KR101469859B1 - Vacuum heating device for circuit board - Google Patents
Vacuum heating device for circuit board Download PDFInfo
- Publication number
- KR101469859B1 KR101469859B1 KR1020140113413A KR20140113413A KR101469859B1 KR 101469859 B1 KR101469859 B1 KR 101469859B1 KR 1020140113413 A KR1020140113413 A KR 1020140113413A KR 20140113413 A KR20140113413 A KR 20140113413A KR 101469859 B1 KR101469859 B1 KR 101469859B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- side door
- vacuum
- supply
- vacuum chamber
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Tunnel Furnaces (AREA)
Abstract
The substrate vacuum heating apparatus according to the present invention is a vacuum heating apparatus for a substrate having a chamber structure having an internal space, comprising a supply port opened and closed by a supply-side door, an exhaust port opened and closed by a discharge-side door, A vacuum chamber having a conveyor for conveyance; A vacuum pump for forming vacuum pressure inside the vacuum chamber; A heating unit for heating the inside of the vacuum chamber; . Since the substrate can be heated in a reduced pressure state by using the substrate vacuum heating apparatus according to the present invention, it is possible to prevent the occurrence of bubbles on the substrate and to continuously supply and discharge the substrate while opening and closing the door of the vacuum chamber It is possible to increase the productivity and to maintain the tension of the conveyance belt constant even if the conveyance belt for conveying the substrate is expanded and contracted so that the substrate can be stably conveyed.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vacuum heating apparatus for heating a printed circuit board in a vacuum state so that bubbles are not generated when various chips or components are mounted on a substrate, And a vacuum heating apparatus configured to stably supply the vacuum chamber to the inside of the chamber.
Generally, when mounting electronic components such as various chips on various substrates such as a printed circuit board and a flexible circuit board, the substrate is heated to a temperature equal to or higher than a reference value. When the substrate is heated at atmospheric pressure There is a problem that a void is generated on the contact surface between the substrate and the electronic component.
Therefore, in heating the substrate, a method of heating the substrate to be heated in a low atmospheric pressure atmosphere has been proposed. However, in order to draw the substrate into the vacuum chamber or pull out the substrate in the vacuum chamber to the outside, The manufacturing cost of the apparatus is greatly increased.
In addition, when the substrate is pulled in and out of the vacuum chamber using a separate transport tray, the substrate placed in the vacuum chamber must first be drawn out before the new substrate is supplied into the vacuum chamber, Can not be performed at the same time. Therefore, a long time is required for processing the substrate, which increases the manufacturing cost of the substrate.
In addition, a method of using a conveyor belt of a conveyor structure to continuously supply the substrate may be proposed. When the conveyor belt is heated, the conveyor belt is stretched so that the tension of the conveyor belt is within the reference range There is a problem in that it can not be maintained.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a method and apparatus for heating a substrate on a vacuum within a reference range so that bubbles are not generated on the substrate, And it is an object of the present invention to provide a substrate vacuum heating apparatus capable of always keeping the tension of a conveyance belt for conveying a substrate constant.
According to another aspect of the present invention, there is provided a substrate vacuum heating apparatus including a supply port which is opened and closed by a supply-side door, a discharge port which is opened and closed by a discharge-side door, A vacuum chamber having a conveyor for transferring the substrate to the discharge port; A vacuum pump for forming vacuum pressure inside the vacuum chamber; And a heating unit for heating the inside of the vacuum chamber.
And a transfer belt which is connected to the at least one drive roller and the idle roller so as to transfer the substrate placed on the upper surface, the transfer unit being installed at the supply port and the discharge port of the vacuum chamber, respectively.
The transfer unit includes a rotation block extending from the end of the supply port or the discharge port toward the supply port or the discharge port and rotatable about a rotation shaft having a length in the width direction of the transfer belt, And one or more transport rollers mounted on the rotary block so as to roll in a traveling direction of the substrate transported on the transport belt.
Wherein the supply side door and the discharge side door are located lower than the rotary block and are configured to close the supply port or the discharge port as they are transported upward, Side door or the discharge-side door so that the end is drawn out from the supply port or the discharge port.
One or more rolling rollers are mounted at the point of contact with the supply-side door or the discharge-side door that rises in the rotary block.
