KR101446959B1 - Apparatus for test shear force of package lid for semiconductor - Google Patents
Apparatus for test shear force of package lid for semiconductor Download PDFInfo
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- KR101446959B1 KR101446959B1 KR1020130075391A KR20130075391A KR101446959B1 KR 101446959 B1 KR101446959 B1 KR 101446959B1 KR 1020130075391 A KR1020130075391 A KR 1020130075391A KR 20130075391 A KR20130075391 A KR 20130075391A KR 101446959 B1 KR101446959 B1 KR 101446959B1
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- lead
- housing unit
- package
- layer
- shear
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/24—Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
An apparatus for testing a shear force of a semiconductor package lead is disclosed.
According to an embodiment of the present invention, there is provided a package comprising: a first housing unit provided with a front end block to which an end of one layer is attached in a package lead in which a printed circuit board layer and a lead layer are superimposedly coupled; And a second housing unit having a fixing means for receiving the external force in the direction opposite to the external force direction of the first housing unit and preventing the flow of the package lead and a shearing means for hanging another layer of the package lead A device for testing a shear force of a semiconductor package lead can be provided.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for testing a shear force of a semiconductor package lead, and more particularly to a device for testing a shear force of a semiconductor package lead for measuring a bonding force between a lead- will be.
2. Description of the Related Art In recent years, a semiconductor package including a semiconductor device that stores vast amounts of data and processes data stored within a short time has been developed.
The semiconductor package includes a semiconductor chip manufacturing process for forming a semiconductor chip by integrating elements such as transistors, resistors, capacitors, and the like on a wafer, a die sorting process for testing a good semiconductor chip by inspecting electrical characteristics of the semiconductor chip, And is fabricated by a packaging process in which a semiconductor chip, which is individualized and electrically connected to an external circuit board or the like, and which is weak in embrittlement is protected from impact / vibration applied from the outside.
The semiconductor package as described above is also commonly referred to as a package lead. The package lead includes a printed circuit board (PCB) and a lead, and the printed circuit board and the lead are overlapped Are bonded to each other by a bonding material such as an epoxy or a double-sided tape excellent in bonding strength.
Since the bonding force between the printed circuit board and the lead is an important factor directly related to the durability of the semiconductor package lead, it is necessary to measure the bonding force of the semiconductor package lead.
Shear force test is effective to measure the bond strength of package leads. However, since the device for performing shear force test has not been provided so far, We are conducting a test.
In order to perform the pull test, first, the substrate jig is bonded to the printed circuit board side of the package lead using a bonding material such as epoxy or tape, and the lead jig is bonded to the lead side using the bonding material as described above.
When the substrate jig and the lead jig are firstly bonded to the printed circuit board and the lead, they are put into a high-temperature oven and subjected to a hardening process for a certain period of time, thereby increasing the bonding force.
After the substrate jig and the lead jig are completely bonded to the printed circuit board and the lead through the oven insertion, the substrate jig and the lead jig are connected to the predetermined pull test device and pulled in opposite directions to each other, Is measured.
However, in the pull test of the package leads as described above, not only the substrate jig and the lead jig need to be primarily bonded to the printed circuit board and the lead, but also must be put in a separate oven and heated. Which is inconvenient and time consuming.
In addition, since the bonding material is bonded not only between the printed circuit board and the leads but also the substrate jig and the lead jig, it is difficult to measure only the bonding force between the printed circuit board and the leads. have.
In addition, once the pull test is completed, the PCB jig and the lead jig, which are respectively bonded to the printed circuit board and the leads, must be removed for recycling, and the operation of removing the bonded substrate jig and lead jig is also very inconvenient and time consuming .
An object of the present invention is to provide a device for testing a shear force of a semiconductor package lead which is simple in preparation for testing a package lead shear force and can shorten a preparation time .
In addition, the embodiment of the present invention is intended to provide a device for testing a shear force of a semiconductor package lead that can increase reliability in measuring a bonding force between a printed circuit board and a lead.
