KR101446959B1 - Apparatus for test shear force of package lid for semiconductor - Google Patents

Apparatus for test shear force of package lid for semiconductor Download PDF

Info

Publication number
KR101446959B1
KR101446959B1 KR1020130075391A KR20130075391A KR101446959B1 KR 101446959 B1 KR101446959 B1 KR 101446959B1 KR 1020130075391 A KR1020130075391 A KR 1020130075391A KR 20130075391 A KR20130075391 A KR 20130075391A KR 101446959 B1 KR101446959 B1 KR 101446959B1
Authority
KR
South Korea
Prior art keywords
lead
housing unit
package
layer
shear
Prior art date
Application number
KR1020130075391A
Other languages
Korean (ko)
Inventor
한기웅
나석호
안병준
Original Assignee
앰코 테크놀로지 코리아 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 앰코 테크놀로지 코리아 주식회사 filed Critical 앰코 테크놀로지 코리아 주식회사
Priority to KR1020130075391A priority Critical patent/KR101446959B1/en
Application granted granted Critical
Publication of KR101446959B1 publication Critical patent/KR101446959B1/en

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/24Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An apparatus for testing a shear force of a semiconductor package lead is disclosed.
According to an embodiment of the present invention, there is provided a package comprising: a first housing unit provided with a front end block to which an end of one layer is attached in a package lead in which a printed circuit board layer and a lead layer are superimposedly coupled; And a second housing unit having a fixing means for receiving the external force in the direction opposite to the external force direction of the first housing unit and preventing the flow of the package lead and a shearing means for hanging another layer of the package lead A device for testing a shear force of a semiconductor package lead can be provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a package lead-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for testing a shear force of a semiconductor package lead, and more particularly to a device for testing a shear force of a semiconductor package lead for measuring a bonding force between a lead- will be.

2. Description of the Related Art In recent years, a semiconductor package including a semiconductor device that stores vast amounts of data and processes data stored within a short time has been developed.

The semiconductor package includes a semiconductor chip manufacturing process for forming a semiconductor chip by integrating elements such as transistors, resistors, capacitors, and the like on a wafer, a die sorting process for testing a good semiconductor chip by inspecting electrical characteristics of the semiconductor chip, And is fabricated by a packaging process in which a semiconductor chip, which is individualized and electrically connected to an external circuit board or the like, and which is weak in embrittlement is protected from impact / vibration applied from the outside.

The semiconductor package as described above is also commonly referred to as a package lead. The package lead includes a printed circuit board (PCB) and a lead, and the printed circuit board and the lead are overlapped Are bonded to each other by a bonding material such as an epoxy or a double-sided tape excellent in bonding strength.

Since the bonding force between the printed circuit board and the lead is an important factor directly related to the durability of the semiconductor package lead, it is necessary to measure the bonding force of the semiconductor package lead.

Shear force test is effective to measure the bond strength of package leads. However, since the device for performing shear force test has not been provided so far, We are conducting a test.

In order to perform the pull test, first, the substrate jig is bonded to the printed circuit board side of the package lead using a bonding material such as epoxy or tape, and the lead jig is bonded to the lead side using the bonding material as described above.

When the substrate jig and the lead jig are firstly bonded to the printed circuit board and the lead, they are put into a high-temperature oven and subjected to a hardening process for a certain period of time, thereby increasing the bonding force.

After the substrate jig and the lead jig are completely bonded to the printed circuit board and the lead through the oven insertion, the substrate jig and the lead jig are connected to the predetermined pull test device and pulled in opposite directions to each other, Is measured.

However, in the pull test of the package leads as described above, not only the substrate jig and the lead jig need to be primarily bonded to the printed circuit board and the lead, but also must be put in a separate oven and heated. Which is inconvenient and time consuming.

In addition, since the bonding material is bonded not only between the printed circuit board and the leads but also the substrate jig and the lead jig, it is difficult to measure only the bonding force between the printed circuit board and the leads. have.

In addition, once the pull test is completed, the PCB jig and the lead jig, which are respectively bonded to the printed circuit board and the leads, must be removed for recycling, and the operation of removing the bonded substrate jig and lead jig is also very inconvenient and time consuming .

