KR101392022B1 - Test socket and method for manufacturing thereof - Google Patents

Abstract

A test socket and a method of manufacturing the same are disclosed. A test socket according to an embodiment of the present invention includes a signal connection portion electrically contacting a test device such as a semiconductor device, a signal terminal portion contacting the test device or the test board, and a signal connection portion electrically connecting the signal connection portion and the signal terminal portion. A film portion including a signal transmitting portion for connecting the signal portion; And a control unit which is located on one side of the film unit and supports the signal connection unit when the testing device is pressed and contacted in the direction of the signal connection unit and controls the position of the test equipment and the signal connection unit at a predetermined position The manufacturing cost of the test socket having a fine pitch can be reduced, the manufacturing yield can be increased, and the test of the high frequency test apparatus can be reliably performed.

Description

Technical Field [0001] The present invention relates to a test socket and a method of manufacturing the same,

[0001] The present invention relates to a test socket, and more particularly, to a test socket using an elastic body, for example, a flexible printed circuit board (FPCB), to reduce the manufacturing cost, The present invention relates to a test socket and a method of manufacturing the same, which can solve the existing high frequency and electrical signal interference phenomena.

Semiconductor devices manufactured through complicated processes are inspected for their characteristics and defects through various electrical tests. More specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as a package IC and an MCM, and wafers on which integrated circuits are formed, the terminals formed on one surface of the semiconductor device to be inspected and the pads of the test device are electrically connected A test socket is disposed between the semiconductor device and the test apparatus.

The test socket includes a contactor for electrically connecting the test apparatus and the semiconductor device, and a high-fix board for providing an electrical signal of the contactor to the test apparatus.

Conventional test sockets use a vertical structure in which semiconductor devices, contactors, and high-fix boards are vertically arranged. In such a high-fix board, if the pitch between contacts is reduced to a certain pitch, for example, below 0.3 pitch, And the production yield is low.

Therefore, there is a need for a test socket that can reduce the manufacturing cost and improve the yield.

Korean Registered Patent No. 1145886 (registered on May 07, 2012)

In order to solve the above-mentioned problems, an object of an embodiment of the present invention is to provide a method and apparatus for manufacturing a test socket using a flexible printed circuit board (FPCB) And a method of manufacturing the same.

Another object of the present invention is to provide a test socket and a method of manufacturing the same which can reduce the manufacturing cost of the test socket and increase the product life by making each component of the test socket replaceable.

It is still another object of the present invention to provide a test socket capable of reliably testing a device for high frequency testing and a method of manufacturing the same.

In order to achieve the above object, a test socket according to an embodiment of the present invention includes a signal connection part electrically contacting a testing device such as a semiconductor device, a signal terminal part making contact with a test device or a test board, A film portion including a signal transmission portion for electrically connecting between the signal terminal portions; And a control unit which is located on one side of the film unit and supports the signal connection unit when the testing device is pressed and contacted in the direction of the signal connection unit and controls the position of the test equipment and the signal connection unit at a predetermined position And a restoring unit for restoring the image in the direction of the image.

The film portion may be a flexible printed circuit board (FPCB).

The circuit impedance of the circuit of the signal transfer unit or the signal connection unit to the signal terminal unit may be between 20 ohms and 80 ohms and the circuit impedance of the signal transfer unit or the signal connection unit to the signal terminal unit may be 50 ohms The circuit impedance of the circuit of the signal transfer unit or the signal connection unit to the signal terminal unit may have an error range of 30 ohms or less with respect to the impedance value of the test apparatus or the test board and the system.

Surfaces other than the signal connection, the signal terminal, and the ground may be insulated.

And a second restoring unit located on one side of the film unit and supporting the signal terminal unit when the test apparatus and the signal terminal unit make contact with each other.

The restoration part may be disposed apart from the film part.

