KR101423400B1 - Multi-layered printed circuit board and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a prepreg; And an insulating resin layer formed on one surface of the prepreg and capable of forming an illuminance by a desmearing process, wherein the insulating resin layer comprises (a) polyphenylene ether and 9,9-bis A polyphenylene ether modified resin obtained by a redistribution reaction in the presence of a hydroxyaryl fluorene (BCF); (b) an epoxy resin; (c) a curing agent; (d) at least one modified epoxy resin selected from the group consisting of dimeric acid-modified epoxy resins and urethane-modified epoxy resins; And (e) a flame retardant, and a multilayer printed circuit board comprising the insulating resin sheet and a method of manufacturing the same.
In the present invention, it is possible to provide a build-up printed circuit board capable of reducing the total stacking thickness and lowering the interlayer thermal expansion coefficient of the substrate while realizing a high-density micro-circuit pattern.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a multi-layer printed circuit board

The present invention relates to an insulating resin sheet for forming an insulating layer of a build-up printed circuit board capable of reducing the total stacking thickness and lowering the interlayer thermal expansion coefficient of the substrate while achieving a high density fine circuit pattern, And a method of manufacturing the same.

In recent years, due to the high functionality and miniaturization of electronic devices, high integration has been actively pursued in accordance with Moore's Law. As a result, there is a growing demand for a package substrate on which a semiconductor is mounted, in addition to high functionality and fine wiring, as well as thinness.

In order to meet these demands, a build-up board is used as a package substrate for semiconductor, in which insulating resin is laminated by a build-up method and a circuit is formed by a semi-custom method. . Here, the semi-additive method is one of the methods of forming a circuit of a PCB substrate. The method includes a subtractive method of forming a circuit pattern through etching and a method of forming a circuit by plating only a pattern part There is an advantage that a finer pattern can be formed than the subtractive method by a wiring formation method in which a field method (Additive) is combined.

On the other hand, in the conventional microcircuit build-up printed circuit board, since 100% resin is applied as an interlayer insulating material, there arises a problem that the coefficient of thermal expansion of the substrate increases when the components such as chips are mounted on these substrates, There has been a problem that defects are generated during mounting. In order to solve the above-mentioned problems, attempts have been made to lower the interlayer thermal expansion coefficient by adding a large amount of inorganic filler to the inside of the insulating layer, but interlayer adhesion strength, heat resistance and long-term reliability have been lowered. In order to compensate for the warpage problem, a prepreg must be used. However, when such a prepreg is used as an interlayer insulating material, it is impossible to form a roughness of the insulating layer through a desmear process, There is a limit in forming a fine pattern by using the TIB method.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the above-described problems, and it is an object of the present invention to provide a method of manufacturing a multilayer printed circuit board by laminating an insulating resin sheet including an insulating resin layer capable of forming a prepreg and a fine circuit pattern, , It is recognized that the roughness is formed in the circuit forming portion to improve the bonding strength between the rough surface of the insulating layer and the plating layer by the plating process and at the same time reduce the total layer thickness and realize a fine circuit pattern.

Accordingly, an object of the present invention is to provide an insulating resin sheet of a novel laminate structure capable of lowering the thermal expansion coefficient of a substrate and forming an illuminance by a desmear treatment.

Further, the present invention includes the insulating layer formed using the above-described insulating resin sheet, thereby reducing defects in the circuit formation process and simultaneously achieving reduction in thickness of the laminate, interlaminar bond strength, heat resistance and long- It is another object to provide a substrate and a method of manufacturing the same.

The present invention relates to a prepreg; And an insulating resin layer formed on one surface of the prepreg and capable of forming an illuminance by a desmearing process, wherein the insulating resin layer comprises (a) polyphenylene ether and 9,9-bis A polyphenylene ether modified resin obtained by a redistribution reaction in the presence of a hydroxyaryl fluorene (BCF); (b) an epoxy resin; (c) a curing agent; (d) at least one modified epoxy resin selected from the group consisting of dimeric acid-modified epoxy resins, and urethane-modified epoxy resins; And (e) a flame retardant. The present invention also provides an insulating resin sheet formed by curing a thermosetting resin composition.

Here, the polyphenylene ether-modified resin (a) is a low-molecular-weight modified polyphenylene ether resin having a number average molecular weight in the range of 1,000 to 15,000 by a redistribution reaction of a high molecular weight polyphenylene ether resin having a number average molecular weight in the range of 10,000 to 30,000, It is preferable that the redistribution reaction is performed in the presence of an initiator, a catalyst, or a radical initiator and a catalyst.

The modified epoxy resin (d) preferably has an epoxy equivalent of 100 to 500 g / eq and a viscosity of 5,000 to 30,000 cps. The epoxy resin (b) preferably contains two or more kinds of epoxy resins different in epoxy equivalent. .

Wherein the resin composition for forming an insulating resin layer comprises: (a) 10 to 60 parts by weight of a polyphenylene ether modified resin; (b) 10 to 40 parts by weight of an epoxy resin; (c) 10 to 40 parts by weight of a curing agent; (d) 5 to 40 parts by weight of a modified epoxy resin; And (e) 5 to 40 parts by weight of a flame retardant.

According to a preferred embodiment of the present invention, the prepreg includes a fiber substrate and a resin composition impregnated in the fiber substrate, wherein the fiber substrate is selected from the group consisting of glass fiber, glass paper, glass fiber web, and may include one or more selected from the group consisting of glass cloth, aramid fiber, aramid paper, polyester fiber, carbon fiber, inorganic fiber and organic fiber.

It is preferable that the thickness of the prepreg is in the range of 15 탆 to 200 탆, and the thickness of the insulating resin layer is in the range of 1 탆 to 50 탆.

According to a preferred embodiment of the present invention, a support layer may be further included on the insulating resin layer, and further, a release layer may be further provided between the insulating resin layer and the support layer.

The present invention also provides a multilayer printed circuit board on which an insulating layer is formed by the above-described insulating resin sheet.

In addition, the present invention provides a method of manufacturing a multilayer printed circuit board using the above-described insulating resin sheet.

According to a preferred embodiment of the present invention, the manufacturing method comprises the steps of: (i) stacking one or more of the above-described insulating resin sheets on one surface or both surfaces of an inner wiring board so that the prepreg of the insulating resin sheet is in contact with the metal surface of the wiring board Forming a laminate by thermally curing the prepreg through a heating and pressing process to form an insulating layer; (Ii) forming at least one hole in the insulating layer of the laminate; (Iii) desmearing the surface of the insulating layer and the inside of the hole to form an illuminance; (Iv) forming an electroless plating layer on the rough surface and the hole inner surface of the insulating layer; (v) forming a pattern on the formed electroless plating layer using a photoresist; (Vi) forming a circuit layer by electroplating on the pattern; And (iii) peeling the photoresist and removing the exposed electroless plating layer.

