KR101374369B1 - Organic EL display device and an adhesive composition for the same - Google Patents

Abstract

The present invention relates to an organic EL display device and an adhesive composition for encapsulating an organic EL device contained therein. More specifically, the present invention comprises an epoxy resin having a weight average molecular weight of 200-3,000g / mol and a softening point of 40-120 ℃, after curing for 2 hours at 90 ℃ and moisture permeability at 50 ℃ and 100% relative humidity (water vapor transmission rate, WVTR) is less than 100g / m2 · day, the organic EL display device comprising an adhesive layer having a good coating film state, good adhesion and high usability, and an adhesive composition for encapsulating an organic EL device contained therein .

Description

[0001] The present invention relates to an organic EL display device and an adhesive composition for encapsulating an organic EL element contained therein,

The present invention relates to an organic EL display device and an adhesive composition for encapsulating an organic EL device contained therein. More specifically, the present invention comprises an epoxy resin having a weight average molecular weight of 200-3,000g / mol and a softening point of 40-120 ℃, after curing for 2 hours at 90 ℃ and moisture permeability at 50 ℃ and 100% relative humidity (water vapor transmission rate, WVTR) is less than 100g / m ² · day, the organic EL display device comprising an adhesive layer having a good coating film state, good adhesion and high usability and an adhesive composition for encapsulating an organic EL device contained therein will be.

The organic EL device is a polycrystalline semiconductor device, and is used as a backlight of liquid crystal for obtaining light emission of a high luminance at a low voltage and is expected as a thin flat display device. However, the organic EL element is extremely weak in moisture, and the interface between the metal electric field and the organic EL layer may be peeled off due to the influence of moisture, the metal may be oxidized to have high resistance, the organic material itself may be deteriorated by moisture, Therefore, there is a problem that the light is not emitted and the luminance is lowered.

In order to solve such a problem, a method of encapsulating an organic EL device with a curable composition has been developed. A method of molding an organic EL device with an acrylic resin by a conventional sealing method, a method of adding a moisture absorbing material to an encapsulating resin of an organic EL device to block the organic EL device from moisture, and the like have been proposed.

However, the conventional method of encapsulating the organic EL device has a limitation in suppressing the occurrence and growth of dark spots, it cannot have sufficient adhesive force, and it cannot fully satisfy all the requirements for encapsulation of the organic EL device. There was a limit to use for encapsulation. In particular, the organic EL device has a disadvantage in that it is very sensitive to moisture and easily decomposes, causing chemical reaction with moisture. However, the curable composition used for the sealing application of the existing organic EL device has a limit in lowering the water transmittance.

It is an object of the present invention to provide an organic EL display device comprising an adhesive layer having a low water transmittance.

Another object of the present invention is to provide an organic EL display device having an adhesive layer having a good coating state and having good adhesion and high usability.

Still another object of the present invention is to provide an adhesive composition for sealing an organic EL device constituting the adhesive layer.

An organic EL display device according to an aspect of the present invention includes: a first substrate on which an organic EL element is formed;

A second substrate spaced apart from the first substrate; And

Disposed between the first substrate and the second substrate to bond the first substrate and the second substrate, and cured at 90 ° C. for 2 hours, and then water vapor transmission rate at 50 ° C. and 100% relative humidity. , WVTR) may include an adhesive layer having less than 100 g / m ² · day.

In one embodiment, the adhesive layer may include an epoxy resin having a weight average molecular weight of 200-3,000 g / mol and a softening point of 40-120 ℃.

In one embodiment, the adhesive layer may further include a low molecular weight epoxy resin, a film former resin and a curing agent having a weight average molecular weight of 50-5,000g / mol.

In one embodiment, the adhesive layer may further include one or more selected from the group consisting of a silane coupling agent and a filler.

According to another aspect of the present invention, an adhesive composition for encapsulating an organic EL device includes (A) an epoxy resin having a weight average molecular weight of 200-3000 g / mol and a softening point of 40-120 ° C., (B) a weight average molecular weight of 50-5,000 g / mol Phosphorus low molecular weight epoxy resin, (C) film former resin; And (D) hardeners.

The present invention provides an organic EL display device including an adhesive layer having a low moisture permeability. The present invention provides an organic EL display device including an adhesive layer having a good coating film state and having good adhesion and high usability.

1 illustrates an organic EL display device according to an embodiment of the present invention.

