KR101324481B1 - Adhesive composition having heat dissipation, radiant heat circuit board for light emmiting apparatus using the same and manufacturing method of the same - Google Patents

Abstract

PURPOSE: A heat radiating adhesive composition is provided to have excellent heat radiating effect as thermal conductivity is high and to conveniently assemble a luminary heat radiating circuit board through liquid injection and solidification as an adhesive property is superb. CONSTITUTION: A heat radiating adhesive composition has a main material and a curing agent which are mixed. The main material contains 80-95 weight% of Al_2O_3; 1-10 weight% of a reaction product generated by reaction between bisphenol-A and epichlorohydrin; and 0.5-5 weight% of additives; and 0.5-5 weight% of an organic solvent. The curing agent contains 80-95 weight% of Al_2O_3; 1-10 weight% of an amine based curing agent; 0.5-5 weight% of a curing agent, 0.5-5 weight% of additives, and 0.5-5 weight% of an organic solvent. The luminary heat radiating circuit board is one material, on which a circuit pattern (11) is formed with a certain interval to install one or more of luminous bodies (20), among epoxy, phenol, a composite epoxy material [CEM]. The luminary heat radiating circuit board comprises a circuit board (10); holes which are individually formed in the middle of position on which the luminous bodies are installed on the circuit pattern of the circuit board; the luminous bodies which is attached on the circuit board on which the holes are formed; a heat radiating board (30) which is cured depositing the heat radiating adhesive composition with a certain height in a lower part of the circuit board while the heat radiating composition is packed in the hole which are formed in the lower part of the circuit board; and an wire hole which is formed to penetrate the center in which the heat radiating adhesive composition is packed in one hole which is formed on the circuit board. The luminous heat radiating circuit board is a product in which the circuit pattern and a wire are connected by inserting the wired (40) from the lower part of the heat radiating board in which the wire hole is formed.

Description

A heat dissipating adhesive composition, a light emitting heat dissipation circuit board manufactured using the same, and a method for manufacturing the same {Adhesive composition having heat dissipation, radiant heat circuit board for light emmiting apparatus using the same and manufacturing method of the same}

The present invention is a heat dissipating adhesive composition in which the main material and the curing agent are mixed, wherein the main material is Al ₂ O ₃ ; Reaction products of bisphenol A with epichlorohydrin; additive; And an organic solvent, wherein the curing agent is Al ₂ O ₃ ; Amine curing agents; additive; And it relates to a heat dissipation adhesive composition comprising an organic solvent, a light emitting heat dissipation circuit board manufactured using the same, and a method of manufacturing the same.

In the case of indoor / outdoor lighting, the light emitting devices emit light by arranging a plurality of devices, which results in more heat generation. In the existing FR-4 and CEM (composite type of laminate material) circuit boards equipped with these light emitting devices, the cost is low and the thermal conductivity is not good. Therefore, the lifespan of the light emitting devices is shortened and frequent replacement and repair are performed. There was this. Moreover, as the production of luminaires, TVs, notebooks, LCD monitors and other home appliances that apply LEDs and LED packages is increasing, there is a need for circuit boards with heat dissipation.

In order to solve the above problems, a conventional circuit board having a heat sink of aluminum material is used. Aluminum has a specific gravity of 2.7 and has a thermal conductivity of 236 W / mK. It has excellent physical properties, and is widely used as a heat sink because it is cheap and easy to purchase.

However, such a conventional circuit board with a heat sink is required to use a large aluminum heat sink to heat a large lamp, so that the bulky and heavy weight is difficult to install, and also a lot of trouble to replace the heat sink due to heavy weight in case of failure. There was this.

One embodiment of the present invention is to provide a heat dissipation adhesive composition that can have a good heat dissipation effect even in a small amount.

In addition, another embodiment of the present invention is to provide a light emitting heat dissipation circuit board manufactured using the heat dissipation adhesive composition.

In addition, another embodiment of the present invention is to provide a method for manufacturing a light-emitting radiator circuit board manufactured using the heat-radiating adhesive composition.