In the present invention, since the insulating resin sheet in which the prepreg capable of lowering the thermal expansion coefficient of the substrate and the insulating resin layer capable of forming the roughness in the desmear treatment are sequentially laminated is used in the present invention, it is possible to realize a more precise circuit by significantly reducing the micro-crack incidence rate.

In addition, the thermal expansion coefficient (CTE) of the substrate can be lowered by applying a prepreg (for example, High Filler Loading Prepreg, 60 to 80 wt%) compared to the conventional products having no shrinkage and expansion rate due to the absence of reinforcement.

Further, the thickness of the printed circuit board can be remarkably reduced, and the structural deflection characteristics of the final product can be minimized, thereby ensuring ease of manufacture.

1 is a cross-sectional view showing a configuration of an insulating resin sheet according to an embodiment of the present invention.
2 is a cross-sectional view illustrating a manufacturing process of a multilayer printed circuit board according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail.

The present invention relates to an insulating resin sheet capable of forming an insulating layer in the production of a printed circuit board, which is capable of simultaneously exhibiting a reduction in the total thickness of the laminate, a decrease in the CTE of the substrate, and a high- Sheet is provided.

The insulating resin sheet includes (i) a prepreg; And (ii) an insulating resin layer formed on the prepreg and capable of forming a roughness by a desmearing process.

Here, since the insulating resin layer is a resin layer which does not contain an inorganic filler or contains a very small amount, a micro-crack due to a high content of inorganic filler contained in the insulating layer in a laser processing step in the process of producing a printed circuit board ) Generation rate is significantly reduced, enabling more accurate circuit implementation. In addition, since the soluble material capable of forming the roughness by the desmearing process is included, the bonding strength between the rough surface of the insulating layer and the plating layer formed by the subsequent plating process can be improved.

In addition, since the insulating resin sheet of the present invention has a structure in which the insulating resin layer is laminated on the prepreg, the insulating resin layer has a thickness that does not affect the thermal expansion characteristics of the substrate, The thermal expansion coefficient (CTE) reduction effect can be expressed as it is. At this time, the coefficient of thermal expansion of the substrate can be adjusted by adjusting the composition / composition of the prepreg.

≪ Resin composition for forming insulating resin layer &

In the insulating resin sheet according to the present invention, the insulating resin layer is formed by curing the thermosetting resin composition.

Wherein the thermosetting resin composition comprises: (a) a polyphenylene ether modified resin obtained by redispersing a polyphenylene ether in the presence of 9,9-bis (hydroxyaryl) fluorene (BCF); (b) an epoxy resin; (c) a curing agent; (d) at least one modified epoxy resin selected from the group consisting of dimeric acid-modified epoxy resins and urethane-modified epoxy resins; And (e) a flame retardant. However, it is not particularly limited.

(a) a polyphenylene ether (PPE) modified resin

The first component constituting the thermosetting resin composition for forming an insulating resin layer according to the present invention is a polyphenylene ether modified resin (a).

Conventionally, when modifying a high molecular weight polyphenylene ether with a low molecular weight polyphenylene ether resin, a compound such as a phenol derivative or bisphenol A is generally used. In this case, the molecular structure is rotatable and the dielectric constant is lowered .

However, in the present invention, a high molecular weight polyphenylene ether is modified with a low molecular weight polyphenylene ether resin by using 9,9-bis (hydroxyaryl) fluorene (BCF) instead of the conventionally used phenol derivative or bisphenol A The solubility is improved and the film coating is facilitated. In addition, the hydrophobic double ring hydrocarbon group is prevented from being introduced in the molecular structure, thereby reducing the electron polarization and lowering the dielectric constant. In addition, since the molecular structure of 9,9-bis (hydroxyaryl) fluorene (BCF) is bulky and higher in crystallinity than the conventional phenol derivatives and bisphenol A, the low molecular weight modified polyphenylene ether resin An improvement in the properties of the glass transition temperature (Tg) can be achieved.

Further, the hygroscopic property can be enhanced by the increase of the hydrophobic group, and the crosslinking property can be strengthened, so that the thermal property and the chemical resistance property can be enhanced. By improving the dielectric properties, low dielectric and low loss substrates can be realized. Particularly, in the case of a desmear process for forming a microcircuit, the chemical resistance of the insulating layer is important because it is mostly composed of an acid / alkali process. In the present invention, the polyphenylene ether resin (PPE) modified with BCF has a high degree of crosslinking, thereby enhancing chemical resistance and enabling low surface roughness (Ra).

Accordingly, the insulating resin sheet and the printed circuit board manufactured using the resin composition of the present invention have an advantage of improving physical properties such as moldability, workability, dielectric properties, heat resistance, and adhesive strength.

In the present invention, the polyphenylene ether to be modified may be a high molecular weight polyphenylene ether. For example, a polyphenylene ether having a number average molecular weight (Mn) of 10,000 to 30,000 may be used. Further, it is not particularly limited as long as the main skeleton is polyphenylene ether. The molecular weight of the low molecular weight modified polyphenylene ether modified resin through the redistribution reaction of the high molecular weight polyphenylene ether resin is not particularly limited, but may be, for example, in the range of 1,000 to 15,000.

The 9,9-bis (hydroxyaryl) fluorene (BCF) may be at least one compound selected from the group consisting of compounds represented by the following formulas (1) to (3)

In Formula (1), R ¹ to R ³ are each independently a C ₁ to C ₆ alkyl group; p1 is an integer of 1 to 5, q1 is an integer of 0 to 4, and p1 + q1 is an integer of 5 or less; k1 and k2 are each independently an integer of 0 to 4;

In Formula 2, R ⁴ to R ⁶ are each independently a C ₁ to C ₆ alkyl group; p2 is an integer of 1 to 4, q2 is an integer of 0 to 3, and p2 + q2 is an integer of 4 or less; k3 and k4 are each independently an integer of 0 to 4;

In Formula (3), R ⁷ to R ¹⁰ are each independently a C ₁ to C ₆ alkyl group; q3 and q4 are each independently an integer of 0 to 2, p3 + q3 is an integer of 3 or less, p4 + q4 is an integer of 4 or less, p3 is an integer of 1 to 3, p4 is an integer of 0 to 4, ; k5 and k6 are each independently an integer of 0 to 4;

In addition, the reaction of redispersing the polyphenylene ether in the presence of the 9,9-bis (hydroxyaryl) fluorene (BCF) can be carried out in the presence of a radical initiator and / or a catalyst.

