KR101441326B1 - Teaching data auto-generation apparatus of automated inspection machine and method for teaching data auto-generation the same - Google Patents

Abstract

The present invention provides an apparatus and method for automatically generating teaching data of an automatic optical inspection machine capable of automatically generating not only a solder area but also a package area of a component mounted on a printed circuit board (PCB) An apparatus for automatically generating teaching data of an optical inspection machine includes a Gerber file input unit for inputting Gerber file data corresponding to a printed circuit board (PCB) to be inspected; A pad extracting unit for separating data constituting the solder pad by processing the input Gerber file data and extracting pad data therefrom; A mounter file input unit for inputting mounter data of a mounter file of a component mounted corresponding to the printed circuit board (PCB); A solder region generating unit for combining the pad data and the mounter data to generate solder region data for each part necessary for solder site inspection; An integrated circuit printed circuit board (PCB) image input unit for acquiring an image of the printed circuit board (PCB) and inputting image data; A package area generation unit for automatically extracting solder area data and package area data necessary for part inspection from the image data; And a teaching data output unit for combining the solder area data and the package area data to output teaching data required for the automatic optical inspection unit (AOI).

Description

TECHNICAL FIELD [0001] The present invention relates to an apparatus and method for automatically generating teaching data of an automatic optical inspection apparatus,

The present invention relates to teaching data generation for inspection of surface mounting lines, and more particularly, to an apparatus and method for automatically generating teaching data of an automatic optical inspection machine for determining whether or not a component assembly is defective on a surface mounting line.

In general, an automated inspection machine (AOI) on a surface mount technology (SMT) line will ultimately determine whether electronic components such as resistors, capacitors, and ICs are properly assembled on a printed circuit board It is equipment to inspect. An image of the assembled PCB is acquired and processed to check whether the component is misplaced, such as positional deviation of the component, and whether the solder is defective, such as overcharge, shortage, or short circuit.

In order to inspect the automatic optical inspection unit (AOI), the position and size of the image region to be inspected for each component must be taught in advance. At this time, the image area to be inspected is divided into a 'solder area' for inspecting the solder state and a 'package area' for checking the parts state.

At this time, a part such as a chip usually requires one package area and two solder areas for each part, and one package area and several to several dozen solder areas are required for parts such as an IC.

FIGS. 1 and 2 generally show a package and solder region defined in a chip component and an IC component.

First, as shown in FIG. 1, a chip component is mounted on a pad 101 on a PCB, and the component is divided into a component package 102 portion and a component electrode 103 portion. At this time, the teaching data necessary for the automatic optical inspection machine (AOI) is extracted by the solder region 104 for the solder inspection and the package region 105 for the component inspection.

2, the IC component is mounted on the pad 201 on the PCB, and the component is divided into the component package 202 portion and the component lead 203 portion. At this time, the teaching data necessary for the automatic optical inspection machine (AOI) is extracted by the solder region 204 for the solder inspection and the package region 205 for the component inspection.

In general, since hundreds to thousands of parts are assembled on a single PCB, it takes a lot of time to individually teach the solder area and the package area of all the parts, which can greatly reduce the productivity of the production line. Therefore, automatically generating teaching data can dramatically shorten the task preparation time of the automatic optical tester (AOI) and ultimately increase the productivity of the surface mount line.

In order to support automatic teaching, the operating software of the automatic optical inspection machine (AOI) manages the geometry data corresponding to the solder area and the package area for each part type and various inspection parameters into a database and manages them as a parts library.

Mounter data or CAD XY data used in the mount equipment of the surface mount (SMT) line includes the center position value (XY coordinate value) of the component mounted on the printed circuit board (PCB) And the like).

The operating software of the automatic optical inspection unit (AOI) reads the mount file, extracts the position value of each component, and connects the component library data from the component code included in the mount file to generate teaching data.

Automatic teaching can be conveniently performed for parts already registered in the parts library. However, for parts not registered in the parts library, the manual teaching process should be added. That is, the camera of the automatic optical inspection machine (AOI) acquires an image of an assembled printed circuit board (PCB), and a soldering area and a package area are directly displayed on an image screen to perform teaching and add to a parts library. Component As the development of electronic device technology, the kinds of parts assembled on printed circuit board (PCB) are continuously increasing. In addition, there may be a variation in the shape of the parts for each component element maker. Therefore, it is almost impossible for the component library of the automatic optical inspection machine (AOI) to include all kinds of parts. In particular, since the parts registered in the parts library are few in the initial stage after purchasing the automatic optical inspection machine (AOI), the time required for manual teaching is large.

