KR101336781B1 - Optical proximity sensor with ambient light sensor and method of making the same - Google Patents

Abstract

The present invention relates to an optical proximity sensor integrated with an ambient light sensor which improves the luminous efficiency of a light source, improves EMI characteristics, and reduces manufacturing costs. The sensor according to the present invention comprises a housing metal plate with an integrated reflector, a PCB substrate, and an IR LED chip. The housing metal plate with an integrated reflector includes a reverse cone shaped hole whose top is truncated and which forms the side wall of a first cavity in which the IR LED chip is installed and a cone shaped hole whose top is truncated and which forms the side wall of a second cavity, wherein the reflector is formed by making the surface profile of the side wall of the first cavity which reflects the light in order to be a mirror surface. The PCB substrate is one side of the first and second cavities by being connected to the metal plate, and includes a circuit pattern which is electrically connected to each element which is placed on the bottoms of the first and second cavities and mounted on the substrate. The IR LED chip is mounted on the PCB substrate which is the bottom of the first cavity formed by the metal plate and the PCB substrate, and emits infrared rays when power is supplied. The sensor according to the present invention is an ASIC chip with an integrated photo sensor which includes: the cone shaped hole whose top is truncated; the second cavity which is formed by connecting the PCB substrate and the metal plate; the IR LED chip which is installed on the PCB which is the bottom of the second cavity, and operates when power is supplied; and a photo sensor which performs proximity detection by receiving the infrared rays reflected off an object and detects the brightness of ambient light, wherein the diameter of the truncated top is smaller than the diameter of the other end which is an opening of the metal plate.

Description

OPTICAL PROXIMITY SENSOR WITH AMBIENT LIGHT SENSOR AND METHOD OF MAKING THE SAME

The present invention relates to a near-intensity sensor that integrally implements an illuminance sensor and proximity sensor function, and more specifically, an optical near-illuminance sensor capable of increasing light efficiency of a light source, improving EMI shielding properties, and reducing manufacturing cost. It's about how.

In general, a proximity sensor is a sensor that detects the approach of an object without physical contact, and according to the detection principle, a magnetic proximity sensor, an ultrasonic proximity sensor, an electrostatic proximity sensor, an inductive proximity sensor, an optical proximity sensor, etc. It is separated by. An optical proximity sensor is composed of a light emitting element that generates light and a light receiving element that senses light. An infrared light emitting diode (IR LED) is mainly used as the light emitting element, and a photo transistor or photo diode is used as the light receiving element. Is used.

On the other hand, the illuminance sensor is for detecting the brightness felt by the human eye, and consists of a light receiving element that senses a visible light region. Therefore, since the optical proximity sensor and the illuminance sensor have similar parts, a small-scale electronic product that requires both the illuminance sensor and the proximity sensor at the same time, for example, a smart phone, etc., tends to use an illuminance sensor that integrally implements the illuminance sensor and proximity sensor. .

In the light intensity sensor, a light emitting unit and a light receiving unit are usually implemented as one assembly, and the light emitting unit emits infrared rays, and the light receiving unit senses infrared rays of the light emitting units reflected from the object and detects an infrared light receiving unit and surrounding visible light for detecting proximity It consists of a visible light receiver for detecting the illuminance.

1 is a first example of a conventional proximity sensor 10 disclosed in Korean Patent Office Publication No. 10-2012-0087368, the proximity sensor 10 of the first example is an infrared light emitting device on the printed circuit board 11 The first lens unit 15 and the second lens unit 16 while forming the light-transmitting sealing unit 14 by mold injection molding an epoxy sealing material 12 and a light-receiving element 13 are disposed and capable of transmitting infrared rays ) Is formed. Then, after forming transverse grooves in the light-transmissive sealing part 14 with cutting equipment or cutting tools, the light-shielding sealing material is filled to form the light-shielding sealing parts 17 and 18. The proximity sensor 10 of the first conventional example has a problem that requires an additional configuration to prevent light leakage using an injection molded lens.