Korean Published Patent Application No. 10-2003-0070424

An object of the present invention is to provide a device for testing a shear force of a semiconductor package lead which is simple in preparation for testing a package lead shear force and can shorten a preparation time .

In addition, the embodiment of the present invention is intended to provide a device for testing a shear force of a semiconductor package lead that can increase reliability in measuring a bonding force between a printed circuit board and a lead.

In addition, the embodiment of the present invention is intended to provide a device for testing a shear force of a semiconductor package lead, which requires no subsequent work after the test is completed.

According to an embodiment of the present invention, there is provided a package comprising: a first housing unit provided with a front end block to which an end of one layer is attached in a package lead in which a printed circuit board layer and a lead layer are superimposedly coupled; And a second housing unit having a fixing means for receiving the external force in the direction opposite to the external force direction of the first housing unit and preventing the flow of the package lead and a shearing means for hanging another layer of the package lead A device for testing a shear force of a semiconductor package lead can be provided.

The first housing unit may include a first housing body having a first horizontal portion, a first vertical portion bent from the first horizontal portion and having a first receiving groove formed at a lower portion thereof, And a test bed to which the front end block is coupled at a lower portion thereof.

The front end block may protrude toward the second housing unit.

The protruding amount of the front end block is adjustable through the elongated hole formed at the lower end of the test bed and the bolt.

The first housing unit is provided with a first guide member for guiding a relative movement with the second housing unit, and the first guide member is arranged to pass through one side of the second housing unit.

The second housing unit includes a second housing body having a second horizontal portion, a second vertical portion bent from the second horizontal portion and having a second receiving groove formed thereon; A coupling member coupled to the second receiving groove and having a hole for fixing means for mounting the fixing means and a hole for shearing means for installing the shearing means; And a coupling piece laminated on the coupling member and provided with the hole for the fixing member.

The second housing unit is provided with a second guide member for guiding a relative movement with the first housing unit, and the second guide member is arranged to pass through one side of the first housing unit.

A guide bush is provided on the first guide member and the second guide member.

The fixing means includes a lead fixing body which is installed on the first housing unit so as to freely move toward the package lead and prevents the package lead from flowing; And a locking handle disposed in a direction crossing the lead fixture to restrict the flow of the lead fixture.

A trimming portion in which a portion of the outer circumferential surface is chamfered by a predetermined interval is formed in the lead fixture and an eccentric portion for pressing the lead fixture by rotation is formed at a portion of the locking handle in contact with the trimming portion .

Wherein the shearing means comprises at least one shear shaft provided to be hung on another layer of the package lead; An adjustment screw for adjusting an entry amount of the shear shaft with respect to the package lead; And an elastic member that provides an elastic force in a direction in which the shear shaft is away from the package.

At the end of the shear shaft, a shear bar is stably coupled to the other layer of the package lead.

The first housing unit is provided with a first joint holder for connection with external force providing means.

The second housing unit is provided with a second joint holder for connecting to the external force providing means or the fixing portion.

The external force providing means may be a load cell.

According to the embodiment of the present invention, the preparation process for testing the shear force of the package leads is very simple and the preparation time is shortened.

In addition, according to the embodiment of the present invention, since only the bonding force between the printed circuit board and the lead is measured in measuring the shear force of the package lead, the reliability can be very high.

Further, according to the embodiment of the present invention, there is an advantage that the test of the shear force of the package leads becomes very simple since no additional work is required after the test is finished.

1 is an exploded perspective view showing an apparatus for testing a shear force of a semiconductor package lead according to an embodiment of the present invention,
2 is an assembled perspective view of FIG. 1,
FIG. 3 is a side view showing a state in which a package lead is seated on a front end block according to an embodiment of the present invention;
FIGS. 4 and 5 are views showing structures of a lead fixture and a locking handle according to an embodiment of the present invention;
6 is a plan view showing the configuration of the shearing means of the present embodiment,
7 is a side view showing a state in which the shear shaft of the present embodiment is caught in the lead layer of the package lead,
8 is a view for schematically explaining a state in which a printed circuit board layer and a lead layer of a package lead are separated by a shear force test according to the present embodiment,
9 is a view showing the shear bar coupled to the front end shaft of the present embodiment,
Figs. 10 and 11 are diagrams for explaining the preparatory process of the shearing force test according to the present embodiment. Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present embodiment, the same reference numerals and symbols are used for the same components, and further description thereof will be omitted.