The solder region and the package region of the component mounted on the printed circuit board (PCB) must be automatically extracted in order to automatically extract the teaching data for the new component not registered in the component library. For the solder area, the printed circuit board (PCB) Gerber file and the mounter file can be combined and extracted automatically. Gerber files are international standard files used in the manufacture of printed circuit boards (PCBs) and are readily available in most surface mount (SMT) lines. The position and size data of the pad from the layer containing the pads in the Gerber file can be extracted and combined with the part center position of the mounter file to extract the solder area data required for the automatic optical inspection machine (AOI). In addition to the printed circuit board (PCB) Gerber file, it is possible to extract the solder area from various CAD files. However, the CAD file is not easy to connect because of different CAD models, It is not easy to secure in a general surface mount (SMT) line.

In addition, since the package area is not included in the Gerber file or the CAD file as data specific to the component element, passive teaching is inevitable. Since the silk surface layer of the gerber file contains the package outline for some parts such as IC, it can extract the package area for some parts such as IC by utilizing it, but it is difficult to extract the package area for general parts such as chips. There is a method of extracting the package area included in the database by retrieving an international database related to the component element from the pad shape of the component. However, the specification of the component element is continuously updated and it is difficult to actually apply it in the reality that new parts appear frequently.

As a result, it is difficult to completely generate teaching data of the automatic optical inspection unit (AOI), and the solder region can be automatically generated. However, the package region is generated manually or semi-automatically, There is a problem that it takes a considerable time to create a new program.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problem of the related art, and it is an object of the present invention to provide an automatic optical inspection machine teaching data which can automatically generate not only a solder area but also a package area to a component mounted on a printed circuit board And an object thereof is to provide an automatic generation apparatus and a method thereof.

It is another object of the present invention to provide a method and apparatus for automatically generating and registering teaching data without using a component database inside or outside an automatic optical inspection unit (AOI) There is.

It is also a further object of the present invention to eliminate the use of data that is difficult to obtain in the field of surface mount (SMT) lines and to provide a variety of surface mount (SMT) devices, such as Gerber files, mounter files and assembled printed circuit board ) Line to automatically generate teaching data using data.

According to an aspect of the present invention, there is provided an apparatus for automatically generating teaching data of an automatic optical inspection machine, comprising: a Gerber file input unit for inputting Gerber file data corresponding to a printed circuit board (PCB) to be inspected; A pad extracting unit for separating data constituting the solder pad by processing the input Gerber file data and extracting pad data therefrom; A mounter file input unit for inputting mounter data of a mounter file of a component mounted corresponding to the printed circuit board (PCB); A solder region generating unit for combining the pad data and the mounter data to generate solder region data for each part necessary for solder site inspection; An integrated circuit printed circuit board (PCB) image input unit for acquiring an image of the printed circuit board (PCB) and inputting image data; A package area generation unit for automatically extracting solder area data and package area data necessary for part inspection from the image data; And a teaching data output unit for combining the solder area data and the package area data to output teaching data required for an automatic optical inspection unit (AOI).

The method of automatically generating teaching data of an automatic optical inspection machine according to the present invention having the above configuration may further include: inputting gerber file data corresponding to a printed circuit board (PCB) to be inspected; Processing the input Gerber file data to separate data constituting the solder pad and extract pad data therefrom; Inputting mount file data of a component mounted corresponding to the printed circuit board (PCB); Combining the pad data and the mount file data to generate solder area data for each part necessary for solder site inspection; Acquiring an image of the printed circuit board (PCB) and inputting image data; Automatically extracting the package area data necessary for the parts part inspection from the solder area data and the image data; And combining the solder area data and the package area data to output teaching data required for the automatic optical inspection unit (AOI).

The present invention described above automates the package area registration process, which requires the most time and effort during the automatic optical inspection (AOI) teaching process, by using a printed circuit board (PCB) image, a Gerber file, and a mounter file, Time and convenience can be improved.

In addition, since the teaching data can be automatically generated and registered without using the internal or external parts database of the automatic optical inspection unit (AOI), the operation program of the automatic optical inspection unit (AOI), which is the core inspection equipment of the surface mount (SMT) It is possible to shorten the production time and ultimately improve the productivity of the electronic product manufacturing surface mount (SMT) line.

