KR101521873B1 - Tube supply apparatus for semiconductor package fabrication apparatus - Google Patents

Tube supply apparatus for semiconductor package fabrication apparatus Download PDF

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Publication number
KR101521873B1
KR101521873B1 KR1020140153506A KR20140153506A KR101521873B1 KR 101521873 B1 KR101521873 B1 KR 101521873B1 KR 1020140153506 A KR1020140153506 A KR 1020140153506A KR 20140153506 A KR20140153506 A KR 20140153506A KR 101521873 B1 KR101521873 B1 KR 101521873B1
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South Korea
Prior art keywords
tube
semiconductor package
guide
hollow tube
empty
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KR1020140153506A
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Korean (ko)
Inventor
신계철
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에스에스오트론 주식회사
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Priority to KR1020140153506A priority Critical patent/KR101521873B1/en
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Publication of KR101521873B1 publication Critical patent/KR101521873B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding Of Articles To Conveyors (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic supply apparatus for a semiconductor package, and more particularly, to an automatic supply apparatus for a semiconductor package, And more particularly, to an automatic supply apparatus for a semiconductor package tube for efficiently improving the manufacturing efficiency by keeping the productivity constant regardless of the skill of the operator.
According to an aspect of the present invention, An automatic supply device for a semiconductor package tube that automatically feeds and feeds an empty tube (10) for packaging a semiconductor package, comprising: a case (100) having a space therein; A hollow tube 10 which is coupled to one side of the case 100 and in which a large number of empty tubes 10 are stacked and a hollow tube 10 loaded by a belt conveying system is fed one by one, A tank 200; A conveyor 300 coupled to a supply side of the hollow tube 10 to the upper portion of the tube tank 200 and continuously feeding the hollow tube 10 conveyed vertically upward horizontally; When the horizontally conveyed hollow tube 10 is allowed to fall freely inward, the sensor senses a falling direction of the hollow tube 10, and the empty tube is rotated 180 ° A chute 400 for rotating the chute 400 in a predetermined direction; A drawing means 500 installed at the front of the chute 400 to pull out the bottommost end of the empty tubes 10 held in the predetermined direction and transfer it to the conveying means 600; A conveying means 600 installed at a lower portion of the drawing means 500 and transferring the empty tubes 10 to a position where the semiconductor packages can be inserted when the empty tubes 10 are mounted on the inner side by the drawing means 500, And,
When the plurality of hollow tubes 10 are accurately transported and aligned at a position where the semiconductor package is inserted by the transfer means 600, the semiconductor package is automatically inserted and packed inside the hollow tubes.

Description

TECHNICAL FIELD [0001] The present invention relates to an automatic feeder for a semiconductor package tube,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic supply apparatus for a semiconductor package, and more particularly, to an automatic supply apparatus for a semiconductor package, And more particularly, to an automatic supply apparatus for a semiconductor package tube for efficiently improving the manufacturing efficiency by keeping the productivity constant regardless of the skill of the operator.

In general, the semiconductor package is an electronic component manufactured to have a suitable electrical connection structure that can be mounted on a small electronic apparatus such as a smart phone, a cellular phone, a digital camera, a notebook, and the like.

Such a semiconductor package is very vulnerable to external environments such as high temperature, impurities and physical impacts, and is thus packaged in a protective case such as a tube for the purpose of preventing damage to, storing and transporting the semiconductor package.

(Patent Literature) Korean Patent Laid-Open Publication No. 1996-0003527 (published on 1996.01.26) discloses a prior art which is the background of the present invention. This is because the glass or lead of the package is damaged A protrusion such as a circle, a square, or a triangle is formed on the upper surface of the tube so as to form a protrusion such as a circle, a square, or a triangle, There is proposed a semiconductor package tube having a structure in which a step is formed which is higher than the lead height of the semiconductor package and has a groove facing the projecting portion and on the inner wall of the tube, a plating film for preventing static electricity is formed.

However, conventionally, the worker has to manually insert the tubes for packaging into the equipment of the semiconductor package, or directly insert the semiconductor package into the tube, so that the workability is remarkably deteriorated, resulting in inefficiency, There is a problem that the productivity is lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of packaging semiconductor packages, in which a plurality of empty tubes are stacked and vertically and horizontally transported, The automatic tube feeding device for the semiconductor package for efficiently improving the manufacturing efficiency by keeping the productivity constant regardless of the skill level of the operator through the automatic tube feeding system The purpose is to provide.

