate, but may be provided integrally as described in claim 24. The first cushioning material and auxiliary plate if they are made of a material that has excellent thermal conductivity and can be deformed by receiving pressure from the hot press plate so as not to interfere with pressurization to the laminate by the hot press plate Can be provided integrally.

請求項25に記載のように、補助板と積層体との間に、熱伝導性に優れるとともに、積層体側面の凹凸に合わせて変形可能な第2の緩衝材を備えることが好ましい。   As described in claim 25, it is preferable to provide a second cushioning material between the auxiliary plate and the laminate, which has excellent thermal conductivity and can be deformed in accordance with the irregularities on the side of the laminate.

積層時の位置ずれや寸法誤差等により積層体の側面には凹凸が生じる。従って、補助板と積層体の側面との間にも、熱伝導性に優れるとともに、積層体側面の凹凸に合わせて変形可能な第2の緩衝材を備えると、補助板から積層体側面への伝熱経路が増すので、加熱時間を短縮することができる。   Concavities and convexities are formed on the side surfaces of the laminate due to misalignment or dimensional errors during lamination. Therefore, between the auxiliary plate and the side surface of the laminate, the second buffer material that is excellent in thermal conductivity and can be deformed according to the irregularities on the side surface of the laminate is provided from the auxiliary plate to the side surface of the laminate. Since the heat transfer path increases, the heating time can be shortened.

そのような第2の緩衝材の材料としては、例えば請求項26に記載のように、金属繊維をあげることができる。   As a material of such a second cushioning material, for example, a metal fiber can be used as described in claim 26.

また、第2の緩衝材と第1の緩衝材は別個に設けられても良いが、請求項27に記載のように、一体に設けられても良い。この場合、第2の緩衝材は、補助板と積層体との間に配置されるとともに、補助板の端面と熱プレス板との間にも回り込んで配置される。
Moreover, although the 2nd shock absorbing material and the 1st shock absorbing material may be provided separately, as described in Claim 27, you may provide integrally. In this case, the second cushioning material is disposed between the auxiliary plate and the laminated body, and is also disposed so as to wrap around between the end surface of the auxiliary plate and the hot press plate.

以下、本発明の実施の形態を図に基づいて説明する。
(第1の実施形態)
図1は、本実施形態における加熱・加圧時の熱プレス機の概略構成を示す断面図である。従って、図1においては、熱プレス機の熱プレス板間に積層体が配置されている。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a cross-sectional view showing a schematic configuration of a hot press machine during heating and pressurization in the present embodiment. Therefore, in FIG. 1, the laminated body is arrange | positioned between the hot press plates of a hot press machine.

図1に示すように、熱プレス機10は、一対の熱プレス板20a,20bと、積層体の側面側に配設される補助板30と、積層体の側面側に配設されつつ当該補助板30の端面と熱プレス板20a,20bとの間に配設される第1の緩衝材40とにより構成される。   As shown in FIG. 1, the hot press 10 includes a pair of hot press plates 20a and 20b, an auxiliary plate 30 disposed on the side of the laminate, and the auxiliary while being disposed on the side of the laminate. It is comprised by the 1st shock absorbing material 40 arrange | positioned between the end surface of the board 30, and hot press board 20a, 20b.

熱プレス板20a,20bは、積層体50を上下両側から挟むように配置され、積層体50を上下両面から加熱・加圧する。尚、本実施形態においては、一対の熱プレス板20a,20b間に、5つの積層体が積層方向に重なって位置決め配置される。この熱プレス板20a,20bは、例えば、チタン等の導電性金属から構成されており、電流を通電することにより発熱する。それ以外にも、熱プレス板20a,20b内にヒータを埋設して、そのヒータにより加熱したり、熱プレス板20a,20b内に流体の流通経路を設け、その流通経路内に加熱された流体を流すことにより熱プレス板20a,20bを加熱しても良い。   The hot press plates 20a and 20b are arranged so as to sandwich the laminated body 50 from both upper and lower sides, and heat and pressurize the laminated body 50 from both upper and lower sides. In the present embodiment, five laminated bodies are positioned and arranged so as to overlap each other in the laminating direction between the pair of hot press plates 20a and 20b. The hot press plates 20a and 20b are made of a conductive metal such as titanium, for example, and generate heat when a current is applied. In addition, a heater is embedded in the hot press plates 20a and 20b and heated by the heater, or a fluid flow path is provided in the hot press plates 20a and 20b, and the fluid heated in the flow path The hot press plates 20a and 20b may be heated by flowing.

補助板30は、熱伝導性に優れる材料により構成され、例えばAlやCu等の金属からなる。また、補助板30は、熱プレス板20a,20bによる積層体50への加圧の妨げにならない長さをもって形成されており、積層体50の側面に接するように配置される。その際、補助板30の形状は特に限定されるものではないが、本実施形態においては、積層体50の側面に接するように、積層体50の側面にそって環状に設けられている。このように、積層体50の側面に沿って環状に設けられると、補助板30と積層体50の側面との接触面積が増加するので、熱プレス板20a,20bからの伝熱経路が増加し、加熱時間を短縮することができる。   The auxiliary plate 30 is made of a material having excellent thermal conductivity, and is made of a metal such as Al or Cu, for example. In addition, the auxiliary plate 30 is formed with a length that does not hinder pressurization of the stacked body 50 by the hot press plates 20 a and 20 b, and is disposed so as to contact the side surface of the stacked body 50. At this time, the shape of the auxiliary plate 30 is not particularly limited, but in the present embodiment, the auxiliary plate 30 is annularly provided along the side surface of the stacked body 50 so as to be in contact with the side surface of the stacked body 50. As described above, since the contact area between the auxiliary plate 30 and the side surface of the laminated body 50 is increased when the annular body is provided along the side surface of the laminated body 50, the heat transfer path from the hot press plates 20a and 20b is increased. The heating time can be shortened.

第1の緩衝材40は、熱伝導性に優れつつ、熱プレス板20a,20bからの圧力を受けて変形可能な材料を用いて形成されている。そのような材料としては、例えば、金属を繊維状に加工し、その繊維状金属を不織布として板状に形成したものや、織布としてニット、クロスとしたもの(例えばナスロン(登録商標)のフエルト)を用いることができる。また、第1の緩衝材40は、積層体50が加熱・加圧された際に、熱プレス板20a,20bによる積層体50への加圧の妨げにならず、且つ、熱プレス板20a,20bの熱を補助板30の効率良く伝達可能な厚さ(積層方向)を有しており、積層体50の側面側に配置されつつ熱プレス板20a,20bと補助板30の端面との間に配置される。   The first buffer material 40 is formed using a material that is excellent in thermal conductivity and can be deformed by receiving pressure from the hot press plates 20a and 20b. Examples of such a material include a metal processed into a fiber shape, and the fibrous metal formed into a plate shape as a nonwoven fabric, or a knitted fabric or a cloth as a woven fabric (for example, Nathlon (registered trademark) felt). ) Can be used. Further, the first buffer material 40 does not hinder the pressurization to the laminated body 50 by the hot press plates 20a and 20b when the laminated body 50 is heated and pressurized, and the first pressurizing material 20a, The thickness of the auxiliary plate 30 is such that the heat of the auxiliary plate 30 can be efficiently transferred (in the stacking direction), and the heat plate 20a, 20b and the end surface of the auxiliary plate 30 are disposed on the side surface side of the stacked body 50. Placed in.