One embodiment of the present invention is a heat dissipating adhesive composition in which the main material and the curing agent are mixed, the main material is Al ₂ O ₃ 80 to 95% by weight; 1 to 10% by weight of reaction product of bisphenol A and epichlorohydrin; 0.5 to 5 weight percent of an additive; And 0.5 to 5 wt% of an organic solvent, wherein the curing agent is 80 to 95 wt% of Al ₂ O ₃ ; 1 to 10% by weight of the amine curing agent; 0.5 to 5 weight percent of an additive; And 0.5 to 5% by weight of an organic solvent.

The Al ₂ O ₃ may be a mixture of Al ₂ O ₃ powder having an average particle diameter of 45 μm and 5 μm, respectively, in a weight ratio of 60:40, the main material and the curing agent may be mixed in a weight ratio of 100: 70, the additive May be used at least one selected from the group consisting of a catalyst, a foaming agent, a toughener, and mixtures thereof.

Another embodiment of the present invention is the circuit board 10 and the material of one of the epoxy, phenol, CEM (Composite Epoxy Material) formed at a predetermined interval on the circuit pattern 11 is installed so that at least one light emitting body 20 is installed And holes 12 formed in the center of the position where the light emitting body 20 is installed in the circuit pattern 11 of the circuit board 10, and contacted with the upper portion of the circuit pattern 11 on which the hole 12 is formed. The heat-emitting adhesive composition according to the embodiment of the present invention is filled in the light emitting body 20 and the hole 12 formed in the lower portion of the circuit board 10, and the lower portion of the circuit board 10 has a predetermined height. A heat dissipation plate 30 cured by depositing a heat dissipation adhesive composition, a wire hole 31 formed to penetrate a center filled with the heat dissipation adhesive composition in one hole 12 formed in the circuit board 10, and Insert the electric wire 40 in the lower part of the heat sink 30 in which the electric wire hole 31 is formed, It provides a light emitting heat radiating circuit board is connected to 11 and the wires 40. The

Another embodiment of the present invention is a first process of forming a circuit pattern so that at least one light emitting body is installed on top of a circuit board made of one of epoxy, phenol, CEM (Composite Epoxy Material), and the circuit board A second process of forming holes in the center of the position where the light emitter is installed in the circuit pattern, a third process of attaching the light emitter so as to be in contact with the upper part of the circuit pattern on which the hole is formed, and the hole formed at the bottom by inverting the circuit board; A fourth process of filling the heat dissipation adhesive composition according to an embodiment of the present invention, a fifth process of depositing and curing the heat dissipation adhesive composition on a circuit board integrally with the composition to form a heat dissipation plate, and the circuit A sixth process of forming a wire hole to penetrate a center filled with the heat dissipating adhesive composition in one hole formed in the substrate; It provides a light emitting circuit board manufacturing method comprising a seventh process of connecting a wire and a circuit pattern by inserting a wire.

Heat dissipation adhesive composition according to an embodiment of the present invention has a high thermal conductivity can have an excellent heat dissipation effect, excellent adhesive strength without any screw tightening or soldering method of assembly of the existing electronic circuit components, simply liquid injection And it is possible to assemble the light emitting heat dissipation circuit board very easily through solidification, there is an effect that can simplify the manufacturing process, reduce the material cost, and improve the quality of the light emitting heat dissipation circuit board.

1 is a cross-sectional view of a light emitting circuit board according to an embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing a light-emitting heat dissipation circuit board according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.

One embodiment of the present invention is a heat dissipating adhesive composition in which the main material and the curing agent are mixed, the main material is Al ₂ O ₃ 80 to 95% by weight; 1 to 10% by weight of reaction product of bisphenol A and epichlorohydrin; 0.5 to 5 weight percent of an additive; And 0.5 to 5 wt% of an organic solvent, wherein the curing agent is 80 to 95 wt% of Al ₂ O ₃ ; 1 to 10% by weight of the amine curing agent; 0.5 to 5 weight percent of an additive; And 0.5 to 5% by weight of an organic solvent.