An apparatus for testing a shear force of a semiconductor package lead according to an embodiment of the present invention will be described with reference to Figs.

FIG. 1 is an exploded perspective view showing a device for testing a shear force of a semiconductor package lead according to an embodiment of the present invention, FIG. 2 is an assembled perspective view of FIG. 1, Fig.

As shown in FIGS. 1 and 2, the device for testing a sheathing force for semiconductor package leads according to the present embodiment may include a first housing unit 100 and a second housing unit 200.

The first housing unit 100 is configured to receive an external force in any one direction through an external force providing means such as a load cell. In the first housing unit 100, one of the package leads 10 And a front end block 130 to which an end portion of the front end block is attached.

The package lead 10 is formed by overlapping and bonding the printed circuit board 11 and the lead 12 so as to form layers. The package lead 10 is connected to the package lead 10 (That is, a layer of the printed circuit board 11 or a layer of the lead 12).

3, a layer of the printed circuit board 11 of the package lead 10 is laid on the front end block 130 so that the layer of the lead 12 is caught by the front end block 130 as required. It is acceptable to be placed.

However, it is important that the front end block 130 should be laid so that only one layer of the package leads 10 is laid. If the two layers are laid all together, the printed circuit board 11 and the lid 12 The shear force test of the package lead 10 is impossible.

Here, the first housing unit 100 may include a first housing body 110 and a test bed 120 as shown in FIG.

The first housing unit 110 may include a first horizontal unit 111 and a first vertical unit 112. The first horizontal unit 111 and the first vertical unit 112 may be referred to as " It does not mean that the horizontal part is necessarily arranged horizontally and the vertical part is necessarily arranged vertically.

The first vertical part 112 is formed to be bent from the first horizontal part 111 and a first receiving groove 113 having a predetermined size is formed below the first vertical part 112.

The first horizontal portion 111 and the first vertical portion 112 are preferably bent at right angles, but the angle of bending is not necessarily limited to this, and may be changed according to the needs of the practitioner.

The test bed 120 is coupled to the first receiving groove 113 and is detachably coupled to the first housing body 110 through a conventional coupling means such as a bolt And the front end block 130 is coupled to a lower portion of the test bed 120.

The front end block 130 protrudes from the one side of the test bed 120 toward the second housing unit 200 by a predetermined length. The protrusion amount of the front end block 130 is larger than the protrusion amount of the package lead 10 ) Is related to the thickness of one layer.

3, when the printed circuit board 11 layer of the package lead 10 is arranged to be caught by the front end block 130, the front end block 130 is connected to the printed circuit board 11 ) Layer, the amount of protrusion must be set. This is to prevent both the printed circuit board 11 layer and the lead 12 layer from being caught by the front end block 130 as described above.

It is preferable that the amount of protrusion of the front end block 130 is set to be adjustable according to the thickness of each layer constituting the package lead 10 because the thickness of each layer The protruding amount of the front end block 130 may be adjusted to actively test even in this case as well.

The amount of protrusion of the front end block 130 can be adjusted through the elongated hole formed at the lower end of the test bed 120 to which the front end block 130 is coupled and the bolt. Adjusting the amount of protrusion of the front end block 130 through the holes and bolts described herein is generally well known and is expected to be easily carried out by those skilled in the art, so that separate drawings and explanations are omitted.

In addition, the first housing unit 100 may be provided with a second housing unit 200, which is opposed to the second housing unit 200, so that the first housing unit 100 can move more stably along a predetermined path when the first housing unit 100 receives external force in one direction. It is preferable that a first guide member 140 for guiding movement is provided.

One of the first guide members 140 may be provided. However, in order for the first housing unit 100 to move more stably, it is preferable that at least two first guide members 140 are installed parallel to each other.

