KR101374370B1 - An adhesive film for organic EL device, a composition for the same, and organic EL display device comprising the same - Google Patents

Abstract

The present invention relates to an adhesive film for an organic EL device, a composition contained therein, and an organic EL display device including the same. More specifically, the present invention includes an adsorbent, and cured at 90 ° C. for 2 hours, and then at 50 ° C. and 100% relative humidity, the water transmittance is 100 g / m ² · day or less, the coating state is good, the adhesion is good, and the usability is achieved. The present invention relates to a high adhesive film for organic EL devices, a composition contained therein, and an organic EL display device including the same.

Description

An adhesive film for organic EL device, a composition for the same, and organic EL display device comprising the same}

The present invention relates to an adhesive film for an organic EL device, a composition contained therein, and an organic EL display device including the same. More specifically, the present invention includes an adsorbent, and cured at 90 ° C. for 2 hours, and then at 50 ° C. and 100% relative humidity, the water vapor transmission rate (WVTR) is 100 g / m ² · day or less and the coating state. The present invention relates to an adhesive film for an organic EL device having good adhesion, good adhesion, and high usability, a composition contained therein, and an organic EL display device including the same.

The organic EL device is a polycrystalline semiconductor device, and is used as a backlight of liquid crystal for obtaining light emission of a high luminance at a low voltage and is expected as a thin flat display device. However, the organic EL element is extremely weak in moisture, and the interface between the metal electric field and the organic EL layer may be peeled off due to the influence of moisture, the metal may be oxidized to have high resistance, the organic material itself may be deteriorated by moisture, Therefore, there is a problem that the light is not emitted and the luminance is lowered.

In order to solve such a problem, a method of encapsulating an organic EL device with a curable composition has been developed. A method of molding an organic EL device with an acrylic resin by a conventional sealing method, a method of adding a moisture absorbing material to an encapsulating resin of an organic EL device to block the organic EL device from moisture, and the like have been proposed.

However, the conventional method of encapsulating the organic EL device has a limitation in suppressing the occurrence and growth of dark spots, it cannot have sufficient adhesive force, and it cannot fully satisfy all the requirements for encapsulation of the organic EL device. There was a limit to use for encapsulation. In particular, the organic EL device has a disadvantage in that it is very sensitive to moisture and easily decomposes, causing chemical reaction with moisture. However, the curable composition used for the sealing application of the existing organic EL device has a limit in lowering the water transmittance.

An object of the present invention is to provide an adhesive film for organic EL devices having a low water transmittance.

Another object of the present invention is to provide an adhesive film for an organic EL device having a good coating state, good adhesion and high usability.

Another object of the present invention is to provide a composition included in the adhesive film for an organic EL device.

Still another object of the present invention is to provide an organic EL display device comprising an adhesive layer composed of the above adhesive film for organic EL elements.

An adhesive film for an organic EL device, which is an aspect of the present invention, includes an adsorbent and may be cured at 90 ° C. for 2 hours, and then have a moisture transmittance of 100 g / m ² · day or less at 50 ° C. and 100% relative humidity.

In one embodiment, the adsorbent may be included in 0.5-40% by weight based on solids in the adhesive film.

In one embodiment, the adsorbent may include one or more selected from the group consisting of zeolite, calcium oxide, molecular sieve, activated carbon, silica gel and the like.

In one embodiment, the adhesive film may further include an epoxy resin, a film former resin, and a curing agent having a weight average molecular weight of 50-5,000 g / mol.

In one embodiment, the film former resin may be included in the 50 to 240 parts by weight based on 100 parts by weight of the epoxy resin having a weight average molecular weight of 50-5000g / mol.

In one embodiment, the adhesive film may further include one or more selected from the group consisting of a silane coupling agent, a filler, a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent.

Another aspect of the present invention is an organic EL display device comprising: a first substrate having an organic EL element formed on one surface thereof; A second substrate spaced apart from the first substrate; And a substrate disposed between the first substrate and the second substrate to bond the first substrate to the second substrate, and cured at 90 ° C. for 2 hours, and then having a water transmittance of 100 g / m at 50 ° C. and 100% relative humidity. It may include an adhesive layer that is ² ㆍ day or less.