The heat dissipation adhesive composition is Al ₂ O ₃ 85 to 90% by weight; 3 to 7 wt% of a reaction product of bisphenol A and epichlorohydrin; A subject comprising 0.5 to 5% by weight of an additive and 0.5 to 3% by weight of an organic solvent; 85 to 90 weight percent Al ₂ O ₃ ; 3 to 7% by weight of the amine curing agent; It is possible to excellently improve heat dissipation properties by including a curing agent comprising 0.5 to 5% by weight of the additive and 0.5 to 3% by weight of the organic solvent.

In general, heat sinks (Heatsink) used in the prior art are produced by melting aluminum metal by die casting or extrusion, whereas heat dissipating adhesive composition is mixed with epoxy resin (a raw material of aluminum metal) extracted from mineral bauxite as it is. It can be used. This helps the green environment and complies with No Halogen, RoHS.

In addition, the Al ₂ O ₃ may be a mixture of Al ₂ O ₃ powder having an average particle diameter of 45μm and 5μm, respectively, more specifically, the weight ratio of 60: 40 Al ₂ O ₃ powder having an average particle diameter of 45μm and 5μm, respectively It is possible to excellently improve the heat dissipation characteristics by using the mixture.

The amine curing agent is generally used in the art and is not particularly limited in its kind. For example, condensation of aliphatic amines such as diethyltriamine, triethyltetramine, polyoxypropylenediamine, cyclic amines, amines and ketones Amines containing active hydrogens such as ketimines prepared by the reaction, modified resins such as polyamine amides, polyamidoamines, phenol-modified amines and epoxy-added amines using these amines or condensation of polyamines with dimer fatty acids The reaction product can be used as a curing agent.

The main agent and the curing agent can be mixed in a weight ratio of 100: 70, and can improve not only heat dissipation characteristics but also adhesion.

The additive may be one or more selected from the group consisting of catalysts, foaming agents, tougheners, and mixtures thereof. The catalyst, the foaming agent (foaming agent), the toughener (toughener) is generally used in the art, but the type is not particularly limited, more specifically NaOH, amines, imidazoles, acid anhydride, dicyandiamide (DICYANDIAMIDE) Catalysts, such as these, can be used preferably, Organic chemical foaming agent can be used preferably, Reinforcing agents, such as an epoxy resin containing a thermosetting plastic component, a bisphenol-type epoxy resin, or these copolymers, can be used preferably.

In addition, the organic solvent is generally used in the art, and the type thereof is not particularly limited, but alcohols, ketones, and the like may be more preferably used. In particular, butanol and methyl ethyl ketone (MEK) may be used, and methyl ethyl ketone (MEK) may be more preferably used.

Heat dissipation adhesive composition according to an embodiment of the present invention has a high thermal conductivity can have an excellent heat dissipation effect, IP dustproof waterproof rating of 68, very good adhesion, printability, assembly of the existing electronic circuit components It is possible to assemble the light emitting heat dissipation circuit board very simply by simply liquid injection and solidification without using any screw tightening or soldering method which is a method, which can simplify the manufacturing process, reduce the material cost, and improve the quality of the light emitting heat dissipation circuit board. It can be effective.

Heat dissipation adhesive composition according to an embodiment of the present invention after applying it to a substrate, natural drying at room temperature is possible, of course, after applying it to a substrate, comprising the step of drying hot air at a temperature of 70 to 80 ℃ Through the manufacturing method, it can be applied to the light emitting circuit board very simply. The hot air drying may be performed for 10 minutes to 2 hours, more preferably about 1 hour. In addition, the heat dissipation adhesive composition may be applied to have a predetermined thickness to expect a sufficient heat dissipation effect. In addition, the heat dissipation adhesive composition of the present invention is very excellent in adhesion, and after applying the heat dissipation adhesive composition to the substrate, further proceeds to attach and fix the heat dissipating material such as aluminum rods at regular intervals, crosscut A heat sink of the (CROSSCUT) method may be manufactured.

