KR101328589B1 - Multi-source and apparatus for depositing thin films using the same - Google Patents

Abstract

The present invention relates to a multiple evaporation source and a thin film forming apparatus using the same, and more specifically, to evaporate two or more evaporation materials and to be deposited by spraying on a substrate, the multiple evaporation source and using the same to improve the deposition efficiency It is to provide a thin film forming apparatus.

Description

MULTI-SOURCE AND APPARATUS FOR DEPOSITING THIN FILMS USING THE SAME}

The present invention relates to a multiple evaporation source and a thin film forming apparatus using the same, and more specifically, to evaporate two or more evaporation materials and to be deposited by spraying on a substrate, the multiple evaporation source and using the same to improve the deposition efficiency It is to provide a thin film forming apparatus.

In a conventional vacuum deposition apparatus, vaporized evaporated materials in a crucible are radially dispersed. Therefore, it is not easy to deposit only in the position to be deposited, the deposition material is attached to the inner wall of the chamber as well as the substrate has a problem that a considerable amount of evaporation material is wasted.

In addition, since the heating part is heated to a temperature higher than the vaporization temperature to heat the evaporation material charged in the crucible to the vaporization temperature, a large distance is required between the substrate and the evaporation source because a large amount of radiant heat is emitted from the evaporation source. There was a problem that the ratio becomes even lower. In particular, when the evaporation material is a compound, the vaporization temperature is high, the above problem becomes more serious.

On the other hand, in order to increase productivity, substrates, especially glass substrates, are being enlarged. However, if a thin film is formed by mounting an evaporation source on the lower side and installing the substrate on the upper side in a conventional manner, the substrate may not only bend downward, In the case of additional coating and processing on the substrate, most of the reaction materials come from the top to the bottom, so the process of overturning the large substrate is required.

In order to overcome the above problems, a top-down evaporation apparatus has been developed, but since the gas phase movement path including the nozzle must be maintained at a high temperature, power consumption is high and the equipment has a problem of being complicated.

An object of the present invention for solving the above problems is to vaporize two or more evaporation materials at the same time and to be deposited by spraying downward on the substrate, it is possible to reduce the power consumption, improve the deposition efficiency and simplify the configuration of the device It is to provide a multiple evaporation source and a thin film forming apparatus using the same.

Multiple evaporation source of the present invention for achieving the above object is a crucible having two or more filling space therein to accommodate the evaporation material; A charging pipe installed through the side or the top of the crucible to supply the evaporation material and the transfer gas into each of the filling spaces of the crucible; Heating means for vaporizing the evaporated materials filled in the respective filling spaces of the crucible; At least two outlets formed below the crucible so as to inject the respective evaporated substances vaporized inside the crucible by the heating means downward; And isolating means for isolating the vaporized material or vaporized vapors filled in the respective filling spaces from being mixed with each other until the vaporized vapors pass through the respective outlets.

Here, the crucible may be made of carbon or silicon carbide, and the heating means may include a power supply for applying power to the crucible so as to heat the evaporation material to self-heating of the crucible.

In addition, it is preferable to discharge the vapor of the different evaporation material from the discharge port adjacent to each other.

In addition, it further comprises a membrane (membrane) covering the outlet, the membrane (membrane) may be made of carbon fiber.

Another thin film forming apparatus using a multi-evaporation source of the present invention is connected to the evaporation material storage for storing the evaporation material is supplied through the charging pipe to the filling space of the crucible; A gate valve provided in the charging pipe to adjust a supply amount of the evaporation material supplied from the evaporation material reservoir to the filling space of the crucible; And substrate transport means for transporting and supplying the substrate adjacent to the lower side of the crucible in which the discharge port is formed.

In addition, the thin film forming apparatus using the multiple evaporation source may further include a cooling means for cooling the charging pipe.

The gas supply pipe may further include a gas supply pipe connected to the charging pipe to supply a transport gas into the crucible.

The greatest effect of the multiple evaporation source of the present invention and the thin film forming apparatus using the same is expressed in the deposition process of a compound having a high vaporization temperature. Instead of using the compound as an evaporation material, an element having a low vaporization temperature constituting the compound is evaporated. By lowering the temperature of the evaporation source to use, not only can reduce power consumption, but also has the effect of improving the deposition density and deposition efficiency by reducing the distance between the substrate and the evaporation source.

In addition, the membrane covering the outlet port can block the inflow of air from the outside of the crucible to suppress deterioration such as oxidation of the evaporation material charged inside the crucible and to control the excessive discharge of vaporized evaporation material through the outlet. can do.

In addition, according to the multiple evaporation source of the present invention and the thin film forming apparatus using the same, by performing the top-down deposition to vaporize the vaporized evaporation material is deposited, there is an effect that can improve the process efficiency compared to the conventional bottom-up deposition.