The present invention provides an adhesive film for an organic EL device comprising an adhesive layer having a low water transmittance. This invention provided the adhesive film for organic electroluminescent elements containing the adhesive layer in the state of a favorable coating film, and the adhesive force is high and usability is high. The present invention provides an organic EL display device comprising an adhesive layer composed of the adhesive film for organic EL elements.

1 illustrates an organic EL display device according to an embodiment of the present invention.

One aspect of the present invention relates to an adhesive film for an organic EL device.

The film of the present invention may be cured at 90 ° C. for 2 hours, and then the water transmittance in the film thickness direction may be 100 g / m ² · day or less at 50 ° C. and 100% relative humidity. Within this range, the water barrier effect is high, and peeling of the glass or film substrate on which the organic EL element is formed and the organic EL element can be prevented. Moisture permeability may preferably be more than 0 100g / m ² and day or less, more preferably more than 0 to 50g / m ² and day or less at 50 ℃ and 100% relative humidity at 50 ℃ and 100% relative humidity.

Moisture permeability can be measured with a film having a thickness of 20-30 μm. First, the composition constituting the adhesive film is filmed to the thickness and cured at 90 ° C. for 2 hours, and then measured by MOCON test using carrier gas as nitrogen gas under 50 ° C., 100% relative humidity, and 760 mmHg pressure. This is not restrictive. After curing, the adhesive film may have a thickness of 20-30 μm.

In one embodiment, the adhesive film may include an adsorbent. The adsorbent can block the contact between the organic EL element and water by providing hygroscopicity by physical adsorption.

The adsorbent preferably uses particles that are porous such that the surface area adsorbed per unit volume or unit weight is wide to provide effective hygroscopicity. The adsorbent preferably has an average pore size of 1-20 nm.

The adsorbent preferably has a particle size (D50) of 50 nm-5 μm. Within this range, the hygroscopic effect is good and the film formability does not deteriorate. The adhesive film may comprise an adsorbent having two or more particle sizes.

The adsorbent may include one or more selected from the group consisting of zeolite, calcium oxide, molecular sieve, activated carbon, silica gel and the like, but is not limited thereto.

The adsorbent may be included in 0.5-40% by weight of the adhesive film on a solids basis. Within this range, the hygroscopic effect is good and the film formability does not deteriorate. Preferably 4-20% by weight.

The adsorbent may be included in an amount of 10-150 parts by weight based on 100 parts by weight of an epoxy resin having a weight average molecular weight of 50-5,000 g / mol described below. Within the above range, the hygroscopicity effect is good, the film formability is not deteriorated, and the adhesive strength is high. Preferably 15 to 50 parts by weight.

In another embodiment, the adhesive film may further include an epoxy resin having a weight average molecular weight of 50-5,000 g / mol, a film former resin, and a curing agent, in addition to the adsorbent.

The epoxy resin may have a weight average molecular weight of 50-5,000 g / mol. Within the above range, the adhesion of the film can be enhanced and the film properties can be imparted. The weight average molecular weight may preferably be 100-5,000 g / mol, more preferably 200-4,000 g / mol. The epoxy resin preferably has a hydrolyzable chlorine ion content of 700 ppm or less. Within this range, there may be an effect that does not damage the device in the acceleration reliability test for long-term reliability evaluation. The chlorine ion may preferably be 0-500 ppm, more preferably 0-300 ppm.

The epoxy resin is a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a hydrogenated bisphenol type epoxy resin, a cycloaliphatic epoxy resin, a naphthalene type epoxy resin, a phenol novolak type epoxy resin, an o-cresol novolak type epoxy It may include, but is not limited to, one or more selected from the group consisting of resins, disclopentadiene type epoxy resins, biphenyl type epoxy resins, biphenyl novolak type epoxy resins, and naphthalene novolak type epoxy resins. .

The epoxy resin may be contained in an amount of 20 to 80% by weight based on the solid content of the adhesive layer. Within the above range, the film properties and film formability may be good. Preferably 20-75% by weight, more preferably 25-70% by weight, most preferably 27-59% by weight.