One aspect of the present invention relates to an organic EL display device. The apparatus includes: a first substrate on which an organic EL device is formed;

A second substrate spaced apart from the first substrate; And

Disposed between the first substrate and the second substrate to bond the first substrate and the second substrate, and cured at 90 ° C. for 2 hours, and then water vapor transmission rate at 50 ° C. and 100% relative humidity. , WVTR) may include an adhesive layer having less than 100 g / m ² · day.

Referring to FIG. 1, an organic EL display device 1 according to an embodiment of the present invention may include a first substrate 2, an organic EL element 3, a second substrate 4, and an adhesive layer 5. Can be.

After the adhesive layer is cured at 90 ° C. for 2 hours, the moisture transmittance in the adhesive layer thickness direction may be less than 100 g / m ² · day at 50 ° C. and 100% relative humidity. Within this range, the moisture blocking effect is high and the peeling of the organic EL device from the first substrate can be prevented. Moisture permeability may preferably be more than 0 to 80g / m ² · day or less, more preferably more than 0 to 63g / m ² · day or less at 50 ℃ and 100% relative humidity at 50 ℃ and 100% relative humidity.

Moisture permeability can be measured with an adhesive layer having a thickness of 10-50 μm. First, the composition constituting the adhesive layer can be measured by MOCON test using a carrier gas as a nitrogen gas at 50 DEG C, 100% relative humidity, and 760 mmHg pressure after curing the composition at 90 DEG C for 2 hours, It is not limited. After curing, the adhesive layer may have a thickness of 10-50 μm.

In one embodiment, the adhesive layer may include an epoxy resin having a weight average molecular weight of 200-3,000 g / mol and a softening point of 40-120 ℃.

The epoxy resin may have a weight average molecular weight of 200-3000g / mol. Within this range, it is possible to improve the adhesion while giving the coating properties at room temperature of the film. The weight average molecular weight may be preferably 200-2500 g / mol, more preferably 200-2000 g / mol.

The epoxy resin may have a softening point of 40-120 ° C. Within this range, it is possible to give a softening point that can exhibit low water permeability and good film molding and exhibit coating film properties for use of the film as an adhesive film. The softening point may preferably be 50-100 ° C, more preferably 50-90 ° C.

The epoxy resin may have two or more glycidyl groups.

The epoxy resin preferably has a content of hydrolyzable chlorine ions of 1000 ppm or less. Within this range, the device may not be damaged in an accelerated reliability test for long-term reliability evaluation. The content of chlorine ions may preferably be 0-700 ppm, more preferably 0-500 ppm.

Examples of the epoxy resins include phenol novolac epoxy resins, o-cresol novolac epoxy resins, dicyclopentadiene epoxy resins, biphenyl epoxy resins, biphenyl novolac epoxy resins and naphthalene novolac epoxy resins. It may include one or more selected from the group consisting of, but is not limited thereto.

The epoxy resin may be included in 1-70% by weight based on the solids of the adhesive layer. Within this range, good room temperature stability and film formability may be obtained. Preferably it may be included in 10-50% by weight, more preferably 10-35% by weight.

The epoxy resin may be included in 10 to 80 parts by weight based on 100 parts by weight of the film-forming resin to be described below. Within this range, there may be an effect of low moisture permeability and high adhesion. Preferably it may be included in 30-70 parts by weight.

In another embodiment, the adhesive layer may further include, in addition to the epoxy resin, a low molecular weight epoxy resin having a weight average molecular weight of 100-5,000 g / mol, a film former resin, and a curing agent.

The low molecular weight epoxy resin may have a weight average molecular weight of 50-5,000 g / mol. Within this range, the adhesion of the film may be enhanced and the coating properties may be imparted. The weight average molecular weight may preferably be 100-5,000 g / mol, more preferably 200-4,000 g / mol. In addition, the low molecular weight epoxy resin preferably has a hydrolyzable chlorine ion of 700 ppm or less. Within this range, there may be an effect of not damaging the device in the accelerated reliability test for long term reliability evaluation. The chlorine ion may preferably be 0-500 ppm, more preferably 0-300 ppm.

The low molecular weight epoxy resin may include at least one selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol type epoxy resins, cycloaliphatic epoxy resins, and naphthalene type epoxy resins. However, it is not limited to these.

The low molecular weight epoxy resin may be included in 1-50% by weight based on solids of the adhesive layer. Within the above range, the film properties and film formability may be good. Preferably 5-35% by weight, more preferably 10-35% by weight.