The conveying unit includes a tension adjusting roller mounted on the conveying belt so as to be lifted or lowered in a state of being in contact with the conveying belt, a tension adjusting roller attached to one side of the tensioning roller in the longitudinal direction, Further comprising a connecting link for raising or lowering the tension adjusting roller.
The connection link includes a pivot link mounted in a structure rotatable in the middle portion thereof and a pivot link having a structure in which one side in the longitudinal direction is rotatable is coupled to the weight and is rotatable on the other side in the longitudinal direction, And a roller link coupled to the tension adjusting roller in a structure in which one side in the longitudinal direction is rotatable and connected to the other longitudinal side of the rotational link and the other side in the longitudinal direction is rotatable.
The tension adjusting roller is mounted so as to be in close contact with the bottom surface of the lower portion of the conveyance belt so as to increase the tension of the conveyance belt as it is moved upward and decrease the tension of the conveyance belt as it is moved downward .
Since the substrate can be heated in a reduced pressure state by using the substrate vacuum heating apparatus according to the present invention, it is possible to prevent the occurrence of bubbles on the substrate and to continuously supply and discharge the substrate while opening and closing the door of the vacuum chamber It is possible to increase the productivity and to maintain the tension of the conveyance belt constant even if the conveyance belt for conveying the substrate is expanded and contracted so that the substrate can be stably conveyed.
1 is a schematic view of a substrate vacuum heating apparatus according to the present invention.
2 is a perspective view of a vacuum chamber and a transfer unit included in the substrate vacuum heating apparatus according to the present invention.
3 is a side view of the transfer unit included in the substrate vacuum heating apparatus according to the present invention.
Figs. 4 and 5 are a perspective view and a bottom perspective view showing the structure of the rotation block side of the transfer unit. Fig.
6 is a schematic view showing the mounting structure of the conveyance belt included in the conveyance unit.
7 is a perspective view of a connection link included in the transfer unit.
8 is a perspective view of a supply side door included in the vacuum chamber.
9 and 10 are sectional views showing the process of opening and closing the supply side door and the discharge side door of the vacuum chamber.
Hereinafter, embodiments of a substrate vacuum heating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
1 is a schematic view of a substrate vacuum heating apparatus according to the present invention.
The apparatus for heating a substrate according to the present invention includes a device for heating the substrate in a reduced-pressure atmosphere so that bubbles are not generated in the substrate when the substrate is heated to mount an electronic chip or an electronic part on a substrate such as a PCB The substrate to be heated is placed in the
That is, as shown in FIG. 1, the substrate vacuum heating apparatus according to the present invention includes a
When the substrate is heated by using the vacuum heating apparatus according to the present invention, the substrate is first drawn into the
When the substrate is heated in the atmospheric pressure state, bubbles are generated at the position where the electronic components are seated in the substrate. However, when the substrate is heated in a vacuum in the space where the substrate is located, Effect can be obtained. The phenomenon that no bubbles are generated in the substrate when the substrate is heated in the state where the vacuum pressure is formed is a well-known technical idea in the related technical field of the present invention, and thus a detailed description thereof will be omitted.
The substrate vacuum heating apparatus according to the present invention includes a
Therefore, the substrate vacuum heating apparatus according to the present invention stably releases the vacuum pressure in the
Therefore, the substrate vacuum heating apparatus according to the present invention includes a vacuum
The
FIG. 2 is a perspective view of a vacuum chamber and a transfer unit included in the substrate vacuum heating apparatus according to the present invention, FIG. 3 is a side view of the transfer unit included in the substrate vacuum heating apparatus according to the present invention, Fig. 8 is a perspective view and a bottom perspective view showing the structure of the rotating block side of the unit; Fig.
A
Therefore, the
The
The
That is, the supply-
The
6 is a structural view showing the mounting structure of the
The
The substrate vacuum heating apparatus according to the present invention is configured such that the tension of the
The
7, when the
Although the
FIG. 8 is a perspective view of a supply side door included in the vacuum chamber, and FIGS. 9 and 10 are sectional views showing the process of opening and closing the supply side door and the discharge side door of the vacuum chamber.
During the supply and discharge of the substrate to the
The substrate on which the vacuum annealing process is completed is discharged to the outside of the
Therefore, the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the present invention.