The film-forming resin is an aromatic resin including an epoxy resin, an acrylate resin, a urethane acrylate resin, a polyimide, a styrene resin, etc. having a weight average molecular weight of 10,000-500,000 g / mol, and a diene, silicone, urethane It may include one or more selected from the group consisting of rubber, including fluorine-based rubber. Preferably, the film-forming resin may be an epoxy resin having a weight average molecular weight of 10,000 to 500,000 g / mol. The epoxy resin has an effect of imparting adhesion and coating properties of the film with a room temperature tack within the weight average molecular weight range. Preferably 70,000-500,000 g / mol.

The epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol may include a resin having a bisphenol A type or a bisphenol F type epoxy skeleton. For example, at least one selected from the group consisting of a solid bisphenol A type epoxy resin, a solid bisphenol F type epoxy resin and a phenoxy resin, but is not limited thereto.

The film-forming resin may be contained in an amount of 10-70% by weight based on the solid content of the adhesive layer. Within this range, film formability is good and reliability is good. Preferably 20-70% by weight, more preferably 25-70% by weight, most preferably 25-67% by weight.

The film former resin may include 40 to 240 parts by weight based on 100 parts by weight of the epoxy resin having a weight average molecular weight of 50-5,000 g / mol. Within this range, film formability is good and reliability is good. Preferably it may be included in 50-240 parts by weight, more preferably 100-150 parts by weight.

The curing agent may include an imidazole-based curing agent. The imidazole-based curing agent may include an imidazole compound having at least one functional group selected from the group consisting of a phenyl group, an alkenyl group having 10 or more carbon atoms, preferably 10 to 20 carbon atoms, and a cyan group. The imidazole-based curing agent may enable the curing of the film coating film stability, room temperature compatibility and low temperature, especially at a temperature of 90 ° C or less.

The curing agent may include an imidazole curing agent having a reaction initiation temperature of 60-100 ° C and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C. In the present invention, the term "reaction initiation temperature" means a temperature at which the imidazole curing agent reacts with the epoxy resin to initiate curing. Preferably an imidazole curing agent having a reaction initiation temperature of 70-98 ° C and an imidazole curing agent having a reaction initiation temperature of 105-140 ° C.

Two or more kinds of imidazole curing agents having a reaction initiation temperature of 60-100 ° C may be contained. The imidazole curing agent having a reaction initiation temperature of 100-160 DEG C may be contained in two or more kinds.

The imidazole curing agent having a reaction initiation temperature of 60 to 100 占 폚 and an imidazole curing agent having a reaction initiation temperature of 100 to 160 占 폚 may be a phenyl group, a benzyl group, an alkane having 1 to 20 carbon atoms, An anion or an amine group.

Examples of the imidazole curing agent having a reaction initiation temperature of 60 to 100 占 폚 include 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl- Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl- Imidazoline, 2-phenylimidazoline, and the like.

Examples of the imidazole curing agent having a reaction initiation temperature of 100 to 160 ° C include 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium-trimellitate, Amino-6 [2'-undecylimidazolyl- (1 ')] - ethyl-s-triazine, 2,4-diamino-6- [ 1 ')] - ethyl-s-triazine, 1-cyanoethyl-2-phenylimidazolium-trimellitate, 2-phenylimidazole isocyanuric acid adduct, ≪ / RTI > imidazole hydrobromide, and the like.

 The curing agent may be included in 0.1-10% by weight based on the solids of the adhesive film. Within this range, film formability is good and reliability is good. Preferably 1-10% by weight, more preferably 1-5% by weight.

In addition, the curing agent may be included as 0.1-20 parts by weight, preferably 0.5-10 parts by weight, more preferably 1-7 parts by weight based on 100 parts by weight of the epoxy resin having a weight average molecular weight of 50-5,000 g / mol. have.

In another embodiment, the adhesive layer may further include one or more selected from the group consisting of a silane coupling agent and a filler. The silane coupling agent and the filler may increase the properties and reliability of the film coating film.