2A and 2B are a second example of a conventional proximity sensor disclosed in Korean Patent Office Publication No. 10-2011-0134326, and the proximity sensor 20 of the second example is on one printed circuit board 22. After forming the first cup 24 and the second cup 26, the electromagnetic wave transmitter is operatively placed in the first cup 24, the electromagnetic wave receiver is operatively placed in the second cup 26, and then sealed. It was prepared by sealing. However, the proximity sensor 20 of the second conventional example is difficult to form a non-penetrating groove in order to form a reflector on the single-layer PCB plate 22, and even if the method is used, the yield is poor and the economy is insufficient. There is this. In addition, the configuration of FIG. 2A is insufficient in the implementation of the function or performance, so it is necessary to form the lenses 28 and 29 through the molding process as shown in FIG. 2B, and there is a problem in that a basic function can be realized only when a separate sealing material is added. Since the mounting of the device and wire bonding must be performed inside the (24,26), the process is difficult, and the structure is complicated, so the manufacturing process is complicated, and accordingly, the manufacturing cost increases.

Conventional roughness sensor uses an injection molded lens to increase the light efficiency of the light source to secure a certain distance at which the proximity of an object is detected, but additional measures such as a separate sealing material are used to prevent leakage of light. It is necessary, and the method of forming a reflector on a single-layer PCB sheet material is also difficult to form a uniformly shaped non-penetrating hole in the sheet material, and thus the yield is remarkably lowered, resulting in insufficient realism. There is a problem that reliability is low and cost is increased by using an expensive ceramic substrate.

The present invention has been proposed to solve the above problems, and the object of the present invention is to form a reflector accurately and simply by processing a through hole in the metal plate, and this metal plate serves as a housing for protecting the device to be accommodated. It is also possible to provide a simple optical structure, thereby improving the light efficiency of the light source, improving the EMI shielding properties, and improving the process to provide an optical roughness sensor and a manufacturing method that can reduce manufacturing cost.

In order to achieve the above object, the sensor of the present invention is formed with a truncated conical hole constituting the side wall of the first cavity for mounting the IR LED chip and a truncated conical hole constituting the side wall of the second cavity. And a reflector-integrated housing metal plate formed such that the sidewalls of the first cavity have a roughness of the surface so as to reflect well, and thus become a mirror surface; PCB formed with a circuit pattern so as to be bonded to the metal plate to form a first cavity and a second cavity, and to mount elements accommodated in the bottom surface of the first cavity and the bottom surface of the second cavity, respectively, and to connect for electrical connection. Board; An IR LED chip mounted on the PCB substrate of the bottom surface of the first cavity formed by the metal plate and the PCB substrate, and emitting infrared rays when power is supplied; A hole having a diameter smaller than the diameter of the lower end serving as an opening in the metal plate is formed in a conical shape with a truncated cone, and is joined to the PCB substrate to form a second cavity, and mounted on the PCB substrate of the bottom surface of the second cavity A photo sensor integrated ASIC chip that drives the IR LED chip when power is supplied, detects proximity by receiving infrared light reflected from an object, and detects the illuminance of visible light around; An opening formed at an end of an inverted conical hole in which a tap processed in the metal plate is cut in order to emit light of the IR LED chip in the first cavity; And an opening formed at an end of a conical hole in which a tap processed in the metal plate is cut in order to introduce light from the second cavity to the light-receiving side of the ASIC chip.

In order to achieve the above object, the method of the present invention comprises: preparing a metal plate and forming a first cavity hole for mounting an IR LED chip and a second cavity hole for mounting an optical sensor-integrated ASIC chip; After preparing the PCB substrate, processing the through-hole after plating the copper foil, and forming a pad for connection with the outside to mount the LED chip in the first cavity hole region of the PCB substrate and integrated optical sensor in the second cavity hole region of the PCB substrate. Wire bonding by mounting the ASIC chip; Combining the metal plate and the PCB substrate to complete an assembly; And attaching the upper cap as needed.