The first guide member 140 is fixedly coupled to one side of the first housing unit 100. In this embodiment, the first guide member 140 passes through the front end block 130, And the first guide member 140 is disposed so as to pass through one side of the second housing unit 200 (the second horizontal portion 211 to be described later in this embodiment).

The second housing unit 200 receives an external force in the direction opposite to the external force direction of the first housing unit 100. The second housing unit 200 is connected to the second housing unit 200 through external force providing means such as a load cell It is possible to receive an external force directly and receive a physical reaction force generated by an external force applied to the first housing unit 100 even if the external force is not directly supplied from the outside. Accordingly, the second housing unit 200 may be connected to the external force providing means or may be connected to a structure (fixing portion) fixed to the periphery.

In this case, the second housing unit 200 is provided with fixing means 240 for preventing the free flow of the package leads 10 placed on the front end block 130, And a shearing means 250 for covering the other layer except the layer sandwiched between the layers.

The fixing means 240 will be further described with reference to Figs. 4 and 5. Fig.

4 and 5 are views showing the structure of the lead fixture and the locking handle 242 according to the embodiment of the present invention. As shown further herein, the fixing means 240 mainly includes the lead fixture 241 A locking handle 242 may be included.

The lead fixing body 241 is freely movably installed on the first housing unit 100 toward the package lead 10 as shown in FIGS. 1 and 2 to prevent the package lead 10 from flowing freely .

Since the package lead 10 has no separate restraining means, it may be moved during the shear force test or may be bent forward, and the lead fixing body 241 enters the package lead 10 side, It is possible to prevent the package lead 10 from moving freely during the shear force test while preventing the package lead 10 from being pressed while maintaining the gap (about 0.02 to 0.05 mm), and in particular, to prevent the package lead 10 from being bent So that a stable shear force test can be carried out.

The locking handle 242 is also disposed in a direction crossing the lid fixture 241 so that when the lid fixture 241 needs to be fixed without moving in any one position, .

That is, the lead fixing body 241 must be fixed so as not to flow in a state maintaining a fine gap with the package lead 10 as described above. So that it does not flow at one position.

4 and 5 show a structure in which the locking handle 242 restricts and fixes the flow of the lead fixture 241. As shown here, the lead fixture 241 is provided with a part of the outer circumferential surface thereof, A trimming portion 241a is chamfered by a predetermined interval along the longitudinal direction of the base portion 241. [

In this embodiment, since the locking handle 242 is disposed at the lower portion of the lead fixing body 241, a trimming portion 241a is formed in a lower portion of the outer circumferential surface of the lead fixing body 241 except for both ends, The same structure.

The locking handle 242 is disposed at a lower portion of the lid fixing body 241. A portion of the locking handle 242 which contacts the trimming portion 241a is pressed against the lid fixing body 241 by rotation An eccentric portion 242a is formed.

Therefore, when the locking handle 242 is rotated in either direction, the eccentric portion 242a which is in contact with the trimming portion 241a is rotated to press the trimming portion 241a, (241) is pushed in one direction by the urging force and is brought into close contact with the inside of the second housing unit (200) to prevent the flow. Actually, the lead fixture 241 may not be greatly elevated as shown in FIG. 4, but this is exaggerated in order to facilitate explanation and understanding.

4, when the locking member 242 is rotated to the right to lock the lid fixing body 241, the lid fixing body 241 is slightly raised upward, (Not shown in detail) but is finely moved to the left (i.e., away from the package lead 10) in the drawing to maintain a fine gap (0.02 to 0.05 mm) with the package lead 10, 10 are not directly pressed by the lead fixing body 241. [

The shearing means 250 will be described with reference to FIGS. 6 to 8. FIG.

Fig. 6 is a plan view showing the configuration of the shearing means of this embodiment. Fig. 7 is a side view showing a state in which the shear shaft 251 of the present embodiment is engaged with the lead layer of the package lead. Fig. FIG. 3 is a view for schematically explaining a state in which a printed circuit board layer and a lead layer of a package lead are separated; FIG.