In addition, according to the multiple evaporation source of the present invention and the thin film forming apparatus using the same, the configuration of the apparatus by forming the crucible of carbon and silicon carbide material to self-heat the heat required to vaporize the evaporated material by the power supplied through the power supply Has the effect of simplifying

1 is a plan view of a thin film forming apparatus using a multiple evaporation source according to an embodiment of the present invention.
FIG. 2 is a front sectional view of the thin film forming apparatus using the multiple evaporation source cut along the line II-II of FIG. 1.
3 is a side cross-sectional view of the thin film forming apparatus using the multiple evaporation source cut along the line III-III of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a thin film forming apparatus using a multiple evaporation source according to an embodiment of the present invention, Figure 2 is a front sectional view of the thin film forming apparatus using a multiple evaporation source cut along the line II-II of Figure 1, Figure 3 Is a side cross-sectional view of the thin film forming apparatus using the multiple evaporation source cut along the line III-III of FIG.

1 to 3, the thin film forming apparatus 1 using the multiple evaporation sources of the present embodiment includes a multiple evaporation source 10, a substrate transfer means 30, an evaporation material reservoir, a gate valve, a cooling means, and a transfer gas. It comprises a supply pipe.

Here, the above-mentioned evaporation material reservoir, the transfer gas supply pipe, the cooling means, and the heating means of the multiple evaporation source described later are not separately shown in FIGS. 1 to 3.

The multiple evaporation source 10 comprises a crucible 11, a charging pipe 14, 15, a heating means, an outlet 19 and an isolation means 18.

The crucible 11 has a box shape in which two filling spaces, that is, a first filling space and a second filling space 12 and 13, are provided inside to accommodate the evaporation material.

However, in the present invention, the crucible 11 is not necessarily limited to the box shape described above, and it is natural that the crucible 11 may be formed in various kinds of cylindrical shapes as long as two or more evaporation material filling spaces can be formed therein.

On the other hand, the crucible 11 is preferably made of carbon or silicon carbide material. As such, since the crucible 11 is made of carbon or silicon carbide, when the power is supplied by a heating means (not shown) which will be described later without using a separate heating member, heat for heating the evaporation material by its electric resistance is used. Can be generated.

In addition, when the evaporation material is injected downward into the substrate 100 through the outlet 19, the gap between the outlet 19 and the substrate 100 is minimized to prevent deposition on unnecessary portions.

In the side of the crucible 11, a charging hole is formed to penetrate through the charging hole so that the filling materials can be supplied into the filling spaces 12 and 13. In addition, the charging holes 14 and 15 which serve as a passage for supplying the evaporation material from the evaporation material reservoir (not shown) into the filling space of the crucible 11 are fitted into and fixed to the respective charging holes.

Heating means (not shown) are configured to heat the evaporated material charged inside the crucible 11. In the present embodiment, since the crucible 11 is made of a carbon or silicon carbide material having high electrical resistance, the crucible 11 does not use a separate heating member, and is self-electrically heated by the power supplied through a power supply (not shown). Illustrates that it is possible to vaporize the evaporation material filled in the crucible 11 by generating heat.

The outlet 19 may be formed of at least two linear slots extending in a lengthwise direction below the crucible 11 so as to downwardly spray each of the evaporated substances vaporized inside the crucible 11 by the heating means (not shown) or The first outlet and the second outlets 19a and 19b are formed alternately with each other in the form of a plurality of holes arranged in a linear manner.

In this case, the first and second outlets 19a and 19b disposed to be adjacent to each other are deposited to discharge steam generated from evaporation materials of the first and second filling spaces 12 and 13 respectively. It is possible to increase the uniformity of the thin film composition.

Moreover, in order to further improve the uniformity of the deposited thin film, it is preferable to operate the substrate transfer means 30 such as a roller 31 to continuously transfer the substrate.

In addition, the vaporized material or vapor vaporized by the vaporized material filled in each of the filling spaces 12 and 13 is not mixed with each other until passing through the respective outlets 19a and 19b by the isolation means 18. It is isolated.

Meanwhile, a membrane 20 is further installed to cover the outlets 19a and 19b, and in this embodiment, the membrane 20 is made of carbon fiber.

The membrane 20 prevents the inflow of air outside the crucible 11 to prevent deterioration such as oxidation of the evaporated material charged in the crucible 11 and controls the excessive discharge of vaporized evaporated material through the outlet. And also serves to uniform the deposition rate of the thin film, and also to heat the transport gas flowing through the vaporized evaporation material and the transfer gas supply pipe (not shown), thereby preventing the temperature of the outlet 19 to lower do.