According to an aspect of the present invention, An automatic feeder for a semiconductor package tube for automatically feeding and feeding a hollow tube for packaging a semiconductor package, the apparatus comprising: a case having a space therein; A tube tank coupled to one side of the case, wherein a hollow tube is loaded in a large amount and the hollow tubes loaded by the belt conveying system are fed one by one and continuously fed vertically upward; A conveyor connected to the supply side of the hollow tube to the upper portion of the tube tank and continuously conveying the hollow tube conveyed in the vertical upward direction; When the horizontally conveyed hollow tube is allowed to fall freely inward, the sensor senses the falling direction of the hollow tube, and the empty tube is rotated 180 ° according to the result of the reading to maintain the hollow tube in a predetermined direction A suit to make; A draw-out means installed at the front of the chute and pulling out a lowermost empty tube among the empty tubes held in the predetermined direction and transferring the drawn-out tube to the conveying means; And a transfer means installed at a lower portion of the drawing means for transferring the empty tubes to a position where the semiconductor packages can be inserted when the empty tubes are mounted on the inner side by the drawing means,

Wherein the semiconductor package is automatically inserted and packaged inside the plurality of empty tubes when the plurality of empty tubes are accurately transferred and aligned by the transfer means,
The conveying means
A first guide installed at a lower portion of the drawing means to be reciprocated and to which a plurality of hollow tubes are initially mounted inside by the drawing means; A plurality of empty tubes installed at the conveying end of the first guide to be lifted and lowered and installed to face each other with a gap therebetween at a distance therebetween, A second guide which is seated and transferred; And a third guide that is installed to be reciprocated within the center interval of the second guide and is inserted into the gap when the slide is inserted, and a plurality of empty tubes are received and transferred during the descending of the second guide. And an automatic supply device for a semiconductor package tube.

According to the present invention, since the semiconductor package is automatically packaged in a plurality of empty tubes, the productivity can be maintained constant regardless of the skill of the operator, and the manufacturing efficiency can be efficiently improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view and a partial enlarged view of an automatic supply apparatus for a semiconductor package tube according to an embodiment of the present invention; FIG.
FIGS. 2 to 4 are operational states of an automatic supply apparatus for a semiconductor package tube according to an embodiment of the present invention; FIG.

An automatic supply device for a tube for a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the exemplary embodiments of the present invention, a detailed description of components that are widely known and used in the art to which the present invention belongs is omitted, and unnecessary explanations thereof are omitted. It is to communicate the point more clearly.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view for explaining an automatic supply apparatus for a semiconductor package tube according to an embodiment of the present invention; FIG.

Accordingly, the automatic supplying apparatus 1 for a semiconductor package tube will be schematically described. The case 100 has a space therein. A tube tank 200 coupled to one side of the case 100 for allowing a hollow tube 10 to be loaded in a large quantity and continuously feeding the empty tubes stacked vertically upwards by one by one, )Wow; A conveyor 300 coupled to a supply side of the hollow tube 10 to the upper portion of the tube tank 200 and continuously feeding the hollow tube 10 conveyed vertically upward horizontally; When the horizontally conveyed hollow tube 10 is allowed to fall freely inward, the sensor senses a falling direction of the hollow tube 10, and the empty tube is rotated 180 ° A chute 400 for rotating the chute 400 in a predetermined direction; A drawing means 500 installed at the front of the chute 400 to pull out the bottommost end of the empty tubes 10 held in the predetermined direction and transfer it to the conveying means 600; A conveying means 600 installed at a lower portion of the drawing means 500 and transferring the empty tubes 10 to a position where the semiconductor packages can be inserted when the empty tubes 10 are mounted on the inner side by the drawing means 500, And,

When the plurality of hollow tubes 10 are accurately transported and aligned at a position where the semiconductor package is inserted by the transfer means 600, the semiconductor package is automatically inserted and packed inside the hollow tubes.

Hereinafter, the constitution of each part of the present invention will be described in detail.

First, the case 100 has a space therein and serves as a body for supporting the load of the automatic feeder 1 for a semiconductor package.

At this time, the case 100 has a structure in which three plates are assembled on the lower surface and both sides, and both the upper and lower surfaces of the plate are opened in the longitudinal direction.

The tube tank 200 is coupled to one side of the case 100 and includes a hollow tube 10 in which a large number of empty tubes 10 are stacked one by one, To be supplied continuously.

At this time, the tube tank 200 has a structure in which four plates are assembled to the rear surface including the lower surface and both side surfaces, and the upper surface and the front surface are opened.

A plurality of empty tubes 10 are placed in an opened portion of the tube tank 200 and the empty tubes 10 are stacked on the lower surface of the tube tank 200 to form an empty tube 10).