In addition, the embodiment of the present invention is intended to provide a device for testing a shear force of a semiconductor package lead, which requires no subsequent work after the test is completed.
According to an embodiment of the present invention, there is provided a package comprising: a first housing unit provided with a front end block to which an end of one layer is attached in a package lead in which a printed circuit board layer and a lead layer are superimposedly coupled; And a second housing unit having a fixing means for receiving the external force in the direction opposite to the external force direction of the first housing unit and preventing the flow of the package lead and a shearing means for hanging another layer of the package lead A device for testing a shear force of a semiconductor package lead can be provided.
The first housing unit may include a first housing body having a first horizontal portion, a first vertical portion bent from the first horizontal portion and having a first receiving groove formed at a lower portion thereof, And a test bed to which the front end block is coupled at a lower portion thereof.
The front end block may protrude toward the second housing unit.
The protruding amount of the front end block is adjustable through the elongated hole formed at the lower end of the test bed and the bolt.
The first housing unit is provided with a first guide member for guiding a relative movement with the second housing unit, and the first guide member is arranged to pass through one side of the second housing unit.
The second housing unit includes a second housing body having a second horizontal portion, a second vertical portion bent from the second horizontal portion and having a second receiving groove formed thereon; A coupling member coupled to the second receiving groove and having a hole for fixing means for mounting the fixing means and a hole for shearing means for installing the shearing means; And a coupling piece laminated on the coupling member and provided with the hole for the fixing member.
The second housing unit is provided with a second guide member for guiding a relative movement with the first housing unit, and the second guide member is arranged to pass through one side of the first housing unit.
A guide bush is provided on the first guide member and the second guide member.
The fixing means includes a lead fixing body which is installed on the first housing unit so as to freely move toward the package lead and prevents the package lead from flowing; And a locking handle disposed in a direction crossing the lead fixture to restrict the flow of the lead fixture.
A trimming portion in which a portion of the outer circumferential surface is chamfered by a predetermined interval is formed in the lead fixture and an eccentric portion for pressing the lead fixture by rotation is formed at a portion of the locking handle in contact with the trimming portion .
Wherein the shearing means comprises at least one shear shaft provided to be hung on another layer of the package lead; An adjustment screw for adjusting an entry amount of the shear shaft with respect to the package lead; And an elastic member that provides an elastic force in a direction in which the shear shaft is away from the package.
At the end of the shear shaft, a shear bar is stably coupled to the other layer of the package lead.
The first housing unit is provided with a first joint holder for connection with external force providing means.
The second housing unit is provided with a second joint holder for connecting to the external force providing means or the fixing portion.
The external force providing means may be a load cell.
According to the embodiment of the present invention, the preparation process for testing the shear force of the package leads is very simple and the preparation time is shortened.
In addition, according to the embodiment of the present invention, since only the bonding force between the printed circuit board and the lead is measured in measuring the shear force of the package lead, the reliability can be very high.
Further, according to the embodiment of the present invention, there is an advantage that the test of the shear force of the package leads becomes very simple since no additional work is required after the test is finished.
1 is an exploded perspective view showing an apparatus for testing a shear force of a semiconductor package lead according to an embodiment of the present invention,
2 is an assembled perspective view of FIG. 1,
FIG. 3 is a side view showing a state in which a package lead is seated on a front end block according to an embodiment of the present invention;
FIGS. 4 and 5 are views showing structures of a lead fixture and a locking handle according to an embodiment of the present invention;
6 is a plan view showing the configuration of the shearing means of the present embodiment,
7 is a side view showing a state in which the shear shaft of the present embodiment is caught in the lead layer of the package lead,
8 is a view for schematically explaining a state in which a printed circuit board layer and a lead layer of a package lead are separated by a shear force test according to the present embodiment,
9 is a view showing the shear bar coupled to the front end shaft of the present embodiment,
Figs. 10 and 11 are diagrams for explaining the preparatory process of the shearing force test according to the present embodiment. Fig.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In describing the present embodiment, the same reference numerals and symbols are used for the same components, and further description thereof will be omitted.