次に、多層基板の製造方法について、図1を用いて説明する。   Next, the manufacturing method of a multilayer substrate is demonstrated using FIG.

まず、図示されないが、積層体50を形成する積層工程が実施される。積層体50は、絶縁層と導体層とを積層して形成され、熱プレス板20a,20bからの加熱・加圧により多層基板となるもの(所謂ビルドアップ多層基板)であれば、その材料構成や形成方法は特に限定されるものではない。例えば、絶縁層は熱硬化性樹脂であっても良いし、熱可塑性樹脂であっても良い。さらには、ガラス布に樹脂を含浸し、加熱・乾燥してBステージとした樹脂シートであっても良い。また、導体層は、樹脂に貼着された導体箔をエッチング加工によりパターン化したものであっても良いし、メッキや導電性ペーストにより形成される導体パターンであっても良い。また、コア基板の上下両表面に1層ずつ片面銅箔付きフィルムを積層接着して多層基板を形成しても良いし、導体パターンを有する樹脂フィルムを一度に積層して一括で多層基板を形成しても良い。   First, although not shown, a stacking process for forming the stacked body 50 is performed. If the laminated body 50 is formed by laminating an insulating layer and a conductor layer and becomes a multilayer substrate by heating and pressurization from the hot press plates 20a and 20b (so-called build-up multilayer substrate), its material configuration The forming method is not particularly limited. For example, the insulating layer may be a thermosetting resin or a thermoplastic resin. Further, a resin sheet in which a glass cloth is impregnated with a resin, heated and dried to form a B stage may be used. Further, the conductor layer may be a conductor foil bonded to a resin patterned by etching, or may be a conductor pattern formed by plating or conductive paste. In addition, a multilayer substrate can be formed by laminating and bonding single-sided copper foil films on each of the upper and lower surfaces of the core substrate, or a multilayer substrate can be formed by laminating resin films having conductor patterns at once. You may do it.

本実施形態においては、熱可塑性樹脂からなる樹脂フィルムを絶縁層とし、当該樹脂フィルムの片面に貼着された導体箔をエッチングによりパターン化してなる導体パターンを導体層として、当該片面導体パターンフィルムを含む複数の樹脂フィルムを積層することにより積層体50を形成する。そして、一括で多層基板を形成する。尚、熱可塑性樹脂は、特に限定されるものではないが、本実施形態においては、厚さ25〜100μmの液晶ポリマー(LCP)を用いるものとする。また、導体パターンに用いられる導体箔としては、例えばAu、Ag、Cu、Alの少なくとも1種を含む低抵抗金属箔を用いることができ、本実施形態においては安価でマイグレーションの心配のないCu箔を用いるものとする。   In this embodiment, a resin film made of a thermoplastic resin is used as an insulating layer, and a conductive pattern formed by etching a conductive foil attached to one side of the resin film is used as a conductive layer. The laminated body 50 is formed by laminating a plurality of resin films. And a multilayer substrate is formed in a lump. The thermoplastic resin is not particularly limited, but in the present embodiment, a liquid crystal polymer (LCP) having a thickness of 25 to 100 μm is used. In addition, as the conductive foil used for the conductive pattern, for example, a low resistance metal foil containing at least one of Au, Ag, Cu, and Al can be used. In this embodiment, the Cu foil is inexpensive and has no fear of migration. Shall be used.

積層体50の形成後、熱プレス機10の熱プレス板20a,20b間に積層体50を位置決め配置する。熱プレス板20a,20b間に配置される積層体50の数は特に限定されるものではなく、1つだけ配置されても良い。本実施形態においては、図1に示すように、第3の緩衝材60と積層体50を交互に積層し、一対の熱プレス板20a,20b間に5つの積層体50を配置する。このように、複数の積層体50を配置し、一括で複数の多層基板を形成すると、多層基板の製造時間を短縮することができる。尚、図1において、下側の熱プレス板20bと第1の緩衝材40及び第3の緩衝材60の間には、金属からなる積層体50搬送用のパレット70が配設されている。   After the laminated body 50 is formed, the laminated body 50 is positioned between the hot press plates 20a and 20b of the hot press 10. The number of the laminated bodies 50 arrange | positioned between the hot press boards 20a and 20b is not specifically limited, Only one may be arrange | positioned. In this embodiment, as shown in FIG. 1, the 3rd buffer material 60 and the laminated body 50 are laminated | stacked alternately, and the five laminated bodies 50 are arrange | positioned between a pair of hot press board 20a, 20b. In this way, when a plurality of stacked bodies 50 are arranged and a plurality of multilayer substrates are formed at once, the manufacturing time of the multilayer substrates can be shortened. In FIG. 1, a pallet 70 for transporting the laminated body 50 made of metal is disposed between the lower heat press plate 20 b and the first buffer material 40 and the third buffer material 60.

ここで、第3の緩衝材60は、加熱・加圧時に、積層体50表面の凹凸に合わせて変形しつつ、熱プレス板20a,20bの圧力を積層体50に伝達する材料をもって形成されている。例えば、ステンレス等の金属を繊維状に加工し、その繊維状金属を不織布として板状に形成したものや、織布としてニット、クロスとしたもの(例えばナスロン(登録商標))を用いることができる。それ以外にも、後述する加熱・加圧条件以上の耐性を有し、熱プレス板20a,20bの加圧面と積層体50との形状差を緩衝できる形状に弾性変形可能な柔軟性を有するものであれば、他の材質及び構成のものを使用できる。例えば、ポリテトラフルオロエチレンフィルム、ケブラー(登録商標)及びポリテトラフルオロエチレン樹脂を特殊加工したハイパーシート(登録商標)ガスケット等の樹脂をフィルム或いは繊維化したもの、ガラス繊維などを用いることができる。尚、本実施形態においては、金属を繊維状に加工し、その繊維状金属を不織布として板状(フエルト)に形成したものを用いるものとする。   Here, the third buffer material 60 is formed of a material that transmits the pressure of the hot press plates 20a and 20b to the laminate 50 while being deformed in accordance with the unevenness of the surface of the laminate 50 during heating and pressurization. Yes. For example, a metal such as stainless steel processed into a fiber shape and the fiber metal formed into a plate shape as a non-woven fabric, or a woven fabric made into a knit or cloth (for example, NASRON (registered trademark)) can be used. . Other than that, it has a resistance equal to or higher than the heating / pressurizing condition described later, and has a flexibility capable of elastically deforming into a shape that can buffer the shape difference between the pressing surface of the hot press plates 20a, 20b and the laminate 50. Other materials and configurations can be used. For example, a polytetrafluoroethylene film, a Kevlar (registered trademark) and a hypersheet (registered trademark) gasket obtained by specially processing a polytetrafluoroethylene resin, a film or fiberized resin, glass fiber, or the like can be used. In the present embodiment, a metal is processed into a fiber shape, and the fiber metal is formed into a plate shape (felt) as a nonwoven fabric.