Another embodiment of the present invention is the circuit board 10 and the material of one of the epoxy, phenol, CEM (Composite Epoxy Material) formed at a predetermined interval on the circuit pattern 11 is installed so that at least one light emitting body 20 is installed And holes 12 formed in the center of the position where the light emitting body 20 is installed in the circuit pattern 11 of the circuit board 10, and contacted with the upper portion of the circuit pattern 11 on which the hole 12 is formed. The heat-emitting adhesive composition according to the embodiment of the present invention is filled in the light emitting body 20 and the hole 12 formed in the lower portion of the circuit board 10, and the lower portion of the circuit board 10 has a predetermined height. A heat dissipation plate 30 cured by depositing a heat dissipation adhesive composition, a wire hole 31 formed to penetrate a center filled with the heat dissipation adhesive composition in one hole 12 formed in the circuit board 10, and Insert the electric wire 40 in the lower part of the heat sink 30 in which the electric wire hole 31 is formed, It provides a light emitting heat radiating circuit board is connected to 11 and the wires 40. The 1 is a cross-sectional view of a radiator heat dissipation circuit board according to an exemplary embodiment of the present invention.

Another embodiment of the present invention is a first step (S10) of forming a circuit pattern so that at least one light emitting body is installed on the circuit board made of one of epoxy, phenol, CEM (Composite Epoxy Material) material, and A second step (S20) of forming holes in the center of the position where the light emitter is installed in the circuit pattern of the circuit board, a third step (S30) of attaching the light emitter to contact the upper part of the circuit pattern on which the hole is formed, and the circuit The fourth step (S40) of filling the heat dissipating adhesive composition according to the embodiment of the present invention in the hole formed in the lower part by inverting the substrate, and hardened by depositing the heat dissipating adhesive composition at a predetermined height on the circuit board integrally with the composition A fifth step (S50) of forming a heat sink and a sixth step (S60) of forming a wire hole to penetrate a center filled with the heat dissipating adhesive composition in one hole formed in the circuit board, and the wire holeGenerated provides a seventh process (S70) the light emitting heat radiating circuit board manufacturing method consisting of the insertion of a wire from the heat sink connected to the lower circuit patterns and the wire. 2 is a flowchart illustrating a method of manufacturing a light-emitting heat dissipation circuit board according to an embodiment of the present invention.

Conventional substrates made of epoxy, phenol, and CEM materials are inexpensive, but have very low thermal conductivity, which is problematic in terms of heat dissipation. However, since the heat dissipation adhesive composition according to the embodiment of the present invention has good thermal conductivity and excellent printability, as described above, the light emitting heat dissipation circuit board is manufactured using the heat dissipation adhesive composition according to the embodiment of the present invention. By doing so, there is an effect of having excellent heat dissipation even at a low cost.

Hereinafter, preferred embodiments and comparative examples of the present invention will be described. However, the following examples are only preferred embodiments of the present invention and the present invention is not limited by the following examples.

Example One

As subject, 90% Al ₂ O ₃ ; And 4% by weight of a reaction product of bisphenol A and epichlorohydrin, followed by 5% by weight of a bisphenol-based epoxy resin reinforcing agent; And 1% by weight of MEK were used, and as a curing agent, 87% by weight of Al ₂ O ₃ ; 7% by weight of amine curing agent; 4 weight percent NaOH catalyst; And 2% by weight of MEK were used.

The prepared main ingredient and the curing agent were mixed in a weight ratio of 100: 70 to prepare a heat dissipating adhesive composition.

Test Example 1

The thermal conductivity of the heat dissipation adhesive composition prepared in Example 1, Al ₂ O ₃ -Epoxy, AlN-Epoxy, AlN-LLDPE (Linear low-density polyethylene), and BN-Polyimide, which are conventional heat dissipation resin composite materials, are compared. A test was conducted to evaluate. The test was carried out by the test method ASTM E 1461, the results are shown in Table 1 below.

Example 1
Heat resistant adhesive composition Al ₂ 0 ₃ -Epoxy AlN-Epoxy AlN-LLDPE BN-Polyimide Thermal conductivity (W / mK) 2.73 1.50 0.42 1.4 1.0

As shown in Table 1, the heat dissipation adhesive composition prepared in Example 1 was confirmed that the thermal conductivity is very excellent compared to other conventional heat dissipation resin composite materials.