The tube tank 200 further includes an elevator 210 installed on an inner side surface of the belt 211 and adapted to continuously convey a plurality of empty tubes 10 vertically upward.

At this time, the elevator 210 is connected to a belt shaft 212 having a belt pulley fitted on both sides of the tube tank 200, and an external motor is connected to the belt shaft 212, .

Further, both ends of the elliptical belt 211 are inserted into the pulleys of the belt shaft 212, and the belt 211 continuously rotates in an endless track form.

A plurality of belt protrusions 213 protrude in the width direction of the belt 211. The belt protrusions 213 correspond to the size of the hollow tube 10, So that the hollow tubes 10 are inserted into the gap of the belt protrusions 213 one by one.

The conveyor 300 is connected to the supply side of the hollow tube 10 on the upper side of the tube tank 200 and is connected to the empty tube 30 vertically upwardly moved by the elevator 210 of the tube tank 200 10 in the horizontal direction.

At this time, the conveyor 300 has the same structure as that of the elevator 210 of the tube tank 200, and the installation direction of the conveyor 300 is horizontal, and the structure of the belt is different. The configuration for the projection 213 may be omitted.

The chute 400 is vertically installed at the end of the conveyor 300. When the empty tube 10 horizontally conveyed by the conveyor 300 is allowed to fall freely inward, So that the hollow tube 10 is rotated by 180 ° according to the result of the detection by the sensor so as to be maintained in a predetermined direction.

The chute 400 further includes a guide plate 410 installed vertically and having an interval at which the hollow tube 10 falls freely inward.

At this time, the guide plate 410 has a pair of rectangular plates, and the side ends of the rectangular plates are fixed to the inner side walls of the case 100 by bolting, And the gap corresponds to the size of the hollow tube 10.

The chute 400 is coupled to the lower end of the guide plate 410 and rotates in place so that when the sensor senses the direction of the free tube 10 falling freely, 420).

The direction guide 420 is formed in the shape of a circular shaft and has a guide groove 421 through which the hollow tube 10 is inserted at the center of the guide groove 420. The guide groove 421 is a hollow tube 10).

The chute 400 is vertically coupled to the lower end of the direction guide 420 and has an interval at which the hollow tube 10 falls freely inward, And a drawing plate 430 for allowing the empty tubes 10 to be sequentially discharged after they are stacked in a row.

At this time, the drawing plate 430 is provided with a pair of rectangular plates, and the side ends of the rectangular plates are fixed to inner side walls of the case 100 by bolting, And the gap corresponds to the size of the hollow tube 10.

Closing cylinder 440 is fixedly coupled to the lower portion of the drawing plate 430. The opening and closing cylinder 440 has a rod 441 passing through the gap between the drawer plate 430 and the rod 441, The empty tubes 10 are sequentially discharged one by one in a vertically stacked state.

At this time, the opening and closing cylinder 440 may be applied to the lower portion of the guide plate 410 and the lower portion of the direction guide 420.

The chute 400 determines the forward and backward directions of the hollow tube 10 in such a manner as to measure the distance to the groove formed on one surface of the hollow tube 10 which is penetrated to the inner center of the chute 400 and falls freely. And a detection sensor 450 for detecting the temperature of the fluid.

At this time, the sensing sensor 450 is a type of sensor that measures distance, such as an infrared sensor, and is selectively coupled to the lower portion of the guide plate 410 and the upper and lower portions of the drawing plate 430, It is preferable that the tube 10 penetrates at an interval at which the tube 10 falls.

The drawing means 500 is installed in front of the chute 400 and draws out the empty tube 10 held at a certain position by the chute 400 in a predetermined direction, 600).

The drawing unit 500 may further comprise a rear portion of a vacuum cylinder 520 fixed to the rotary shaft 510 to receive air when the rotary shaft 510 is connected to the motor,

The hollow tube 520 is rotated around the rotary shaft 510 by a radius of 90 ° and the hollow tube 10 is drawn out by an operation of vacuum suction and then mounted on the conveying means 600.

At this time, the rotary shaft 510 is formed in a rod shape, and both ends of the rotary shaft 510 are fixedly coupled to rotate on the inner side surface of the case 100, and are connected to an external motor.

Furthermore, the vacuum cylinder 520 is a kind of cylinder for sucking in air, and its shape and structure are variously applicable to ordinary ones.