これにより、熱可塑性樹脂のように加熱・加圧時に流動する樹脂を構成要素とする積層体50を熱プレス板20a,20bにより加熱・加圧しても、積層体50表面の凹凸に応じて第3の緩衝材60が変形するため、積層体50の各所にほぼ均等に圧力が印加され、その結果、導体層の位置ずれを防止することができる。   As a result, even if the laminated body 50 having a resin that flows during heating and pressurizing as a thermoplastic resin, such as a thermoplastic resin, is heated and pressurized by the hot press plates 20a and 20b, Since the three cushioning members 60 are deformed, pressure is applied almost uniformly to the various portions of the laminated body 50, and as a result, displacement of the conductor layer can be prevented.

次いで、熱プレス板20a,20bを用いて積層体50の上下両面から加熱・加圧する加熱・加圧工程が実施される。   Next, a heating / pressurizing step of heating / pressing the laminated body 50 from the upper and lower surfaces using the hot press plates 20a, 20b is performed.

まず、熱プレス板20a,20bが加熱・加圧動作に入る前に、積層体50の側面に接するように補助板30が配設され、それとともに積層体50の側面側(図1では積層体50に重なる第3の緩衝材60の側面に接するように)であって当該補助板30の熱プレス板20a,20bの圧力印加面と対向する端面上(熱プレス板20b側はパレット70との間)に、第1の緩衝材40が配設される。   First, before the hot press plates 20a and 20b enter the heating / pressurizing operation, the auxiliary plate 30 is disposed so as to be in contact with the side surface of the laminated body 50, and the side surface side of the laminated body 50 (in FIG. 1, the laminated body). 50 on the end surface of the auxiliary plate 30 facing the pressure application surface of the hot press plate 20a, 20b (the hot press plate 20b side is on the pallet 70). In the middle), the first buffer material 40 is disposed.

そして、補助板30及び第1の緩衝材40が配設された状態で、熱プレス板20a,20bにより積層体50の上下方向から加熱・加圧がなされる。このとき、積層体50の上下両面には、第3の緩衝材60を介して熱プレス板20a,20bの熱が伝達されるとともに、熱プレス板20a,20bからの圧力が積層体50の各所に均等に印可される。   Then, in a state where the auxiliary plate 30 and the first buffer material 40 are disposed, heating and pressurization are performed from above and below the laminated body 50 by the hot press plates 20a and 20b. At this time, the heat of the hot press plates 20a and 20b is transmitted to the upper and lower surfaces of the laminate 50 via the third buffer material 60, and the pressure from the hot press plates 20a and 20b is applied to various portions of the laminate 50. Applied evenly.

それとともに、本実施形態においては、第1の緩衝材40が熱プレス板20a,20bからの圧力を受けて熱プレス板20a,20bと補助板30の端面との間(下側の熱プレス板20bはパレット70を介して)で変形し、熱プレス板20a,20b及び補助板30と広い接触面積をもって接する(熱プレス板20a,20bと補助板30の端面との間の隙間を埋める)。従って、熱プレス板20a,20bからの熱が、第1の緩衝材40及び補助板30を介して、側面側からも積層体50に効率良く伝達される。   At the same time, in the present embodiment, the first buffer member 40 receives pressure from the hot press plates 20a and 20b and is located between the hot press plates 20a and 20b and the end face of the auxiliary plate 30 (lower hot press plate). 20b is deformed by the pallet 70) and contacts the hot press plates 20a, 20b and the auxiliary plate 30 with a wide contact area (fills the gap between the hot press plates 20a, 20b and the end face of the auxiliary plate 30). Therefore, the heat from the hot press plates 20 a and 20 b is efficiently transmitted to the laminated body 50 also from the side surface via the first buffer material 40 and the auxiliary plate 30.

そして、積層体50を構成する熱可塑性樹脂が軟化して樹脂同士が接着されるとともに、予め樹脂フィルムに形成されていたビアホール内の層間接続材料同士或いは層間接続材料と導体層である導体パターンとが接合され、加熱・加圧後の冷却工程を経て、多層基板が形成される。尚、本実施形態において、熱プレス板20a,20bにより積層体50に印加される加熱・加圧条件は、例えば、温度は、200〜350℃の範囲の値であり、圧力は0.1〜10MPaの範囲の値である。また、多層基板は、熱プレス機により、所定の温度勾配をもって冷却されるように管理される。   And the thermoplastic resin which comprises the laminated body 50 is softened, resin is adhere | attached, and between the interlayer connection materials in the via hole previously formed in the resin film, or the conductor pattern which is an interlayer connection material and a conductor layer, And a multilayer substrate is formed through a cooling process after heating and pressurization. In the present embodiment, the heating / pressurizing conditions applied to the laminate 50 by the hot press plates 20a, 20b are, for example, a temperature in a range of 200 to 350 ° C., and a pressure of 0.1 to It is a value in the range of 10 MPa. In addition, the multilayer substrate is managed so as to be cooled with a predetermined temperature gradient by a hot press.

このように、本実施形態における多層基板の製造方法によると、積層体50の側面側からも積層体50に熱プレス板20a,20bの熱を伝達することができるので、加熱時間を短縮することができる。すなわち多層基板の製造時間を短縮することができる。   Thus, according to the manufacturing method of the multilayer substrate in the present embodiment, the heat of the hot press plates 20a and 20b can be transmitted to the laminated body 50 also from the side surface side of the laminated body 50, so that the heating time is shortened. Can do. That is, the manufacturing time of the multilayer substrate can be shortened.