The restoring unit may be composed of at least one of a spring, a rubber, a rubber, a gelatin, a urethane, a composite elastic, a curved plate, a damper, a silicone, a cylinder, a hydraulic device and a sponge.

The signal connection portion may be formed by forming a hole on one side of the film portion and plating the conductive material around the hole or coating the hole.

And a moving unit configured such that a part of the signal connecting part or the signal terminal part is separated or cut from the film part when the terminal is in contact with the testing device so that the signal connecting part can move independently.

The film portion may further include a ground portion formed between at least one of the two surfaces of the film portion, the ground portion being formed between any one of the signal connection portion, the signal terminal portion, and the signal transmission portion.

The film portion may further include a ground portion formed by laminating or bonding a layer including a conductive material on at least one surface of the upper surface or the lower surface.

Wherein the film portion is formed between at least one of the signal connection portion, the signal terminal portion, and the signal transmission portion, and has a first ground portion formed to expose a part or the entire surface to the outside, And a second grounding portion that is laminated or bonded to at least one surface of the upper surface or the lower surface and is configured such that the conductive material is in contact with the exposed portion of the first grounding portion.

The film portion may further include an electromagnetic wave shielding portion formed on the same surface as the signal connection portion or stacked on at least one of two surfaces of the film portion to perform electromagnetic shielding between the signal connection portions.

And a first contactor having one side connected to the signal connection part and the other side connected to the testing device when the testing device is contacted.

And a second contactor, one side of which is connected to the signal terminal unit and the other side of which is connected to the test apparatus, and which electrically connects the signal transfer unit and the test apparatus.

The restoration portion, the first contactor, the restoration portion, and the second contactor may be formed on one side of the signal contact portion or the signal terminal portion by any one of bonding, coating, molding, soldering, welding, .

And a housing or a mold part necessary for fastening or fixing to an instrument and a part configured in the test apparatus.

And a housing or a mold part for fastening, storing and fixing at least one of the film part and the restoring part.

A method of manufacturing a test socket according to an exemplary embodiment of the present invention includes forming a signal connection portion electrically contacting a test device such as a semiconductor device on one side of a film; Forming a signal transfer portion on at least one surface of the film, the signal transfer portion electrically connecting between the signal connection portion and a signal terminal portion which is in contact with a test device or a test board; And a restoration portion for supporting the signal connection portion when the testing device is pressed in contact with the signal connection portion and restoring the position of the testing device and the signal connection portion to a predetermined position or direction upon releasing the pressure, On one surface of the substrate.

According to the present invention, by using an elastic body such as a flexible printed circuit board (FPCB), a signal through a contact with a semiconductor device is switched in a horizontal direction, and a signal transmitted in a horizontal direction is tested Device, it is possible to lower the manufacturing cost of a fine pitch, for example, a test socket having a pitch of 0.3 pitch or less, and increase the manufacturing yield.

Further, the present invention can increase the service life of the test socket by making each component of the test socket replaceable.

Further, the present invention provides an electromagnetic wave shielding function between the connection portions electrically connected to the FPCB for shielding the electromagnetic wave between the signals of the test device operating in the high frequency range, so that the test of the high frequency test device can be performed reliably have.

1 is a cross-sectional view of a test socket according to an embodiment of the present invention.
FIG. 2 is a plan view of an embodiment of the film portion shown in FIG. 1. FIG.
Fig. 3 is a plan view of another embodiment of the film portion shown in Fig. 1. Fig.
4 is a cross-sectional view of a test socket according to another embodiment of the present invention.
5 is a cross-sectional view of a test socket according to another embodiment of the present invention.
6 is a flowchart illustrating an operation of a test socket manufacturing method according to an embodiment of the present invention.

Other objects and features of the present invention will become apparent from the following description of embodiments with reference to the accompanying drawings.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprising" or " comprising " is intended to specify the presence of stated features, integers, steps, operations, elements, parts or combinations thereof, , But do not preclude the presence or addition of one or more other features, elements, components, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted in an ideal or overly formal sense unless explicitly defined in the present application Do not.

