KR101469859B1 - Vacuum heating device for circuit board - Google Patents

Vacuum heating device for circuit board Download PDF

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Publication number
KR101469859B1
KR101469859B1 KR1020140113413A KR20140113413A KR101469859B1 KR 101469859 B1 KR101469859 B1 KR 101469859B1 KR 1020140113413 A KR1020140113413 A KR 1020140113413A KR 20140113413 A KR20140113413 A KR 20140113413A KR 101469859 B1 KR101469859 B1 KR 101469859B1
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KR
South Korea
Prior art keywords
substrate
side door
vacuum
supply
vacuum chamber
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Application number
KR1020140113413A
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Korean (ko)
Inventor
박현
Original Assignee
헬러코리아(주)
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Priority to KR1020140113413A priority Critical patent/KR101469859B1/en
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Publication of KR101469859B1 publication Critical patent/KR101469859B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Tunnel Furnaces (AREA)

Abstract

The substrate vacuum heating apparatus according to the present invention is a vacuum heating apparatus for a substrate having a chamber structure having an internal space, comprising a supply port opened and closed by a supply-side door, an exhaust port opened and closed by a discharge-side door, A vacuum chamber having a conveyor for conveyance; A vacuum pump for forming vacuum pressure inside the vacuum chamber; A heating unit for heating the inside of the vacuum chamber; . Since the substrate can be heated in a reduced pressure state by using the substrate vacuum heating apparatus according to the present invention, it is possible to prevent the occurrence of bubbles on the substrate and to continuously supply and discharge the substrate while opening and closing the door of the vacuum chamber It is possible to increase the productivity and to maintain the tension of the conveyance belt constant even if the conveyance belt for conveying the substrate is expanded and contracted so that the substrate can be stably conveyed.

Figure R1020140113413

Description

[0001] The present invention relates to a vacuum heating apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum heating apparatus for heating a printed circuit board in a vacuum state so that bubbles are not generated when various chips or components are mounted on a substrate, And a vacuum heating apparatus configured to stably supply the vacuum chamber to the inside of the chamber.

Generally, when mounting electronic components such as various chips on various substrates such as a printed circuit board and a flexible circuit board, the substrate is heated to a temperature equal to or higher than a reference value. When the substrate is heated at atmospheric pressure There is a problem that a void is generated on the contact surface between the substrate and the electronic component.

Therefore, in heating the substrate, a method of heating the substrate to be heated in a low atmospheric pressure atmosphere has been proposed. However, in order to draw the substrate into the vacuum chamber or pull out the substrate in the vacuum chamber to the outside, The manufacturing cost of the apparatus is greatly increased.

In addition, when the substrate is pulled in and out of the vacuum chamber using a separate transport tray, the substrate placed in the vacuum chamber must first be drawn out before the new substrate is supplied into the vacuum chamber, Can not be performed at the same time. Therefore, a long time is required for processing the substrate, which increases the manufacturing cost of the substrate.

In addition, a method of using a conveyor belt of a conveyor structure to continuously supply the substrate may be proposed. When the conveyor belt is heated, the conveyor belt is stretched so that the tension of the conveyor belt is within the reference range There is a problem in that it can not be maintained.

KR 10-0320702 B1

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method and apparatus for heating a substrate on a vacuum within a reference range so that bubbles are not generated on the substrate, And it is an object of the present invention to provide a substrate vacuum heating apparatus capable of always keeping the tension of a conveyance belt for conveying a substrate constant.

According to another aspect of the present invention, there is provided a substrate vacuum heating apparatus including a supply port which is opened and closed by a supply-side door, a discharge port which is opened and closed by a discharge-side door, A vacuum chamber having a conveyor for transferring the substrate to the discharge port; A vacuum pump for forming vacuum pressure inside the vacuum chamber; And a heating unit for heating the inside of the vacuum chamber.

And a transfer belt which is connected to the at least one drive roller and the idle roller so as to transfer the substrate placed on the upper surface, the transfer unit being installed at the supply port and the discharge port of the vacuum chamber, respectively.