また、真空引きせずに多層基板を製造する場合には、積層体50の側面に配置された補助板30により、積層体50からの放熱が抑制されるので、それによっても加熱時間が短縮される。   Further, in the case of manufacturing a multilayer substrate without evacuation, the auxiliary plate 30 disposed on the side surface of the multilayer body 50 suppresses heat radiation from the multilayer body 50, which also shortens the heating time. The

また、本実施形態に示すように、複数の積層体50を一括で熱プレスする場合、熱プレス板20a,20bの熱が、熱プレス板20a,20bから遠い位置にある積層体50にも側面側から伝達されるので、複数配置した積層体50間における温度差(温度むら)を低減することができる。すなわち、一括で複数の多層基板を製造するのに適しており、製造される多層基板の品質を安定させることができる。   In addition, as shown in the present embodiment, when the plurality of laminated bodies 50 are hot-pressed in a lump, the heat of the hot-pressed plates 20a and 20b is also on the side of the laminated body 50 located far from the hot-pressed plates 20a and 20b. Since it is transmitted from the side, the temperature difference (temperature unevenness) between the laminated bodies 50 arranged in plurality can be reduced. That is, it is suitable for manufacturing a plurality of multilayer substrates at once, and the quality of the manufactured multilayer substrates can be stabilized.

尚、本実施形態において、補助板30の端面と熱プレス板20a,20bとの間に第1の緩衝材40が配置される例を示した。しかしながら、図2に示すように、補助板30が積層方向に分割してなる場合には、補助板30間に第1の緩衝材40を配置しても良い。尚、図2は、本実施形態の変形例を示す断面図であり、図1に対応している。この場合も、熱プレス板20a,20bからの圧力を受けて、第1の緩衝材40が補助板30間において変形し、補助板30と広い接触面積をもって接する(補助板30間の隙間を埋める)。従って、熱プレス板20a,20bからの熱が、補助板30及び第1の緩衝材40を介して、側面側からも積層体50に効率良く伝達される。尚、補助板30間とともに、補助板30の端面と熱プレス板20a,20bとの間にも、第1の緩衝材40を配置しても良い。   In the present embodiment, an example in which the first buffer material 40 is disposed between the end face of the auxiliary plate 30 and the hot press plates 20a and 20b is shown. However, as shown in FIG. 2, when the auxiliary plate 30 is divided in the stacking direction, the first buffer material 40 may be disposed between the auxiliary plates 30. FIG. 2 is a cross-sectional view showing a modification of the present embodiment and corresponds to FIG. Also in this case, the first cushioning material 40 is deformed between the auxiliary plates 30 under pressure from the hot press plates 20a and 20b, and comes into contact with the auxiliary plates 30 with a wide contact area (fills the gap between the auxiliary plates 30). ). Therefore, the heat from the hot press plates 20a and 20b is efficiently transmitted to the laminate 50 also from the side surface via the auxiliary plate 30 and the first buffer material 40. In addition, you may arrange | position the 1st shock absorbing material 40 between the end surface of the auxiliary | assistant board 30, and the hot press board 20a, 20b with between the auxiliary | assistant boards 30. FIG.

また、本実施形態において、補助板30と第1の緩衝材40とが独立して別個に設けられる例を示した。しかしながら、図3に示すように、第1の緩衝材40が補助板30と一体に設けられても良い。例えば、補助板30を、熱プレス板20a,20bからの圧力を受けた際に変形可能な材料をもって、且つ、第1の緩衝材40の配置位置まで伸延して形成すれば良い。そのような材料としては、例えば、ステンレス等の金属を繊維状に加工し、その繊維状金属を不織布として板状に形成したものや、織布としてニット、クロスとしたもの(例えばナスロン(登録商標))を用いることができる。この場合、部品点数を削減することができるだけでなく、第1の緩衝材40が補助板30の一部となっている分、補助板30の長さ(積層方向)調整が容易となる。尚、図3は、本実施形態の変形例を示す断面図であり、図1に対応している。   Moreover, in this embodiment, the auxiliary plate 30 and the 1st shock absorbing material 40 showed the example provided separately separately. However, as shown in FIG. 3, the first cushioning material 40 may be provided integrally with the auxiliary plate 30. For example, the auxiliary plate 30 may be formed of a material that can be deformed when subjected to pressure from the hot press plates 20a and 20b and extended to the position where the first buffer material 40 is disposed. As such a material, for example, a metal such as stainless steel is processed into a fiber shape, the fiber metal is formed into a plate shape as a nonwoven fabric, or a knitted fabric or a cloth as a woven fabric (for example, Naslon (registered trademark) )) Can be used. In this case, not only can the number of parts be reduced, but the length (stacking direction) of the auxiliary plate 30 can be easily adjusted by the amount of the first cushioning material 40 being a part of the auxiliary plate 30. FIG. 3 is a cross-sectional view showing a modification of the present embodiment, and corresponds to FIG.

また、本実施形態において、第1の緩衝材40と第3の緩衝材60とが独立して設けられる例を示した。しかしながら、図4に示すように、第3の緩衝材60が第1の緩衝材40と一体に設けられても良い。第3の緩衝材60の内、積層体50と熱プレス板20a,20bとの間に配置される第3の緩衝材60のみを、例えば熱伝導性に優れる材料をもって、且つ、第1の緩衝材40の配置位置まで伸延して設ければ良い。そのような材料としては、例えば、ステンレス等の金属を繊維状に加工し、その繊維状金属を不織布として板状に形成したものや、織布としてニット、クロスとしたもの(例えばナスロン(登録商標))を用いることができる。この場合、部品点数を削減することができる。尚、図4は、本実施形態の変形例を示す断面図であり、図1に対応している。   Moreover, in this embodiment, the example in which the 1st shock absorbing material 40 and the 3rd shock absorbing material 60 were provided independently was shown. However, as shown in FIG. 4, the third cushioning material 60 may be provided integrally with the first cushioning material 40. Of the third buffer material 60, only the third buffer material 60 disposed between the laminated body 50 and the hot press plates 20a and 20b is made of, for example, a material having excellent thermal conductivity and the first buffer material. What is necessary is just to extend and provide to the arrangement position of the material 40. FIG. As such a material, for example, a metal such as stainless steel is processed into a fiber shape, the fiber metal is formed into a plate shape as a nonwoven fabric, or a knitted fabric or a cloth as a woven fabric (for example, Naslon (registered trademark) )) Can be used. In this case, the number of parts can be reduced. FIG. 4 is a cross-sectional view showing a modification of the present embodiment, and corresponds to FIG.

(第2の実施形態)
次に、本発明の第2の実施形態を図5に基づいて説明する。図5は、本実施形態における加熱・加圧時の熱プレス機10の概略構成を示す断面図である。尚、図5は、図1に対応している。
(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a schematic configuration of the hot press 10 at the time of heating and pressurization in the present embodiment. FIG. 5 corresponds to FIG.

第2の実施の形態における多層基板の製造方法及び当該方法を用いて多層基板を製造する熱プレス機10は、第1の実施の形態によるものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。   The manufacturing method of the multilayer substrate in the second embodiment and the heat press machine 10 that manufactures the multilayer substrate using the method are often in common with those according to the first embodiment. Detailed explanation is omitted, and different parts are explained mainly.