The roughness sensor according to the present invention can easily form a reflector by processing a through-hole in a metal plate, thereby improving the light efficiency of the light source and improving EMI characteristics, and the metal plate serves as a housing for protecting the device being accommodated. Also, since the structure is simplified, the process can be improved and manufacturing costs can be reduced. In addition, the roughness sensor according to the present invention can use any one of plastic, rubber, silicone, foam, sponge, resin, and metal as the upper cap, and in the case of rubber, silicone, foam, and sponge, the adhesion to the mechanism is improved and impact is prevented. There is an additional effect of preventing the parts from being destroyed.

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1 is a schematic diagram showing a first example of a conventional light intensity sensor,
2A and 2B are schematic diagrams showing a second example of a conventional roughness sensor,
Figure 3 is a flow chart showing the manufacturing procedure of the light intensity sensor according to the present invention,
Figure 4 is a side cross-sectional view of the optical roughness sensor according to the first embodiment of the present invention,
Figure 5 is a perspective view of the metal plate shown in Figure 4,
6 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention,
7 is a side sectional view of an optical roughness sensor according to a third embodiment of the present invention,
8 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention,
9 is a block diagram of an optical roughness sensor according to the present invention.

The technical problems achieved by the present invention and the practice of the present invention will be made clear by preferred embodiments of the present invention described below. The following examples are only illustrated to illustrate the present invention, and are not intended to limit the scope of the present invention.

Figure 3 is a schematic diagram showing the manufacturing procedure of the roughness sensor according to the present invention.

The manufacturing procedure of the roughness sensor according to the present invention is as shown in FIG. 3, after preparing the square metal plate and preparing the holes for the mounting space (S1, S2) and after preparing the square PCB substrate This is a wire bonding by forming a copper foil layer, processing through holes after gold plating, and forming pads for connection with the outside to mount LED chips on a part of the bottom surface of the PCB board and ASIC on other parts of the bottom surface of the PCB board. It consists of 2 sub-assembly processes (S3~S8), and a main assembly process (S9, S10) of attaching the upper cap (cover) after completing the assembly by combining the metal plate and the PCB substrate.

Referring to FIG. 3, in the first sub-assembly process of the embodiment according to the present invention, after preparing a square metal plate, a through hole having a predetermined shape is formed in the metal plate to form a side wall of the cavity for mounting the IR LED chip and the ASIC chip. . For example, the shape of a through hole for a cavity may be a truncated cone or a truncated inverted cone, a cylindrical shape, a truncated elliptical cone, a truncated inverted cone, a truncated square pyramid, a truncated square pyramid, an elliptical prism, a square prism, Alternatively, various shapes such as a double-coupling type of the above type (for example, a circular column on a square column) are possible. In particular, the side wall of the metal plate cavity in which the IR LED chip is accommodated is a mirror surface when forming a through hole to form a reflector. The metal plate in which the cavity is formed as described above has an advantage of simplifying the structure by integrating the reflector and the housing by also serving as a reflector as well as a housing for housing the element. Meanwhile, although not illustrated in the manufacturing procedure of FIG. 3, through holes may be formed in the metal plate during the first sub-assembly process, and then metal such as gold may be coated to further increase the reflectance of the reflector to increase light efficiency.

In addition, in the second sub-assembly process of the embodiment according to the present invention, after preparing a rectangular FR-4 PCB substrate, gold is coated on the copper foil area to form the bottom surface of the mounting space, and a through-hole is processed to form a pad. Then, the IR LED chip is mounted on the first cavity position, the ASIC chip is mounted on the second cavity position, and wire bonding is performed.

Then, the metal plate and the PCB substrate are joined to complete an assembly having a first cavity for accommodating an IR LED chip and a second cavity for accommodating an ASIC chip. In addition, a cap can be attached to the top of the metal plate as needed. The upper cap can be made of plastic, silicone, rubber, foam, sponge, resin, and metal, and in the case of rubber, silicone, foam, and sponge, it has the additional effect of improving mechanical adhesion. Can be obtained.