The transfer unit includes a rotation block extending from the end of the supply port or the discharge port toward the supply port or the discharge port and rotatable about a rotation shaft having a length in the width direction of the transfer belt, And one or more transport rollers mounted on the rotary block so as to roll in a traveling direction of the substrate transported on the transport belt.

Wherein the supply side door and the discharge side door are located lower than the rotary block and are configured to close the supply port or the discharge port as they are transported upward, Side door or the discharge-side door so that the end is drawn out from the supply port or the discharge port.

One or more rolling rollers are mounted at the point of contact with the supply-side door or the discharge-side door that rises in the rotary block.

The conveying unit includes a tension adjusting roller mounted on the conveying belt so as to be lifted or lowered in a state of being in contact with the conveying belt, a tension adjusting roller attached to one side of the tensioning roller in the longitudinal direction, Further comprising a connecting link for raising or lowering the tension adjusting roller.

The connection link includes a pivot link mounted in a structure rotatable in the middle portion thereof and a pivot link having a structure in which one side in the longitudinal direction is rotatable is coupled to the weight and is rotatable on the other side in the longitudinal direction, And a roller link coupled to the tension adjusting roller in a structure in which one side in the longitudinal direction is rotatable and connected to the other longitudinal side of the rotational link and the other side in the longitudinal direction is rotatable.

The tension adjusting roller is mounted so as to be in close contact with the bottom surface of the lower portion of the conveyance belt so as to increase the tension of the conveyance belt as it is moved upward and decrease the tension of the conveyance belt as it is moved downward .

Since the substrate can be heated in a reduced pressure state by using the substrate vacuum heating apparatus according to the present invention, it is possible to prevent the occurrence of bubbles on the substrate and to continuously supply and discharge the substrate while opening and closing the door of the vacuum chamber It is possible to increase the productivity and to maintain the tension of the conveyance belt constant even if the conveyance belt for conveying the substrate is expanded and contracted so that the substrate can be stably conveyed.

1 is a schematic view of a substrate vacuum heating apparatus according to the present invention.
2 is a perspective view of a vacuum chamber and a transfer unit included in the substrate vacuum heating apparatus according to the present invention.
3 is a side view of the transfer unit included in the substrate vacuum heating apparatus according to the present invention.
Figs. 4 and 5 are a perspective view and a bottom perspective view showing the structure of the rotation block side of the transfer unit. Fig.
6 is a schematic view showing the mounting structure of the conveyance belt included in the conveyance unit.
7 is a perspective view of a connection link included in the transfer unit.
8 is a perspective view of a supply side door included in the vacuum chamber.
9 and 10 are sectional views showing the process of opening and closing the supply side door and the discharge side door of the vacuum chamber.

Hereinafter, embodiments of a substrate vacuum heating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view of a substrate vacuum heating apparatus according to the present invention.

The apparatus for heating a substrate according to the present invention includes a device for heating the substrate in a reduced-pressure atmosphere so that bubbles are not generated in the substrate when the substrate is heated to mount an electronic chip or an electronic part on a substrate such as a PCB The substrate to be heated is placed in the vacuum chamber 100, and then the inside of the vacuum chamber 100 is heated.

That is, as shown in FIG. 1, the substrate vacuum heating apparatus according to the present invention includes a vacuum chamber 100 having an inner space sized to allow a substrate to be introduced thereinto and a vacuum chamber 100 in which vacuum pressure is formed inside the vacuum chamber 100 And a heating unit 300 for heating the inside of the vacuum chamber 100. As shown in FIG. The vacuum chamber 100 is provided with a supply port 110 and a discharge port 120 for supplying and withdrawing the substrate and a supply side door 130 for opening and closing the supply port 110 and a discharge port 120 for opening / A discharge side door 140 is mounted and a conveyor 160 for transferring the substrate drawn into the supply port 110 to the discharge port 120 is installed therein.

When the substrate is heated by using the vacuum heating apparatus according to the present invention, the substrate is first drawn into the vacuum chamber 100 and the supply-side door 130 and the discharge-side door 140 are closed The vacuum pump 200 is operated to form a vacuum in the vacuum chamber 100 and the heating unit 300 is operated to heat the substrate placed inside the vacuum chamber 100.