In addition, the low molecular weight epoxy resin may be included in 10 to 80 parts by weight based on 100 parts by weight of the film forming resin. Within this range, there is an effect that can be given an appropriate tack at room temperature. Preferably it may be included in 30-70 parts by weight.

The film former resin may include one or more selected from the group consisting of a high molecular weight epoxy resin, an acrylic binder, a polyimide, a styrene resin, and an NBR rubber having a weight average molecular weight of 10,000-500,000 g / mol. Preferably, the film-forming resin may be a high molecular weight epoxy resin having a weight average molecular weight of 10,000-500,000 g / mol. Within the weight average molecular weight range in the high molecular weight epoxy resin, there is an effect of imparting the adhesion and coating properties of the film and the room temperature tack. Preferably 150,000-500,000 g / mol.

The high molecular weight epoxy resin may include a resin having a bisphenol A type or bisphenol F type epoxy skeleton. For example, at least one selected from the group consisting of a solid bisphenol A type epoxy resin, a solid bisphenol F type epoxy resin and a phenoxy resin, but is not limited thereto.

The film former resin may be included in 20-80% by weight based on the solids of the adhesive layer. Within this range, film formability is good and reliability is good. Preferably it may be included in 30-70% by weight, more preferably 30-50% by weight.

The curing agent may include an imidazole-based curing agent. The imidazole-based curing agent may include an imidazole compound having at least one functional group selected from the group consisting of a phenyl group, an alkenyl group having 10 or more carbon atoms, preferably 10 to 20 carbon atoms, and a cyan group. The imidazole-based curing agent can be cured at a temperature of less than 100 ° C, particularly at room temperature and compatibility with a film at room temperature.

The curing agent may include an imidazole curing agent having a reaction initiation temperature of 60-100 ° C and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C. In the present invention, the term "reaction initiation temperature" means a temperature at which the imidazole curing agent reacts with the epoxy resin to initiate curing. Preferably an imidazole curing agent having a reaction initiation temperature of 70-98 ° C and an imidazole curing agent having a reaction initiation temperature of 105-140 ° C.

Two or more kinds of imidazole curing agents having a reaction initiation temperature of 60-100 ° C may be contained. The imidazole curing agent having a reaction initiation temperature of 100-160 DEG C may be contained in two or more kinds.

The imidazole curing agent having a reaction initiation temperature of 60 to 100 占 폚 and an imidazole curing agent having a reaction initiation temperature of 100 to 160 占 폚 may be a phenyl group, a benzyl group, an alkane having 1 to 20 carbon atoms, An anion or an amine group.

Examples of the imidazole curing agent having a reaction initiation temperature of 60 to 100 占 폚 include 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl- Benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl- Imidazoline, 2-phenylimidazoline, and the like.

Examples of the imidazole curing agent having a reaction initiation temperature of 100 to 160 ° C include 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium-trimellitate, Amino-6 [2'-undecylimidazolyl- (1 ')] - ethyl-s-triazine, 2,4-diamino-6- [ 1 ')] - ethyl-s-triazine, 1-cyanoethyl-2-phenylimidazolium-trimellitate, 2-phenylimidazole isocyanuric acid adduct, ≪ / RTI > imidazole hydrobromide, and the like.

 The curing agent may be contained in an amount of 0.1-10% by weight based on the solid content of the adhesive layer. Within this range, film formability is good and reliability is good. Preferably 1-10% by weight, more preferably 1-5% by weight.

The curing agent may be contained in an amount of 1-20 parts by weight, preferably 1-10 parts by weight, more preferably 1-5 parts by weight, based on 100 parts by weight of the film-forming resin.

In another embodiment, the adhesive layer may further include one or more selected from the group consisting of a silane coupling agent and a filler. The silane coupling agent and the filler may increase the properties and reliability of the film coating film.

As the silane coupling agent, a conventional coupling agent may be used. For example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl tri Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) (Meth) acryloxypropyltrimethoxysilane and trimethoxysilane, vinyltrimethoxysilane, N-2- (vinylbenzylamino) ethyl) -3-aminopropyltrimethoxysilane hydrochloride and 3- , But is not limited thereto. The silane coupling agent may be included in an amount of 0.1-20 parts by weight based on 100 parts by weight of the film-forming resin based on a solid content.

The filler may be a conventional filler. For example, one or more selected from the group consisting of silica, aluminum oxide, aluminum silicate, talc and panic acid silicate may be used, but is not limited thereto. The filler may be included in an amount of 1-150 parts by weight, preferably 10-100 parts by weight, based on 100 parts by weight of the film-forming resin, based on solid content.