As described above, in the present invention, the manufacturing cost can be reduced by easily forming a hole by using a processing technique on the metal plate, and the light intensity sensor according to the present invention has the light efficiency as the reflector structure itself integrated in the housing metal plate for protecting the accommodated device. Since it can be increased, light can be quickly accumulated even at a small amount of light, thereby reducing the integration time to speed up the reaction speed, and coating a metal such as gold on the metal plate to improve light efficiency.
4 is a side sectional view of an optical roughness sensor according to a first embodiment of the present invention, and FIG. 5 is a perspective view of a metal plate 110 used in the first embodiment of the present invention.

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The optical roughness sensor 100 according to the present invention, as shown in Figures 4 and 5, the tip of the side wall 114a constituting the first cavity 112 for mounting the IR LED chip 140 is cut off A conical hole (hereinafter simply referred to as an'inverted cone' in the following description) and a truncated conical hole constituting the side wall 114b of the second cavity 118 (hereinafter simply referred to as a'conical hole') are formed. In particular, the side wall 114a constituting the first cavity has a roughness of the surface so as to reflect well, and the square metal plate 110 is formed to be a mirror surface, and the metal plate 110 is joined to the first cavity 112 and the second Forming the cavity 118, the IR LED chip 140 and the optical sensor integrated ASIC chip 150 are mounted on the bottom surfaces of the first cavity 112 and the second cavity 118, respectively, and connected for electrical connection. It is mounted on the PCB substrate of the bottom surface of the first cavity 112 formed by the metal plate 110 and the PCB substrate 120, the square PCB substrate 120 is formed so that the circuit pattern, and when the power is supplied to the infrared The IR LED chip 140 to emit, and a hole formed in a conical shape having a diameter smaller than the diameter of the lower end serving as an opening in the metal plate are formed, and the second cavity 118 is connected to the PCB substrate 120. Formed, mounted on a PCB substrate on the bottom of the second cavity, when powered, drives the IR LED 140, receives infrared rays reflected from an object, detects proximity, and detects the illuminance of nearby visible light (photo sensor) An integrated ASIC chip 150, an opening 112a formed at an end of an inverted conical hole processed in a metal plate to emit light of the IR LED 140 in the first cavity 112, and in the second cavity It consists of an opening (118a) formed at the end of a conical hole processed in a metal plate to introduce light to the light-receiving side of the ASIC chip. Here, the IR LED chip 140 and the ASIC 150 are bonded to the PCB substrate 120 through an adhesive 162.

Referring to FIGS. 4 and 5, the metal plate 110 of the first embodiment has a first cavity hole 112 formed in an inverted cone shape in which the diameter of the end serving as the opening 112a is larger than the diameter of the lower portion, A second cavity hole 118 is formed in a cone shape in which the diameter of the end serving as the opening 118a is smaller than the diameter of the lower portion. In particular, the sidewall 114a constituting the first cavity 112 is reflected. It is formed so that it has a roughness of the surface so as to be good and becomes a mirror surface.

In addition, the metal plate 110 of the first embodiment forms an inverted cone-shaped reflector in the first cavity 112 to efficiently emit light emitted from the IR LED 140 toward the opening 112a, and the second cavity ( 118) consists of a hole formed in the metal plate 110 and a metal layer formed on the PCB substrate 120 that is bonded to the metal plate, so that a device accommodated in the second cavity 118 can be shielded significantly from electromagnetic noise. And in order to emit light of the IR LED 140 from the first cavity 112, an opening 112a is formed at the end of an inverted conical hole processed in the metal plate 110, and the ASIC chip ( An opening 118a is formed at an end of a conical hole processed in the metal plate 110 in order to introduce light toward the light-receiving portion of 150).