As the silane coupling agent, a conventional coupling agent may be used. For example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl tri Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) (Meth) acryloxypropyltrimethoxysilane and trimethoxysilane, vinyltrimethoxysilane, N-2- (vinylbenzylamino) ethyl) -3-aminopropyltrimethoxysilane hydrochloride and 3- , But is not limited thereto. The silane coupling agent may be contained in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the epoxy resin having a weight average molecular weight of 50 to 5,000 g / mol on a solid basis.

The filler may be a conventional filler. For example, one or more selected from the group consisting of aluminum oxide, aluminum silicate, talc and plate silicates may be used, but is not limited thereto. The filler may be included in an amount of 1-150 parts by weight, preferably 10-100 parts by weight, based on 100 parts by weight of the film-forming resin, based on solid content.

In another embodiment, the adhesive layer may further comprise at least one additive. The additive can improve the leveling on the surface and the film property. The additive may be, for example, at least one selected from the group consisting of a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent, but is not limited thereto.

The adhesive film can be produced by drying and laminating an adhesive composition for sealing an organic EL device described below. Drying and laminating methods are not particularly limited, and may include a method of drying at 20-80 ° C. to 0.2 m / s-1.5 m / s.

The adhesive film preferably has a thickness of 1-100 µm, more preferably 10-50 µm. Within this range, the organic EL device and the sealing film can be adhered well.

Another aspect of the present invention relates to a resin composition for sealing an organic EL device.

The composition is present in the form of a film exhibiting non-fluidity at 25 ℃ and when heated to 50-100 ℃ to express the fluidity and adhesiveness between the organic EL element formed on the glass or film substrate and the sealing glass or film substrate between can do.

Form an organic EL device consisting of a transparent electrode, a hole transport layer, an organic EL layer and a back electrode on a glass or film substrate, heat transfer the composition of the present invention thereon, and heat-transfer the non-permeable glass or film to bond and encapsulate it. Can be. Alternatively, the composition of the present invention may be thermally transferred to a water-impermeable glass or film, and bonded and sealed while heating to a glass or film on which an organic EL element is formed.

More specifically, a transparent electrode is formed to a thickness of about 0.1 mu m on a glass or film substrate. The transparent electrode may be formed by vacuum evaporation or sputtering. A hole transport layer and an organic EL layer are sequentially formed on the transparent electrode at a thickness of 0.05 mu m and a rear electrode is formed at a thickness of 0.1 to 0.3 mu m on the organic EL layer. The composition of the present invention is transferred onto a glass or film substrate after the film formation of the device is finished with a laminate or the like. At this time, when the composition of the present invention is transferred onto a release film to form a sheet, it can be easily transferred. Then, a non-permeable glass or film substrate is superimposed on top of the transferred composition. This is heat-compression-bonded using a vacuum laminator apparatus to preliminarily fix the lower glass or film substrate and the upper non-permeable glass or film substrate. Then, the thermosetting resin is completely cured at a curing temperature, for example, 90 DEG C or less. It is also possible to transfer the composition of the present invention to the above impervious glass or film substrate first and to polymerize the element substrate on which the organic EL layer is formed.

The composition of the present invention may have a shelf life of 7 days or more at 25 ℃.

The film or cured product layer prepared from the composition of the present invention preferably has a thickness of 1-100 μm, more preferably 10-50 μm. It is possible to easily bond between two glasses or films within the above range.

The composition may include (A) an epoxy resin having a weight average molecular weight of 50-5,000 g / mol, (B) film former resin, (C) adsorbent, and (D) hardener. The content about said component (A)-(D) is as having mentioned above.

The composition may further include one or more selected from the group consisting of the silane coupling agent and the filler described above, and may further include one or more of the additives described above.

The composition may include a solvent commonly used in the art, for example, methyl ethyl ketone. Solvents may be included in the balance in the composition.

Another aspect of the present invention relates to an organic EL display device. The apparatus includes: a first substrate on which an organic EL device is formed;

A second substrate spaced apart from the first substrate; And

Disposed between the first substrate and the second substrate to bond the first substrate and the second substrate, and cured at 90 ° C. for 2 hours, and then a water transmittance of 100 g / m ² at 50 ° C. and 100% relative humidity. The adhesive layer which is below day may be included.

