KR101399265B1 - Organic light emitting diodes diplay device and method of manufacturing the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting diode (OLED) display device and a method of manufacturing the same, and more particularly, to an organic light emitting diode display device having a structure in which a getter member is interposed between a substrate and a thin film transistor And the lifetime can be improved. In addition, since a separate patterning step for forming the getter member is not required, it is possible to reduce the number of steps and prevent the contact characteristics between the thin film transistor and the organic light emitting diode from being deteriorated.

Getter element, thin film transistor, organic light emitting diode, lifetime, moisture, oxygen

Description

Technical Field [0001] The present invention relates to an organic light emitting diode (OLED) display device and a method of manufacturing the same,

1 is a plan view of an organic light emitting diode display device according to a first embodiment of the present invention.

2 is a cross-sectional view taken along the line I-I 'shown in FIG.

3 is a cross-sectional view of an organic light emitting diode display device according to a second embodiment of the present invention.

4 is a cross-sectional view of an organic light emitting diode display device according to a third embodiment of the present invention.

5A to 5G are views illustrating a method of manufacturing an organic light emitting diode display device according to a fourth embodiment of the present invention.

6A and 6B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display device according to a fifth embodiment of the present invention.

7A and 7B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display device according to a sixth embodiment of the present invention.

 DESCRIPTION OF THE REFERENCE NUMERALS (S)

 100: first substrate 110: getter member

 120: gate insulating film 130: protective film

 132: first connecting member 135: first auxiliary getter member

 200: second substrate 210: first electrode

 220: organic light emitting layer 230: second electrode

 235: second auxiliary getter member 245: second connecting member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode (OLED) display device, and more particularly, to a dual panel type organic light emitting diode display device having a gettering device and a method of manufacturing the same.

The organic light emitting diode display device is a self-luminous type, and it does not require a backlight such as a liquid crystal display device, so that it can be made thin and light, and can be manufactured through a simple process, thereby improving price competitiveness. In addition, organic light emitting diode display devices are rapidly advancing as next generation displays because they have low voltage driving, high luminous efficiency and wide viewing angles.

The organic light emitting diode display device includes an organic light emitting diode element and an array element for generating light. The array element has a thin film transistor for individually driving the organic light emitting diode elements disposed in each pixel, and exhibits the same luminance even when a low current is applied. As a result, the organic light emitting diode display device is advantageous in terms of low power consumption, fixed size, and large size, and can improve the life of the device.

Such an organic light emitting diode display device has a disadvantage that an array device and an organic light emitting diode device are formed on a single substrate, the manufacturing process time of the organic light emitting diode display device is prolonged and the process yield is lowered.

Thus, a technology for a dual panel type organic light emitting diode display device in which an array element and an organic light emitting diode element are formed on different substrates has been developed. That is, in the dual panel type organic light emitting diode display device, the array elements and the organic light emitting diode elements are formed on different substrates, respectively, and then the array elements and the organic light emitting diode elements are electrically connected to each other. Thus, the production efficiency of the organic light emitting diode display device can be improved.

However, although the dual panel type organic light emitting diode display device can improve the production yield and the aperture ratio, it has been difficult to provide a getter member for removing moisture remaining therein. This is because the dual panel type organic light emitting diode display device is a top light emitting type that emits light to the upper substrate, so that a getter member made of an opaque material can not be provided on the inner surface of the upper substrate as in the conventional organic light emitting diode display device to be.

In addition, when a getter member is interposed between the thin film transistor and the organic light emitting diode, the contact resistance between the thin film transistor and the organic light emitting diode may increase or they may not be electrically connected to each other.

It is an object of the present invention to provide a dual panel type organic light emitting diode display device having a getter member to prevent the lifetime and the reliability from deteriorating.

It is another object of the present invention to provide a method of manufacturing the organic light emitting diode display device.