1 is a plan view showing a general chip-type component.
2 is a plan view showing a general IC type part.
3 is a block diagram showing an apparatus for automatically generating teaching data of an automatic optical tester according to an embodiment of the present invention.
FIG. 4 is an exemplary view illustrating input of gerber data through the gerber data input unit of FIG. 3. FIG.
5 is an exemplary diagram showing pad data displayed on the screen through the pad extracting unit of FIG.
FIG. 6 is an exemplary view showing a solder region on the screen through the solder region generating unit of FIG. 3;
7 is a flowchart showing a method of automatically generating teaching data of an automatic optical tester according to an embodiment of the present invention.
FIG. 8 is a flowchart showing the driving of the package area generation unit of FIG. 3;
FIG. 9 is a diagram showing an original image, clustering results, and package area identification for each part of the package area creation unit of FIG. 3. FIG.

The present invention generates a solder region from the gerber data and mounter data of a printed circuit board (PCB), creates a package area from the image data of the printed circuit board (PCB) The present invention relates to an apparatus and method for automatically generating teaching data.

Best Mode for Carrying Out the Invention The most preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

3, the apparatus for automatically generating teaching data of an automatic optical inspection machine according to an embodiment of the present invention includes a gerber file input unit 301, a pad extraction unit 302, a mount file input unit 303, An area generation unit 304, an assembled PCB image input unit 305, a package area generation unit 306, and a teaching data output unit 307.

Among the constituent elements of the present invention, the Gerber file input unit 301 reads a Gerber file of a layer including a printed circuit board (PCB) pad to be inspected and displays it on the screen.

The Gerber file is a text file of an international standard (RS-274X, RS-274D) and is a file in which various patterns drawn on a printed circuit board (PCB) are represented by vector type data. FIG. 4 shows an example of displaying Gerber data on the screen by reading the Gerber file.

The pad extracting unit 302 processes the Gerber file data input through the Gerber file input unit 301, separates data constituting the solder pad, and extracts the position and area data of the pad from the data . The pad extracting unit 302 can extract the pad completely automatically from the layer where only the pad exists in the Gerber file.

5 shows an example in which pad data is automatically extracted using the pad extracting unit 302 and displayed on the screen, and reference numeral 501 denotes pad data.

The mount file input unit 303 reads a mount file (or a CAD XY file) including a mount name, a center position and an angle of a component mounted on the PCB, a component material code, and the number of pads, It is responsible for displaying on the screen.

If the reference origin of the Gerber file is different from that of the mount file, the mount file input unit 303 also changes the overall position and coincides with the reference origin.

The solder region generating unit 304 combines the pad data output from the pad extracting unit 302 and the mounter data output from the mounter file input unit 303 to generate a solder region required for the solder portion inspection for each part . At this time, the pads around the center position of the parts are connected in consideration of the center position of the parts, the center position of the pad, and the number of pads per part. At this time, the pad to which the component mounting name is assigned is generated as the solder region of the component.

FIG. 6 is an example of a solder region generated through the solder region generating unit 304 on the screen. In FIG. 6, reference numeral 601 denotes a solder region, and reference numeral 602 denotes mount data.

The assembled PCB image input unit 305 acquires an image of a printed circuit board (PCB) to be inspected using a camera attached to the automatic optical inspection unit (AOI). At this time, a PCB (Gold PCB) in which parts assembly is performed well is used.

The package area generation unit 306 processes the image acquired by the PCB input unit 305 and automatically extracts the package area data necessary for part inspection. At this time, in order to easily extract the package area data, solder area data for each part output from the solder area creating unit 304 is used.

The teaching data output unit 307 combines the solder area data for each part generated by the solder area generating unit 304 with the package area data for each part generated by the package area generating unit 306, (AOI), and outputs the generated teaching data.

The solder area creation unit 304 and the package area creation unit 306 having the above configuration need not be performed for all the individual parts in the printed circuit board (PCB), and parts having the same part code can be used by copying the data .

Hereinafter, a method of automatically generating teaching data of the automatic optical tester in the surface mounting line having the above-described configuration will be described.