In another embodiment, the adhesive layer may further comprise at least one additive. The additive can improve the leveling on the surface and the film property. The additive may be, for example, at least one selected from the group consisting of a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent, but is not limited thereto.

The adhesive layer can be produced by drying and laminating an adhesive composition for encapsulating an organic EL device described below. The method of drying and laminating is not particularly limited, but may include a method of drying at 20-80 DEG C at 0.2 m / s to 1.5 m / s.

The thickness of the adhesive layer is preferably 1-100 mu m, more preferably 10-50 mu m. The organic EL element and the sealing film can be adhered well within the above range.

The first substrate may be made of a material such as a transparent glass, a plastic sheet, a silicon or a metal substrate, and may have a flexible or non-flexible characteristic and a transparent or non-transparent characteristic. At least one organic EL element is formed on one surface of the first substrate. The organic EL element is composed of a transparent electrode, a hole transporting layer, an organic EL layer and a back electrode.

The second substrate may be disposed on the organic EL device, may be disposed on the first substrate, and may be bonded to the first substrate by the adhesive layer. As the second substrate, not only a glass substrate but also a substrate having excellent barrier properties such as a plastic sheet in which metal is laminated can be used.

A getter 6 for bonding the first substrate and the second substrate may be formed between the first substrate and the second substrate and on the side of the organic EL device.

Another aspect of the present invention relates to an adhesive composition for encapsulating an organic EL device.

The composition is present in a film state exhibiting fluidity at 25 ° C and is heated to 50-100 ° C to exhibit fluidity and tackiness so that the gap between the organic EL device formed on the first substrate and the second substrate can be sealed .

An organic EL device comprising a transparent electrode, a hole transport layer, an organic EL layer and a back electrode is formed on a first substrate, the composition of the present invention is thermally transferred onto the first substrate, and the second substrate is bonded while being heated. Alternatively, the composition of the present invention may be thermally transferred to the second substrate, and the first substrate on which the organic EL device is formed may be bonded while being heated.

More specifically, a transparent electrode is formed on the first substrate to a thickness of about 0.1 mu m. The transparent electrode may be formed by vacuum evaporation or sputtering. A hole transport layer and an organic EL layer are sequentially formed on the transparent electrode at a thickness of 0.05 mu m and a rear electrode is formed at a thickness of 0.1 to 0.3 mu m on the organic EL layer. The composition of the present invention is transferred onto a glass or film substrate after the film formation of the device is finished with a laminate or the like. At this time, when the composition of the present invention is transferred onto a release film to form a sheet, it can be easily transferred. Then, the second substrate is superposed on top of the transferred composition. This is heat-pressed using a vacuum laminator to preliminarily fix the lower first substrate and the upper second substrate. Then, the thermosetting resin is completely cured at a curing temperature, for example, 90 DEG C or less. It is also possible to transfer the composition to the second substrate first and to polymerize the first substrate on which the organic EL layer is formed.

The composition may have a shelf-life of at least 7 days at 25 ° C.

The thickness of the film or cured layer made of the composition is preferably from 1 to 100 mu m, more preferably from 10 to 50 mu m. It is possible to easily bond between two glasses or films within the above range.

The composition includes (A) an epoxy resin having a weight average molecular weight of 200-3000 g / mol and a softening point of 40-120 ° C., (B) a low molecular weight epoxy resin having a weight average molecular weight of 100-5,000 g / mol, and (C) film formation. Agent resin and (D) hardener. Details of the components (A) to (D) are as described above.

The epoxy resin having a weight average molecular weight of 200-3000 g / mol and a softening point of 40-120 ° C. may be included in an amount of 1-70 wt% based on the solids content of the composition. Within this range, good room temperature stability and film formability may be obtained. Preferably it may be included in 10-50% by weight, more preferably 10-35% by weight.

The low molecular weight epoxy resin may be included in 1-50% by weight based on solids of the composition. Within the above range, the film properties and film formability may be good. Preferably 5-35% by weight, more preferably 10-35% by weight.

The film former resin may be included in 20-80% by weight based on solids of the composition. Within this range, film formability is good and reliability is good. Preferably it may be included in 30-70% by weight, more preferably 30-50% by weight.

The curing agent may be included in 0.1-10% by weight based on solids of the composition. Within this range, film formability is good and reliability is good. Preferably 1-10% by weight, more preferably 1-5% by weight.