According to an aspect of the present invention, there is provided an organic light emitting diode (OLED) display device. The organic light emitting diode display device includes a first substrate, a second substrate bonded to the first substrate with a space therebetween, a getter member disposed on the first substrate to remove moisture remaining in the spaced space, And an organic light emitting diode electrically connected to the thin film transistor.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting diode display device. The method includes forming a getter member on a first substrate, forming a thin film transistor on the getter member, forming an organic light emitting diode on a second substrate, and forming the thin film transistor and the organic light emitting diode And electrically connecting the first and second substrates to each other, and bonding the first and second substrates together.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of an organic light emitting diode display device. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of an apparatus may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

Example  One

FIGS. 1 and 2 are views illustrating an organic light emitting diode display device according to a first embodiment of the present invention.

1 is a plan view of an organic light emitting diode display device according to a first embodiment of the present invention. 2 is a cross-sectional view taken along the line I-I 'shown in FIG.

Referring to FIGS. 1 and 2, the organic light emitting diode display includes first and second substrates 100 and 200 bonded to each other at regular intervals. Here, a getter member 110, a thin film transistor Tr, and an organic light emitting diode E are interposed between the first substrate 100 and the second substrate 200.

The first substrate 100 has a plurality of pixels P.

The getter member 110 is disposed on the front surface of the first substrate 100. The getter member 110 is made of a material that adsorbs and removes oxygen and moisture. For example, the getter member 110 may be formed of any of barium, calcium, aluminum, iron, titanium, vanadium, niobium, tantalum, tungsten, thorium, lithium sulfate, sodium sulfate, calcium sulfate, Cobalt sulfate, gallium sulfate, titanium sulfate, calcium chloride, zirconium, calcium nitrate, and the like.

The thin film transistor Tr is arranged on the getter member 110 corresponding to each pixel P. The thin film transistor includes a gate electrode 112, a gate insulating film 120, a semiconductor layer 122, a source electrode 124, and a drain electrode 126. Here, the gate electrode 112 is disposed on the getter member 110. The gate insulating film 120 covers the gate electrode 112 and is disposed on the getter member 110. Here, the gate insulating layer 120 serves to insulate the gate electrode 112 and to protect the getter member 110. Thereby, the getter member 110 can be detached from the first substrate 100, thereby preventing contamination of other elements. The semiconductor layer 122 overlaps the gate electrode 112 and is disposed on the gate insulating film 120. Further, the source electrode 124 and the drain electrode 126 are separately disposed on the semiconductor layer 122.

In the embodiment of the present invention, the structure of the thin film transistor is not limited, and thin film transistors having various structures can be applied.

The organic light emitting diode display device may further include a protective layer 130 covering the thin film transistor Tr and disposed on the gate insulating layer 120 and exposing the drain electrode 126.

An organic light emitting diode E having a first electrode 210, an organic light emitting layer 220 and a second electrode 230 sequentially formed on a second substrate 200 is formed. In the organic light emitting diode E, the first electrode 210 is commonly used in each pixel. However, the organic light emitting layer 220 and the second electrode 230 are patterned for each pixel. Thus, the organic light emitting diode E can be driven for each pixel P.

In addition, the organic light emitting diode display may further include an auxiliary electrode 202 interposed between the second substrate 200 and the first electrode 210. The auxiliary electrode 202 serves to lower the resistance difference of the first electrode 210. Thus, a uniform current is supplied to the organic light emitting diode display device, and light of different luminance can be prevented from being generated for each position. Thus, the auxiliary electrode 202 improves the image quality characteristics of the organic light emitting diode display.

The organic light emitting diode display further includes a pixel defining pattern 215 disposed on the first electrode 210 corresponding to the edge of the pixel to define each pixel P. [ In addition, the pixel defining pattern 215 serves to fix the separator 235, which will be described later, on the first electrode 210. This is because the separator 235 is formed of an organic material, and the separator 235 is inferior in adhesion to the first electrode. In addition, the pixel defining pattern 215 prevents a short between the first electrode 210 and the second electrode 230 from occurring. Accordingly, the pixel defining pattern 215 should be made of an insulating material having excellent adhesion to the first electrode 210 and the separator 235, respectively. For example, the pixel defining pattern 215 is made of silicon oxide, silicon nitride, or the like.