As the radical initiator and the catalyst, those conventionally known in the art can be used. Examples of the radical initiator include t-butylperoxy isopropylmonocarbonate, t-butylperoxy 2-ethylhexylcarbonate, benzoyl peroxide, acetyl But are not limited to, acetyl peroxide, di-t-butyl peroxide, t-butyl peroxylaurate, t-butylperoxybenzoate, , But is not limited thereto. The radical initiator may be used in an amount of 0.1 to 5 parts by weight based on 10 to 60 parts by weight of the polyphenylene ether.

A non-limiting example of the catalyst is cobalt naphthanate. The catalyst may be used in an amount of 0.001 to 0.5 parts by weight based on 10 to 60 parts by weight of the polyphenylene ether.

The method of synthesizing a modified polyphenylene ether modified resin by redistribution of polyphenylene ether is not particularly limited and a conventional method known in the art can be applied. For example, polyphenylene ether, 9,9-bis (hydroxyaryl) fluorene (BCF) and a radical initiator are mixed and heated in a solvent or in the absence of a solvent to prepare a polyphenylene ether modified resin Can be obtained. At this time, the solvent may be a hydrocarbon-based solvent such as benzene or toluene, but is not particularly limited thereto. The reaction temperature and the reaction time can be appropriately controlled according to the number average molecular weight of the desired polyphenylene ether resin, and the reaction can be performed at 60 to 200 ° C for 10 minutes to 10 hours, for example.

In the thermosetting resin composition for forming an insulating resin layer according to the present invention, the content of the polyphenylene ether-modified resin may be in the range of 10 to 60 parts by weight, preferably in the range of 20 to 40 parts by weight, have. When the content of the polyphenylene ether-modified resin falls within the above-mentioned range, the curing property, the molding processability and the adhesive force of the resin composition are good.

(b) Epoxy resin

The second component constituting the thermosetting resin composition for forming an insulating resin layer according to the present invention is an epoxy resin (b).

The epoxy resin may be any conventional epoxy resin known in the art, and it is preferable that two or more epoxy groups are present in one molecule.

Examples of usable epoxy resins include, but are not limited to, bisphenol A type / F type / S type resin, novolak type epoxy resin, alkylphenol novolak type epoxy resin, biphenyl type, aralkyl type, naphthol Naphthol type, dicyclopentadiene type, or mixed form thereof.

More specific examples thereof include epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, naphthalene type epoxy resin, anthracene epoxy resin, biphenyl type epoxy resin, tetramethyl biphenyl type epoxy resin, Cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol S novolak type epoxy resin, biphenyl novolac type epoxy resin, naphthol novolak type epoxy resin, naphthol phenol coaxial novolak type epoxy resin , Naphthol cholizole co-novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenol resin type epoxy resin, triphenyl methane type epoxy resin, tetraphenyl ethane type epoxy resin, dicyclopentadiene phenol addition reaction type epoxy resin, phenol aral A quarternary epoxy resin, a polyfunctional phenol resin, a naphthol aralkyl type epoxy resin There is. At this time, the above-mentioned epoxy resin may be used alone, or two or more epoxy resins may be used in combination.

Particularly when a hydrogenated epoxy resin is used, it is preferable to use bisphenol A or biphenyl-type epoxy resin. In addition, when a resin having a high molecular weight is used in the epoxy resin, a greater ductility can be imparted to the insulating layer, so that adhesion characteristics between the laminated body and the metal after plating can be improved.

In order to further improve the adhesion properties after plating, two or more epoxy resins having different epoxy equivalents may be used in combination in the present invention. Preferably a first epoxy resin having an epoxy equivalent of 400 to 1000 g / eq; And a second epoxy resin having an epoxy equivalent of 100 to 300 g / eq at a weight ratio of 50 to 90:10 to 50. For example, YD-011 (epoxy equivalent: 500 g / eq) and YD-128 (epoxy equivalent: 190 g / eq) can be mixed at the above-mentioned weight ratio.

In the thermosetting resin composition for forming an insulating resin layer according to the present invention, the content of the epoxy resin may be in the range of 10 to 40 parts by weight, preferably 15 to 30 parts by weight per 10 to 60 parts by weight of the polyphenylene ether modified resin Can be negative. When the content of the epoxy resin falls within the above range, the curing property, the molding processability and the adhesive force of the resin composition are good.

(c)

The third component constituting the thermosetting resin composition for forming an insulating resin layer according to the present invention is a curing agent (c).

The curing agent may be a conventional curing agent known in the art without limitation, and may be appropriately selected depending on the type of epoxy resin to be used. Non-limiting examples of usable curing agents include phenol-based, anhydride-based, dicyanamide-based, and curing agents. Of these, phenolic curing agents are preferred because they can further improve heat resistance and adhesiveness.

Non-limiting examples of the phenolic curing agent include phenol novolak, cresol novolac, bisphenol A novolac, naphthalene type, etc. These may be used alone or in combination of two or more.

In the thermosetting resin composition for forming an insulating resin layer according to the present invention, the content of the curing agent can be appropriately controlled in accordance with the content of the epoxy resin. In order to maintain the surface roughness (Ra) of the insulating layer at a low level while further improving the heat resistance and the adhesive strength, it is preferable to mix the curing agent and the epoxy resin in a weight ratio of 20 to 50:80 to 50.

In the thermosetting resin composition for forming an insulating resin layer of the present invention, the content of the curing agent may be 10 to 40 parts by weight, preferably 10 to 30 parts by weight, relative to 10 to 60 parts by weight of the polyphenylene ether modified resin Lt; / RTI > When the content of the curing agent falls within the above-mentioned range, the curing property, strength, heat resistance and fluidity of the resin composition are satisfactory.

In the present invention, the compounding ratio of the epoxy resin and the curing agent may be such that the phenolic hydroxyl group equivalent of the curing agent is in the range of 0.4 to 2.0, preferably 0.5 to 1.0, in terms of the epoxy equivalent of the epoxy resin . ≪ / RTI >

(d) Modified epoxy resin

The fourth component constituting the thermosetting resin composition for forming an insulating resin layer according to the present invention is a modified epoxy resin (d).

Nonlimiting examples of the usable modified epoxy resin include dimer acid-modified epoxy resin and urethane-modified epoxy resin, and these may be used alone or in combination of two or more.