At this time, the rear part of the vacuum cylinder 520 is fixedly coupled to the rotation shaft 510, and the front part is provided with a suction plate (not shown) for absorbing rubber, The hollow tube 10, which is discharged one by one, is sucked, and is rotated and transferred to the transporting means 600, which will be described later.

When the plurality of empty tubes 10 are mounted on the inner side by the drawing means 500, the transfer means 600 is installed on the lower side of the drawing means 500, Lt; / RTI > position.

The conveying means 600 is installed at a lower portion of the drawing means 500 and is reciprocated and is guided by the drawing means 500 to form a first guide 610 ).

At this time, the first guide 610 is formed in a square plate shape with a groove for mounting a plurality of hollow tubes 10 on the upper side thereof, and the groove corresponds to the size of the hollow tube 10.

The lower portion of the first guide 610 is coupled with the first guide rail 611 in the longitudinal direction of the case 100 and a screw shaft 612 coupled to the motor is coupled to the lower center of the first guide 610, And is reciprocated along the first guide rail 611 by the rotation of the shaft 612.

At this time, the first guide 610 preferably includes a sensor for detecting an appropriate position to be reciprocated.

In addition, the conveying means 600 is provided at a conveying end portion of the first guide 610 so as to move up and down. The conveying means 600 is provided at a distance from the center of the first guide 610, And a second guide 620 for receiving and transferring a plurality of empty tubes 10 mounted and inserted during the lifting process.

At this time, the second guides 620 are formed as a pair. The second guides 620 are fixedly coupled to opposite sides of the inner side of the case 100 to face each other, As shown in FIG.

The second guide 620 is provided with a lift block 621 having a plurality of grooves on the upper side of which the hollow tube 10 is mounted and formed corresponding to grooves provided on the upper side of the first guide 610, And a cylinder (not shown) for ascending and descending is coupled to a lower portion of the block 621.

In addition, when the second guide 620 is slidably inserted, the conveying means 600 is installed to be reciprocated within the center interval of the second guide 620. In the descending process of the second guide 620, And a third guide 630 on which the first guide 10 is mounted.

At this time, the third guide 630 is formed in the shape of a square plate, and a plurality of grooves on which the hollow tube 10 is mounted are formed corresponding to the grooves provided on the upper side of the second guide 620 .

The lower portion of the third guide 630 is coupled with the third guide rail 631 in the longitudinal direction of the case 100 and a rod (not shown) of the cylinder is connected to the lower center of the third guide 630, And is reciprocated along the third guide rail 631 by a stretching operation.

At this time, the third guide 630 preferably includes a sensor for sensing an appropriate position to be reciprocated.

2 to 4 are views showing operation states of an automatic supply apparatus for a semiconductor package tube according to an embodiment of the present invention.

2, the semiconductor package is packaged using the automatic supplying apparatus 1 having the above-described structure. When a large number of empty tubes 10 are loaded and supplied to the tube tank 200, The empty tubes 10 are vertically transferred to the elevator 210 provided in the main body 200 by one by one.

At this time, the empty tube 10 vertically conveyed to the elevator 210 is horizontally continuously conveyed through the conveyor 300, and is inserted into the chute 400, which is the next process.

Referring to FIG. 3, the empty tube 10 continuously conveyed as described above freely falls into the chute 400. After the detection sensor 450 provided in the chute 400 detects the falling direction of the empty tube 10 , And the empty tube 10 is rotated by 180 ° according to the read result to maintain a constant supply direction.

At this time, the empty tubes 10 in which the supply direction is kept constant are sequentially discharged one by one by the action of the opening / closing cylinder 440 in a state where they are stacked vertically by the drawing plate 430 of the chute 400.

Further, the empty tubes 10 sequentially discharged as described above are rotated by 90 ° to the conveying means 600 by using the drawing means 500, and the empty tubes 10 are mounted one by one.

4, the empty tubes 10 mounted and arranged one by one on the conveying means 600 are slid to the second guide 620 side by the horizontal conveying operation of the first guide 610, The guide 620 rises to transfer a plurality of empty tubes 10 mounted on the first guide 610,

At this time, the first guide 610 returns to the home position and the third guide 630 is slid toward the second guide 620. During the descent of the second guide 620, 10 are transferred to the third guide 630.

Thereafter, the third guide 630 is transferred and aligned to a position where the semiconductor package is inserted, thereby automatically preparing the package for the semiconductor package.

Accordingly, when a plurality of hollow tubes 10 are accurately transported and aligned at a position where the semiconductor package is inserted by the automatic supplying device having the above-described structure, the semiconductor package is automatically inserted and packed therein, The productivity can be maintained constant without the need for the manufacturing process, so that the manufacturing efficiency can be improved efficiently.