7, a gerber file corresponding to a printed circuit board (PCB) to be inspected is read and input through a gerber file input unit 301 to be displayed on the screen (S71)

Thereafter, the Gerber file data input through the Gerber file input unit 301 is processed through the pad extracting unit 302 to separate the data constituting the solder pad, and the position and area data of the pad, that is, the pad data (S72)

Then, a mounter file (or a CAD XY file) including a mounting name, a center position and an angle, a part material code, and the number of pads of the parts mounted corresponding to the printed circuit board (PCB) through the mounter file input unit 303, And displays it on the screen (S73)

Thereafter, the pad data output from the pad extraction unit 302 and the mounter data output from the mounter file input unit 303 are combined through the solder region generation unit 304, (S74)

When creating the solder region, the pads around the center position of the component are connected in consideration of the center position of the component, the center position of the pad, and the number of pads per component. At this time, the pad to which the component mounting name is assigned is generated as the solder region of the component.

Thereafter, an image of a printed circuit board (PCB) to be inspected is obtained through a camera attached to an automatic optical inspection unit (AOI) through an assembled printed circuit board (PCB) image input unit 305, (S75). At this time, a PCB (Gold PCB) on which component assembly is performed well is used.

Thereafter, the package area of the part is automatically extracted by processing the image data acquired by the assembled printed circuit board (PCB) image input unit 305 through the package area creation unit 306. (S76) At this time, The solder area data for each part output from the solder area creation unit 304 is used to easily extract the area.

That is, the package area data necessary for part parts inspection is extracted from the solder area data and the image data through the package area creation part 306. [

Thereafter, the solder area data for each part generated by the solder area creating unit 304 and the package area data for each part generated by the package area creating unit 306 are combined through the teaching data output unit 307 and finally And generates and outputs teaching data necessary for the automatic optical tester AOI. (S77)

At this time, the solder region creation and the package region creation through the solder region creation unit 304 and the package region creation unit 306 need not be performed for every individual component in the printed circuit board (PCB), and the component material code The same parts can be used by copying the data.

In operation S76, a step S76 for automatically extracting the package area will be described in more detail.

First, as shown in FIG. 8, the PCB image data obtained through the assembled PCB image input unit is read (S81)

Then, the solder area data for all the components in the printed circuit board (PCB) is read (S82).

Subsequently, a step of dividing the PCB image into parts-specific images is performed (S83). This step is a step of dividing the printed circuit board (PCB) image into images of respective parts.

Since the solder area data is a region in which pads of each component exist, in the case of a component having a plurality of pads, it is possible to obtain a region in which the component exists by adding the respective pad regions. From this, the PCB image can be divided into parts-by-part images.

At this time, an image divided into parts includes various images such as a component package, an electrode or a lead, a substrate, a silk wire, and a solder.

Thereafter, the PCB image is clustered (S84)

At this time, the step of clustering the PCB image is a step of dividing the image of each part into several groups. For example, since the component package, electrode, lead, and substrate have different color information (RGB, HSI, etc.) for each property, each pixel of the image can be divided into several groups based on color information. At this time, various clustering techniques such as a k-means algorithm and an EM algorithm may be applied, but a group of about two or more is sufficient, and therefore, a fast processing is possible.

Finally, a step of identifying the package area is performed (S85)

At this time, in the step of identifying the package area, a group corresponding to the package among the image groups divided on the basis of the color information is searched and the image data of the group is processed to extract the area information. At this time, since the package area exists in the central part in the image of each part, the corresponding group can be identified using the position value and color information. Image binarization is performed to leave only the identified group, and region information can be extracted through processing on the binarized image.

FIG. 9 is a diagram showing an example of creating a package area for a chip part and an IC part, which shows an original image divided by a chip and an IC part, a binarized image after clustering, and a finally identified package area.

The technical idea of the present invention has been specifically described according to the above preferred embodiments, but the above-mentioned embodiments are intended to be illustrative and not restrictive. In addition, it will be understood by those of ordinary skill in the art that various embodiments are possible within the scope of the technical idea of the present invention. Accordingly, the scope of the present invention should be determined by the claims rather than the examples described.

