KR101387387B1 - 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지 - Google Patents

대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지 Download PDF

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Publication number
KR101387387B1
KR101387387B1 KR1020110139264A KR20110139264A KR101387387B1 KR 101387387 B1 KR101387387 B1 KR 101387387B1 KR 1020110139264 A KR1020110139264 A KR 1020110139264A KR 20110139264 A KR20110139264 A KR 20110139264A KR 101387387 B1 KR101387387 B1 KR 101387387B1
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KR
South Korea
Prior art keywords
layer
sheet
work stage
antistatic
esd coating
Prior art date
Application number
KR1020110139264A
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English (en)
Korean (ko)
Other versions
KR20130071824A (ko
Inventor
오상근
주태규
최한현
Original Assignee
(주)탑나노시스
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)탑나노시스, 주식회사 탑 엔지니어링 filed Critical (주)탑나노시스
Priority to KR1020110139264A priority Critical patent/KR101387387B1/ko
Priority to TW101149124A priority patent/TW201345673A/zh
Priority to CN2012105625683A priority patent/CN103171215A/zh
Publication of KR20130071824A publication Critical patent/KR20130071824A/ko
Application granted granted Critical
Publication of KR101387387B1 publication Critical patent/KR101387387B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
KR1020110139264A 2011-12-21 2011-12-21 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지 KR101387387B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020110139264A KR101387387B1 (ko) 2011-12-21 2011-12-21 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지
TW101149124A TW201345673A (zh) 2011-12-21 2012-12-21 抗靜電板及包含其之工作平台組件
CN2012105625683A CN103171215A (zh) 2011-12-21 2012-12-21 抗静电板及包含其的工作平台组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110139264A KR101387387B1 (ko) 2011-12-21 2011-12-21 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지

Publications (2)

Publication Number Publication Date
KR20130071824A KR20130071824A (ko) 2013-07-01
KR101387387B1 true KR101387387B1 (ko) 2014-04-30

Family

ID=48631613

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110139264A KR101387387B1 (ko) 2011-12-21 2011-12-21 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지

Country Status (3)

Country Link
KR (1) KR101387387B1 (zh)
CN (1) CN103171215A (zh)
TW (1) TW201345673A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024005622A1 (ko) * 2022-07-01 2024-01-04 주식회사 엘지에너지솔루션 단위 셀 운반 시스템

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102405657B1 (ko) * 2015-09-22 2022-07-01 지멕주식회사 Esd 방지 코팅 구조 및 esd 방지 코팅 구조의 제조 방법
WO2020194635A1 (ja) * 2019-03-27 2020-10-01 シャープ株式会社 検査装置
JPWO2020208747A1 (zh) * 2019-04-10 2020-10-15
DE102019125819A1 (de) 2019-04-17 2020-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleiterverarbeitungsvorrichtung und verfahren unter einsatz einer elektrostatischen entladungs-(esd)- verhinderungsschicht
US10950485B2 (en) 2019-04-17 2021-03-16 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer
US11540432B2 (en) 2019-09-26 2022-12-27 Applied Materials, Inc. Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050153138A1 (en) * 2002-07-25 2005-07-14 Halladay James R. Ambient cured flexible fluoroelastomer coatings and coated products
JP2007308666A (ja) * 2006-05-22 2007-11-29 Chuko Kasei Kogyo Kk 吸着固定用緩衝シート
KR20100123880A (ko) * 2008-02-27 2010-11-25 바스프 에스이 직물 시트 재료를 포함하는 다층 복합 재료, 이의 제조 방법 및 용도
KR20100133075A (ko) * 2009-06-11 2010-12-21 장관식 대전방지 코팅액, 이를 이용한 대전방지 시트, 이의 제조방법 및 이를 이용한 대전방지 제품

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002173250A (ja) * 2000-12-07 2002-06-21 Nitto Denko Corp 吸着搬送方法および吸着加工方法
KR101426572B1 (ko) * 2006-03-15 2014-08-05 신에츠 폴리머 가부시키가이샤 보유 지그, 반도체 웨이퍼의 연삭 방법
KR101044554B1 (ko) * 2009-03-31 2011-06-28 (주)탑나노시스 대전 방지 처리된 작업 스테이지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050153138A1 (en) * 2002-07-25 2005-07-14 Halladay James R. Ambient cured flexible fluoroelastomer coatings and coated products
JP2007308666A (ja) * 2006-05-22 2007-11-29 Chuko Kasei Kogyo Kk 吸着固定用緩衝シート
KR20100123880A (ko) * 2008-02-27 2010-11-25 바스프 에스이 직물 시트 재료를 포함하는 다층 복합 재료, 이의 제조 방법 및 용도
KR20100133075A (ko) * 2009-06-11 2010-12-21 장관식 대전방지 코팅액, 이를 이용한 대전방지 시트, 이의 제조방법 및 이를 이용한 대전방지 제품

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024005622A1 (ko) * 2022-07-01 2024-01-04 주식회사 엘지에너지솔루션 단위 셀 운반 시스템

Also Published As

Publication number Publication date
TW201345673A (zh) 2013-11-16
CN103171215A (zh) 2013-06-26
KR20130071824A (ko) 2013-07-01

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