The shear means 250 may include a shear shaft 251, an adjusting screw 252 and an elastic member 253, which are connected to the package lead 10, (The lead 12 layer in the present embodiment) of the second housing unit 200, the transfer shaft 251 passes through the second housing unit 200, as shown in Fig. 7 And is allowed to enter the lead 12 layer of the package lead 10.

However, in order to more stably catch the lead 12, it is preferable that two or more lead wires 251 are provided so as to be spaced apart from each other. In this embodiment, The number of the transmission shafts 251 can be increased or decreased as needed.

The adjustment screw 252 is for adjusting the amount of entry of the transfer shaft 251 into the package lead 10 (that is, the distance to the package lead 10) It is preferable to adjust the entry amount of the transfer shaft 251 through the adjusting screw 252 because the transfer arm 25 is freely movable toward the package lead 10.

The shear block 251 is moved toward the package lead 10 so that the shear load is limited only to the lead 12 layer. And the layer of the printed circuit board 11 of the lead 10 must be caught.

The lower end of the layer of the printed circuit board 11 is engaged with the front end block 130 and the front end shaft 251 is engaged with only the upper end of the layer of the lead 12, When the housing units 200 are relatively moved in opposite directions to each other, the printed circuit board 11 layer and the lead 12 layer of the package lead 10 are separated from each other, Shear force can be measured.

Therefore, it is very important to adjust the entry amount of the front end shaft 251 in the same manner as the amount of protrusion of the front end block 130, so that the adjustment screw 252 can finely adjust the entry amount of the front end shaft 251 Do it.

The adjusting screw 252 is installed between the coupling bar 254 and the second housing unit 200 formed in a direction intersecting the at least one turning shaft 251 and the adjusting screw 252 The distance between the coupling bar 254 and the second housing unit 200 is adjusted so that the entry amount of the rotation shaft 251 is adjusted.

In order to increase the reliability of the shear force test, the package lead 10 is required to have any force by the shear shaft 251 It is good not to be provided.

Therefore, the elastic member 253 is provided to provide the elastic force in the direction in which the transfer shaft 251 is away from the package lead 10. [ The elastic member 253 is installed so as to surround the outer circumferential surface of the rotation shaft 251 between the coupling bar 254 and the second housing unit 200. However,

9, a separate shear bar 254 is coupled to a shear shaft according to an embodiment of the present invention. As shown in FIG. 9, at the end of the shear shaft 251, a package lead 10 A shear bar 254 for stably engaging the other layer (the lead 12 layer in the present embodiment) may be combined.

The transfer shaft 251 may be directly hooked to the lead 12 layer of the package lead 10 as described above. However, since the transfer shaft 251 is in the form of a rod, Can be relatively small.

Therefore, in order to stably catch the lead 12 layer of the package lead 10, or when the package lead 10 to be tested is relatively large, or when a very large shearing force is required, the rectangular bar- (254) is detachably coupled to the end of the transmission shaft (251).

The second housing unit 200 may include a second housing body 210, a coupling member 220, and a coupling member 230, as shown in FIG.

The second housing body 210 may include a second horizontal portion 211 and a second vertical portion 212. The second vertical portion 212 may be formed to be bent from the second horizontal portion 211, And a second receiving groove 213 having a predetermined size is formed on the second vertical portion 212. The second horizontal portion 211 and the second vertical portion 212 are also preferably bent at right angles, but the present invention is not limited thereto.

The coupling member 220 is detachably coupled to the second receiving groove 213 and is coupled to the second housing body 213 through a conventional coupling means c such as a bolt or an engagement pin, (Not shown).

The joint member 220 may be formed with a hole H for fixing means for mounting the fixing means 240 and a hole K for shearing means for installing the shearing means 250, have.

The hole for fixing means H formed on the coupling member 220 may be divided into a hole for a lead fixture 241h and a hole for a locking handle 242h. 10 and a locking handle hole 242h is formed in a direction crossing the hole 241h for the lead fixture. The locking handle hole 242h may also be formed in the second housing body 210. [

The hole K for the shearing means is formed on the upper portion of the coupling member 220. The hole K for the shearing means is formed in the direction of the package lead 10 in the same manner as the hole for the lead fixture 241h, As shown in FIG.