The organic light emitting diode display further includes a separator 235 disposed on the pixel defining pattern 215 for patterning the second electrode for each pixel P. The separator 235 has a columnar shape having an inverted taper shape. When the conductive material is deposited on the substrate including the separator 235 to form the second electrode, the conductive material is automatically patterned for each pixel P while being deposited, The second electrode 230 is formed. In addition, when the organic light emitting layer 220 is formed of a low molecular material, the separator 235 can pattern the organic light emitting layer 220 for each pixel P.

The organic light emitting diode display further includes connection members 132 and 245 for electrically connecting the thin film transistors and the organic light emitting diodes to each other. The connecting members 132 and 245 include a first connecting member 132 and a second connecting member 245.

The first connection member 132 is disposed on the protection film 130 in contact with the drain electrode 126. In addition, the second connecting member 245 includes a protruding member 245a and a conductive member 245b. Here, the projection member 245a has a columnar shape protruding toward the first substrate 100. The protrusion member 245a is disposed on the pixel defining pattern 215 between the pixel P and the separator 235 and corresponding thereto. The conductive member 245b covers the outer surface of the projection member 245a and is connected to the second electrode 230. [ At this time, the conductive member 245b and the second electrode 230 may be integrally formed. That is, the second connection member 245 protrudes toward the first substrate 100.

Here, when the first connection member 132 and the second connection member 145 are in contact with each other, the thin film transistor Tr and the organic light emitting diode E are electrically connected to each other at a predetermined interval. Thus, it is possible to prevent the contaminants, which may be present in the first substrate 100, from damaging the organic light emitting diode E.

Accordingly, the organic light emitting diode display according to the embodiment of the present invention emits light through the second substrate 200 and provides the image to the user. At this time, by interposing the getter member between the first substrate 100 and the thin film transistor Tr, it is possible to prevent the light transmittance of the organic light emitting diode display device from being lowered or the contact failure between the thin film transistor and the organic light emitting diode to occur , It is possible to prevent the organic light emitting layer from being deteriorated.

Example  2

3 is a cross-sectional view of an organic light emitting diode display device according to a second embodiment of the present invention. The second embodiment of the present invention has the same configuration as the organic light emitting diode display device of the first embodiment described above except for the first subsidiary getter member. Therefore, redundant description of the same constituent elements will be omitted, and the same names and reference numerals will be given to the same constituent elements.

Referring to FIG. 3, the organic light emitting diode display includes first and second substrates 100 and 200 bonded to each other at regular intervals.

The first substrate 100 includes a getter member 110, a thin film transistor Tr, and a first connection member 132. A protective film 130 is interposed between the thin film transistor Tr and the first connection member 132 on the first substrate 100.

On the second substrate 200, an organic light emitting diode E and a second connection member 245 are provided.

The first auxiliary getter member 135 is disposed on the protective film 130 covering the thin film transistor Tr. The first subsidiary getter member 135 exposes the first linking member 132. This is because the first connection member 132 is in contact with the second connection member 245 and the thin film transistor Tr and the organic light emitting diode E must be electrically connected to each other.

The first auxiliary getter member 135 and the protective film 130 are further interposed between the first auxiliary getter member 135 and the protective film 130 so that the first auxiliary getter member 135 can be more firmly fixed to the protective film 130. [

The adhesive member 136 may be a resin layer or an adhesive tape having adhesiveness. For example, the adhesive member 136 may be made of a urethane resin, an acrylic resin, a silicone resin, or the like.

The organic light emitting diode display device according to the embodiment of the present invention further includes a first auxiliary getter member 135 on the protective film 130 so that residual Moisture and oxygen can be removed more effectively.

The first auxiliary getter member 135 is attached to a certain area by an adhesive member so that even if the organic light emitting diode display device further includes the first subsidiary getter member 135, 132, and 245, respectively.