1, an organic EL display device 1 according to an embodiment of the present invention includes a first substrate 2, an organic EL element 3, a second substrate 4, and an adhesive layer 5 .

After the adhesive layer is cured at 90 ° C. for 2 hours, the moisture transmittance in the adhesive layer thickness direction may be 100 g / m ² · day or less at 50 ° C. and 100% relative humidity. Within this range, the moisture blocking effect is high and the peeling of the organic EL device from the first substrate can be prevented. Moisture permeability may preferably be greater than 0 and less than 50 g / m ² · day at 50 ° C. and 100% relative humidity.

The adhesive layer may include the adhesive film for organic EL device or the adhesive composition for encapsulating the organic EL device described above.

It is preferable that the adhesive layer has a thickness of 1-100 μm, more preferably 10-50 μm. The organic EL element and the sealing film can be adhered well within the above range.

The first substrate may be made of a material such as a transparent glass, a film, a plastic sheet, a silicon or a metal substrate, and may have a flexible or non-flexible characteristic and a transparent or non-transparent characteristic. At least one organic EL element is formed on one surface of the first substrate. The organic EL element is composed of a transparent electrode, a hole transport layer, an organic EL layer and a back electrode.

The second substrate may be disposed on the organic EL device, may be disposed on the first substrate, and may be bonded to the first substrate by the adhesive layer. As the second substrate, not only a glass substrate but also a substrate having excellent barrier properties such as a plastic sheet on which metals are stacked may be used.

A getter 6 for bonding the first substrate and the second substrate may be formed between the first substrate and the second substrate and on the side of the organic EL device.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Specific specifications of the components used in the following examples and comparative examples are as follows.

(1) YDF-8170 (TOHTO) (epoxy equivalent weight: 159 g / g-eq., Mw .: 318 g / mol) was used as an epoxy resin having a weight average molecular weight of 50-5,000 g / mol.

(2) E-4275 (JER) (Mw. 74,000 g / mol), an epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol, was used as the film-forming resin.

(3) Zeolite (Aldrich) was used as the adsorbent.

(4) 2P4MZ (2-phenyl-4-methylimidazole) and 2P4MHZ (Shikoku) (2-phenyl-4-methyl-5-hydoxymethylimidazole) were used as the hardener.

Example  1-4

The film-forming resin was dispersed in methyl ethyl ketone and the solid content was mixed in the amount shown in Table 1 below. Then, an epoxy resin, an adsorbent, and a curing agent having a weight average molecular weight of 50-5,000 g / mol were added in the amounts shown in Table 1 below. And dispersed using a planetary mixer and a 3-roll mill. A coating film was formed with an applicator, dried and laminated to prepare an adhesive film having a thickness of 20 μm.

Comparative Example  One

Adhesion with a thickness of 20 μm was carried out in the same manner, except that the epoxy resin, film former resin, adsorbent, and curing agent having a weight average molecular weight of 50-5,000 g / mol were changed to the contents shown in Table 1 below. A film was prepared.

Experimental Example : Evaluation of Physical Properties of Adhesive Film

The adhesive films prepared in Examples and Comparative Examples were used as samples, and physical properties were evaluated, and are shown in Table 1 below.

≪ Method for measuring physical properties &

1) Moisture permeability: After heat curing at 90 ℃ for 2 hours, the film was 20㎛ thickness MOCON test using nitrogen gas as a carrier gas under 50 ℃, 100% relative humidity, 760mmHg pressure.

2) Coating state: It was confirmed whether the tack generation and flow of the produced film at 25 ℃. tack is a tack test of the surface of the film made to a thickness of 20 μm with TOPTAC 2000A of CHEMILAB. When the tack is less than 100gf or no flow at 25 ℃, ○, when the tack exceeds 100gf at 25 ℃ was evaluated as ×.

3) DSS (die shear strength) after curing: Laminated (bonding conditions 120 ℃ 5kgf, 5 seconds) to the 20㎛ thick film of the prepared film on a 5mmx5mm glass substrate and cured for 2 hours at 100 ℃ DAGE 4000 (DAGE90 Co., Ltd.) ) Was measured die shear strength.