Test Example 2

One piece of aluminum having a size of 55 × 70 mm and a thickness of 1.6T, and four pieces of aluminum having a size of 50 × 50 mm and a thickness of 1.6T were attached using the heat dissipating adhesive composition prepared in Example 1, respectively. In addition, the same size and number of aluminum were attached using a conventional heat dissipation grease.

The aluminum attached by the test materials was placed on a heat source at 90 ° C., and the temperatures after 2 minutes, 5 minutes, and 7 minutes were checked, respectively, and the results are shown in Table 2 below.

(Unit: ℃) 2 minutes later 5 minutes later 7 minutes later Prepared in Example 1
Heat resistant adhesive composition 39 49 58 Conventional heat dissipation grease 34 42 52

As shown in Table 2, the heat dissipation adhesive composition prepared in Example 1 was excellent in thermal conductivity, more effectively absorbed heat from the heat source, it was confirmed that it has an excellent heat dissipation effect.

10: circuit board 11: circuit pattern 12: hole 20: the light emitting body
30: heat sink 31: wire hole 40: electric wire

Claims (6)

A heat dissipating adhesive composition in which a main material and a curing agent are mixed,
The subject matter is 80 to 95% by weight of Al ₂ O ₃ ; 1 to 10% by weight of reaction product of bisphenol A and epichlorohydrin; 0.5 to 5 weight percent of an additive; And 0.5 to 5% by weight of an organic solvent,
The curing agent Al ₂ O ₃ 80 to 95% by weight; 1 to 10% by weight of the amine curing agent; 0.5 to 5 weight percent of an additive; And 0.5 to 5% by weight of an organic solvent.
The method of claim 1,
The Al ₂ O ₃ is a heat radiation adhesive composition characterized in that the Al ₂ O ₃ powder having an average particle diameter of 45 μm and 5 μm, respectively, mixed in a weight ratio of 60:40.
The method of claim 1,
The subject matter and the hardener are mixed in a weight ratio of 100: 70.
The method of claim 1,
The additive is a heat dissipating adhesive composition, characterized in that at least one selected from the group consisting of a catalyst, a foaming agent (foaming agent), a toughener and mixtures thereof.
The circuit board 10 is made of one of epoxy, phenol, and CEM (Composite Epoxy Material) formed with a predetermined interval thereon so that at least one light emitting body 20 is installed. A hole 12 formed at each center of the position where the light emitting body 20 is installed in the circuit pattern 11, a light emitting body 20 attached to contact the upper portion of the circuit pattern 11 on which the hole 12 is formed, and the circuit The heat dissipation adhesive composition according to any one of claims 1 to 4 is filled in the hole 12 formed in the lower portion of the substrate 10, and the heat dissipation adhesive composition at a predetermined height in the lower portion of the circuit board 10. A heat sink 30 formed by depositing a through hole, a wire hole 31 formed to penetrate a center filled with the heat dissipating adhesive composition in one hole 12 formed in the circuit board 10, and the wire hole ( The circuit pattern 11 and the wires are inserted by inserting the wires 40 under the heat sink 30 having the 31 formed therein. Light emitting circuit board, characterized in that 40 is connected.
A first process of forming a circuit pattern such that at least one light emitting body is installed on the circuit board made of one of epoxy, phenol, and composite epoxy material (CEM);
A second process of forming holes in the center of the position where the light emitting body is installed in the circuit pattern of the circuit board;
A third process of attaching a light emitting body to be in contact with an upper portion of the circuit pattern on which the hole is formed;
A fourth process of inverting the circuit board and filling the heat-dissipating adhesive composition according to any one of claims 1 to 4 in a hole formed in a lower portion thereof;
A fifth process of forming a heat sink by depositing and curing the heat radiation adhesive composition at a predetermined height on a circuit board integrally with the composition;
A sixth process of forming a wire hole penetrating a center filled with the heat dissipating adhesive composition in one hole formed in the circuit board;
And a seventh process of connecting the circuit pattern and the wire by inserting an electric wire under the heat sink having the wire hole formed therein.

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