When the substrate is heated in the atmospheric pressure state, bubbles are generated at the position where the electronic components are seated in the substrate. However, when the substrate is heated in a vacuum in the space where the substrate is located, Effect can be obtained. The phenomenon that no bubbles are generated in the substrate when the substrate is heated in the state where the vacuum pressure is formed is a well-known technical idea in the related technical field of the present invention, and thus a detailed description thereof will be omitted.

The substrate vacuum heating apparatus according to the present invention includes a vacuum pump 200 for sucking and discharging air in the vacuum chamber 100 to form a vacuum in the vacuum chamber 100, A valve 210 for opening and closing the flow path between the vacuum pump 200 is indispensably required. The vacuum pump 200 can be operated in a state where the supply side door 130 and the discharge side door 140 of the vacuum chamber 100 are closed and the supply port 110 and the discharge port 120 are both closed, When the supply port 110 and the discharge port 120 are opened in a state in which vacuum pressure is formed in the vacuum chamber 100, the vacuum is generated in the vacuum chamber 100, Air can be rapidly introduced into the vacuum chamber 100 through the supply port 110 and the discharge port 120, so that a large impact force can be generated.

Therefore, the substrate vacuum heating apparatus according to the present invention stably releases the vacuum pressure in the vacuum chamber 100 by supplying nitrogen into the vacuum chamber 100 before the supply port 110 and the discharge port 120 are opened It is preferable that a vacuum release nitrogen tank 230 is additionally provided. Of course, even when air is supplied into the vacuum chamber 100 before the supply port 110 and the discharge port 120 are opened, the internal vacuum pressure of the vacuum chamber 100 can be released. However, It is preferable that nitrogen is supplied into the vacuum chamber 100. In order to adjust the vacuum pressure in the vacuum chamber 100, the air suction amount of the vacuum pump 200 must be adjusted. In general, since the vacuum pump 200 has a structure that can not finely control the air suction amount, There is a limit in finely adjusting the vacuum pressure in the vacuum chamber 100. [

Therefore, the substrate vacuum heating apparatus according to the present invention includes a vacuum control nitrogen tank 220 for controlling the vacuum pressure inside the vacuum chamber 100 by supplying nitrogen to the flow path connecting the vacuum chamber 100 and the vacuum pump 200, May be additionally provided. When nitrogen is supplied from the vacuum control nitrogen tank 220 even if the air suction amount of the vacuum pump 200 is constant, the air in the vacuum chamber 100 is more The operator adjusts the nitrogen supply amount of the vacuum regulating nitrogen tank 220 so that the amount of nitrogen supplied to the inside of the vacuum chamber 100 is controlled by controlling the amount of nitrogen supplied to the vacuum regulating nitrogen tank 220 There is an advantage that the magnitude of the vacuum pressure to be formed can be finely adjusted.

The supply port 110 and the discharge port 120 of the vacuum chamber 100 are provided with a transfer unit (not shown) for supplying a substrate to the inside of the vacuum chamber 100 and transferring the substrate discharged from the vacuum chamber 100 to a storage space. 400 are respectively provided. The detailed structure and operation principle of the transfer unit 400 will be described in detail with reference to separate drawings.

FIG. 2 is a perspective view of a vacuum chamber and a transfer unit included in the substrate vacuum heating apparatus according to the present invention, FIG. 3 is a side view of the transfer unit included in the substrate vacuum heating apparatus according to the present invention, Fig. 8 is a perspective view and a bottom perspective view showing the structure of the rotating block side of the unit; Fig.

A transfer unit 400 for supplying a substrate to the supply port 110 side and transferring the substrate discharged to the discharge port 120 is connected to one or more drive rollers 412 and idle rollers 414, And a conveyance belt 410 for conveying the substrate, which is placed on the upper surface by being rotated by the power of the conveyor 412, in the longitudinal direction. When the conveyance belt 410 is installed inside the supply port 110 and the discharge port 120, the conveyance belt 410 interferes with the supply side door 130 and the discharge side door 140, And the discharge port 120. In this case,