As described above. While the present invention has been particularly shown and described with reference to certain preferred embodiments thereof, it is to be understood that the terminology used herein is for the purpose of describing the present invention only and is not intended to limit the scope of the claims. But is not intended to,

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be easy for anyone to know.

The case 100, the tube tank 200, the conveyor 300, the chute 400, the drawing means 500, the conveying means 600,

Claims (5)

An automatic feeding device for a semiconductor package tube for automatically feeding and feeding an empty tube (10) for packaging a semiconductor package,
A case 100 having a space therein;
A hollow tube 10 which is coupled to one side of the case 100 and in which a large number of empty tubes 10 are stacked and a hollow tube 10 loaded by a belt conveying system is fed one by one, A tank 200;
A conveyor 300 coupled to a supply side of the hollow tube 10 to the upper portion of the tube tank 200 and continuously feeding the hollow tube 10 conveyed vertically upward horizontally;
When the horizontally conveyed hollow tube 10 is allowed to fall freely inward, the sensor senses a falling direction of the hollow tube 10, and the empty tube is rotated 180 ° A chute 400 for rotating the chute 400 in a predetermined direction;
A drawing means 500 installed at the front of the chute 400 to pull out the bottommost end of the empty tubes 10 held in the predetermined direction and transfer it to the conveying means 600;
A conveying means 600 installed at a lower portion of the drawing means 500 and transferring the empty tubes 10 to a position where the semiconductor packages can be inserted when the empty tubes 10 are mounted on the inner side by the drawing means 500, And,
A plurality of empty tubes 10 are accurately transported and aligned at a position where the semiconductor package is inserted by the transfer means 600. The semiconductor package is automatically inserted and packaged in the inside thereof,
The conveying means (600)
A first guide 610 installed at a lower portion of the drawing means 500 and reciprocatingly transported, and in which a plurality of hollow tubes 10 are first mounted on the inner side by the drawing means 500;
The first guide 610 is installed at a conveying end portion of the first guide 610 so as to move up and down. The first guide 610 is installed at a distance from the center of the first guide 610, A second guide 620 for receiving and transferring the hollow tube 10 in the ascending process;
When the second guide 620 is slidably inserted, the plurality of empty tubes 10 are seated in the lowering process of the second guide 620, And a guide (630). ≪ RTI ID = 0.0 > [0002] < / RTI > The method according to claim 1,
The tube tank 200 is further provided with an elevator 210 installed on an inner side surface of the belt 211 to allow the empty tubes 10 to be conveyed vertically upwardly one by one, And the automatic supply device for the semiconductor package tube. delete The method according to claim 1,
The drawing unit 500 further includes a rear portion of a vacuum cylinder 520 fixed to the rotary shaft 510 to receive air when the rotary shaft 510 is connected to the motor,
Wherein the vacuum tube is pulled out by an operation process of vacuum suction while the vacuum cylinder is rotated at a radius of 90 degrees about the rotation axis and then mounted on the transfer means. Automatic supply of tubes for packaging. The method according to claim 1,
The chute 400 is connected to the center of the inside of the chute 400 and measures the distance to the groove formed on one surface of the free tube 10 falling freely, And a detection sensor (450) for detecting the temperature of the semiconductor package.
KR1020140153506A 2014-11-06 2014-11-06 Tube supply apparatus for semiconductor package fabrication apparatus KR101521873B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230084746A (en) * 2021-12-06 2023-06-13 주식회사 인터원 PCB alignment device for LED module inline unmanned automation system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970072268A (en) * 1996-04-13 1997-11-07 김광호 Automatic supply method of package storage tube
KR19980021719A (en) * 1996-09-18 1998-06-25 김광호 Arrangement device for plastic tubes for semiconductor packages
KR200159719Y1 (en) * 1993-11-10 1999-11-01 김영환 Semiconductor device tube supply equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200159719Y1 (en) * 1993-11-10 1999-11-01 김영환 Semiconductor device tube supply equipment
KR970072268A (en) * 1996-04-13 1997-11-07 김광호 Automatic supply method of package storage tube
KR19980021719A (en) * 1996-09-18 1998-06-25 김광호 Arrangement device for plastic tubes for semiconductor packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230084746A (en) * 2021-12-06 2023-06-13 주식회사 인터원 PCB alignment device for LED module inline unmanned automation system
KR102571765B1 (en) * 2021-12-06 2023-08-28 주식회사 인터원 PCB alignment device for LED module inline unmanned automation system

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