As described above, the roughness sensor 100 according to the first embodiment of the present invention has a diameter of an end portion serving as an opening 112a of the first cavity 112 in the housing metal plate 110 for protecting an element to be accommodated. While forming a hole in the form of an inverted cone larger than the diameter of the lower portion, the side wall 114a having a diagonal shape is processed to have a mirror surface. Then, after forming a copper foil layer 122a on the upper surface of the PCB substrate 120, gold plating is performed, the IR LED 140 is mounted thereon, and then combined with the metal plate 110 to form a kind of stem structure having a reflector shape. Constituting the first cavity. Since the light emitted from the IR LED 140 of the first cavity 112 configured as described above is reflected by an inverted cone-shaped reflector, there is an advantage of efficiently passing the emitted light through an opening (Apature) 112a on the top of the metal plate. .

In addition, the light-receiving unit for detecting the light that is emitted from the first cavity (C1) is reflected by the object is introduced into the metal plate 110 in the form of a cone having a diameter of the end portion serving as an opening 118a smaller than the diameter of the lower portion After forming the sidewall 114b of the hole and forming the copper foil layer 122b on the upper surface of the PCB substrate 120, gold plating is performed, the ASIC chip 150 is mounted thereon, and the second cavity is combined with the metal plate 110. (118). The second cavity 118 constructed as described above has the advantage that the ASIC chip 150 is significantly shielded with sidewalls and metal at the bottom to improve EMI shielding properties even in a strong electromagnetic noise environment.

In addition, since the first cavity and the second cavity are made of metal, light emitted from the IR LED 140 can be prevented from leaking to the photosensor of the ASIC chip 150 and causing cross talk.

In the present invention, the material of the metal plate 110 uses a conventional metal, and the PCB substrate 120 uses a material used for the PCB, for example, FR-4.

6 is a side cross-sectional view of an optical roughness sensor according to a second embodiment of the present invention.

The optical roughness sensor 200 according to the second embodiment of the present invention, as shown in Figure 6, and the inverted conical hole constituting the side wall of the first cavity 212 for mounting the IR LED chip 240 A square metal plate 210 having a cylindrical hole constituting the sidewall of the second cavity 218 and the metal plate 210 are joined to form the first cavity 212 and the second cavity 218, and the first cavity A square PCB board 220 having a circuit pattern formed to mount the IR LED chip 240 and the optical sensor integrated ASIC chip 250 on the bottom surfaces of the 212 and the second cavity 218, respectively, and to make wiring for electrical connection. ), is mounted on the PCB substrate of the bottom surface of the first cavity formed by the metal plate 210 and the PCB substrate 220, the IR LED chip 240 that emits infrared rays when power is supplied, and the metal plate 210 When mounted and powered on the PCB substrate of the bottom surface of the second cavity formed by the PCB substrate 220, the IR LED chip 240 is driven and the infrared rays reflected from the object are received to detect proximity and detect surroundings. It is composed of an ASIC chip 250 integrated with a light sensor that detects the illuminance of visible light. That is, in the optical roughness sensor 200 of the second embodiment, the metal plate 210 accommodates the conical sidewall 214a and the ASIC chip 250 of the first cavity 212 for accommodating the IR LED chip 240. A hole for the side wall 214b of the second cavity 218 for forming is formed, and the IR LED 240 on the PCB substrate 220 of the bottom surface 222a of the first cavity 212 is formed on the PCB substrate 220. The ASIC chip 250 is mounted on the PCB substrate 220 of the bottom surface 222b of the second cavity 218. Then, in order to emit light of the IR LED chip 240 from the first cavity 212, light is drawn from the end of the inverted conical hole processed in the metal plate 210 to the light receiving portion of the ASIC chip 250 from the second cavity 218. In order to do this, openings 212a and 218a are formed at the ends of the cylindrical holes processed in the metal plate 210, respectively.

Referring to FIG. 6, in the roughness sensor 200 according to the second embodiment of the present invention, the diameter of the end portion serving as the opening 212a in the housing metal plate 210 for protecting the accommodated element has a lower diameter. While forming a hole in the form of a larger inverted cone, the side wall 214a having a diagonal shape is processed to have a mirror surface, and after forming a copper foil layer 222a on the upper surface of the PCB substrate 220, gold plating is performed and IR LED ( After mounting 240), the first cavity 212 is configured as a kind of stem structure having a reflector shape in combination with the metal plate 210. Since the light emitted from the IR LED 240 of the first cavity configured as described above is reflected by an inverted cone-shaped reflector, there is an advantage of efficiently passing the emitted light through the opening (Apature) 212a on the top of the metal plate.