Therefore, the conveyor belt 410 and the conveyor 160 must be separated from each other by the thickness of the side wall of the vacuum chamber 100 and the thickness of the door. Thus, when the conveyor belt 410 is separated from the conveyor 160, In addition, the substrate may fall between the conveyor belt 410 and the conveyor 160. Accordingly, the transfer unit 400 may further include a rotation block 420 connecting and disconnecting the conveyor belt 410 with the conveyor belt 160 on the same principle as a bascule bridge. That is, the rotation block 420 is rotatably coupled to the feed port 110 or the discharge port 120 of the feed unit 400. When the rotation block 420 is rotated to the horizontal direction, the extension end is connected to the conveyor 160 Side door 130 and the discharge-side door 140 are closed when the supply-side door 130 and the discharge-side door 140 are closed, (Not shown in the figure).

The rotation block 420 is rotatably supported on the rotation shaft 422 having a length in the width direction of the conveyance belt 410 so that the substrate passing over the rotation block 420 can be smoothly conveyed. It is preferable that the conveying roller 424 is mounted. When the conveying roller 424 is provided in the rotation block 420 as described above, the substrate passing on the rotation block 420 receives the rolling friction of the conveying roller 424, but does not receive the sliding friction, So that it can pass over the rotation block 420.

The rotary block 420 may be rotated by a separate power source. However, if a separate power source for rotating the rotary block 420 is provided, the structure of the substrate vacuum heating apparatus according to the present invention becomes complicated The manufacturing cost is increased. Therefore, the rotation block 420 is not rotated by a separate power source, but is configured to be pushed and rotated by the supply-side door 130 and the discharge-side door 140.

That is, the supply-side door 130 and the discharge-side door 140 are positioned lower than the rotary block 420 and are configured to seal the supply port 110 or the discharge port 120 as they are transported upward, The rotation block 420 is pushed by the supply side door 130 or the discharge side door 140 which is lifted to close the supply port 110 or the discharge port 120 and is rotated so that the end is lifted upward, And may be configured to be drawn out from the sphere 110 or the discharge port 120.

The supply side door 130 and the discharge side door 140 and the rotation block 420 are moved in the process of pushing up the rotation block 420 by the supply side door 130 and the discharge side door 140, There is a risk of damage. In order to prevent such damage, at least one rolling roller 426 is mounted at a point of contact with the supply-side door 130 or the discharge-side door 140 rising in the rotary block 420. When the rolling roller 426 is mounted as described above, the supply side door 130 and the discharge side door 140 are in contact with only the rolling roller 426 without contacting the bottom surface of the rotation block 420, Side door 140 and the rotary block 420 are prevented from being damaged by friction and the power loss caused by friction between the supply-side door 130 and the discharge-side door 140 with the rotary block 420 Can be minimized.

6 is a structural view showing the mounting structure of the conveyance belt 410 included in the conveyance unit 400 and FIG. 7 is a perspective view of the connection link 440 included in the conveyance unit 400. FIG.

The heating unit 300 for heating the substrate is configured not only to be located inside the vacuum chamber 100 but also on the transfer unit 400 so as to heat the transferred substrate on the transfer belt 410 of the transfer unit 400 . In this case, the conveyance belt 410 is made of metal so that it can not be melted or broken even if the heat is applied at a high temperature. The conveyance belt 410 made of metal has a length There is a characteristic that the tension can not be kept constant because it is lengthened or shortened. When the length of the conveyance belt 410 becomes long and the tension is weakened, a portion where the substrate is seated is lowered downward, so that the conveyance of the substrate can not be smoothly performed. Also, the length of the conveyance belt 410 becomes short, The conveyance belt 410 may be broken.

The substrate vacuum heating apparatus according to the present invention is configured such that the tension of the conveyance belt 410 can be kept constant even if the length of the conveyance belt 410 is variable, Feature. That is, the transfer unit 400 includes a tension adjusting roller 450 that is mounted in a structure that can be raised or lowered while being in contact with the bottom surface of the conveyance belt 410, and a weight 430 is coupled to one side in the longitudinal direction The tension adjusting roller 450 may be coupled to the other side of the longitudinal direction so that the tension adjusting roller 450 is lifted by the weight of the weight 430.