The dimeric acid-modified epoxy resin is liable to form a cured product which gives flexibility by the structural factors of the dimeric acid-modified part when the insulating layer is formed by the curing reaction. Further, by providing elastomeric properties to the insulator, the plating adhesion, heat resistance, and humidity resistance characteristics can be improved.

Such a dimeric acid-modified epoxy resin is preferred because the modification ratio is about 5 to 30%, and the coating adhesion property is excellent and the heat resistance and moisture resistance are further improved. Examples of usable dimeric acid-modified epoxy resins include KSR-200 (Kukdo Chemical Co., Ltd.) and the like. The epoxy equivalent weight and viscosity of the dimeric acid-modified epoxy resin are not particularly limited, but when the epoxy equivalent is about 100 to 500 g / eq and the viscosity is about 5,000 to 30,000 cps, the plating adhesion, the heat resistance and the moisture resistance can be further improved desirable.

The urethane-modified epoxy is an insulating layer, which improves the plating adhesion and the ductility of the insulating layer when used, thereby improving heat resistance and moisture resistance.

Examples of the urethane-modified epoxy resin that can be used include UME-315 (Kukdo Chemical), UME-330 (Kukdo Chemical), and the like. These may be used alone or in combination of two or more. In addition, the urethane-modified epoxy resin is preferable because it has excellent plating adhesion properties and further improved heat resistance and moisture resistance when the modification ratio is about 5 to 30%. The epoxy equivalent weight and viscosity of the urethane-modified epoxy resin are not particularly limited. However, when the epoxy equivalent is about 100 to 500 g / eq and the viscosity is about 5,000 to 30,000 cps, the coating adhesion, heat resistance, .

In the thermosetting resin composition for forming an insulating resin layer according to the present invention, the content of the modified epoxy resin may be 5 to 40 parts by weight, preferably 5 to 30 parts by weight, based on 100 parts by weight of the mixture of the epoxy resin and the curing agent And more preferably in the range of 5 to 15 parts by weight. If the amount of the modified epoxy resin is less than 5 parts by weight, the coating property and the plating adhesion property may be deteriorated. If the amount exceeds 40 parts by weight, the compatibility between the modified epoxy resin and the epoxy resin is poor and coating property and adhesion between the printed circuit board and the insulator And a reduction in heat resistance is expected.

(e) Flame retardant

The fifth component constituting the thermosetting resin composition for forming an insulating resin layer according to the present invention is a flame retardant (e).

The flame retardant may be any conventional flame retardant known in the art, but it is preferably an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicon flame retardant, or a metal hydroxide.

The flame retardant may be contained in an amount of 5 to 40 parts by weight, preferably 5 to 30 parts by weight, more preferably 5 to 15 parts by weight, based on 10 to 60 parts by weight of the polyphenylene ether modified resin have. When the content is in the above range, the resin composition has sufficient flame resistance and the heat resistance of the cured product is also preferable.

The thermosetting resin composition for forming an insulating resin layer of the present invention may further comprise a curing accelerator. The curing accelerator may be an organic metal salt or an organic metal complex containing at least one metal selected from the group consisting of iron, copper, zinc, cobalt, lead, nickel, manganese and tin.

Examples of the organic metal salt or organometallic complex include iron naphthenate, copper naphthenate, zinc naphthenate, cobalt naphthenate, nickel naphthenate, manganese naphthenate, tin naphthenate, zinc Octanoate, tin octanoate, iron octanoate, copper octanoate, zinc 2-ethylhexanate, lead acetylacetonate, cobalt acetylacetonate, or dibutyltin maleate. But is not limited thereto. These may be used singly or in combination of two or more. The curing accelerator may be included in an amount of 0.01 to 1 part by weight based on 10 to 60 parts by weight of polyphenylene ether, but is not limited thereto.

In addition to the above-mentioned components, the thermosetting resin composition for forming an insulating resin layer of the present invention may further contain additives such as inorganic fillers. Examples of the inorganic filler include, but are not limited to, silica, alumina, aluminum hydroxide, calcium carbonate, clay, talc, silicon nitride, boron nitride, titanium oxide, barium titanate or titanate.

On the other hand, the resin composition of the present invention may contain various additives such as flame retardants generally known in the art, other thermosetting resins, thermoplastic resins and oligomers thereof, Other additives such as a polymer, a solid rubber particle or an ultraviolet absorber, an antioxidant, a polymerization initiator, a dye, a pigment, a dispersing agent, a thickener, a leveling agent and the like. For example, flame retardants such as organic phosphorus flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, silicone flame retardants and metal hydroxides; Organic fillers such as silicone-based powder, nylon powder, and fluororesin powder; thickeners such as orthobenzene and benzene; Polymer-based defoaming agents or leveling agents such as silicones and fluororesins; Adhesion-imparting agents such as imidazole-based, thiazole-based, triazole-based and silane-based coupling agents; Phthalocyanine, carbon black, and other coloring agents.

The thermosetting resin composition may be blended with a thermoplastic resin for the purpose of imparting appropriate flexibility to the cured resin composition. Examples of such a thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyimide, polyamideimide, polyethersulfone, polysulfone and the like. Any one of these thermoplastic resins may be used alone, or two or more of them may be used in combination.

≪ Prepreg >

The prepreg of the present invention comprises a fiber substrate and a resin composition impregnated in the fiber substrate.

The fibrous substrate may be any flexible fibrous substrate of the present invention having flexibility.

Non-limiting examples of usable fiber substrates are glass fibers, glass paper, glass webs, glass cloths, aramid fibers, aramid paper, polyester fibers, carbon fibers, Inorganic fibers, organic fibers, or a mixed form of at least one of these. More specifically, glass fiber substrates such as glass woven fabric, glass nonwoven fabric, and glass paper; A woven fabric or a nonwoven fabric made of synthetic fibers such as paper, aramid, polyester, aromatic polyester, and fluororesin; Woven fabrics and mats made of roving, chopped strand mat, surfacing mat, metal fiber, carbon fiber, mineral fiber and the like. These substrates may be used alone or in combination of two or more. When a reinforced fiber substrate is used in combination, rigidity and dimensional stability of the prepreg can be improved. The thickness of such a fiber substrate is not particularly limited, and may range, for example, from about 0.01 mm to 0.3 mm.

The resin composition may be used without limitation in a conventional thermosetting resin composition used in the prepreg formation. For example, it may be a thermosetting resin composition containing an epoxy resin, a phenol resin or the like as an effective component.

The prepreg of the present invention may further include inorganic fillers customary in the art for the purpose of lowering the thermal expansion rate.