第2の実施の形態において、第1の実施の形態と異なる点は、熱プレス機10が第2の緩衝材を備える点である。   The second embodiment is different from the first embodiment in that the hot press 10 includes a second cushioning material.

図5に示すように、本実施形態において、熱プレス機10は第2の緩衝材80を備え、補助板30と積層体50との間に当該第2の緩衝材80を配置した状態で、加熱・加圧がなされる。   As shown in FIG. 5, in the present embodiment, the hot press 10 includes a second cushioning material 80, and the second cushioning material 80 is disposed between the auxiliary plate 30 and the laminated body 50. Heating and pressurization are performed.

第2の緩衝材80は、熱伝導性に優れるとともに、積層体50側面の凹凸に合わせて変形可能な材料を用いて形成されている。このような材料としては、例えば第1の緩衝材40と同様、金属を繊維状に裁断し、その繊維状金属を不織布として板状に形成したものや、織布としてニット、クロスとしたもの(例えばナスロン(登録商標))を用いることができる。また、第2の緩衝材80の形状は特に限定されるものではないが、本実施形態においては、補助板30同様、積層体50の側面に沿って環状に設けられており、積層方向における長さは、補助板30と略同等の長さを有している。   The second buffer material 80 is excellent in thermal conductivity and is formed using a material that can be deformed in accordance with the unevenness on the side surface of the stacked body 50. As such a material, for example, like the first buffer material 40, a metal is cut into a fiber shape, and the fiber metal is formed into a plate shape as a nonwoven fabric, or a knitted fabric or a cloth as a woven fabric ( For example, Naslon (registered trademark) can be used. Further, the shape of the second cushioning material 80 is not particularly limited, but in the present embodiment, like the auxiliary plate 30, the second cushioning material 80 is provided in a ring shape along the side surface of the stacked body 50, and is long in the stacking direction. The length is substantially equal to that of the auxiliary plate 30.

そして、加熱・加圧工程において、この第2の緩衝材80を積層体50の側面に配置し、その状態で補助板30を配置する。通常、積層時の位置ずれや寸法誤差等により、積層体50の側面は凹凸状となっている。従って、第1の実施形態で示したように、補助板30を積層体50の側面に配置しても、補助板30と積層体50の側面との間には部分的な隙間が生じる。しかしながら、本実施の形態においては、補助板30を第2の緩衝材80に接するように配置するとともに、第2の緩衝材80が補助板30と積層体50の側面との間で積層体50の表面凹凸に合わせて変形する。従って、補助板30が配置された状態で、第2の緩衝材80は、補助板30及び積層体50側面と広い接触面積をもって接することとなる。このように、熱伝導性に優れるとともに、積層体50の側面凹凸に合わせて変形可能な第2の緩衝材80を、補助板30と積層体50の側面との間に配置することにより、補助板30から積層体50側面への伝熱経路が増すので、加熱時間(製造時間)をより短縮することができる。   In the heating / pressurizing step, the second buffer material 80 is disposed on the side surface of the laminated body 50, and the auxiliary plate 30 is disposed in that state. Usually, the side surface of the laminated body 50 is uneven due to a positional deviation or dimensional error during lamination. Therefore, as shown in the first embodiment, even if the auxiliary plate 30 is disposed on the side surface of the laminated body 50, a partial gap is generated between the auxiliary plate 30 and the side surface of the laminated body 50. However, in the present embodiment, the auxiliary plate 30 is disposed so as to be in contact with the second buffer material 80, and the second buffer material 80 is disposed between the auxiliary plate 30 and the side surface of the stack 50. Deforms to match the surface irregularities of Therefore, in a state where the auxiliary plate 30 is disposed, the second cushioning material 80 comes into contact with the side surfaces of the auxiliary plate 30 and the laminated body 50 with a wide contact area. As described above, the second cushioning material 80 that has excellent thermal conductivity and can be deformed in accordance with the unevenness of the side surface of the laminated body 50 is disposed between the auxiliary plate 30 and the side surface of the laminated body 50, thereby assisting. Since the heat transfer path from the plate 30 to the side surface of the laminate 50 is increased, the heating time (manufacturing time) can be further shortened.

尚、本実施形態において、第1の緩衝材40と第2の緩衝材80とは独立して別個に配置される例を示した。しかしながら、図6に示すように、第2の緩衝材80は第1の緩衝材40と一体に設けられても良い。尚、図6は、本実施形態の変形例を示す断面図であり、図1に対応している。例えば、第2の緩衝材80を、熱プレス板20a,20bからの圧力を受けて変形可能な材料を用い、図6に示すように第1の緩衝材40の配置位置まで伸延して設ければ良い。この場合、第2の緩衝材80は、補助板30と積層体50との間に配置されるとともに、補助板30の端面と熱プレス板20a,20bとの間にも回り込んで配置される。そのような材料としては、例えば、金属を繊維状に加工し、その繊維状金属を不織布として板状に形成したものや、織布としてニット、クロスとしたもの(例えばナスロン(登録商標))を用いることができる。この場合、部品点数を削減することができる。尚、図6に示す第2の緩衝材80は、補助板30の周囲を全て覆うように(補助板30を包みこむように)設けられても良い。例えばテープ状の第2の緩衝材80を補助板30に巻きつけることにより補助板30の全周囲を覆うことができる。   In the present embodiment, an example in which the first cushioning material 40 and the second cushioning material 80 are disposed separately and independently has been shown. However, as shown in FIG. 6, the second cushioning material 80 may be provided integrally with the first cushioning material 40. FIG. 6 is a cross-sectional view showing a modification of the present embodiment, and corresponds to FIG. For example, the second cushioning material 80 is provided by using a material that can be deformed by receiving pressure from the hot press plates 20a and 20b and extending to the position where the first cushioning material 40 is disposed as shown in FIG. It ’s fine. In this case, the second cushioning material 80 is disposed between the auxiliary plate 30 and the laminated body 50 and is also disposed so as to wrap around between the end surface of the auxiliary plate 30 and the hot press plates 20a and 20b. . As such a material, for example, a metal is processed into a fibrous shape, and the fibrous metal is formed into a plate shape as a nonwoven fabric, or a woven fabric is knit or cloth (for example, NASRON (registered trademark)). Can be used. In this case, the number of parts can be reduced. 6 may be provided so as to cover the entire periphery of the auxiliary plate 30 (so as to wrap around the auxiliary plate 30). For example, the entire periphery of the auxiliary plate 30 can be covered by winding the tape-like second cushioning material 80 around the auxiliary plate 30.

(第3の実施形態)
次に、本発明の第3の実施形態を図7に基づいて説明する。図7は、本実施形態における熱プレス機10の概略構成を示す断面図である。尚、図7は、図1に対応している。
(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view illustrating a schematic configuration of the hot press 10 according to the present embodiment. FIG. 7 corresponds to FIG.