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Hereinafter, a test socket and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6.

1 is a cross-sectional view of a test socket according to an embodiment of the present invention.

Referring to FIG. 1, a test socket includes a film portion 120, a restoration portion 140, and a housing 130.

The film unit 120 electrically contacts the testing apparatus 110 such as a semiconductor device to connect the testing apparatus 110 to the testing apparatus.

In this case, the film unit 120 may be a flexible printed circuit board (FPCB), or may be an elastic body having flexible characteristics while performing electrical connection as well as FPCB.

Such a film portion 120 will be described in detail with reference to FIG.

FIG. 2 is a plan view of an embodiment of the film portion shown in FIG. 1 and includes a signal connection part 210, a moving part 230, a signal transmission part 220, and a signal terminal part 240.

The signal connection unit 210 is configured to perform electrical contact with the test device 110. When the test device is contacted, the signal connection unit 210 transmits a signal of the test device to the test device through an electrical connection, To the device.

In this case, the signal connection unit 210 is shown as having a circular shape with holes, but it is not limited thereto. The signal connection unit 210 may have various shapes without holes, or may have a polygonal shape with holes , This shape can be determined according to the shape of the contact portion of the test device that is in contact with the signal connection portion 210.

At this time, the signal connection part 210 may be formed by forming a hole on one side of the film part 120 and plating or coating the periphery of the hole with a conductive material.

The moving unit 230 moves the signal connecting unit 210 toward the restoring unit 140 by the pressure of the testing device when the signal connecting unit 210 and the testing device 110 are brought into contact with each other, And performs a function of moving the signal connection unit 210 to its original position by the function of the restoration unit 140 when the contact is released.

Here, the moving part 230 may be formed by separating or cutting off a part of the periphery of the signal connecting part 210, for example, by laser cutting, and the area to be cut may be a contact or the like . ≪ / RTI >

In addition, in the drawings of the present invention, the moving part 230 is shown as being formed by separating or cutting a part of the signal connecting part 210, but the present invention is not limited thereto, and a part of the signal connecting part 210, The signal connection unit 210 may be separated or disconnected from the signal connection unit 120 so that the signal connection unit 210 can be independently moved.

The signal transfer unit 220 electrically connects the signal connection unit 210 and the signal terminal unit 240 to transfer a signal received from the signal connection unit 210 to the test apparatus through the signal terminal unit 240 .

In this case, the signal transfer unit 220 may be formed on the same surface as the signal connection unit 210, or may be formed on the other surface of the signal connection unit 210. Of course, when the signal transmission unit 220 is formed on the other side of the signal connection unit 210, it is obvious that a via hole or the like for connection with the signal connection unit 210 should be formed.

One side of the signal transmission unit 220 may be connected to the signal connection unit 210 and the other side may be connected to the test apparatus through a signal terminal unit 240 such as a connector.

The signal terminal unit 240 connects the signal transfer unit 220 to the test apparatus or the test board, and contacts the test apparatus or the test board.

At this time, the circuit impedance of the circuit of the signal transfer unit 220 or the signal connection unit 210 to the signal terminal unit 240 may be 20 ohms to 80 ohms.

At this time, the circuit impedance of the signal transmission unit 220 or the signal connection unit 210 to the signal terminal unit 240 may be designed to be 50 ohms.

The circuit impedance of the signal transfer unit 220 or the signal connection unit 210 to the signal terminal unit 240 is determined by the impedance of the test board and the system used in the test apparatus or the test apparatus, . ≪ / RTI >

1, the restoring unit 140 is disposed on one side of the film unit 120 and supports the signal connection unit when the testing device 110 is pressed and contacted in the direction of the signal connection of the film unit 120 And performs a function of restoring the position of the testing device and the signal connecting portion to a predetermined original position or direction when releasing the pressure, that is, after the contact is separated.