The composition may further include one or more selected from the group consisting of the silane coupling agent and the filler described above, and may further include one or more of the additives described above.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Specific specifications of the components used in the following examples and comparative examples are as follows.

(1) YDF-8170 (TOHTO) (epoxy equivalent 159 g / g-eq., Mw. 318 g / mol) was used as the low molecular weight epoxy resin.

(2) E-4275 (JER) (Mw. 74,000 g / mol), which is a high molecular weight epoxy resin, was used as the film-forming resin.

(3) YDCN500-7P (KUKDO) (O-cresol novolak epoxy, softening point 68 ° C) was used as an epoxy resin having a softening point of 40 to 120 ° C.

(4) As a curing agent, 2P4MZ (Shikoku) (2-phenyl-4-methylimidazole), which is a curing agent 1, and 2P4MHZ (Shikoku) (2-phenyl-4-methyl-5-hydoxymethylimidazole), which was a curing agent 2, were used.

(5) A plate-like filler D-1000 (Nippon talc) was used as the filler.

Example  1-4

The film-forming resin and the epoxy resin having a softening point of 40 to 120 ° C. were respectively dispersed in methyl ethyl ketone, and the solids were mixed in the amounts shown in Table 1 below. Then, the obtained solution was mixed and a low molecular weight epoxy resin, an imidazole compound, and a filler were added in the amounts shown in Table 1 below. And dispersed using a planetary mixer and a 3-roll mill. A coating film was formed with an applicator, followed by drying and laminating, thereby producing an adhesive layer having a thickness of 20 탆.

Comparative Example  One

In the above embodiment, a low molecular weight epoxy resin, a film former resin, an epoxy resin having a softening point of 40 to 120 ° C., and an imidazole compound were changed to the contents shown in Table 1, and the same method was performed to obtain a thickness of 20 μm. An adhesive layer was prepared.

Experimental Example : Evaluation of properties of adhesive layer

The adhesive layers prepared in the above Examples and Comparative Examples were used as samples and the physical properties thereof were evaluated.

≪ Method for measuring physical properties &

1) Moisture permeability: After heat curing at 90 ℃ for 2 hours, the film was 20㎛ thickness MOCON test using nitrogen gas as a carrier gas under 50 ℃, 100% relative humidity, 760mmHg pressure.

2) Room temperature fluidity: After the 20 20㎛ film was laminated to make a film 400㎛ thickness, it was measured by Parallel Plates type at 25 ℃ with ARES (Model name: TA G2) (frequency = 10 rad / s). The case where the storage modulus was 25,0000 dyne / cm 2 or less was evaluated as x, and when the storage elastic modulus was more than 25,0000 dyne / cm 2.

3) Coating state: It was confirmed whether the tack generation and flow of the produced film at 25 ℃. tack is a tack test of the surface of the film made to a thickness of 20 μm with TOPTAC 2000A of CHEMILAB. When the tack is less than 100gf or no flow at 25 ℃, ○, when the tack exceeds 100gf at 25 ℃ was evaluated as ×.

4) DSS (die shear strength) after curing: Laminated film (20um thickness of the prepared film on a 5mmx5mm glass substrate (adhesive conditions 120 ℃ 5kgf, 5 seconds) and cured for 2 hours at 100 ℃ DAGE 4000 (DAGE Co., Ltd.)) Die shear strength was measured.

5) Reliability Evaluation After DSS: Samples prepared in the same manner as in (4) above were maintained at 85 ° C. and 85% relative humidity for 24 hours, and then die shear strength was measured by DAGE 4000.

6) Dark spot generation: A device was fabricated by sequentially depositing a transparent electrode, a hole transport layer, an organic EL layer, and a back electrode on the glass substrate by sputtering. The produced film was transferred to a laminate, and a glass substrate was superimposed thereon, followed by heat compression. It cured at 100 degreeC for 2 hours. The manufactured device was turned on after maintaining for 24 hours at 85 ℃ and 85% relative humidity. When there was no dark spot, it evaluated as (triangle | delta), and (a) when a large quantity was found.

7) Possibility of film use: It was evaluated as ○ for the use of the organic EL element encapsulation, △ for the partial use, and × for the inability to use.