4) After the reliability evaluation DSS: After maintaining the sample prepared in the same manner as the method (3) above at 85 ℃ and 85% relative humidity for 24 hours, the die shear strength was measured by DAGE 4000.

5) Tensile strength: The film was cured at 100 ° C. for 2 hours, and then measured by UTM tensile strength measuring method for a film having a width of 8 mm and a thickness of 20 μm.

6) Film usability: It was evaluated as (circle) when it can be used for organic electroluminescent element sealing use, (triangle | delta) when it can be partially used, and × when it cannot use.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 An epoxy resin having a weight average molecular weight of 50-5,000 g / mol
(Parts by weight) 100 100 100 100 100 Film Formation Resin
(Parts by weight) 100 100 50 240 100 absorbent
(Parts by weight) 15 50 15 15 - Hardener
(Parts by weight) Hardener 1 One One One One One Hardener 2 4 4 4 4 4 Moisture permeability
(g / m ² ㆍ day) 37 29 36 43 378 Coat state ○ ○ ○ ○ ○ DSS after curing
(kgf) 76 72 80 64 73 DSS after reliability evaluation
(kgf) 63 69 68 48 52 The tensile strength
(N / mm ² ) 24.1 23.6 23.9 19.8 21.3 Availability ○ ○ ○ ○ ×

As shown in Table 1, the film containing the adsorbent of the present invention compared to the film not containing the adsorbent has a low moisture permeability, a good coating state, good adhesion and high usability as a film (Comparative Example 1 Reference).

Claims (14)

After curing for 2 hours at 90 ℃ water vapor transmission rate (WVTR) at 50 ℃ and 100% relative humidity is less than 100g / m ² ㆍ day,
At least one adsorbent selected from the group consisting of zeolites, molecular sieves, activated carbon and silica gel, epoxy resins and imidazole curing agents,
The epoxy resin is an adhesive film for an organic EL device which is a mixture of an epoxy resin having a weight average molecular weight of 50 to 5,000 g / mol and an epoxy resin having a weight average molecular weight of 10,000 to 500,000 g / mol.
The adhesive film for organic EL device according to claim 1, wherein the moisture transmittance is more than 0 and 50g / m ² · day or less.
The adhesive film for organic EL device according to claim 1, wherein the adhesive film has a thickness of 20-30 μm after curing at 90 ° C. for 2 hours.
The adhesive film for an organic EL device according to claim 1, wherein the adsorbent is contained in an amount of 0.5-40% by weight based on solids in the adhesive film.
delete The adhesive film for organic EL device according to claim 1, wherein the adsorbent has an average pore size of 1-20 nm.
The adhesive film for organic EL device according to claim 1, wherein the adsorbent has a particle size of 50 nm-5 탆.
delete According to claim 1, wherein the weight average molecular weight of 10,000 to 500,000 g / mol epoxy resin is characterized in that it comprises 50 to 240 parts by weight based on 100 parts by weight of the epoxy resin having a weight average molecular weight of 50 to 5000 g / mol Adhesive film for organic EL elements.
delete The adhesive film for organic EL devices according to claim 1, wherein the imidazole curing agent includes an imidazole curing agent having a reaction initiation temperature of 60-100 ° C and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C.
The adhesive film for organic EL device according to claim 1, wherein the adhesive film further comprises at least one selected from the group consisting of a silane coupling agent, a filler, a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent. .
A first substrate on which an organic EL element is formed;
A second substrate spaced apart from the first substrate; And
An adhesive layer disposed between the first substrate and the second substrate to bond the first substrate and the second substrate;
The adhesive layer is cured for 2 hours at 90 ℃ and water vapor transmission rate (WVTR) at 50 ℃ and 100% relative humidity is less than 100g / m ² ㆍ day,
The adhesive layer comprises at least one adsorbent, an epoxy resin and an imidazole curing agent selected from the group consisting of zeolite, molecular sieve, activated carbon and silica gel,
The epoxy resin is a mixture of an epoxy resin having a weight average molecular weight of 50 to 5,000 g / mol and an epoxy resin having a weight average molecular weight of 10,000 to 500,000 g / mol,
Organic EL display device.
The organic EL display device according to claim 13, further comprising a getter.

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