In addition, the coupling piece 230 is configured to be stacked on the coupling member 220 as shown in FIG. 1, and can be coupled through a conventional coupling means (c).

A separate fixing hole H is formed in the coupling piece 230 so as to correspond to the fixing hole H of the coupling member 220. In this embodiment, The hole H for the means is a hole 241h for the lead fixture.

The shape and number of the holes described above can be practiced by those skilled in the art in accordance with the configurations described above, so that detailed description is omitted.

Meanwhile, the second housing unit 200 may be provided with a second guide member 260 for guiding relative movement with the first housing unit 100.

One of the second guide members 260 may be provided, but two or more of the second guide members 260 may be parallel to each other in order for the second housing unit 200 to move more stably.

The second guide member 260 is fixed to one side of the second housing unit 200. In this embodiment, the second guide member 260 is configured to be coupled to the coupling member 220, 2 guide member 260 is disposed so as to pass through one side of the first housing unit 100 (i.e., the first horizontal portion 111).

The guide bushes b may be provided on the first guide member 140 and the second guide member 260. The guide bushes b may include a first housing unit 100, 2 When the housing unit 200 is relatively moved, friction is minimized so that it can be moved more smoothly.

The guide bushing b includes one side of the second housing unit 200 through which the first guide member 140 and the second guide member 260 are respectively passed (the second horizontal portion 211 of the present embodiment) (The first horizontal portion 111 of the present embodiment) of the housing unit 100, respectively.

Also, as shown in FIGS. 1 and 2, the first housing unit 100 may be provided with a first joint holder 150 to be connected to an external force providing means such as a load cell.

The first housing unit 100 is easily coupled to or disassembled from the external force providing means, and the first joint holder 150 is provided on the upper portion of the first housing unit 100. The first joint holder 150 is easily detachable via a pin (p) coupling with one side (e.g., a connecting rod) of the external force providing means.

Also, the second housing unit 200 may be provided with a second joint holder 270 for connecting to an external force providing means such as a load cell or a fixing unit. Since the second joint holder 270 is the same as the first joint holder 150, detailed description is omitted.

However, as described above, the second housing unit 200 may be connected to an external force providing means such as a load cell or may be connected to a structure (fixed portion) fixed to the periphery.

Hereinafter, a preparation process for testing the shear force of the package lead 10 through the present embodiment will be described with reference to FIGS. 10 and 11. FIG.

The user can freely move the lead fixing body 241 toward the package lead 10 by releasing the locking state of the lead fixing body 241 such that the locking handle 242 becomes a "1" Free flow state.

In this state, the user removes the lead fixing body 241 in the direction away from the package lead 10 as shown in Fig. 10, and inserts the package into the gap between the first housing unit 100 and the second housing unit 200 The lead 10 is inserted to seat the printed circuit board 11 of the package lead 10 only on the front end block 130 as shown in FIG. If the amount of protrusion of the front end block 130 is greater than the thickness of the printed circuit board 11, the protrusion amount of the front end block 130 is adjusted by using the above-described slots and bolts.

When the state shown in FIG. 3 is completed, the user pushes the lead fixing body 241 toward the package lead 10 by hand so that the end of the lead fixing body 241 contacts the lead (not shown) of the package lead 10 12) layer.

As shown in FIG. 11, when the locking handle 242 is rotated counterclockwise in the drawing, the locking handle 242 locks the lead fixing body 241 as described with reference to FIGS. 4 and 5, The lead fixing body 241 is fixed without moving in a state in which a minute gap is maintained from the package lead 10.

7, the user uses the adjusting screw 252 of the shearing means 250 to move the shearing shaft 251 so as to catch only the lead 12 layer of the package lid 10 as shown in Fig. 7, the initial preparation process for testing the shear force of the package lead 10 is completed when the entry length is adjusted so that the shear shaft 251 is caught only on the lid 12 layer as shown in Fig.

2, the first joint holder 150 provided in the first housing unit 100 is connected to one side (R, connecting rod) of the external force providing means such as a load cell, And the second joint holder 270 of the second housing unit 200 is pin-connected to one side Q of the structure (fixing portion) fixed to the external force providing means or the periphery.

