KR101530711B1 - 슬러리 소비를 감소시키기 위한 홈을 갖는 연마 패드 - Google Patents

슬러리 소비를 감소시키기 위한 홈을 갖는 연마 패드 Download PDF

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Publication number
KR101530711B1
KR101530711B1 KR1020080009801A KR20080009801A KR101530711B1 KR 101530711 B1 KR101530711 B1 KR 101530711B1 KR 1020080009801 A KR1020080009801 A KR 1020080009801A KR 20080009801 A KR20080009801 A KR 20080009801A KR 101530711 B1 KR101530711 B1 KR 101530711B1
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KR
South Korea
Prior art keywords
carrier
groove
pad
polishing pad
polishing
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KR1020080009801A
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English (en)
Korean (ko)
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KR20080071934A (ko
Inventor
그레고리 피. 멀다우니
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Priority claimed from US11/700,490 external-priority patent/US7520798B2/en
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20080071934A publication Critical patent/KR20080071934A/ko
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Publication of KR101530711B1 publication Critical patent/KR101530711B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020080009801A 2007-01-31 2008-01-30 슬러리 소비를 감소시키기 위한 홈을 갖는 연마 패드 Active KR101530711B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/700,490 2007-01-31
US11/700,490 US7520798B2 (en) 2007-01-31 2007-01-31 Polishing pad with grooves to reduce slurry consumption
US12/005,241 2007-12-26
US12/005,241 US7520796B2 (en) 2007-01-31 2007-12-26 Polishing pad with grooves to reduce slurry consumption

Publications (2)

Publication Number Publication Date
KR20080071934A KR20080071934A (ko) 2008-08-05
KR101530711B1 true KR101530711B1 (ko) 2015-06-22

Family

ID=39587516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080009801A Active KR101530711B1 (ko) 2007-01-31 2008-01-30 슬러리 소비를 감소시키기 위한 홈을 갖는 연마 패드

Country Status (6)

Country Link
US (1) US7520796B2 (https=)
JP (1) JP5208530B2 (https=)
KR (1) KR101530711B1 (https=)
DE (1) DE102008005331A1 (https=)
FR (1) FR2912076B1 (https=)
TW (1) TWI426980B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8062103B2 (en) * 2008-12-23 2011-11-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate groove pattern
US8057282B2 (en) * 2008-12-23 2011-11-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate polishing method
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
CN117532427B (zh) * 2023-12-14 2026-02-06 西安奕斯伟材料科技股份有限公司 硅片抛光装置和硅片抛光方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883802A (en) * 1956-09-24 1959-04-28 Crane Packing Co Method of and apparatus for lapping shoulders
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
JPH07237120A (ja) * 1994-02-22 1995-09-12 Nec Corp ウェーハ研磨装置
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
JP3453977B2 (ja) * 1995-12-28 2003-10-06 信越半導体株式会社 ウェーハの研磨装置
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
JP2001298006A (ja) * 2000-04-17 2001-10-26 Ebara Corp 研磨装置
US6386962B1 (en) * 2000-06-30 2002-05-14 Lam Research Corporation Wafer carrier with groove for decoupling retainer ring from water
JP2005515904A (ja) * 2002-01-22 2005-06-02 マルチ プレイナー テクノロジーズ インコーポレイテッド スラリー分配のための形状付けされた表面を持つ保持リングを有する化学的機械研磨装置及び方法
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
US6869348B1 (en) * 2003-10-07 2005-03-22 Strasbaugh Retaining ring for wafer carriers
US7125318B2 (en) * 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US7059949B1 (en) * 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7001248B1 (en) * 2004-12-29 2006-02-21 Industrial Technology Research, Institute Fine tilting adjustment mechanism for grinding machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization

Also Published As

Publication number Publication date
DE102008005331A1 (de) 2008-08-07
US20080182493A1 (en) 2008-07-31
TWI426980B (zh) 2014-02-21
TW200911457A (en) 2009-03-16
JP2008188762A (ja) 2008-08-21
KR20080071934A (ko) 2008-08-05
JP5208530B2 (ja) 2013-06-12
US7520796B2 (en) 2009-04-21
FR2912076B1 (fr) 2014-10-10
FR2912076A1 (fr) 2008-08-08

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EP2202031B1 (en) High-rate polishing method
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