In order to increase energy efficiency, the multi-evaporation source 10 needs to reduce the size of the crucible 11 and contain the evaporation material in the crucible 11 as much as necessary for the immediate deposition and minimize the amount of extra evaporation material. . Therefore, an evaporation material reservoir (not shown) is installed and connected to each other through charging pipes 14 and 15 of the evaporation source to continuously supply the evaporation material to the filling spaces 12 and 13 inside the crucible 11.

Gate valve 40 is installed on the charge pipe (12, 22) connecting the evaporation reservoir (not shown) to control the amount of evaporation material supplied from the evaporation reservoir (not shown) to the crucible (11). . Therefore, the gate valve 40 can supply the required amount of evaporation material to the crucible 11 at any time without breaking the atmosphere inside the crucible 11, so that a continuous deposition process can be performed through the multiple evaporation sources 1. Make sure

In addition, when heat is transferred from the crucible 11 through the charging pipes 14 and 15 to the gate valve 40 and the evaporation material reservoir (not shown), the interior of the charging pipes 14 and 15 may be caused by melting and deformation of the evaporation material. The charging passage may be blocked or the gate valve 40 may be broken. To prevent this, cooling means (not shown) for cooling the respective charging pipes 14 and 15 may be installed.

On the other hand, although not shown in Figures 1 to 3, the apparatus for creating the atmosphere inside the crucible 11, the atmosphere inside the evaporation material reservoir (not shown) at the moment when the evaporation material is charged into the crucible 11 (11) It is preferable to maintain the same or similar to the atmosphere inside.

In addition, when the evaporated material vaporized from the crucible 11 is introduced into the charging pipes 14 and 15, the charging passage 14 may be deposited inside the charging pipes 14 and 15 to block the charging passage. Therefore, the transfer gas supply pipe (not shown) is connected to the charging pipes 14 and 15 to supply the gas transferring the vaporized evaporated material into the charging pipes 14 and 15. The conveying gas prevents the vaporized evaporation material from flowing into the charging tube to suppress the blockage of the charging tubes 14 and 15.

In addition, by adjusting the pressure of the gas flowing through the conveying gas supply pipe (not shown) to maintain the pressure inside the crucible (11) higher than the external pressure and the amount of evaporated material injected through the outlet 19 can be adjusted. Make sure In particular, the composition of the thin film deposited on the substrate 100 may be changed by differently controlling the amount of the carrier gas injected into the two filling spaces 12 and 13.

As described above, the thin film forming apparatus 1 using the multiple evaporation sources according to the present exemplary embodiment may discharge the vaporized evaporation material downward from the bottom of the substrate 100 to be continuously deposited on the surface of the substrate 100. In addition, the equipment of the thin film forming apparatus can be compactly and simply configured, and the process cost can be reduced by reducing energy consumed in the deposition process.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications or changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. In addition, it is natural that it belongs to the scope of the present invention. In particular, the embodiment described only the multiple evaporation source having two filling spaces, it is easy to think of extending the filling space to three or more.

1: thin film forming apparatus 10: multiple evaporation source
11: crucible 12, 13: charging space
14, 15; Charge tube 18; Containment
19; Outlet 20: Membrane
30: substrate transfer means 31: roller
40: gate valve 100: substrate

Claims (8)

A crucible having two or more filling spaces therein to accommodate evaporation material;
A charging pipe installed through the side or the top of the crucible to supply the evaporation material and the transfer gas into each of the filling spaces of the crucible;
Heating means for vaporizing the evaporated materials filled in the respective filling spaces of the crucible;
At least two outlets formed below the crucible so as to inject the respective evaporated substances vaporized inside the crucible by the heating means downward;
Isolating means for isolating the evaporated material or vaporized vapors filled in the filling spaces from being mixed with each other until they pass through the respective outlets; And
And a membrane covering the outlets.
In claim 1,
The crucible is made of carbon or silicon carbide material,

The heating means,
And a power supply for supplying power to the crucible so as to heat the evaporation material to the self-heating of the crucible.
In claim 1,
Multiple evaporation sources for discharging the vapor of the different evaporation material from the discharge port adjacent to each other.
delete In claim 1,
The membrane is a multiple evaporation source made of carbon fibers.
A thin film forming apparatus for forming a thin film by depositing the evaporation material using the multiple evaporation source of claim 1,
An evaporation material reservoir connected to the charging pipe to store the evaporation material supplied to the filling space of the crucible;
A gate valve provided in the charging pipe to adjust a supply amount of the evaporation material supplied from the evaporation material reservoir to the filling space of the crucible; And
And substrate transfer means for transferring and supplying the substrate adjacent to the lower side of the crucible in which the discharge port is formed.
The method of claim 6,
Thin film forming apparatus further comprises; cooling means for cooling the charging pipe.
The method of claim 6,
And a gas supply pipe connected to the charging pipe and supplying a transport gas into the crucible.

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