In addition, the light receiving unit for detecting the light that is emitted by the light emitted from the first cavity 212 is reflected on the object is processed into a hole on the metal plate 210 as a second wall for mounting the ASIC 250 including the processor. After forming the side wall 214b of the cavity 218, and forming a copper foil layer 222b in the central portion of the upper surface of the PCB substrate 220, gold plating is performed and the ASIC chip 250 is mounted thereon, and then the metal plate 210 ) To form the second cavity 218. The second cavity 218 configured as described above has the advantage that the ASIC chip 250 is significantly shielded with sidewalls and metal at the bottom to improve EMI shielding properties even in a strong electromagnetic noise environment.

In addition, since the first cavity and the second cavity are made of metal, light emitted from the IR LED 240 can be prevented from leaking to the photo sensor of the ASIC chip 250 and causing cross talk.

7 is a side cross-sectional view of an optical roughness sensor according to a third embodiment of the present invention.

In the roughness sensor 300 according to the third embodiment of the present invention, an inverted cone hole 312 constituting a sidewall of the first cavity 312 for mounting the IR LED chip 340 is formed, and the inverse cone type A square metal plate 310 formed to have a mirror surface with a roughness of the surface so that the sidewall 314a of the hole is well reflected, and is joined to the metal plate 310 to form a first cavity 312, and the bottom surface of the first cavity A square PCB substrate 320 with a circuit pattern formed to mount the IR LED chip 340 at 322 and connect for electrical connection, and a first cavity formed by the metal plate 310 and the PCB substrate 320 ( 312) is mounted on the PCB substrate 320 of the bottom surface, the IR LED 240 to emit infrared light when power is supplied, and the metal plate 210 has a hole in a cone shape with a diameter smaller than the diameter of the bottom ( 314b) and bonded to the PCB substrate 320 to form a second cavity 318, mounted on the PCB substrate 310 of the bottom surface of the second cavity 318 to supply the IR LED 340 when power is supplied. In addition to the driving box, the infrared light reflected from the object is detected to detect proximity, and the light sensor (photo sensor) integrated ASIC chip 350 that senses the illuminance of the visible light around it and the metal plate 310 are combined with the IR LED 340. An opening 332 for emitting light of the IR LED 340 is formed on the first cavity 312 on which is mounted, and for introducing light to the light receiving portion of the ASIC chip 350 on the second cavity 318. It is composed of an upper cap 330 in which the opening 332 is formed.

Referring to FIG. 7, the near-intensity sensor 300 according to the third embodiment of the present invention is combined with a housing metal plate 310 protecting an element accommodated in the configuration of the invention described in the first embodiment, and the IR LED ( An opening 332 for emitting light of the IR LED 340 is formed on the first cavity 312 on which the 340 is mounted, and light is drawn into the light receiving portion of the ASIC chip 350 on the second cavity 318. The upper cap 330 having an opening 332 for forming is additionally configured.

When the additional upper cap 330 is configured as described above, in the mobile phone to which the product of the first embodiment is applied, it is sometimes necessary to separately match the optical and mechanical shapes of light emission and input, and in the present invention, changes to other parts There is an advantage that it is possible to easily adjust the distance or aperture between the openings of the upper cap 330 without application and facilitate the optical mechanical matching.

The upper cap 330 may be made of plastic, rubber, silicone, foam, sponge, resin, and metal, and in the case of silicone, rubber, foam, and sponge, device adhesion An additional effect can be obtained.

8 is a side cross-sectional view of an optical roughness sensor according to a fourth embodiment of the present invention.