DESCRIPTION OF THE REFERENCE NUMERALS
301: Gerber file input unit 302: Pad extraction unit
303: Mounter file input unit 304: Solder area creation unit
305: Assembled PCB image input unit 306: Package area creation unit
307: Teaching data output unit 501: Pad data
601: Solder area 602: Mounter data

Claims (16)

A Gerber file input unit for inputting gerber file data corresponding to a printed circuit board (PCB) to be inspected;
A pad extracting unit for separating data constituting the solder pad by processing the input Gerber file data and extracting pad data therefrom;
A mounter file input unit for inputting mounter data of a mounter file of a component mounted corresponding to the printed circuit board (PCB);
A solder region generating unit for combining the pad data and the mounter data to generate solder region data for each part necessary for solder site inspection;
An integrated circuit printed circuit board (PCB) image input unit for acquiring an image of the printed circuit board (PCB) and inputting image data;
A package area generation unit for automatically extracting solder area data and package area data necessary for part inspection from the image data; And
And a teaching data output unit for combining the solder area data and the package area data to output teaching data necessary for an automatic optical inspection unit (AOI)
Wherein the package area creation unit obtains a region in which the component exists from the solder region data having pad information of each component and divides the region in which the component exists in the image data into a component-specific image, And the center portion of the automatic optical inspection machine is extracted as a package area. The method according to claim 1,
Wherein the Gerber file is a text file of an international standard (RS-274X, RS-274D) and is a file in which various patterns drawn on the printed circuit board (PCB) are expressed as vector type data. Of teaching data. The method according to claim 1,
Wherein the mount file includes a name of a component mounted on the printed circuit board (PCB), a center position and an angle, a component material code, and a number of pads. The method according to claim 1,
Wherein the mount file input unit has a function of changing the overall position and matching the reference position of the Gerber file when the reference origin of the Gerber file is different from the reference origin of the Gerber file. The method according to claim 1,
Wherein the assembled printed circuit board (PCB) image input unit acquires image data for the PCB to be inspected using a camera attached to the automatic optical inspection unit (AOI) Automatic generation of teaching data of optic tester. Inputting gerber file data corresponding to a printed circuit board (PCB) to be inspected;
Processing the input Gerber file data to separate data constituting the solder pad and extract pad data therefrom;
Inputting mount file data of a component mounted corresponding to the printed circuit board (PCB);
Combining the pad data and the mount file data to generate solder area data for each part necessary for solder site inspection;
Acquiring an image of the printed circuit board (PCB) and inputting image data;
Automatically extracting the package area data necessary for the parts part inspection from the solder area data and the image data; And
And combining the solder area data and the package area data to output teaching data necessary for the automatic optical inspection unit (AOI)
Wherein the step of automatically extracting the package area data includes the steps of: obtaining an area where the part exists from the solder area data having pad information of each part; dividing the area in which the part exists, And automatically extracting the central portion in the image for each part as a package area. The method according to claim 6,
Wherein the mount file data includes a mount name of the part, a center position and an angle, a part material code, and a pad number. 8. The method according to claim 6 or 7,
The solder region data is generated by connecting the pads around the center position of the component in consideration of the center position of the component, the center position of the pad, and the number of pads for each component, And the solder region is generated as a solder region. The method according to claim 6,
The input of the image data is carried out using a camera attached to the automatic optical inspection unit (AOI) and using a printed circuit board (PCB (Gold PCB) on which the component assembly is well performed) A method for automatically generating teaching data of an automatic optical inspection machine. 8. The method of claim 7,
Wherein the solder area data and the package area data are copied and used in the parts having the same component code in the printed circuit board. The method according to claim 6,
Wherein the step of automatically extracting the package area data comprises:
Reading image data of the printed circuit board (PCB);
Reading solder area data for all components in the printed circuit board (PCB);
Dividing the image data of the printed circuit board (PCB) into images of respective parts;
Clustering the image of the printed circuit board (PCB); And
Wherein the step of recognizing the package area comprises the step of identifying the package area. 12. The method of claim 11,
Wherein the image segmented by the component includes various images such as a component package, an electrode, a lead, a substrate, a silk line, or solder. 12. The method of claim 11,
Wherein clustering the images of the printed circuit board comprises:
Dividing the divided parts into a plurality of groups, wherein the component package, the electrode, the lead, and the substrate have different color information for each property, A method of automatically generating teaching data of an automatic optical inspection machine. 14. The method of claim 13,
Wherein a plurality of clustering techniques such as a k-means algorithm or an EM algorithm are applied when clustering the images of the printed circuit board. 14. The method of claim 13,
Identifying the package area,
And automatically extracts area information by searching for a group corresponding to a package among the divided image groups on the basis of the color information and processing image data of a group corresponding to the package, . 16. The method of claim 15,
When the image data of the group corresponding to the package is processed to extract the area information, the corresponding group is identified using the position value and the color information, and image binarization is performed to leave only the identified group A method for automatically generating teaching data of an automatic optical inspection machine.

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