Non-limiting examples of usable inorganic fillers include inorganic fillers such as silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide, glass fiber, aluminum borate, strontium titanate, calcium titanate , Magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, boron nitride, silicon nitride, and the like. The content of the inorganic filler varies depending on physical properties such as moldability, low stress and high temperature strength. However, the content of the inorganic filler is preferably in the range of about 10 to 90 parts by weight per 100 parts by weight of the resin varnish mixed with the solvent in the thermosetting resin composition for forming a prepreg And preferably about 20 to 80 parts by weight.

Generally, prepreg refers to a sheet-like material obtained by coating or impregnating a fiber substrate with a thermosetting resin composition, followed by curing to a B-stage (semi-cured state) by heating. In addition to the above-mentioned methods, the prepreg of the present invention can be produced by a known hot-melt method, a solvent method or the like known in the art.

In the solvent method, a resin composition varnish formed by dissolving a thermosetting resin composition for forming a prepreg in an organic solvent is impregnated with a fiber substrate, followed by drying. When such a solvent method is employed, a resin varnish is generally used. Examples of the method of impregnating the resin composition with the fiber substrate include a method of immersing the substrate in a resin varnish, a method of applying the resin varnish to the substrate by various coaters, a method of spraying the resin varnish onto the substrate by spraying, . At this time, when the fiber substrate is immersed in the resin varnish, the impregnability of the resin composition with respect to the fiber substrate can be improved, which is preferable.

When the resin composition varnish is prepared, examples of the organic solvent include ketones such as acetone, methyl ethyl ketone and cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate Aromatic hydrocarbons such as toluene and xylene; dimethylformamide; dimethylacetamide; N-methylpyrrolidone; and the like. The organic solvents may be used alone or in combination of two or more.

Also, the hot melt method may be a method in which the resin composition is coated on a releasing paper excellent in releasability from the resin composition without dissolving the resin composition in an organic solvent, and then the resin composition is laminated on a sheet-like fiber substrate, or directly coated with a die coater. It may also be produced by continuously laminating an adhesive film comprising a thermosetting resin composition laminated on a support onto both surfaces of a sheet-like reinforcing substrate under heating and pressurizing conditions.

<Insulation resin sheet>

The insulating resin sheet of the present invention comprises the above-mentioned prepreg; And an insulating resin layer formed on one surface of the prepreg.

Hereinafter, an insulating resin sheet according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1, the insulating resin sheet 100 of the present invention includes a prepreg 110 and an insulating resin layer 120 located on one side of the prepreg, .

In the insulating resin sheet of the present invention, since the prepreg 110 includes the fibrous base material and the inorganic filler, the thermal expansion coefficient of the substrate can be lowered. The prepreg may be composed of 10 wt% to 90 wt% of the inorganic filler, and the coefficient of thermal expansion of the substrate can be adjusted by freely adjusting the content of the inorganic filler. Also, a general-purpose prepreg can be applied as it is.

On the other hand, the thicker the prepreg is, the more the exposure of the fiber substrate is alleviated, while the thickness of the multilayer printed circuit board is disadvantageous. Considering physical stiffness, thermal expansion coefficient, thinning, etc. of the insulating resin sheet, the thickness of the prepreg 110 may be in the range of 15 탆 to 200 탆, preferably in the range of 15 to 100 탆, Lt; / RTI &gt; Further, it is necessary that the prepreg has a laminate-enabling fluidity without forming voids in the wiring portion of the inner-layer circuit board. Accordingly, the lowest melt viscosity is preferably in the range of 200 to 7000 poise, more preferably 400 to 3000 poise.

In the insulating resin sheet of the present invention, the insulating resin layer 120 is disposed on the upper surface of the prepreg 110, and includes a soluble material capable of forming an illuminance by a desmearing process.

The thickness of the insulating resin layer 120 may range from 1 to 50 mu m, preferably from 1 to 30 mu m, which does not affect the thermal expansion characteristics of the substrate. Also, a film which can be peeled off by heating, pressing, and pressing under coating is applied.

The insulating resin layer 120 includes a cured layer formed by curing the above-mentioned thermosetting resin composition for forming an insulating resin layer. In this case, the thermosetting resin composition need not necessarily be completely thermally cured, It is good if it is hard enough to be exercised.

The cured layer can be obtained by a method of heating and curing an adhesive sheet coated with a thermosetting resin composition on a support. For example, the adhesive sheet may be formed by applying a thermosetting resin composition varnish for forming an insulating resin layer on a support, heating and drying the varnish, bonding the resin varnish to one surface of the prepreg, or heating, drying and curing the resin varnish applied on the support And the insulating resin layer can be obtained by bonding the insulating resin layer to one side of the prepreg to obtain the insulating resin sheet of the present invention.

According to an example of the present invention, the insulating resin sheet 100 may further include a support layer 140 on the insulating resin layer 120.

As the support, a plastic film may be used, and a metal foil such as a release film, a copper foil, and an aluminum foil may be used as a support. Examples of usable plastic films include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; Polycarbonate, acrylic resin, cyclic polyolefin, triacetyl cellulose, polyether sulfide, polyether ketone, polyimide and the like.

When a polyimide (PI) film is used as the support, high temperature press at 220 DEG C or higher is possible. In the case of a polyethylene terephthalate (PET) film, a low-temperature press of about 180 占 폚 may be used. In this case, when a plastic film is used as the support, it is preferable to use a support having a release layer, in which the surface to be cured of the cured layer of the thermosetting resin composition has been subjected to release treatment, in order to enable release from the cured product of the thermosetting resin composition. In this case, the plastic film may be a matte-treated or corona-treated film, and a release layer may be formed on the treated surface.

Further, since the metal foil can be removed by etching, it is not necessary to further use the release layer when the metal foil is used as a support. It is also possible to use the metal foil as a conductor layer without peeling off. Examples of usable metal foils include aluminum foil and copper foil. When such a metal foil is used as a support layer, a high-temperature press at 220 DEG C or higher is possible.

The thickness of the support layer 140 is not particularly limited, but may be in the range of 10 to 150 mu m, preferably in the range of 25 to 50 mu m.

According to another embodiment of the present invention, the insulating resin sheet 100 may further include a release layer 130 between the insulating resin layer 120 and the support layer 140.

The releasing layer 130 has a function of easily separating the insulating resin layer 120 so that the insulating resin layer 120 can maintain its shape without deteriorating when the supporting layer 140 is separated from the cured product of the thermosetting resin composition after pressing. Here, the release layer may be a commonly used film-type release material.