第3の実施の形態における多層基板の製造方法及び当該方法を用いて多層基板を製造する熱プレス機10は、第1の実施の形態によるものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。   The manufacturing method of the multilayer substrate in the third embodiment and the heat press machine 10 that manufactures the multilayer substrate using the method are often in common with those according to the first embodiment. Detailed explanation is omitted, and different parts are explained mainly.

第3の実施の形態において、第1の実施の形態と異なる点は、補助板30が加熱手段を有する点である。   The third embodiment is different from the first embodiment in that the auxiliary plate 30 has a heating unit.

本実施形態における熱プレス機10は、図7に示すように、補助板30に加熱手段90を備えている。そして、当該加熱手段90により、自らの熱で側面側から積層体50を加熱する。   As shown in FIG. 7, the hot press 10 according to the present embodiment includes a heating unit 90 on the auxiliary plate 30. And the laminated body 50 is heated by the said heating means 90 from a side surface side with own heat.

加熱手段90としては、熱を生じるものであれば特に限定されるものではない。補助板30自体を通電することにより発熱させても良いし、ヒータ等を設置しても良い。また、補助板30の内部に流体を通し、当該流体を熱することで発熱させても良い。本実施形態においては、加熱手段90として、熱プレス板20a,20bと連動して加熱を行うヒータを有するものとする。   The heating means 90 is not particularly limited as long as it generates heat. Heat may be generated by energizing the auxiliary plate 30 itself, or a heater or the like may be installed. Alternatively, heat may be generated by passing a fluid through the auxiliary plate 30 and heating the fluid. In the present embodiment, the heating means 90 includes a heater that performs heating in conjunction with the hot press plates 20a and 20b.

従って、補助板30は加熱手段90を有するので、熱プレス板20a,20bの熱を積層体50に伝達するだけでなく、自らが発熱して積層体50を加熱することができる。この場合、側面から積層体50に伝達される熱量が増加するので、さらに加熱時間(製造時間)を短縮することができる。   Therefore, since the auxiliary plate 30 has the heating means 90, not only can the heat of the hot press plates 20 a and 20 b be transmitted to the laminated body 50, but the self-generated heat can heat the laminated body 50. In this case, the amount of heat transferred from the side surface to the stacked body 50 increases, so that the heating time (manufacturing time) can be further shortened.

尚、図7において、加熱手段90が補助板30の中央付近に設けられる例を示したが、加熱手段90の形成位置は特に限定されるものではない。しかしながら、熱プレス板20a,20b間に配置される積層体50の数が増すほど、補助板30を有していても熱プレス板20a,20bから遠い位置にある積層体50に熱が伝達される時間が増加するので、図6に示すように、熱プレス板20a,20bから遠い部位に加熱手段90を形成すると加熱時間短縮に対して効果的である。   7 shows an example in which the heating unit 90 is provided in the vicinity of the center of the auxiliary plate 30, the formation position of the heating unit 90 is not particularly limited. However, as the number of laminated bodies 50 arranged between the hot press plates 20a and 20b increases, heat is transmitted to the laminated body 50 located far from the hot press plates 20a and 20b even if the auxiliary plate 30 is provided. As shown in FIG. 6, if the heating means 90 is formed at a location far from the hot press plates 20a and 20b, it is effective for shortening the heating time.

以上本発明の好ましい実施形態について説明したが、本発明は上述の実施形態のみに限定されず、種々変更して実施する事ができる。   The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made.

本実施形態において、熱プレス機10は、一対の熱プレス板20a,20bを備える例を示した。しかしながら、熱プレス機10は複数の熱プレス板を備えれば良いので、一対に限定されるものではない。   In this embodiment, the hot press machine 10 showed the example provided with a pair of hot press board 20a, 20b. However, the hot press machine 10 is not limited to a pair because it only needs to include a plurality of hot press plates.

また、本実施形態において、積層体50間及び積層体50と熱プレス板20a,20b間に全て同一の第3の緩衝材60を配置する例を示した。しかしながら、第3の緩衝材60は、積層体50と熱プレス板20a,20b間のみに配置されても良い。また、その場合、積層体50間には第3の緩衝材60とは異なる緩衝効果を有する材料を配置しても良い。また、積層体50間及び積層体50と熱プレス板20a,20b間に必ずしも第3の緩衝材60を配置する必要はなく、第3の緩衝材60の配置有無にかかわらず、ポリイミド等からなる離型シートや、SUS等からなる鏡面板等を積層体50間及び積層体50と熱プレス板20a、20b間に配置してもよい。   Moreover, in this embodiment, the example which all arrange | positions the same 3rd buffer material 60 between the laminated bodies 50 and between the laminated bodies 50 and the hot press boards 20a and 20b was shown. However, the third buffer material 60 may be disposed only between the laminate 50 and the hot press plates 20a and 20b. In that case, a material having a buffer effect different from that of the third buffer material 60 may be disposed between the stacked bodies 50. Further, it is not always necessary to dispose the third cushioning material 60 between the laminates 50 and between the laminate 50 and the heat press plates 20a and 20b. The third cushioning member 60 is made of polyimide or the like regardless of the presence or absence of the third cushioning member 60. A release sheet, a mirror plate made of SUS, or the like may be disposed between the stacked bodies 50 and between the stacked body 50 and the hot press plates 20a and 20b.

また、本実施の形態において、第1の緩衝材40と第2の緩衝材80、第1の緩衝材40と第3の緩衝材60が一体に設けられる例を示した。しかしながら、図8に示すように、第1の緩衝材40、第2の緩衝材80、及び第3の緩衝材60が一体に設けられても良い。尚、図8はその他の変形例を示す断面図であり、図1に対応している。例えば、第1の緩衝材40が1枚の大きな金属繊維からなり、積層体50の上面から側面を包むように配置された状態で、第1の緩衝材40の周縁部が、例えば図8に示すように、熱プレス板20bと補助板30との間に配置されれば、第1の緩衝材40が第2の緩衝材80と第3の緩衝材60も兼ねることができる。この場合、部品点数をより削減することができる。   Moreover, in this Embodiment, the example in which the 1st shock absorbing material 40 and the 2nd shock absorbing material 80 and the 1st shock absorbing material 40 and the 3rd shock absorbing material 60 were provided integrally was shown. However, as shown in FIG. 8, the 1st shock absorbing material 40, the 2nd shock absorbing material 80, and the 3rd shock absorbing material 60 may be provided integrally. FIG. 8 is a cross-sectional view showing another modification, and corresponds to FIG. For example, in the state where the first buffer material 40 is made of one large metal fiber and is arranged so as to wrap the side surface from the upper surface of the laminated body 50, the peripheral portion of the first buffer material 40 is shown in FIG. Thus, if it arrange | positions between the hot press board 20b and the auxiliary | assistant board 30, the 1st shock absorbing material 40 can serve as the 2nd shock absorbing material 80 and the 3rd shock absorbing material 60. FIG. In this case, the number of parts can be further reduced.