When the above-described series of processes is completed, the primary housing unit or the primary housing unit and the secondary housing unit are pulled out through the external force providing means so that the first housing unit 100 and the second housing unit 200 are opposed to each other .

As the first housing unit 100 and the second housing unit 200 are moved relative to each other, the package leads 10 mounted on the front end block 130 are connected to the printed circuit board 11 Layer and the lead 12 are separated from each other, wherein an external force providing means such as a load cell measures the force when the layer of the printed circuit board 11 and the layer of the lead 12 are separated, The shear force of the package lead 10 or the bonding force (bonding force) between the layer of the printed circuit board 11 and the layer of the lead 12 becomes the bonding force of the package lead 10.

While the present invention has been described in connection with what is presently considered to be preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention is not limited thereto.

10: package lead 11: printed circuit board
12: Lead
100: first housing unit 110: first housing body
111: first horizontal part 112: first vertical part
120: test bed 130: shear block
140: first guide member 150: first joint holder
200: second housing unit 210: second housing body
211: second horizontal part 212: second vertical part
220: coupling member 230: coupling member
240: fixing means 241: lead fixing body
242: locking handle 250: shearing means
251: Full shaft 252: Adjusting screw
253: elastic member 260: second guide member
270: second joint holder

Claims (15)

A first housing unit provided with a front end block to which an end of one layer is attached in a package lead in which a printed circuit board layer and a lead layer are superposedly coupled to each other, And
And a second housing unit having a fixing means for receiving an external force in a direction opposite to an external force direction of the first housing unit and preventing the flow of the package lead and a shearing means for hanging another layer of the package lead, ,
Wherein,
A lead fixture installed on the first housing unit so as to freely move toward the package lead to prevent the package lead from flowing; And a locking handle disposed in a direction crossing the lead fixture to limit the flow of the lead fixture,
And the shear force is measured while the printed circuit board layer and the lead layer are separated from each other as the first housing unit and the second housing unit move relative to each other in opposite directions.
The method according to claim 1,
The first housing unit includes:
A first housing body having a first horizontal portion and a first vertical portion bent from the first horizontal portion and having a first receiving groove formed at a lower portion thereof; And
And a test bed coupled to the receiving groove of the first vertical portion and coupled with the front end block at a lower portion thereof.
3. The method of claim 2,
Wherein the front end block is protruded toward the second housing unit side.
The method of claim 3,
Wherein a protruding amount of the front end block is adjustable through a slot formed in a lower end portion of the test bed and a bolt.
The method according to claim 1,
Wherein the first housing unit is provided with a first guide member for guiding a relative movement with respect to the second housing unit and the first guide member is arranged to pass through one side of the second housing unit Shear force testing equipment for package leads.
The method according to claim 1,
The second housing unit includes:
A second horizontal body, and a second vertical body bent from the second horizontal and having a second receiving groove formed thereon;
A coupling member coupled to the second receiving groove and having a hole for fixing means for mounting the fixing means and a hole for shearing means for installing the shearing means; And
And a coupling piece laminated on the coupling member and provided with the hole for the fixing means.
6. The method of claim 5,
Wherein the second housing unit is provided with a second guide member for guiding a relative movement with the first housing unit and the second guide member is arranged to pass through one side of the first housing unit Shear force testing equipment for package leads.
8. The method of claim 7,
Wherein a guide bush is provided on the first guide member and the second guide member.
delete The method according to claim 1,
Wherein a trimming portion formed by chamfering a portion of the outer circumferential surface of the lead fixture along a longitudinal direction by a predetermined interval is formed in the lead fixture and an eccentric portion for pressing the lead fixture by rotation is formed at a portion of the locking handle, Shear force test device for semiconductor package leads.
The method according to claim 1,
Wherein said shearing means comprises:
At least one shear shaft provided to catch on another layer of the package lead;
An adjustment screw for adjusting an entry amount of the shear shaft with respect to the package lead; And
Wherein the shear force testing device includes an elastic member that provides an elastic force in a direction in which the shear shaft is away from the package lead.
The method according to claim 11,
Wherein a shear bar is stably coupled to another layer of the package lead at an end of the shear shaft.
The method according to claim 1,
Wherein the first housing unit is provided with a first joint holder for connecting with external force providing means.
The method according to claim 1,
Wherein the second housing unit is provided with an external force providing means or a second joint holder to be connected to the fixing portion.
The method according to claim 13 or 14,
Wherein the external force providing means is a load cell.
KR1020130075391A 2013-06-28 2013-06-28 Apparatus for test shear force of package lid for semiconductor KR101446959B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130075391A KR101446959B1 (en) 2013-06-28 2013-06-28 Apparatus for test shear force of package lid for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130075391A KR101446959B1 (en) 2013-06-28 2013-06-28 Apparatus for test shear force of package lid for semiconductor