Example  3

4 is a cross-sectional view of an organic light emitting diode display device according to a third embodiment of the present invention. The third embodiment of the present invention has the same configuration as the organic light emitting diode display device of the second embodiment described above except for the second auxiliary getter member. Therefore, redundant description of the same constituent elements will be omitted, and the same names and reference numerals will be given to the same constituent elements.

Referring to FIG. 3, the organic light emitting diode display includes first and second substrates 100 and 200 bonded to each other at regular intervals.

The first substrate 100 includes a getter member 110, a thin film transistor Tr, and a first connection member 132. A protective film 130 is interposed between the thin film transistor Tr and the first connection member 132 on the first substrate 100.

The second auxiliary getter member 235 is disposed on the second electrode 230. At this time, the second auxiliary getter member 235 exposes the second connecting member 245. This is because the second connection member 245 is in contact with the first connection member 132 to electrically connect the thin film transistor Tr and the organic light emitting diode E. [

An adhesive member 236 may further be interposed between the second auxiliary getter member 235 and the second electrode 230. [ As a result, the second auxiliary getter member 235 can be fixed on the second electrode 230.

The organic light emitting diode display device according to the embodiment of the present invention further includes a second auxiliary getter member 235 on the second electrode 230 so that the gap between the first and second substrates 100 and 200 It is possible to more effectively remove moisture and oxygen remaining in the exhaust gas. Thereby, the light transmittance of the organic light emitting diode display device is not affected, and the lifetime can be further improved.

Example  4

5A to 5G are views illustrating a method of manufacturing an organic light emitting diode display device according to a fourth embodiment of the present invention.

Referring to FIG. 5A, a getter member 110 is formed on a first substrate 100 to manufacture an organic light emitting diode display.

The getter member 110 is made of a material capable of removing oxygen and moisture. For example, the getter member 110 may be formed of any of barium, calcium, aluminum, iron, titanium, vanadium, niobium, tantalum, tungsten, thorium, lithium sulfate, sodium sulfate, calcium sulfate, Cobalt sulfate, gallium sulfate, titanium sulfate, calcium chloride, zirconium, calcium nitrate, and the like. Here, the getter member 110 is formed on the first substrate 100 by a sputtering method or a vacuum deposition method.

Referring to FIG. 5B, after the getter member 110 is formed, a thin film transistor Tr is formed on the getter member 110.

In order to form a thin film transistor, a gate electrode 112 is first formed on the getter member 110. The gate electrode 112 deposits a conductive material to form a conductive film. Thereafter, the conductive film is etched to form the gate electrode 112. At the same time, a gate wiring for applying a gate signal to the gate electrode 112 may be formed although not shown in the figure. Here, the gate wiring and the gate electrode 112 are connected to each other.

 A gate insulating film 120 is formed on the getter member 110 so as to cover the gate electrode 112. The gate insulating film 120 may be formed of silicon oxide or silicon nitride. At this time, the gate insulating layer 120 may be formed by chemical vapor deposition. Here, the gate insulating film 120 not only insulates the gate electrode 112, but also protects the getter member 110.

A semiconductor layer 122 is formed on the gate insulating film 120. The semiconductor layer 122 can be formed by sequentially laminating amorphous silicon and amorphous silicon containing impurities.

A source electrode 124 and a drain electrode 126 spaced on the semiconductor layer 122 are formed. The source electrode 124 and the drain electrode 126 may be formed through the same etching process. Although not shown in the drawing, a data line for applying a data signal to the source electrode 124 is further formed. The data line and the source electrode 124 are connected to each other. Further, the gate wiring and the data wiring intersect each other to define a pixel. At this time, the thin film transistor Tr is provided in the pixel.

The thin film transistor Tr having the gate electrode 112, the gate insulating film 120, the semiconductor layer 122, the source electrode 124 and the drain electrode 126 disposed on the getter member 110 is manufactured can do.

After the thin film transistor Tr is formed on the getter member 110, a protective film 130 is formed on the getter member 110 to cover the thin film transistor Tr.

The protective film 130 may be formed of silicon oxide or silicon nitride. At this time, the protective layer 130 may be formed by a chemical vapor deposition method or a sputtering method.