100: vacuum chamber 110:
120: exhaust port 130: supply side door
140: discharge side door 150: inclined block
160: Conveyor 200: Vacuum pump
210: valve 220: vacuum regulating nitrogen tank
230: vacuum release nitrogen tank 300: heating section
400: conveying unit 410: conveying belt
412: driving roller 414: idler roller
420: rotating block 422: rotating shaft
424: Feed roller 426: Roller roller
430: weight 440: connection link
442: rotation link 444: weight link
446: roller link 450: tension adjusting roller
Claims (8)
A vacuum pump 200 for forming vacuum pressure inside the vacuum chamber 100;
A heating unit 300 for heating the inside of the vacuum chamber 100; And
And a transfer belt 410 connected to the one or more driving rollers 412 and the idle rollers 414 for transferring a substrate placed on the upper surface of the vacuum chamber 100, A transfer unit 400 installed in the discharge port 120, respectively; / RTI >
The conveying unit 400 includes a tension adjusting roller 450 mounted on the conveying belt 410 so as to be lifted or lowered while being in contact with the conveying belt 410, Further comprising a connection link (440) coupled to the tension regulating roller (450) to raise or lower the tension regulating roller (450) by the weight of the weight (430).
The transfer unit 400 is extended from the end of the supply port 110 or the discharge port 120 toward the supply port 110 or the discharge port 120, A rotary block 420 coupled to the rotary block 420 to be rotatable about a rotary shaft 422 having a length corresponding to the length of the rotary block 420, And one or more transfer rollers (424) mounted on the substrate.
The supply side door 130 and the discharge side door 140 are positioned lower than the rotation block 420 and are configured to seal the supply port 110 or the discharge port 120 as they are transported upward ,
The rotation block 420 is pushed by the supply side door 130 or the discharge side door 140 which is raised to close the supply port 110 or the discharge port 120 so that an end of the rotation block 420 is connected to the supply port 110 or the discharge port 120, (120). ≪ / RTI >
Wherein one or more rolling rollers (426) are mounted at a point of contact with the supply-side door (130) or the discharge-side door (140) rising in the rotation block (420).
The connection link 440 includes a rotation link 442 to be mounted in a rotatable structure in the middle thereof and a structure in which one side of the connection link 440 is rotatable in the longitudinal direction and is coupled to the weight 430, A weight weight link 444 coupled to one longitudinal side of the pivot link 442 and a second weight link 444 coupled to the other longitudinal side of the pivot link 442 in a longitudinally rotatable manner, And a roller link (446) coupled to the tension adjustment roller (450).
The tension adjusting roller 450 is mounted so as to be in close contact with the bottom surface of the lower portion of the conveyance belt 410 and increases the tension of the conveyance belt 410 as it is moved upward, And is configured to reduce the tension of the conveyance belt (410).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140113413A KR101469859B1 (en) | 2014-08-28 | 2014-08-28 | Vacuum heating device for circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140113413A KR101469859B1 (en) | 2014-08-28 | 2014-08-28 | Vacuum heating device for circuit board |
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KR101469859B1 true KR101469859B1 (en) | 2014-12-08 |
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KR1020140113413A KR101469859B1 (en) | 2014-08-28 | 2014-08-28 | Vacuum heating device for circuit board |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0582955A (en) * | 1991-09-19 | 1993-04-02 | Daiken Kagaku Kogyo Kk | Ink-form solder for printing and fine soldering method |
JPH0747207B2 (en) * | 1990-11-22 | 1995-05-24 | 松下電器産業株式会社 | Reflow equipment |
US5573174A (en) * | 1994-08-15 | 1996-11-12 | Pekol; Robert | Automatic reflow soldering system |
KR20090005488A (en) * | 2007-07-09 | 2009-01-14 | 삼성전자주식회사 | Apparatus and method for reflow |
-
2014
- 2014-08-28 KR KR1020140113413A patent/KR101469859B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0747207B2 (en) * | 1990-11-22 | 1995-05-24 | 松下電器産業株式会社 | Reflow equipment |
JPH0582955A (en) * | 1991-09-19 | 1993-04-02 | Daiken Kagaku Kogyo Kk | Ink-form solder for printing and fine soldering method |
US5573174A (en) * | 1994-08-15 | 1996-11-12 | Pekol; Robert | Automatic reflow soldering system |
KR20090005488A (en) * | 2007-07-09 | 2009-01-14 | 삼성전자주식회사 | Apparatus and method for reflow |
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