An apparatus for testing a shear force of a semiconductor package lead according to an embodiment of the present invention will be described with reference to Figs.
FIG. 1 is an exploded perspective view showing a device for testing a shear force of a semiconductor package lead according to an embodiment of the present invention, FIG. 2 is an assembled perspective view of FIG. 1, Fig.
As shown in FIGS. 1 and 2, the device for testing a sheathing force for semiconductor package leads according to the present embodiment may include a
The
The
3, a layer of the printed
However, it is important that the
Here, the
The
The first
The first
The
The
3, when the printed
It is preferable that the amount of protrusion of the
The amount of protrusion of the
In addition, the
One of the
The
The
In this case, the
The fixing means 240 will be further described with reference to Figs. 4 and 5. Fig.
4 and 5 are views showing the structure of the lead fixture and the locking handle 242 according to the embodiment of the present invention. As shown further herein, the fixing means 240 mainly includes the lead fixture 241 A locking
The
Since the
The locking handle 242 is also disposed in a direction crossing the
That is, the
4 and 5 show a structure in which the
In this embodiment, since the
The locking handle 242 is disposed at a lower portion of the
Therefore, when the
4, when the locking
The shearing means 250 will be described with reference to FIGS. 6 to 8. FIG.
Fig. 6 is a plan view showing the configuration of the shearing means of this embodiment. Fig. 7 is a side view showing a state in which the
The shear means 250 may include a
However, in order to more stably catch the
The
The
The lower end of the layer of the printed
Therefore, it is very important to adjust the entry amount of the
The adjusting
In order to increase the reliability of the shear force test, the
Therefore, the
9, a
The
Therefore, in order to stably catch the
The
The
The
The
The hole for fixing means H formed on the
The hole K for the shearing means is formed on the upper portion of the
In addition, the
A separate fixing hole H is formed in the
The shape and number of the holes described above can be practiced by those skilled in the art in accordance with the configurations described above, so that detailed description is omitted.
Meanwhile, the
One of the
The
The guide bushes b may be provided on the
The guide bushing b includes one side of the
Also, as shown in FIGS. 1 and 2, the
The
Also, the
However, as described above, the
Hereinafter, a preparation process for testing the shear force of the
The user can freely move the
In this state, the user removes the
When the state shown in FIG. 3 is completed, the user pushes the
As shown in FIG. 11, when the
7, the user uses the adjusting
2, the first
When the above-described series of processes is completed, the primary housing unit or the primary housing unit and the secondary housing unit are pulled out through the external force providing means so that the
As the
While the present invention has been described in connection with what is presently considered to be preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention is not limited thereto.
10: package lead 11: printed circuit board
12: Lead
100: first housing unit 110: first housing body
111: first horizontal part 112: first vertical part
120: test bed 130: shear block
140: first guide member 150: first joint holder
200: second housing unit 210: second housing body
211: second horizontal part 212: second vertical part
220: coupling member 230: coupling member
240: fixing means 241: lead fixing body
242: locking handle 250: shearing means
251: Full shaft 252: Adjusting screw
253: elastic member 260: second guide member
270: second joint holder
Claims (15)
And a second housing unit having a fixing means for receiving an external force in a direction opposite to an external force direction of the first housing unit and preventing the flow of the package lead and a shearing means for hanging another layer of the package lead, ,
Wherein,
A lead fixture installed on the first housing unit so as to freely move toward the package lead to prevent the package lead from flowing; And a locking handle disposed in a direction crossing the lead fixture to limit the flow of the lead fixture,
And the shear force is measured while the printed circuit board layer and the lead layer are separated from each other as the first housing unit and the second housing unit move relative to each other in opposite directions.