The optical roughness sensor 400 according to the fourth embodiment of the present invention, as shown in FIG. 8, is coupled to a housing square metal plate 410 protecting a device accommodated in the configuration of the invention described in the second embodiment The opening 432 for emitting light of the IR LED 440 is formed on the first cavity 412 where the IR LED 440 is mounted, and the light receiving unit of the ASIC chip 450 is disposed on the second cavity 418. It is a further configuration of a square upper cap 430 having an opening 432 for introducing light to the side. When the additional upper cap 430 is configured as described above, it is sometimes necessary to separately match optical and mechanical shapes of light emission and input in a mobile phone to which the product of the second embodiment is applied. In the present invention, other components are changed. There is an advantage in that it is possible to easily adjust the distance or aperture between the openings of the upper cap 430 without any object and facilitate optical mechanical matching.

The upper cap 430 may be made of plastic, rubber, silicone, foam, sponge, resin, and metal, and in the case of silicone, rubber, foam, and sponge, device adhesion An additional effect can be obtained.

4 to 8, ASIC chip (150 ~ 450) and IR LED (140 ~ 440) are connected via copper foil pattern or wiring bonding of the PCB, not shown, holes or via holes (124 ~ 424) It is connected to the connection terminals 126-1 to 126-5 formed on the bottom surface of the PCB substrates 120 to 420 to form an electrical circuit. The PCB substrates 120 to 420 have a structure in which a copper foil layer is formed on the FR-4 substrate. In addition, for the protection of ASIC chips, LEDs, and wires, encapsulation is performed with resin, epoxy, silicone, etc.

9 is a block diagram of an optical roughness sensor according to the present invention.

As shown in FIG. 9, the near-intensity sensor according to the present invention includes an infrared light emitting diode (IR LED) 140 that emits infrared rays, an infrared detection unit 151 for receiving infrared rays reflected from an object, and infrared detection An analog-to-digital converter 152 that converts the analog detection signal of the unit 151 into digital, an illumination detection unit 153 for detecting the illumination of the surrounding visible light, and an analog detection signal of the illumination detection unit to digital The analog-to-digital converter 154, the digital signal processing unit 155 for processing the digitally converted detection signal to calculate proximity and illuminance, and the sensed data of the digital signal processing unit communicate with the outside through a predetermined communication method and IR LED It consists of an interface and a control unit 156 for controlling the driving unit 157, and an IR LED driving unit 157 for driving the infrared light emitting diode 140. Here, the IR sensing unit 151, the ADCs 152 and 154, the illumination detection unit 153, the DSP 155, the interface and control unit 156, and the IR LED driving unit 157 are implemented with an ASIC chip 150. Preferably, the interface and the controller 156 communicate with the external controller 42 in an I ² C interface manner.

Referring to FIG. 9, the IR detector 151 is an infrared photodiode for detecting proximity, and the illuminance detector 153 is a photodiode for detecting the illuminance of visible light around it, and an interface and a controller 156. The controller 42 exchanges data through the interrupt line (INTB), SCL line, and SDA line.

In the above, the present invention has been described with reference to one embodiment shown in the drawings, but those of ordinary skill in the art will understand that various modifications and other equivalent embodiments are possible therefrom.

110,210,310,410: metal plate 112,212,312,412: first cavity
118,218,318,418: Second cavity 120,220,320,420: PCB board
330,430: upper cap 140,240,340,440: IR LED chip
150,250,350,450: ASIC chip

Claims (9)