At this time, the restoring part 140 may be formed of an elastic material and may be composed of at least one of a spring, a rubber, a rubber, a gelatin, a urethane, a composite elastic, a curved plate, a damper, a silicone, a cylinder, .

At this time, the restoration part 140 may be disposed apart from the film part 120.

The restoring unit 140 further includes a separate restoring unit (not shown) for supporting the signal terminal unit 240 when the test apparatus and the signal terminal unit 240 are in contact with each other, can do.

The housing 130 functions to fix the film unit 120 and the restoration unit 140.

Fig. 3 is a plan view of another embodiment of the film portion shown in Fig. 1. Fig.

3, the film unit 120 includes a signal connecting unit 210, a moving unit 230, a signal transmitting unit 220, a ground unit 250, an electromagnetic wave shielding unit 260, and a signal terminal unit 240 .

The signal connection unit 210, the movement unit 230, the signal transmission unit 220, and the signal terminal unit 240 have been described in detail with reference to FIG. 2, and a description thereof will be omitted.

The grounding part 250 is formed between at least one of the signal connecting part 210 formed in the film part 120 and the signal transmitting part 230 and is connected to the ground GND.

At this time, the grounding part 250 may be formed on one side of the film part where the signal connection part 210 is formed, but may be formed on the other side of the film part. Of course, when the grounding portion 240 is formed on the other surface of the film portion, the grounding portion 240 is not necessarily formed between the signal connecting portions, and may be formed at an appropriate position in consideration of the surrounding environment.

At this time, the grounding unit 250 may be formed by laminating or bonding a layer including a conductive material on at least one side of the upper and lower surfaces of the film unit 120.

Further, the ground portion may be formed between any one of the signal connection portion 210, the signal terminal portion 240, and the signal transmission portion 220, and may include a first ground portion formed to expose a part or the entire surface to the outside, And a second ground portion that is laminated or glued on at least one surface of the upper surface or the lower surface of the film portion 120 in the form of a layer and is configured such that the conductive material is in contact with an external exposed portion of the first ground portion.

The electromagnetic wave shielding part 260 is formed between the signal connection parts 210 and performs electromagnetic wave shielding generated between the signal connection parts 210.

The electromagnetic wave shielding part 260 may be formed on the same surface as the signal connecting part 210 or may be formed on at least one of two surfaces of the film part 120, A shielding film or the like.

The electromagnetic wave shielding part 260 may be composed of a metal layer for shielding electromagnetic waves, for example, silver (Ag), and an insulating layer for insulating the metal layer from the outside.

Of course, the region where the electromagnetic wave shielding portion 260 is formed is not limited to the region where the grounding portion 250 is formed.

In the present invention, the surfaces other than the signal connecting portion 210, the signal terminal portion 240, and the grounding portion 250 may be subjected to insulation treatment.

As described above, according to the present invention, in testing a test device operating at a high frequency through an electromagnetic wave shielding part, it is possible to prevent problems caused by electromagnetic waves between signal connection parts, It is possible to improve the reliability.

In addition, the present invention can transmit a signal of a test apparatus in a horizontal direction by using an elastic body such as FPCB, so that it is easy to manufacture a test socket having a fine pitch, thereby reducing manufacturing cost and increasing production yield .

4 is a cross-sectional view of a test socket according to another embodiment of the present invention.

Referring to FIG. 4, the test socket includes a contactor 420, a film portion 430, a restoration portion 450, and a housing 440.

The contactor 420 is connected to a signal transmission line, for example, the signal connection shown in FIG. 2, one side of which is contacted with the testing device 410 and the other side of which is formed on the film portion 430.

At this time, the contactor 420 may be fixedly connected to the signal connection part 210 formed on the film part 430 shown in FIG. 2 by soldering or the like in order to clarify the electrical connection.