The connection link 440 is connected to the weight 430 in such a structure that one side in the longitudinal direction (the lower side in FIG. 7) is rotatable and the other side in the longitudinal direction 7), a weight weight link 444 coupled to one longitudinal side (left side in FIG. 7) of the pivotal link 442 in a rotatable structure, and a structure in which one side in the longitudinal direction (upper side in FIG. 7) And a roller link 446 coupled to the tension adjusting roller 450 in a structure that is coupled to the other longitudinal side of the rotational link 442 (right side in FIG. 7) and rotatable on the other longitudinal side (lower side in FIG. 7) .

7, when the weight link 444 descends downward due to the own weight of the weight 430, the rotation link 442 is rotated counterclockwise and the roller link 446 is rotated counterclockwise, The tension adjusting roller 450 coupled with the roller link 446 is lifted up and the conveying belt 410 is tensioned. That is, even if the length of the conveyance belt 410 is increased by heating, the conveyance belt 410 is tightly pressed by the tension adjusting roller 450 to maintain a predetermined level of tension, Is not generated. On the other hand, when the conveyance belt 410 is cooled, the conveyance belt 410 may be shortened until the tension adjustment roller 450 can be pushed down, so that the conveyance belt 410 is likely to break There is an advantage that it does not.

Although the tension adjusting roller 450 is in close contact with the bottom surface of the conveyance belt 410 and is moved upward by the weight of the weight 430 to increase the tension of the conveyance belt 410, The tension adjusting roller 450 may be replaced with a structure that is closely attached to the upper surface of the conveyance belt 410 and moves downward by a load of the weight 430 to increase the tension of the conveyance belt 410. [ That is, the mounting structure of the tension adjusting roller 450 can be replaced with any structure as long as it can receive the load of the weight 430 to tighten the conveyance belt 410.

FIG. 8 is a perspective view of a supply side door included in the vacuum chamber, and FIGS. 9 and 10 are sectional views showing the process of opening and closing the supply side door and the discharge side door of the vacuum chamber.

During the supply and discharge of the substrate to the vacuum chamber 100, the supply side door 130 and the discharge side door 140 both descend downward as shown in FIG. 9, and the supply port 110 and the discharge port 120 are opened , The rotation block 420 is horizontally rotated so that its tip end faces the inside of the vacuum chamber 100. Therefore, the substrate having undergone the vacuum heat treatment is transferred to the right transfer unit 400 through the discharge port 120, and the substrate newly provided by the left transfer unit 400 is transferred to the conveyor of the vacuum chamber 100 through the supply port 110 (Not shown).

The substrate on which the vacuum annealing process is completed is discharged to the outside of the vacuum chamber 100. When a new substrate requiring vacuum annealing is supplied into the vacuum chamber 100, the supply side door 130 and the discharge side door The process of heating the substrate on the conveyor 160 while repeating the process of forming the vacuum pressure inside the vacuum chamber 100 while the supply port 110 and the discharge port 120 are closed. At this time, the rotation block 420 engaged with the supply port 110 and the discharge port 120 is rotated while the rolling roller 426 is pushed upward by the supply side door 130 and the discharge side door 140, When the upper surface of the discharge side door 130 and the discharge side door 140 are formed in a planar shape and the rolling roller 426 is pushed up by the supply side door 130 and the discharge side door 140, A large impact may be generated in the process of passing over the upper edge of the discharge side door 140.

Therefore, the inclined block 150 may be provided at a portion of the upper end of the supply-side door 130 and the discharge-side door 140 where the rolling roller 426 contacts. The inclined block 150 is inclined in a direction away from the conveying unit 400 as the side toward the conveying unit 400 is moved upward. The rolling roller 426 of the conveying unit 400 is inclined with respect to the inclined block 150 Side door 130 and the discharge-side door 140. As a result, the supply-side door 130 and the discharge- Since the shape of the inclined block 150 can be variously changed according to various conditions such as the rotation angle of the rotation block 420 and the specification of the rolling roller 426, It is omitted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the present invention.