The releasing agent used in the releasing layer 130 is not particularly limited to its component as long as the insulating resin layer can be peeled completely from the support, and conventional releasing agent components known in the art can be used. Non-limiting examples of the releasing agent include an epoxy-based releasing agent, a releasing agent comprising a fluororesin, a silicone-based releasing agent, an alkyd resin-based releasing agent, and a water-soluble polymer. The thickness of the release layer 130 is not particularly limited. For example, the thickness of the release layer 130 may be in the range of 0.01 to 10 mu m, preferably in the range of 0.1 to 5 mu m.

The insulating resin sheet 100 according to the present invention can be obtained by bonding the thermosetting resin composition to the prepreg 110 with the cured insulating resin layer 120. For example, a method of laminating and bonding the support layer 140 and the insulating resin layer 120 comprising the cured layer of the thermosetting resin composition to one side of the prepreg, and a method of bonding the prepreg 110 to the insulating resin layer 120 And the sheet-like insulating resin layer 120 and the prepreg 110 may be rolled up in a roll form and laminated in a continuous manner. Alternatively, both the roll-shaped sheets may be cut It is also possible to perform the post-lamination.

In the insulating resin sheet of the present invention, the total thickness of the prepreg 110 and the insulating resin layer 120 is in the range of 16 탆 to 250 탆, preferably in the range of 20 to 100 탆. When the thickness of the insulating resin sheet is within the above-mentioned range, the circuit is sufficiently filled, and the multilayer printed circuit board can be made thinner.

On the other hand, the other surface of the prepreg on which the insulating resin layer is not disposed is preferably protected by a protective film in order to prevent damage to the surface and adhesion of foreign matter. The same protective film as the above-mentioned plastic film can be used. The thickness of the protective film may range from 1 to 40 mu m, preferably from 10 to 30 mu m.

<Printed Circuit Board>

The present invention includes a multilayer printed circuit board using the above-described insulating resin sheet as an insulating layer.

The multilayer printed circuit board in the present invention refers to a printed circuit board laminated by two to three or more layers by plating through-hole method, build-up method or the like, and can be obtained by superimposing an insulating resin sheet on an inner wiring board and heating and pressing. The multilayered printed circuit board uses an insulating resin sheet according to the present invention in which a prepreg having a low thermal expansion coefficient and an insulating resin layer capable of forming an illuminance by a desmearing process are sequentially laminated, thereby reducing the total lamination thickness, A high density fine circuit pattern can be realized while lowering the interlayer thermal expansion coefficient of the substrate.

The printed circuit board of the present invention can be manufactured by a conventional method known in the art, for example, semi-additive, except that the above-described insulating resin sheet is used.

(I) a step of laminating the above-described insulating resin sheet on one surface or both surfaces of the inner-layer wiring board, wherein the prepreg of the insulating resin sheet is disposed so as to be in contact with the metal surface of the wiring board Heat-curing the prepreg through a post-heating and pressurizing process to build up the laminate; (Ii) forming at least one hole in the insulating resin sheet of the laminate; (Iii) desmearing the surface and the inside of the insulating resin sheet to form an illuminance; (Iv) forming an electroless plating layer on the rough surface and the hole inner surface of the insulating resin sheet; (v) forming a pattern on the formed electroless plating layer using a photoresist; (Vi) forming a circuit layer by electroplating on the pattern; And (iii) peeling the photoresist and removing the exposed electroless plating layer.

Hereinafter, a manufacturing process of a printed circuit board according to an embodiment of the present invention will be described in detail with reference to FIG. However, the present invention is not limited to the processes illustrated below.

1) A prepreg of an insulating resin sheet is disposed on one surface or both surfaces of the inner wiring board so as to be in contact with the metal surface of the wiring board, and then heated and pressed to form a laminate (see FIG.

The inner-layer wiring board is used as a core substrate, and conventional ones known in the art can be used without limitation. For example, a double-sided flexible metal-clad laminate (FCCL) can be used. For example, a double-sided copper plate is drilled to form a hole, and then plating is performed. Then, dry film resistors are laminated on both sides, Lt; RTI ID = 0.0 &gt; a &lt; / RTI &gt;

2, an inner wiring board and an insulating resin sheet are laminated, a metal surface of the inner wiring board is arranged so as to be in contact with a prepreg of an insulating resin sheet, and then a vacuum pressing type laminate apparatus or the like And then the insulating resin sheet is heated and cured by a hot-air drying apparatus or the like.

The conditions under which heating and pressure molding is not particularly limited include, for example, a temperature of 60 to 160 DEG C and a pressure of 0.2 to 3 MPa. The conditions for heating and curing are not particularly limited, but can be carried out at a temperature of 140 to 240 占 폚 for 30 to 120 minutes, for example.

Or prepregs of the above-described insulating resin sheet are superimposed on the inner-layer wiring board, and this is heat-pressed with a flat press or the like. Here, the condition under which heating and pressure molding is not particularly limited, but can be carried out at a temperature of 140 to 240 캜 and a pressure of 1 to 4 MPa, for example. In the heat press molding by such a flat press apparatus or the like, the insulating resin sheet is heated and cured simultaneously with the heat press molding.

The curing of the insulating resin sheet or the prepreg of the insulating resin sheet may be performed in a semi-cured state in order to facilitate laser irradiation and removal of resin residue (smear) thereafter to improve desmearability.

On the other hand, in the case where the insulating resin sheet includes a release layer, a support layer, or all of them, after the laminate is formed in this step, the release layer, the support layer or all of them, which are sequentially laminated on the upper and lower surfaces of the laminate, And then the next 2) step is performed (see Fig. 2 (b)).

2) One or more holes are formed in the insulating resin sheet of the laminate (see Fig. 2 (c)).

A hole is formed by irradiating the insulating resin sheet of the laminate with a laser. The laser may be an excimer laser, a UV laser, or a carbon dioxide gas (CO ₂ ) laser.

When this step is performed, a hole connected to the inner-layer wiring board is formed.

3) The surface of the insulating resin sheet and the inner surface of the hole are subjected to desmear treatment to form roughness (see Fig. 2 (d)).

The desmear process is a process for removing resin residues (smear) after laser irradiation with an oxidizing agent such as permanganate salt, dichromate, or the like. In this step, the surface of the insulating resin sheet and the inner surface of the hole are processed And a rough surface having an appropriate roughness (roughness) is formed.

At this time, if the desmear treatment is insufficient and the desmear resistance is not sufficiently secured, even if the metal plating treatment is performed on the hole, the conductivity of the upper layer metal wiring and the lower layer metal wiring can not be sufficiently secured due to the smear. Further, the surface of the smooth insulating resin sheet can be roughened at the same time, and the adhesion of the conductive wiring circuit formed by the subsequent metal plating can be increased.