本発明の第1の実施形態における加熱・加圧時の熱プレス機の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the hot press machine at the time of the heating and pressurization in the 1st Embodiment of this invention. 第1の実施形態の変形例を示す断面図である。It is sectional drawing which shows the modification of 1st Embodiment. 第1の実施形態の変形例を示す断面図である。It is sectional drawing which shows the modification of 1st Embodiment. 第1の実施形態の変形例を示す断面図である。It is sectional drawing which shows the modification of 1st Embodiment. 第2の実施形態における加熱・加圧時の熱プレス機の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the hot press machine at the time of the heating and pressurization in 2nd Embodiment. 第2の実施形態の変形例を示す断面図である。It is sectional drawing which shows the modification of 2nd Embodiment. 第3の実施形態における加熱・加圧時の熱プレス機の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the hot press machine at the time of the heating and pressurization in 3rd Embodiment. その他の変形例を示す断面図である。It is sectional drawing which shows the other modification.

符号の説明Explanation of symbols

10・・・熱プレス機
20a,20b・・・熱プレス板
30・・・補助板
40・・・第1の緩衝材
50・・・積層体
60・・・第3の緩衝材
80・・・第2の緩衝材
90・・・加熱手段
DESCRIPTION OF SYMBOLS 10 ... Hot press machine 20a, 20b ... Hot press board 30 ... Auxiliary board 40 ... 1st buffer material 50 ... Laminated body 60 ... 3rd buffer material 80 ... Second buffer material 90... Heating means

Claims (27)