An inverted conical hole constituting the side wall of the first cavity for mounting the IR LED chip and a conical hole in which the apex constituting the side wall of the second cavity are cut are formed, and the end of the inverted conical hole where the tap is cut off and the conical shape in which the tap is cut off Openings are respectively formed at the ends of the holes, and the reflector-integrated housing metal plate is formed so that the sidewalls of the first cavity have a roughness of the surface so as to reflect well;
PCB formed with a circuit pattern so as to be bonded to the metal plate to form a first cavity and a second cavity, and to mount elements accommodated in the bottom surface of the first cavity and the bottom surface of the second cavity, respectively, and to connect for electrical connection. Board;
An IR LED chip mounted on the PCB substrate of the bottom surface of the first cavity formed by the metal plate and the PCB substrate, and emitting infrared rays when power is supplied; And
A hole having a diameter smaller than the diameter of the lower end serving as an opening in the metal plate forms a hole in a truncated cone shape and is joined to the PCB substrate to form a second cavity, and mounted on the PCB substrate of the bottom surface of the second cavity When power is supplied, the IR LED chip is driven, and the infrared light reflected from the object is received to detect proximity, and a light sensor (photo sensor) integrated ASIC chip that detects the illuminance of the surrounding visible light. Optical roughness sensor. The method of claim 1, wherein the optical roughness sensor
An opening for emitting light of the IR LED is formed on the first cavity in which the IR LED chip is mounted in combination with the metal plate, and an upper cap having an opening for introducing light to the light receiving portion of the ASIC chip is formed on the second cavity. Optical nearness sensor, characterized in that it further comprises. An inverted cone-shaped hole constituting the sidewall of the first cavity for mounting the IR LED chip and a cylindrical hole constituting the sidewall of the second cavity are formed, and the sidewall of the first cavity is well reflected. A reflector-integrated housing metal plate formed to have a mirror surface with roughness;
A PCB with a circuit pattern formed to be bonded to the metal plate to form a first cavity and a second cavity, and to mount elements accommodated in the bottom surface of the first cavity and the bottom surface of the second cavity, respectively, and to connect for electrical connection. Board;
An IR LED chip mounted on the PCB substrate of the bottom surface of the first cavity formed by the metal plate and the PCB substrate, and emitting infrared rays when power is supplied;
When the power is supplied by being mounted on the PCB substrate of the bottom surface of the second cavity formed by the metal plate and the PCB substrate, the IR LED chip is driven, and the infrared ray reflected from the object is received to detect proximity and detect the surrounding visible light. ASIC chip integrated with an optical sensor for sensing illuminance;
An opening formed at an end of an inverted cone-shaped hole cut by a metal plate to emit light from the IR LED chip in the first cavity; And
Optical luminosity sensor, characterized in that it consists of an opening formed at the end of a cylindrical hole processed in a metal plate to draw light from the second cavity toward the light-receiving portion of the ASIC chip. The method of claim 3, wherein the optical roughness sensor
An opening for emitting light of the IR LED is formed on the first cavity in which the IR LED chip is mounted in combination with the metal plate, and an upper cap having an opening for introducing light to the light receiving portion of the ASIC chip is formed on the second cavity. Optical nearness sensor, characterized in that it further comprises. The shape of the first cavity or the second cavity formed in the metal plate according to claim 1 or 3,
A truncated cone or a truncated inverted cone, a cylinder, a truncated elliptical cone, a truncated inverted cone, a truncated square pyramid, a truncated inverted pyramid, an elliptical column, a rectangular prism, or a double combination of the above. Optical roughness sensor, characterized in that one. According to claim 1 or 3, wherein the reflector-integrated housing metal plate is
Optical roughness sensor, characterized in that the gold plated to further improve the reflectivity of the side wall of the first cavity. delete The method according to claim 2 or 4, wherein the upper cap
Plastic or rubber, silicone, foam, sponge, resin, made of any one of metal, rubber, silicone, foam, sponge, the optical roughness sensor characterized in that the mechanical adhesion is improved. After preparing the metal plate, forming a first cavity hole for mounting an IR LED chip and a second cavity hole for mounting an optical sensor-integrated ASIC chip;
After preparing the PCB substrate, processing the through-hole after plating the copper foil, and forming a pad for connection with the outside to mount the LED chip in the first cavity hole region of the PCB substrate and integrated optical sensor in the second cavity hole region of the PCB substrate. Wire bonding by mounting the ASIC chip;
Combining the metal plate and the PCB substrate to complete an assembly; And
Method for manufacturing an optical roughness sensor, characterized in that comprises a step of attaching the upper cap.

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