100: vacuum chamber 110:
120: exhaust port 130: supply side door
140: discharge side door 150: inclined block
160: Conveyor 200: Vacuum pump
210: valve 220: vacuum regulating nitrogen tank
230: vacuum release nitrogen tank 300: heating section
400: conveying unit 410: conveying belt
412: driving roller 414: idler roller
420: rotating block 422: rotating shaft
424: Feed roller 426: Roller roller
430: weight 440: connection link
442: rotation link 444: weight link
446: roller link 450: tension adjusting roller

Claims (8)

delete A supply port 110 which is opened and closed by the supply-side door 130; a discharge port 120 which is opened and closed by the discharge-side door 140; A vacuum chamber (100) having a conveyor (160) for conveying the substrate to the outlet (120);
A vacuum pump 200 for forming vacuum pressure inside the vacuum chamber 100;
A heating unit 300 for heating the inside of the vacuum chamber 100; And
And a transfer belt 410 connected to the one or more driving rollers 412 and the idle rollers 414 for transferring a substrate placed on the upper surface of the vacuum chamber 100, A transfer unit 400 installed in the discharge port 120, respectively; / RTI >
The conveying unit 400 includes a tension adjusting roller 450 mounted on the conveying belt 410 so as to be lifted or lowered while being in contact with the conveying belt 410, Further comprising a connection link (440) coupled to the tension regulating roller (450) to raise or lower the tension regulating roller (450) by the weight of the weight (430).
3. The method of claim 2,
The transfer unit 400 is extended from the end of the supply port 110 or the discharge port 120 toward the supply port 110 or the discharge port 120, A rotary block 420 coupled to the rotary block 420 to be rotatable about a rotary shaft 422 having a length corresponding to the length of the rotary block 420, And one or more transfer rollers (424) mounted on the substrate.
The method of claim 3,
The supply side door 130 and the discharge side door 140 are positioned lower than the rotation block 420 and are configured to seal the supply port 110 or the discharge port 120 as they are transported upward ,
The rotation block 420 is pushed by the supply side door 130 or the discharge side door 140 which is raised to close the supply port 110 or the discharge port 120 so that an end of the rotation block 420 is connected to the supply port 110 or the discharge port 120, (120). ≪ / RTI >
5. The method of claim 4,
Wherein one or more rolling rollers (426) are mounted at a point of contact with the supply-side door (130) or the discharge-side door (140) rising in the rotation block (420).
delete 3. The method of claim 2,
The connection link 440 includes a rotation link 442 to be mounted in a rotatable structure in the middle thereof and a structure in which one side of the connection link 440 is rotatable in the longitudinal direction and is coupled to the weight 430, A weight weight link 444 coupled to one longitudinal side of the pivot link 442 and a second weight link 444 coupled to the other longitudinal side of the pivot link 442 in a longitudinally rotatable manner, And a roller link (446) coupled to the tension adjustment roller (450).
3. The method of claim 2,
The tension adjusting roller 450 is mounted so as to be in close contact with the bottom surface of the lower portion of the conveyance belt 410 and increases the tension of the conveyance belt 410 as it is moved upward, And is configured to reduce the tension of the conveyance belt (410).
KR1020140113413A 2014-08-28 2014-08-28 Vacuum heating device for circuit board KR101469859B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582955A (en) * 1991-09-19 1993-04-02 Daiken Kagaku Kogyo Kk Ink-form solder for printing and fine soldering method
JPH0747207B2 (en) * 1990-11-22 1995-05-24 松下電器産業株式会社 Reflow equipment
US5573174A (en) * 1994-08-15 1996-11-12 Pekol; Robert Automatic reflow soldering system
KR20090005488A (en) * 2007-07-09 2009-01-14 삼성전자주식회사 Apparatus and method for reflow

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0747207B2 (en) * 1990-11-22 1995-05-24 松下電器産業株式会社 Reflow equipment
JPH0582955A (en) * 1991-09-19 1993-04-02 Daiken Kagaku Kogyo Kk Ink-form solder for printing and fine soldering method
US5573174A (en) * 1994-08-15 1996-11-12 Pekol; Robert Automatic reflow soldering system
KR20090005488A (en) * 2007-07-09 2009-01-14 삼성전자주식회사 Apparatus and method for reflow

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