Referring to FIG. 5C, after forming the passivation layer 130, a contact hole exposing the drain electrode 126 is formed in the passivation layer 130. A first connection electrode 132 electrically connected to the drain electrode 126 exposed through the contact hole is formed.

On the other hand, an organic light emitting diode (E) is formed on the second substrate (200). In order to form the organic light emitting diode E on the second substrate 200, a second substrate 200 on which pixels are defined is provided. Here, the organic light emitting diode display device according to the embodiment of the present invention is a top emission type in which light is generated by the second substrate 200. Accordingly, the second substrate 200 may be made of a transparent material capable of transmitting light. For example, the second substrate 200 may be a glass substrate, a plastic substrate, or a transparent film.

A low-resistance conductive material is deposited on the second substrate 200 in comparison with the first electrode 210 to be described later, and then the auxiliary electrode 202 is formed by patterning. For example, the auxiliary electrode 202 may be formed of Al, AlNd, Mo, Cr, or the like. Here, the auxiliary electrode 202 serves to reduce the resistance difference of the first electrode 210. In addition, the auxiliary electrode 202 is disposed at the boundary of the pixels P to prevent light from leaking.

A first electrode 210 is formed on the first substrate 200. The first electrode 210 may be formed using a conductive material by sputtering or vacuum deposition. Here, the first electrode 210 is formed of a transparent conductive material so that light can be transmitted therethrough. For example, the first electrode 210 may be formed of ITO or IZO. Here, the first electrode 210 is used as a common electrode for all the pixels.

Referring to FIG. 5E, after the first electrode 210 is formed, a pixel defining pattern 215 is formed on the first electrode 210. The pixel defining pattern 215 is arranged at the edge of the pixel to define the pixel. In addition, the pixel defining pattern 215 serves to improve adhesion between the first electrode 210 and a separator 235 to be described later. Thus, the pixel defining pattern 215 is formed of an inorganic insulating material. For example, the pixel defining pattern 215 may be formed of silicon oxide or silicon nitride. At this time, the pixel defining pattern 215 may be formed by chemical vapor deposition or sputtering.

After the pixel defining pattern 215 is formed, a protruding member 245a constituting the second connecting member is formed on the pixel defining pattern 215. [ The projection member 245a is disposed adjacent to the pixel region. Here, the projection member 245a has a columnar shape. Here, the projection member 245a has an acute angle with respect to the second substrate 200. [ This is because the conductive member 245b to be described later must be formed so as not to be short-circuited on the outer surface of the projection member 245a.

The protrusion member 245a may be formed of an organic insulating material that can be formed thick to form a columnar shape. For example, the projection member 245a may be formed of acrylic resin, urethane resin, benzocyclobutene (BCB), polyimide (PI), or the like.

Further, a separator 235 is formed on the pixel defining pattern 215 so as to be spaced apart from the projection member 245a. The separator 235 serves to automatically pattern the second electrode 230, which will be described later, on a pixel-by-pixel basis. Therefore, in order to form the second electrode 230, a shadow mask or an etching process need not be performed. At this time, the separator 235 is disposed at the interval between the pixels.

At this time, the separator 235 has a column shape having an obtuse angle with respect to the second substrate 200 in order to automatically pattern the second electrode 230. Here, the separator 235 may be formed of, for example, an acrylic resin, a urethane resin, benzocyclobutene (BCB), polyimide (PI) or the like as an organic insulating material.

Referring to FIG. 5F, an organic light emitting layer 220 is formed on the first electrode 210 after the separator 235 and the protrusion member 245a are formed.

Here, the organic light emitting layer 220 may be formed of a polymer material or a low molecular material. In this case, when the organic light emitting layer 220 is formed of a low molecular material, the organic light emitting layer 220 may be formed by a vacuum deposition method. At this time, the organic light emitting layer 220 is automatically patterned for each pixel by the separator 235. Thus, the organic light emitting layer 220 can be formed without using a separate shadow mask. At this time, the organic light emitting layer 220 naturally covers the outer surface of the protrusion member 245a.