The film unit 430 is electrically connected to the contactor 420 to electrically connect the contactor 420 and the test apparatus when the test apparatus 410 and the contactor 420 are contacted.

At this time, the film portion 430 may be electrically connected to a connector or the like for connection with a test apparatus.

Of course, such a film portion 430 may have the configuration as shown in FIG. 2 or FIG.

The restoring unit 450 is disposed below the film unit 430 and has a function of restoring the position of the contactor 420 to a predetermined original position when the testing apparatus 410 is separated from the contactor 420 .

Of course, the restoring part 450 can restore not only the position of the contactor 420 but also a part of the film part 430 which is electrically connected to the contactor 420, to the original position.

At this time, the restoring part 450 may be formed of an elastic body such as rubber.

The housing 440 functions to fix the film part 430, the restoring part 450 and, if necessary, the contactor 420.

FIG. 4 also shows a horizontal structure for horizontally transmitting a signal of a test device as in FIG. 2. The present invention can be applied not only to a horizontal structure but also to a vertical structure, which will be described with reference to FIG.

5 is a cross-sectional view of a test socket according to another embodiment of the present invention.

5, the test socket includes a first contactor 520, a second contactor 560, a film portion 530, a restoration portion 550, and a housing 540.

The first contactor 520 is connected to a signal transmission line, for example, the signal connection shown in FIG. 2, one side of which is contacted with the test device 510 and the other side of which is formed on the film portion 530.

In this case, the first contactor 520 may be fixedly connected to the film portion 530 by soldering or the like so as to electrically connect the film portion 530 with the film portion 530.

The second contactor 560 has one side connected to the signal terminal portion provided on the film portion 530 and the other side connected to the testing device to electrically connect the signal transmitting portion and the testing device.

The film portion 530 electrically connects the first contactor 520 and the second contactor 560.

At this time, the film portion 530 may include a connection line for electrically connecting each connection portion with each of the connection portions for electrically connecting the first contactor 520 and the second contactor 560. Of course, the film portion 530 may also include the ground portion and the electromagnetic shielding portion shown in Fig. 3 as well.

Such a film portion 530 can be configured in a "U" shape, as shown, to form a test socket in a vertical structure.

The restoring unit 550 is disposed inside or between the film unit 530 formed in the U shape and when the testing device 510 contacts the first contactor 520 and then is separated from the first contactor 520 ) To a predetermined original position.

Of course, the restoring unit 550 can restore not only the position of the first contactor 520 but also a part of the film unit 530 electrically connected to the first contactor 520 to the original position.

If the position of the film portion 530 connected to the second contactor 560 and the second contactor 560 is moved by the contact with the testing device 510, Position.

The housing 540 functions to fix the film portion 530, the restoring portion 550 and, if necessary, the first contactor 520 and the second contactor 560.

At this time, the housing 540 may be necessary for fastening or fixing to the structure and components of the test apparatus, and may be necessary for fastening, storing, and fixing at least one of the film portion 530 and the restoring portion 550 have. Here, the housing 540 may be replaced with a mold section.

As described above, according to the present invention, it is possible to manufacture a test socket having a vertical structure as well as a test socket having a horizontal structure by using a flexible elastic body such as an FPCB, and the test socket can be formed into any one of an FPCB, a contactor, If a problem arises and you want to replace it, you can use it again by replacing only the part, so that the service life of the product can be greatly extended over the life of the existing test socket.

6 is a flowchart illustrating an operation of a test socket manufacturing method according to an embodiment of the present invention.

Referring to FIG. 6, a test socket manufacturing method forms a signal connecting portion for electrically contacting a testing device on one side of a film such as an FPCB (S610).

When a signal connecting portion is formed on one surface of the FPCB, for example, a signal transmitting portion, which is a signal transmitting means for electrically connecting the signal connecting portion and the signal terminal portion that makes contact with the test apparatus or the test board, is formed (S620).