If necessary, an etching process may be further carried out after the desmearing step to maintain a horizontal roughness surface having an appropriate roughness on the insulating resin sheet.

It is preferable that the surface of the insulating resin sheet after the desmearing step has a desired roughness for forming a fine circuit pattern. For example, the surface roughness of the insulating resin sheet after the desmearing step may be in the range of 50 nm to 1,000 nm, and preferably in the range of 100 nm to 500 nm.

4) An electroless plating layer is formed on the rough surface and the inner surface of the hole of the insulating resin sheet (see Fig. 2 (e)).

Electroless plating is performed on the rough surface and the inner surface of the hole to form a comparatively thin plating layer. This electroless plating layer secures adhesion strength to the insulating resin layer in advance in order to raise the fine circuit pattern layer to be formed thereon.

Generally, the adhesiveness between the formed circuit electrode and the substrate is closely related, and an electroless plating layer is formed between the substrate and the circuit electrode. Here, since the electroless plating layer is formed using the surface-coated catalyst as the active point, ultimately, there is no adhesion with the substrate. Therefore, when the surface roughness of the substrate is large, the adhesion between them is kept good by the anchor effect, but if there is no roughness on the surface of the substrate, the adhesiveness tends to be low. Therefore, it is preferable to adjust the surface roughness to 0.1 times or less of the formed circuit width because a good circuit shape can be obtained.

At this time, the electroless plating layer to be a seed layer of the electroplating layer is preferably in the range of 0.1 to 5 mu m.

5) A pattern is formed on the electroless plating layer formed using a photoresist (see Fig. 2 (f)).

In order to form a desired circuit pattern on the electroless plating layer, a fine circuit pattern is formed through a process of coating a photoresist as a lithography process and forming an opening for forming an outer layer pattern.

Here, the photoresist may be a dry film or the like.

6) A circuit layer is formed by electrolytic plating on the pattern (see Fig. 2 (g)).

Thereafter, a conductor layer for forming the fine circuit pattern is formed on the opening of the photoresist layer by electrolytic plating.

Through this step, the electroplated layer forms a new circuit layer connected to the inner wiring board by the holes. Here, the thickness of the electroplating layer is preferably in the range of about 1 m to 100 m.

7) The photoresist is peeled off and the exposed electroless plating layer is removed.

Finally, the unnecessary photoresist layer is removed and the exposed electroless plating layer is removed to complete the circuit pattern.

Then, if necessary, the production of a printed circuit board is completed by further performing a manufacturing process of a conventional printed circuit board known in the art, such as an electronic element mounting process.

The above-described method for manufacturing a multilayer printed circuit board may be performed by modifying the steps of the respective processes or selectively mixing them according to the design specifications, not by sequentially performing the steps described above.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following Examples and Experimental Examples are merely illustrative of the present invention, and the scope of the present invention is not limited by the following Examples and Experimental Examples.

[Examples 1 to 3]

1. Preparation of Resin Composition

The polyphenylene ether modified resin, the epoxy resin, the curing agent, the modified epoxy resin and the flame retardant were mixed according to the composition shown in the following Table 1 to prepare a resin composition for forming an insulating resin layer. In Table 1, the unit of usage of each composition is parts by weight.

2. Manufacture of insulating resin sheet and printed circuit board

The resin composition thus prepared was coated on a PI film (Polyimide - 50 탆) which had been subjected to a release treatment using a gravure coater to a thickness of 5 탆 and then dried in a dryer at 150 캜 for 5 to 10 minutes Respectively.

(Manufactured by Mitsubishi Gas Chemical Co., CCL-HL-832 (PPG)) and 0.125 mm Thin Core (Mitsubishi Gas Chemicla, CCL-HL-832) And then molded at a temperature of 180 DEG C and a pressure of 40 kgf / cm &lt; ² &gt; for 120 minutes to prepare a laminate having a thickness of 0.23 to 0.25 mm.

A multilayer printed circuit board was fabricated by performing hole processing, desmear treatment, electroless plating layer, and circuit formation according to a conventional method using the thus prepared laminate.

[Comparative Examples 1 to 3]

A resin composition, a prepreg and a printed circuit board were prepared in the same manner as in the above example, except that the composition shown in Table 1 was used. In Table 1, the unit of usage of each composition is parts by weight.

division Example Comparative Example One 2 3 One 2 3 (One) PPE  Modified resin Polyphenylene ether
(PPE) 30 30 30 30 30 30 Polyphenylene ether
Resin molecular weight before reforming 24000 24000 24000 24000 24000 24000 Bisphenol A - - - 0.3 0.3 - 9,9-bis (3-methyl-4-hydroxyphenyl) fluorene (BCF) 0.3 0.3 0.3 - - 0.3 Radical initiator 0.27 0.27 0.27 0.27 0.27 0.27 catalyst 0.008 0.008 0.008 0.008 0.008 0.008 Polyphenylene ether modified resin molecular weight 12500 12500 12500 11000 11000 12500 (2) Epoxy resin Epoxy resin 1 20 20 20 20 20 20 Epoxy resin 2 20 20 20 20 20 20 (3) Curing agent Hardener 25 25 25 25 25 25 (4) Modified epoxy resin Modified epoxy resin 1 10 - 5 10 - - Modified Epoxy Resin 2 - 10 5 - - - Modified Epoxy Resin 3 - - - - 10 10 (5)
Flame retardant Flame retardant 10 10 10 10 10 10 Evaluation items Permittivity & dielectric loss
(at 1 GHz) 2.6 / 0.008 2.7 / 0.007 2.7 / 0.008 3.0 / 0.012 3.1 / 0.013 2.7 / 0.009 Plating adhesion (kgf / cm) 0.8 0.8 0.8 0.5 0.4 0.7 Surface roughness-Ra (nm) 240 260 252 490 580 360 Lead heat resistance (@ 288) 600 seconds 600 seconds 600 seconds 120 seconds 120 seconds 600 seconds Glass transition temperature (Tg, ° C) 170 172 170 142 126 162 Flammability V-0 V-0 V-0 V-0 V-0 V-0

Company

1) Epoxy resin 1: YD-011 (epoxy equivalent weight: 500 g / eq)

2) Epoxy resin 2: YD-128 (epoxy equivalent 190 g / eq)

3) Radical initiator: PB-I

4) Catalyst: Cobalt naphthanate

5) Hardener: KTG-105 (OH equivalent: 104 g / eq)

6) Modified Epoxy Resin 1: Dimeric acid-modified epoxy resin (KSR-200)

7) Modified Epoxy Resin 2: Urethane Modified Epoxy Resin (UME-315)

8) Modified Epoxy Resin 3: CTBN Modified Epoxy Resin (KR-207)

9) Flame retardant: phosphorus flame retardant (SPB-100)

Experimental Example  1. Evaluation of physical properties of printed circuit board

The following tests were conducted on the printed circuit boards prepared in Examples 1 to 3 and Comparative Examples 1 to 3, and the results are shown in Table 1 above.