After the organic light emitting layer 220 is formed, a second electrode 230 is formed on the organic light emitting layer 220. The second electrode 230 may be formed by a vacuum deposition method. At this time, the second electrode 230 is automatically patterned for each pixel by the separator 235. Thus, the second electrode 230 is formed without using a separate shadow mask and etching process.

At the same time, the conductive member 245b covering the outer surface of the projection member 245a is formed, and the second connection member 245 is formed. Here, the conductive member 245b is formed integrally with the second electrode 230.

5G, a thin film transistor Tr and an organic light emitting diode E are formed on a first substrate 100 and a second substrate 200, respectively, and then a first substrate 100 and a second substrate 200 ) Are bonded together to produce an organic light emitting diode display device.

At this time, the thin film transistor Tr and the organic light emitting diode E are electrically connected to each other by the connecting members 132 and 245.

In the embodiment of the present invention, the getter member 110 is formed on the first substrate 100 through which light is not transmitted, thereby preventing the brightness of the organic light emitting diode display from being lowered. Further, since the getter member 110 is interposed between the first substrate 100 and the thin film transistor Tr, the contact between the thin film transistor Tr and the organic light emitting diode E is not affected, ) Need not be subjected to a separate patterning process.

Accordingly, the organic light emitting diode display device can reduce the number of processes and improve the lifetime and reliability of the organic light emitting diode display device.

Example  5

6A and 6B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display device according to a fifth embodiment of the present invention. The fifth embodiment of the present invention is the same as the method of manufacturing the organic light emitting diode display device of the fourth embodiment described above except for forming the first auxiliary getter member. Therefore, redundant description of the same manufacturing method will be omitted, and the same components will be given the same names and reference numerals.

Referring to FIG. 6A, a getter member 110 is formed on a first substrate 100 to form an organic light emitting diode display. The getter member 110 is formed of a material that removes moisture. A protective film 130 covering the thin film transistor Tr and the thin film transistor Tr on the getter member 110 and a first connecting member 132 contacting the thin film transistor Tr on the protective film 130 are formed.

After the first connecting member 132 is formed, the first auxiliary getter member 135 is attached onto the protective film 130. [ At this time, an adhesive member 136 is formed on one surface of the first subsidiary getter member 135, so that the first subsidiary getter member 135 can be fixed on the protective film 130. The adhesive member 136 may be a double-sided tape or an adhesive resin. At this time, since the first connecting member 132 must be in contact with the second connecting member 245, the first auxiliary getter member 135 is not attached on the first connecting member 132.

Referring to FIG. 6B, the organic light emitting diode display device is manufactured by electrically connecting the organic light emitting diode E and the thin film transistor Tr to each other and bonding the first and second substrates 100 and 200 together.

In the embodiment of the present invention, by disposing the first auxiliary getter member 135 on the protective film, moisture remaining inside the organic light emitting diode display device can be more effectively removed. In addition, in order to form the first auxiliary getter member 135, the first auxiliary getter member 135 is selectively attached on the protective film 130 without performing a separate patterning process, so that the first connecting member 132 It is possible to prevent the contact characteristics between the organic light emitting diode E and the thin film transistor Tr from deteriorating.

Example  6

7A and 7B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display device according to a sixth embodiment of the present invention. The sixth embodiment of the present invention is the same as the method of manufacturing the organic light emitting diode display device of the fifth embodiment described above except for forming the second auxiliary getter member. Therefore, redundant description of the same manufacturing method will be omitted, and the same components will be given the same names and reference numerals.

Referring to FIG. 7A, an organic light emitting diode E and a second connection member 245 are formed on a second substrate 200 to form an organic light emitting diode display.

Here, the second connection member 245 is connected to the second electrode 230 of the organic light emitting diode E.

After the second electrode 230 and the second connection member 245 are formed, a second auxiliary getter member 235 is formed on the second electrode 230. And the second auxiliary getter member 235 is attached on the second electrode 230 by the adhesive member 236. [ At this time, the second subsidiary getter member 235 is not disposed in the second linking member 245. This is because the second connection member 245 is in contact with the first connection member 132 and the organic light emitting diode E and the thin film transistor Tr are electrically connected.