Here, the signal transfer unit may be a signal line and may be formed on the same surface of the FPCB in which the signal connection unit is formed, but may be formed on the other surface.

When a signal transmission unit is formed, a ground unit for grounding a signal is formed on one surface of the FPCB and one surface of the FPCB between signal connection units (S630).

At this time, the ground portion may be formed not only in the signal connection portion but also in at least one of the signal transmission portion and the signal terminal portion.

When the ground portion is formed, an electromagnetic wave shielding portion is formed on the same surface as the signal connection portion or stacked on at least one surface of the two surfaces of the film to shield electromagnetic waves between the signal connection portions (S640).

Here, it is preferable that the electromagnetic wave shielding portion is formed on the same surface of the FPCB in which the signal connecting portions are formed.

Next, a moving part is formed on the film (S650). The signal connecting part and the signal terminal part are separated from the film when the signal connecting part formed on the FPCB is contacted with the testing device.

At this time, the moving section can be formed by laser cutting a part of the peripheral region where the signal connecting section is formed.

When the test apparatus is pressed and contacted in the direction of the signal connection section, a restoration section for supporting the signal connection section and for restoring the position of the test apparatus and the signal connection section to a predetermined position or direction upon releasing the pressure is provided on one surface of the film (S660).

Here, if the contact with the testing device is made on one side of the FPCB, the restoring part can be formed facing the other side of the FPCB to be in contact with the other side of the FPCB.

Although it is shown in Fig. 6 that the steps are formed in a certain order, it should be appreciated that the steps may be formed at the same time and that their order may change.

4 and 5, it should be noted that the test socket manufacturing method according to the present invention may be connected to an FPCB using a contactor, and a housing for fixing such components may be used in manufacturing a test socket Needless to say, it is obvious to those skilled in the art.

The test socket manufacturing method according to an exemplary embodiment of the present invention may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions recorded on the medium may be those specially designed and constructed for the present invention or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the present invention, and vice versa.

As described above, the present invention has been described with reference to particular embodiments, such as specific elements, and specific embodiments and drawings. However, it should be understood that the present invention is not limited to the above- And various modifications and changes may be made thereto by those skilled in the art to which the present invention pertains.

Accordingly, the spirit of the present invention should not be construed as being limited to the embodiments described, and all of the equivalents or equivalents of the claims, as well as the following claims, belong to the scope of the present invention .

Claims (26)