Publications (1)

Publication Number Publication Date
KR101446959B1 true KR101446959B1 (en) 2014-10-07

Family

ID=51996446

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130075391A KR101446959B1 (en) 2013-06-28 2013-06-28 Apparatus for test shear force of package lid for semiconductor

Country Status (1)

Country Link
KR (1) KR101446959B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101717264B1 (en) * 2016-11-22 2017-03-17 (주)앤츠 Assistance apparatus for test

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950001980A (en) * 1993-06-17 1995-01-04 이헌조 Automatic landing device for tools for semiconductor package adhesion test
KR20090059804A (en) * 2007-12-07 2009-06-11 주식회사 실트론 Method and apparatus for evaluating bonded strength
KR20120121750A (en) * 2011-04-27 2012-11-06 주식회사 씨이텍 A multi-cartridge type bonding test apparatus for semiconductor maufacturing process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950001980A (en) * 1993-06-17 1995-01-04 이헌조 Automatic landing device for tools for semiconductor package adhesion test
KR20090059804A (en) * 2007-12-07 2009-06-11 주식회사 실트론 Method and apparatus for evaluating bonded strength
KR20120121750A (en) * 2011-04-27 2012-11-06 주식회사 씨이텍 A multi-cartridge type bonding test apparatus for semiconductor maufacturing process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101717264B1 (en) * 2016-11-22 2017-03-17 (주)앤츠 Assistance apparatus for test

Similar Documents

Publication Publication Date Title
JP5166176B2 (en) Socket for electronic devices
US9726720B2 (en) Integrated circuit test device and integrated circuit test equipment
US20080174326A1 (en) Probe, probe assembly and probe card for electrical testing
JP2016533508A (en) Semiconductor chip inspection equipment
US7656179B2 (en) Relay connector having a pin block and a floating guide with guide hole
JP2007017234A (en) Socket for inspection device
TW201237427A (en) Probe card stiffener with decoupling
KR101281693B1 (en) Apparatus for testing led bar
EP3349550B1 (en) Fixing apparatus
KR20180121602A (en) Probe card
KR101446959B1 (en) Apparatus for test shear force of package lid for semiconductor
US7568957B2 (en) Relay connector
TWI442053B (en) Probe card, apparatus and method for maintaining the same
US20140367453A1 (en) Method for aligning plate-like members and method for manufacturing electrical connecting apparatus
KR20240027655A (en) Test tray of handler for testing electronic devices
JP6892235B2 (en) Electrical connection device and manufacturing method of electrical connection device
JP7058159B2 (en) Positioning mechanism and inspection equipment
JP3891343B2 (en) Vertical probe card
JP2015072145A (en) Withstanding voltage performance probe for lead wire and withstanding voltage performance measurement device for lead wire
KR20060100563A (en) Probe block assembly for inspecting flat display panel and assembling method therefor
KR101332656B1 (en) Device for connecting semiconductor chip for testing semiconductor module
KR101258778B1 (en) Mounting device for fixing probing needle and producting method of probe card
WO2018168136A1 (en) Probe pin and inspection unit
US20080297187A1 (en) Location device for contact probes
CN107278120B (en) A kind of axial lead forming device of through-hole mounting element

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170912

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180917

Year of fee payment: 5