1) Permittivity: IPC TM-650 was measured using a material analyzer according to the test standard of 2.5.5.1.

2) Plating adhesion strength: The adhesion strength between the plated layer and the insulator was measured according to the test standard of IPC-TM-650 2.4.8.

3) Surface roughness: Ra value was measured using a non-contact 3D Optical Profiler (Bruker Contour GT) to measure the surface roughness. The Ra value is an average value of the height calculated over the entire measurement area, and specifically, the absolute value of the height varying within the measurement area is measured from the average line surface and arithmetically averaged. Here, the average roughness It is the value measured according to the obtained.

4) Lead heat resistance: The sample was cut into a size of 5 cm x 5 cm in a 288 ° C water bath, and the time at which the abnormality began to occur was measured.

5) The glass transition temperature (T _g ) was _measured by DMA (Dynamic Mechanical Analysis) using Q800 of TA company by IPC-TM-650-2.4.24.4 (DMA Method).

6) Flammability: The measurement was made in accordance with UL 94 standard.

As a result of the test, the printed circuit board using the insulating resin sheet of the present invention had a surface roughness of less than half of that of the conventional product after the desizing treatment, and was excellent in terms of the plating adhesion force, the substrate thermal expansion coefficient, the dielectric constant and the glass transition temperature (See Table 1).

Accordingly, a multilayer printed circuit board with high reliability can be manufactured in the future, and it is considered to be usefully used as a constituent material of a small and lightweight new semiconductor package.

Claims (18)

Prepreg; And
An insulating resin sheet formed on one surface of the prepreg and including an insulating resin layer capable of forming an illuminance by a desmearing process,
The insulating resin layer
(a) a polyphenylene ether modified resin obtained by redistribution of polyphenylene ether in the presence of 9,9-bis (hydroxyaryl) fluorene (BCF);
(b) an epoxy resin;
(c) a curing agent;
(d) at least one modified epoxy resin selected from the group consisting of a dimer acid-modified epoxy resin and a urethane-modified epoxy resin; And
(e) Flame retardant
Wherein the thermosetting resin composition is formed by curing the thermosetting resin composition. The polyphenylene ether modified resin according to claim 1, wherein the polyphenylene ether modified resin is a low molecular weight modified polyphenylene ether resin having a number average molecular weight of 1,000 to 15,000 by a redistribution reaction of a high molecular weight polyphenylene ether resin having a number average molecular weight of 10,000 to 30,000 Is an insulating resin sheet. The insulating resin sheet according to claim 1, wherein the redistribution reaction of the polyphenylene ether-modified resin (a) is carried out in the presence of a radical initiator, a catalyst, or a radical initiator and a catalyst. The insulating resin sheet according to claim 1, wherein the epoxy resin (b) is a mixture of two or more epoxy resins different in epoxy equivalent. The epoxy resin composition according to claim 4, wherein the epoxy resin (b) is a first epoxy resin having an epoxy equivalent of 400 to 1000 g / eq; And a second epoxy resin having an epoxy equivalent of 100 to 300 g / eq at a weight ratio of 50 to 90:10 to 50. The insulating resin sheet according to claim 1, wherein the curing agent (c) is selected from the group consisting of phenol-based, anhydride-based, and dicyanamide-based curing agents. The insulating resin sheet according to claim 1, wherein the modified epoxy resin (d) has an epoxy equivalent of 100 to 500 g / eq and a viscosity of 5000 to 30,000 cps. The insulating resin sheet according to claim 1, wherein the flame retardant is at least one member selected from the group consisting of an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicon flame retardant, and a metal hydroxide. The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition comprises
(a) 10 to 60 parts by weight of a polyphenylene ether modified resin;
(b) 10 to 40 parts by weight of an epoxy resin;
(c) 10 to 40 parts by weight of a curing agent;
(d) 5 to 40 parts by weight of a modified epoxy resin; And
(e) 5 to 40 parts by weight of a flame retardant. The method of claim 1, wherein the prepreg comprises a fiber substrate and a resin composition impregnated in the fiber substrate,
The fibrous base material may be selected from the group consisting of glass fiber, glass paper, glass fiber, glass cloth, aramid fiber, aramid paper, polyester fiber, carbon fiber, Wherein the insulating resin sheet comprises at least one member selected from the group consisting of polyimide, The insulating resin sheet according to claim 10, wherein the prepreg further comprises an inorganic filler. The method of claim 1, wherein the thickness of the prepreg is in the range of 15 탆 to 200 탆,
Wherein the thickness of the insulating resin layer is in the range of 1 占 퐉 to 50 占 퐉. The insulating resin sheet according to claim 1, further comprising a support layer on the insulating resin layer. The insulating resin sheet according to claim 13, further comprising a release layer between the insulating resin layer and the support layer. 14. The insulating resin sheet according to claim 13, wherein the support layer is a plastic film or a metal foil. 15. A multilayer printed circuit board comprising an insulating resin sheet according to any one of claims 1 to 15, wherein the insulating layer is formed. (i) An insulating resin sheet according to any one of claims 1 to 15 is laminated on one or both surfaces of an inner wiring board, wherein the prepreg of the insulating resin sheet is disposed so as to be in contact with the metal surface of the wiring board Heat-curing the prepreg through a post-heating and pressurizing process to build up the laminate;
(Ii) forming at least one hole in the insulating resin sheet of the laminate;
(Iii) dishing the surface and the inside of the insulating resin sheet to form an illuminance;
(Iv) forming an electroless plating layer on the rough surface and the hole inner surface of the insulating resin sheet;
(v) forming a pattern on the formed electroless plating layer using a photoresist;
(Vi) forming a circuit layer by electroplating on the pattern; And
(Iii) peeling the photoresist and removing the exposed electroless plating layer
&Lt; / RTI &gt; 18. The method according to claim 17, wherein if the insulating resin sheet comprises a release layer, a support layer or both, between the step (i) and the step (ii) , The support layer, or all of them. &Lt; Desc / Clms Page number 13 &gt;

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