The first housing unit includes:
A first housing body having a first horizontal portion and a first vertical portion bent from the first horizontal portion and having a first receiving groove formed at a lower portion thereof; And
And a test bed coupled to the receiving groove of the first vertical portion and coupled with the front end block at a lower portion thereof.
Wherein the front end block is protruded toward the second housing unit side.
Wherein a protruding amount of the front end block is adjustable through a slot formed in a lower end portion of the test bed and a bolt.
Wherein the first housing unit is provided with a first guide member for guiding a relative movement with respect to the second housing unit and the first guide member is arranged to pass through one side of the second housing unit Shear force testing equipment for package leads.
The second housing unit includes:
A second horizontal body, and a second vertical body bent from the second horizontal and having a second receiving groove formed thereon;
A coupling member coupled to the second receiving groove and having a hole for fixing means for mounting the fixing means and a hole for shearing means for installing the shearing means; And
And a coupling piece laminated on the coupling member and provided with the hole for the fixing means.
Wherein the second housing unit is provided with a second guide member for guiding a relative movement with the first housing unit and the second guide member is arranged to pass through one side of the first housing unit Shear force testing equipment for package leads.
Wherein a guide bush is provided on the first guide member and the second guide member.
Wherein a trimming portion formed by chamfering a portion of the outer circumferential surface of the lead fixture along a longitudinal direction by a predetermined interval is formed in the lead fixture and an eccentric portion for pressing the lead fixture by rotation is formed at a portion of the locking handle, Shear force test device for semiconductor package leads.
Wherein said shearing means comprises:
At least one shear shaft provided to catch on another layer of the package lead;
An adjustment screw for adjusting an entry amount of the shear shaft with respect to the package lead; And
Wherein the shear force testing device includes an elastic member that provides an elastic force in a direction in which the shear shaft is away from the package lead.
Wherein a shear bar is stably coupled to another layer of the package lead at an end of the shear shaft.
Wherein the first housing unit is provided with a first joint holder for connecting with external force providing means.
Wherein the second housing unit is provided with an external force providing means or a second joint holder to be connected to the fixing portion.
Wherein the external force providing means is a load cell.
Priority Applications (1)
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KR1020130075391A KR101446959B1 (en) | 2013-06-28 | 2013-06-28 | Apparatus for test shear force of package lid for semiconductor |
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KR1020130075391A KR101446959B1 (en) | 2013-06-28 | 2013-06-28 | Apparatus for test shear force of package lid for semiconductor |
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KR101446959B1 true KR101446959B1 (en) | 2014-10-07 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101717264B1 (en) * | 2016-11-22 | 2017-03-17 | (주)앤츠 | Assistance apparatus for test |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950001980A (en) * | 1993-06-17 | 1995-01-04 | 이헌조 | Automatic landing device for tools for semiconductor package adhesion test |
KR20090059804A (en) * | 2007-12-07 | 2009-06-11 | 주식회사 실트론 | Method and apparatus for evaluating bonded strength |
KR20120121750A (en) * | 2011-04-27 | 2012-11-06 | 주식회사 씨이텍 | A multi-cartridge type bonding test apparatus for semiconductor maufacturing process |
-
2013
- 2013-06-28 KR KR1020130075391A patent/KR101446959B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR950001980A (en) * | 1993-06-17 | 1995-01-04 | 이헌조 | Automatic landing device for tools for semiconductor package adhesion test |
KR20090059804A (en) * | 2007-12-07 | 2009-06-11 | 주식회사 실트론 | Method and apparatus for evaluating bonded strength |
KR20120121750A (en) * | 2011-04-27 | 2012-11-06 | 주식회사 씨이텍 | A multi-cartridge type bonding test apparatus for semiconductor maufacturing process |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101717264B1 (en) * | 2016-11-22 | 2017-03-17 | (주)앤츠 | Assistance apparatus for test |
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