Referring to FIG. 7B, the organic light emitting diode display device is manufactured by electrically connecting the organic light emitting diode E and the thin film transistor Tr to each other and bonding the first and second substrates 100 and 200 together.

Therefore, in the embodiment of the present invention, by disposing the second auxiliary getter member 235 on the second electrode 230, the moisture remaining in the organic light emitting diode display device can be more effectively removed. Further, in order to form the second auxiliary getter member 235, the second auxiliary getter member 235 is selectively attached on the second electrode 230 without performing a separate patterning process, It is possible to prevent the contact characteristics between the organic light emitting diode E and the thin film transistor Tr from being deteriorated.

As described above, since the organic light emitting diode display device according to the present invention includes a getter member on a substrate on which light is not emitted, the light transmittance can be prevented from being lowered and the lifetime of the organic light emitting diode display device can be improved.

Further, as the getter member is interposed between the substrate and the thin film transistor, the contact characteristics between the thin film transistor and the organic light emitting diode are not affected.

In addition, since a separate patterning step for forming the getter member is not required, the number of processes can be reduced.

Further, since the first and second auxiliary getter members are further provided, the lifetime of the organic light emitting diode display device can be further improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It can be understood that.

Claims (11)

A first substrate; A getter member disposed over the first substrate to remove residual moisture or residual oxygen from the spacing space; A thin film transistor formed on the getter member; A second substrate bonded to the first substrate and having a spacing space therebetween; And And an organic light emitting diode formed on the second substrate and electrically connected to the thin film transistor, The thin film transistor formed on the getter member includes: A gate electrode disposed on the getter member; A gate insulating film disposed on the getter member having the gate electrode formed thereon and protecting the getter member; A semiconductor layer disposed in the gate insulating film; And And a source electrode and a drain electrode spaced apart from each other on the semiconductor layer. The method according to claim 1, Wherein the getter member is selected from the group consisting of barium, calcium, aluminum, iron, titanium, vanadium, niobium, tantalum, tungsten, thorium, lithium sulfate, sodium sulfate, calcium sulfate and magnesium sulfate. Wherein the organic light emitting diode display comprises at least one selected from the group consisting of cobalt sulfate, gallium sulfate, titanium sulfate, calcium chloride, zirconium and calcium nitrate. The method according to claim 1, Further comprising a connection member interposed between the thin film transistor and the organic light emitting diode and electrically connecting the thin film transistor and the organic light emitting diode to each other. The method of claim 3, The connecting member A first connecting member disposed on a protective film which contacts the drain electrode of the thin film transistor and covers the thin film transistor; And And a second connection member that is in contact with the second electrode of the organic light emitting diode and protrudes toward the first substrate and contacts the first connection member. 5. The method of claim 4, And a first auxiliary getter member disposed on the protective film and exposing the first connection member. 6. The method of claim 5, And an adhesive member interposed between the protective film and the first auxiliary getter member. 5. The method of claim 4, And a second auxiliary getter member disposed on the second electrode and exposing the second connection member. Forming a getter member on the entire surface of the first substrate; Forming a thin film transistor on the getter member; Forming an organic light emitting diode on a second substrate; And And electrically connecting the thin film transistor and the organic light emitting diode to each other, and bonding the first and second substrates together, Wherein forming the thin film transistor on the getter member comprises: Forming a gate electrode on the getter member; Forming a gate insulating film on the getter member with the gate electrode formed thereon to protect the getter member; Forming a semiconductor layer on the gate insulating layer; And And forming a source electrode and a drain electrode spaced apart from each other on the semiconductor layer. 9. The method of claim 8, Wherein the getter member is formed by a vacuum evaporation method or a sputtering method. 9. The method of claim 8, Further comprising the step of attaching a first auxiliary getter member on a protective film covering the thin film transistor. 9. The method of claim 8, Further comprising attaching a second auxiliary getter member on a second electrode constituting the organic light emitting diode.

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