絶縁層と導体層とを積層して積層体を形成する積層工程と、前記積層体を熱プレス板間に配置し、当該熱プレス板により前記積層体を上下両面から加熱・加圧する加熱・加圧工程とを備える多層基板の製造方法であって、
前記加熱・加圧工程において、前記積層体の側面側に、前記熱プレス板による前記積層体への加圧を妨げない長さを有しつつ熱伝導性に優れる補助板と、熱伝導性に優れるとともに前記熱プレス板からの圧力を受けて変形可能な第1の緩衝材とが配置された状態で加熱・加圧がなされ、前記熱プレス板の熱が前記補助板及び前記第1の緩衝材を介して前記積層体の側面に伝達されることを特徴とする多層基板の製造方法。
A laminating step in which a laminated body is formed by laminating an insulating layer and a conductor layer, and the laminated body is disposed between hot press plates, and heating / pressing is performed by heating and pressurizing the laminated body from above and below both surfaces by the hot press plate. A method for producing a multilayer substrate comprising a pressing step,
In the heating / pressurizing step, on the side surface side of the laminate, an auxiliary plate having excellent thermal conductivity while having a length that does not hinder pressurization of the laminate by the hot press plate, and thermal conductivity Heat and pressure are applied in a state where the first buffer material that is excellent and can be deformed by receiving pressure from the hot press plate is disposed, and the heat of the hot press plate is transferred to the auxiliary plate and the first buffer. A method for producing a multilayer substrate, wherein the multilayer substrate is transmitted to a side surface of the laminate through a material.
前記加熱・加圧工程において、前記熱プレス板間に複数の前記積層体が配置されることを特徴とする請求項1に記載の多層基板の製造方法。 The method for producing a multilayer substrate according to claim 1, wherein in the heating / pressurizing step, a plurality of the laminated bodies are arranged between the hot press plates. 前記補助板は、金属からなることを特徴とする請求項1又は請求項2に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 1, wherein the auxiliary plate is made of metal. 前記補助板は、前記積層体の側面に沿って環状に設けられていることを特徴とする請求項1〜3いずれか1項に記載の多層基板の製造方法。 The said auxiliary | assistant board is cyclically | annularly provided along the side surface of the said laminated body, The manufacturing method of the multilayer substrate of any one of Claims 1-3 characterized by the above-mentioned. 前記補助板は加熱手段を有し、前記加熱・加圧工程において、自ら前記積層体を加熱することを特徴とする請求項1〜4いずれか1項に記載の多層基板の製造方法。 The said auxiliary | assistant board has a heating means, The said laminated body itself is heated in the said heating and pressurization process, The manufacturing method of the multilayer substrate of any one of Claims 1-4 characterized by the above-mentioned. 前記補助板は、積層方向に分割されてなり、前記第1の緩衝材は、前記補助板間に配置されることを特徴とする請求項1〜5いずれか1項に記載の多層基板の製造方法。 The said auxiliary | assistant board is divided | segmented into the lamination direction, A said 1st shock absorbing material is arrange | positioned between the said auxiliary | assistant boards, The manufacturing of the multilayer substrate of any one of Claims 1-5 characterized by the above-mentioned. Method. 前記第1の緩衝材は、前記補助板の端面と前記熱プレス板との間に配置されることを特徴とする請求項1〜6いずれか1項に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 1, wherein the first buffer material is disposed between an end face of the auxiliary plate and the hot press plate. 前記第1の緩衝材は、金属繊維からなることを特徴とする請求項1〜7いずれか1項に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 1, wherein the first buffer material is made of a metal fiber. 前記第1の緩衝材は前記補助板と一体に設けられることを特徴とする請求項1〜8いずれか1項に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 1, wherein the first buffer material is provided integrally with the auxiliary plate. 前記加熱・加圧工程において、前記補助板と前記積層体との間に、熱伝導性に優れるとともに、前記積層体側面の凹凸に合わせて変形可能な第2の緩衝材が配置された状態で、加熱・加圧がなされることを特徴とする請求項1〜9いずれか1項に記載の多層基板の製造方法。 In the heating / pressurizing step, a second cushioning material that is excellent in thermal conductivity and deformable in accordance with the irregularities on the side surface of the laminate is disposed between the auxiliary plate and the laminate. Heating and pressurizing are performed, The manufacturing method of the multilayer substrate of any one of Claims 1-9 characterized by the above-mentioned. 前記第2の緩衝材は、金属繊維からなることを特徴とする請求項10に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 10, wherein the second buffer material is made of a metal fiber. 前記第2の緩衝材は前記第1の緩衝材と一体に設けられ、当該第2の緩衝材は前記補助板と前記積層体との間に配置されるとともに、前記補助板の端面と前記熱プレス板との間に回り込んで配置されることを特徴とする請求項10又は請求項11に記載の多層基板の製造方法。 The second cushioning material is provided integrally with the first cushioning material, and the second cushioning material is disposed between the auxiliary plate and the laminate, and the end surface of the auxiliary plate and the heat The method for producing a multilayer substrate according to claim 10 or 11, wherein the multilayer substrate is disposed so as to wrap around between the press plates. 前記絶縁層は樹脂フィルムであり、前記導体層は前記樹脂フィルム表面に設けられた導体パターンであることを特徴とする請求項1〜12いずれか1項に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 1, wherein the insulating layer is a resin film, and the conductor layer is a conductor pattern provided on a surface of the resin film. 前記加熱・加圧工程において、少なくとも一方の前記積層体表面と前記熱プレス板との間に、前記積層体表面の凹凸に合わせて変形しつつ前記熱プレス板から前記積層体に加圧力を伝達する第3の緩衝材が配置された状態で、加熱・加圧がなされることを特徴とする請求項13に記載の多層基板の製造方法。 In the heating / pressurizing step, a pressing force is transmitted from the hot press plate to the laminate while being deformed according to the unevenness of the laminate surface between at least one of the laminate surface and the hot press plate. The method for manufacturing a multilayer substrate according to claim 13, wherein heating and pressurization are performed in a state where the third cushioning material is arranged. 前記第3の緩衝材は前記第1の緩衝材と一体に設けられ、当該第3の緩衝材は前記積層体表面と前記熱プレス板との間に配置されるとともに、前記補助板の端面と前記熱プレス板との間にも配置されることを特徴とする請求項14に記載の多層基板の製造方法。 The third cushioning material is provided integrally with the first cushioning material, and the third cushioning material is disposed between the surface of the laminate and the hot press plate, and an end surface of the auxiliary plate. The method for manufacturing a multilayer board according to claim 14, wherein the multilayer board is also disposed between the hot press plate. 前記樹脂フィルムは、熱可塑性樹脂からなることを特徴とする請求項13〜15いずれか1項に記載の多層基板の製造方法。 The method for manufacturing a multilayer substrate according to claim 13, wherein the resin film is made of a thermoplastic resin. 複数の熱プレス板を備え、当該熱プレス板間に絶縁層と導体層とを積層してなる積層体を配置し、前記積層体の上下両面から前記熱プレス板により加熱・加圧して多層基板を製造する熱プレス機であって、
前記熱プレス板間であって、前記積層体の側面側に、前記熱プレス板による前記積層体への加圧を妨げない長さを有しつつ熱伝導性に優れる材料からなる補助板と、熱伝導性に優れつつ前記熱プレス板からの圧力を受けて変形可能な第1の緩衝材とを備えることを特徴とする熱プレス機。
A multilayer board comprising a plurality of hot press plates, a laminate formed by laminating an insulating layer and a conductor layer between the hot press plates, and being heated and pressed by the hot press plates from the upper and lower surfaces of the laminate. A heat press machine for manufacturing,
An auxiliary plate made of a material excellent in thermal conductivity while having a length that does not prevent pressurization to the laminate by the hot press plate on the side surface side of the laminate, between the hot press plates, A heat press machine comprising: a first cushioning material that is excellent in thermal conductivity and is deformable by receiving pressure from the hot press plate.
前記補助板は、金属からなることを特徴とする請求項14に記載の熱プレス機。 The hot press according to claim 14, wherein the auxiliary plate is made of metal. 前記補助板は、前記積層体の側面に沿って環状に設けられていることを特徴とする請求項14又は請求項15に記載の熱プレス機。 The hot press according to claim 14 or 15, wherein the auxiliary plate is provided in an annular shape along a side surface of the laminate. 前記補助板は加熱手段を有することを特徴とする請求項17〜19いずれか1項に記載の熱プレス機。 The hot press according to any one of claims 17 to 19, wherein the auxiliary plate has a heating means. 前記補助板は、積層方向に分割されてなり、前記第1の緩衝材は、前記積層体の側面であって前記補助板間に配置されることを特徴とする請求項17〜20いずれか1項に記載の熱プレス機。 The said auxiliary | assistant board is divided | segmented into the lamination direction, A said 1st shock absorbing material is a side surface of the said laminated body, and is arrange | positioned between the said auxiliary | assistant boards, The any one of Claims 17-20 characterized by the above-mentioned. The heat press machine according to item. 前記第1の緩衝材は、前記積層体の側面であって前記補助板の端面と前記熱プレス板との間に配置されることを特徴とする請求項17〜21いずれか1項に記載の熱プレス機。 The said 1st shock absorbing material is a side surface of the said laminated body, Comprising: It arrange | positions between the end surface of the said auxiliary | assistant board, and the said heat press board, The any one of Claims 17-21 characterized by the above-mentioned. Heat press machine. 前記第1の緩衝材は、金属繊維からなることを特徴とする請求項17〜22いずれか1項に記載の熱プレス機。 The hot press machine according to any one of claims 17 to 22, wherein the first buffer material is made of a metal fiber. 前記第1の緩衝材は、前記補助板と一体に設けられていることを特徴とする請求項17〜23いずれか1項に記載の熱プレス機。 The hot press machine according to any one of claims 17 to 23, wherein the first cushioning material is provided integrally with the auxiliary plate. 前記補助板と前記積層体との間に、熱伝導性に優れつつ前記積層体側面の凹凸に合わせて変形可能な第2の緩衝材を備えることを特徴とする請求項17〜24いずれか1項に記載の熱プレス機。 25. A second cushioning material that is excellent in thermal conductivity and deformable in accordance with the irregularities on the side surface of the laminated body, is provided between the auxiliary plate and the laminated body. The heat press machine according to item. 前記第2の緩衝材は、金属繊維からなることを特徴とする請求項25に記載の熱プレス機。 The hot press machine according to claim 25, wherein the second buffer material is made of a metal fiber. 前記第2の緩衝材は、前記第1の緩衝材と一体に設けられていることを特徴とする請求項25又は請求項26に記載の熱プレス機。 27. The hot press according to claim 25 or claim 26, wherein the second cushioning material is provided integrally with the first cushioning material.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469690A (en) * 2010-11-05 2012-05-23 三星电机株式会社 Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same
CN102469704A (en) * 2010-11-15 2012-05-23 三星电机株式会社 Manufacturing method of multilayered board
KR101540047B1 (en) * 2013-12-27 2015-07-28 엘아이지인베니아 주식회사 Apparatus and method for attaching substrates

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469690A (en) * 2010-11-05 2012-05-23 三星电机株式会社 Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same
KR101167442B1 (en) * 2010-11-05 2012-07-19 삼성전기주식회사 Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same
CN102469704A (en) * 2010-11-15 2012-05-23 三星电机株式会社 Manufacturing method of multilayered board
KR101156810B1 (en) * 2010-11-15 2012-06-18 삼성전기주식회사 Manufacturing Method of Multilayered Board
KR101540047B1 (en) * 2013-12-27 2015-07-28 엘아이지인베니아 주식회사 Apparatus and method for attaching substrates

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