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Low molecular weight epoxy resin
(Parts by weight) 30 70 30 70 100 Film Formation Resin
(Parts by weight) 100 100 100 100 100 Epoxy Resin with Softening Point of 40 to 120 ℃
(Parts by weight) 70 30 70 30 - Hardener
(Parts by weight) Hardener 1 One One One One One Hardener 2 4 4 4 4 4 filler
(Parts by weight) - - 80 80 - Room temperature fluidity ○ ○ ○ ○ × Moisture permeability
(g / mm ² · day) 57 63 42 54 289 tack
(gf) 46 59 43 58 121 Coat state ○ ○ ○ ○ × After curing DSS (kgf) 84 85 82 85 81 DSS after reliability evaluation
(kgf) 69 67 67 68 64 Dark spots occur × × × × × Availability ○ ○ ○ ○ ×

As shown in Table 1, the film containing the epoxy resin having a softening point of 40-120 ℃ of the present invention compared to the composition does not contain an epoxy resin having a softening point of 40-120 ℃ has a low moisture permeability, a good film state and adhesion It turns out that this is good and the usability as a film is high.

Claims (14)

A first substrate on which an organic EL element is formed;
A second substrate spaced apart from the first substrate; And
Disposed between the first substrate and the second substrate to bond the first substrate and the second substrate, and cured at 90 ° C. for 2 hours, and then water vapor transmission rate at 50 ° C. and 100% relative humidity. , WVTR) of less than 100 g / m ² · day,
The adhesive layer has an epoxy resin having a weight average molecular weight of 200-3,000 g / mol and a softening point of 40-120 ° C., a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol, and a weight average molecular weight of 10,000-500,000 g / mol. formed of a composition comprising a high molecular weight epoxy resin which is mol,
Organic EL display device.
The organic EL display device according to claim 1, wherein the moisture transmittance is more than 0 and 63 g / m ² · day or less.
The organic EL display device according to claim 1, wherein the adhesive layer has a thickness of 10-50 µm after curing at 90 ° C for 2 hours.
delete The epoxy resin according to claim 1, wherein the epoxy resin having a weight average molecular weight of 200-3,000 g / mol and a softening point of 40-120 ° C. is a phenol novolak type epoxy resin, an o-cresol novolak type epoxy resin, or a dicyclopentadiene type epoxy An organic EL display device comprising at least one selected from the group consisting of a resin, a biphenyl type epoxy resin, a biphenyl novolak type epoxy resin and a naphthalene novolak type epoxy resin.
An organic EL display device according to claim 1, wherein the composition further comprises a curing agent.
delete The organic EL display device according to claim 6, wherein the curing agent includes an imidazole curing agent having a reaction initiation temperature of 60-100 ° C and an imidazole curing agent having a reaction initiation temperature of 100-160 ° C.
The epoxy resin of claim 1, wherein the weight average molecular weight is 200-3,000 g / mol and the softening point is 40-120 ° C., and the weight average molecular weight is 10 to 100 parts by weight of the high molecular weight epoxy resin having 10,000-500,000 g / mol. An organic EL display device, characterized by being included at -80 parts by weight.
The organic EL display device according to claim 1, wherein the low molecular weight epoxy resin is contained in an amount of 10 to 80 parts by weight based on 100 parts by weight of the high molecular weight epoxy resin having the weight average molecular weight of 10,000-500,000 g / mol.
The organic EL display device according to claim 1, wherein the composition further comprises at least one selected from the group consisting of a silane coupling agent, a filler, a leveling agent, an antifoaming agent, a storage stabilizer, a plasticizer and a talc adjusting agent.
(A) an epoxy resin having a weight average molecular weight of 200-3000 g / mol and a softening point of 40-120 ° C.,
(B) a low molecular weight epoxy resin having a weight average molecular weight of 50-5,000 g / mol, and
(C) Adhesive composition for sealing organic electroluminescent elements containing the high molecular weight epoxy resin whose weight average molecular weight is 10,000-500,000g / mol.
The adhesive composition for sealing an organic EL device according to claim 12, further comprising a curing agent,
In the adhesive composition for sealing the organic EL device
(A) the weight average molecular weight of 200-3000g / mol and the softening point of the epoxy resin is 40-120 ℃ 1-70% by weight,
The low molecular weight epoxy resin (B) having a weight average molecular weight of 50-5,000 g / mol is 1-50% by weight,
20-80% by weight of the high molecular weight epoxy resin (C) having a weight average molecular weight of 10,000-500,000 g / mol; And
The (D) hardener is 0.1-10% by weight
Adhesive composition for organic electroluminescent element sealing contained by.
The organic electroluminescent element display apparatus containing the adhesive composition for organic electroluminescent element sealing of Claim 12 or 13.

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