A signal connecting portion for electrically contacting a test device such as a semiconductor device, a signal terminal portion for making contact with a test device or a test board, and a signal transmitting portion for electrically connecting the signal connecting portion and the signal terminal portion, (FPCB); And
Wherein the signal connecting portion is located on one side of the film portion and supports the signal connecting portion when the testing device is pressed and contacted in the direction of the signal connecting portion so that the position of the testing device and the signal connecting portion is set at a predetermined position or direction A restoring unit for restoring the original image;
. delete The method according to claim 1,
Wherein the circuit impedance of the circuit of the signal transfer unit or the signal connection unit to the signal terminal unit is between 20 ohms and 80 ohms. The method according to claim 1,
Wherein the circuit impedance of the circuit of the signal transfer unit or the signal connection unit to the signal terminal unit is 50 ohms. The method according to claim 1,
Wherein a circuit impedance of the circuit of the signal transfer unit or the signal connection unit to the signal terminal unit has an error range of 30 ohms or less and an impedance value of the test apparatus or the test board and the system. The method according to claim 1,
The film portion
Wherein a surface excluding the signal connecting portion, the signal terminal portion, and the grounding portion is subjected to insulation treatment. The method according to claim 1,
A second restoring unit located on one side of the film unit and supporting the signal terminal unit when the test apparatus and the signal terminal unit make contact with each other,
Further comprising a test socket. The method according to claim 1,
And the restoring portion is disposed apart from the film portion. The method according to claim 1,
The restoring unit
Wherein the test socket comprises at least one of a spring, a rubber, a rubber, a gelatin, a urethane, a compound elastomer, a curved plate, a damper, a silicone, a cylinder, a hydraulic device and a sponge. The method according to claim 1,
The signal connection
Wherein a hole is formed on one side of the film portion and a periphery of the hole is formed by plating or coating with a conductive material. The method according to claim 1,
Wherein the signal connecting portion and the signal terminal portion are separated or cut from the film portion when the signal connecting portion and the signal terminal portion are brought into contact with the testing device,
Further comprising a test socket. The method according to claim 1,
The film portion
A signal connecting portion formed between the signal connecting portion, the signal terminal portion, and the signal transmitting portion and formed on at least one of two surfaces of the film portion,
Further comprising a test socket. The method according to claim 1,
The film portion
A ground layer formed by laminating or adhering a layer layer containing a conductive material on at least one surface of the upper surface or the lower surface,
Further comprising a test socket. The method according to claim 1,
The film portion
A first ground portion formed between at least one of the signal connection portion, the signal terminal portion, and the signal transmission portion,
The second grounding portion being laminated or glued on at least one surface of the upper surface or the lower surface of the film portion in the form of a layer including the conductive material and configured to be in contact with the exposed portion of the first grounding portion,
Further comprising a test socket. The method according to claim 1,
The film portion
An electromagnetic wave shielding part formed on the same surface as the signal connection part or stacked on at least one surface of the two surfaces of the film part to perform electromagnetic wave shielding between the signal connection parts,
Further comprising a test socket. The method according to claim 1,
And a first contactor, one end of which is connected to the signal connection part, and the other end of which is connected to the test device when the test device is contacted,
Further comprising a test socket. The method according to claim 1,
And a second contactor electrically connected to the signal transmitting unit and the test apparatus, wherein one end of the second contactor is connected to the signal terminal unit and the other end of the second contactor is connected to the test apparatus,
Further comprising a test socket. 18. The method according to claim 16 or 17,
The restoration part, the first contactor or the restoration part and the second contactor
Is formed on one side of the signal contact portion or the signal terminal portion by at least one of bonding, coating, molding, soldering, welding, and mechanical bonding. The method according to claim 1,
Further comprising a housing or a mold part necessary for fastening or fixing to an instrument and a part configured in the test apparatus. The method according to claim 1,
Further comprising a housing or a mold part for fastening, storing and fixing at least one of the film part and the restoring part.
Forming a signal connection portion electrically contacting one surface of the film with a testing device such as a semiconductor device;
Forming a signal transfer portion on at least one surface of the film, the signal transfer portion electrically connecting between the signal connection portion and a signal terminal portion which is in contact with a test device or a test board; And
A restoring portion for supporting the signal connecting portion when the testing device is pressed and contacted in the direction of the signal connecting portion and for restoring the position of the testing device and the signal connecting portion to a predetermined position or direction upon releasing the pressure, The method comprising the steps of:
Further comprising the step of forming a grounding portion for grounding on at least one surface of at least one of two surfaces of the film, the testing portion being formed between at least one of the signal connecting portion, the signal terminal portion, and the signal transmitting portion, Gt; 22. The method of claim 21,
The film
Wherein the flexible printed circuit board (FPCB) is a flexible printed circuit board (FPCB). 22. The method of claim 21,
Forming a moving part on the film so that a part of the signal connecting part or the signal terminal part is separated or cut from the film so that the signal connecting part can move independently when contacting the testing device
Further comprising the steps < RTI ID = 0.0 > of: < / RTI > delete 22. The method of claim 21,
Forming an electromagnetic wave shielding portion formed on the same surface as the signal connection portion or stacked on at least one surface of the two surfaces of the film to perform electromagnetic wave shielding between the signal connection portions
Further comprising the steps < RTI ID = 0.0 > of: < / RTI > A computer-readable recording medium having recorded thereon a program for executing the method according to any one of claims 21 to 25.

Images