KR101321499B1 - Printed circuit board and flat panel display apparatus comprising the same - Google Patents

Abstract

The present invention provides a printed circuit board and a flat panel display device having the same, which can reduce manufacturing costs and improve yield, and include a conductive pattern, a first film covering an upper surface of the conductive pattern, and a lower surface of the conductive pattern. Provided is a printed circuit board and a flat panel display device including the second film.

Description

Printed circuit board and flat panel display apparatus comprising the same

1 is a plan view schematically showing a conventional printed circuit board.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

3 is a plan view schematically showing a modification of another conventional printed circuit board.

4 is a cross-sectional view schematically illustrating a printed circuit board according to an exemplary embodiment of the present invention.

5 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

6 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6.

8 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

FIG. 9 is a cross-sectional view taken along the line IX-IX of FIG. 8.

10 is a cross-sectional view schematically showing a printed circuit board according to another exemplary embodiment of the present invention.

11 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

12 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

13 is a schematic cross-sectional view of a portion of a flat panel display device according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

111: first film 112: second film

200: challenge pattern

The present invention relates to a printed circuit board and a flat panel display apparatus having the same, and more particularly, to a printed circuit board and a flat panel display apparatus having the same that can reduce the manufacturing cost and improve the yield.

Recently, as interest in display devices has increased, studies on them have been actively conducted. In particular, studies on lightweight and thin flat panel display devices using liquid crystal displays or organic light emitting displays have been actively conducted.

In the case of such a flat panel display device, a terminal electrically connected to the display unit extends to the edge of the display panel to apply an electrical signal to the display unit in the center of the display panel, and the electrical signal to be transmitted to the display unit is provided at the terminal of the display panel. Is approved. To this end, a printed circuit board is electrically connected to the terminals of the display panel.

1 is a plan view schematically illustrating a conventional printed circuit board, and FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

1 and 2, in the conventional printed circuit board, conductive patterns 21 and 22 are provided on upper and lower portions of the center film 10, and the first film is formed on the upper and lower portions of the conductive patterns 21 and 22 again. (11) and the second film 12 are provided. The tip portions of the conductive patterns 21 and 22 interposed between the first film 11 and the second film 12 are exposed to the outside of the first film 11 and the second film 12, and the exposed portions are exposed. It is connected to the terminal of the display panel to apply an electrical signal to the display unit of the display panel.

Of course, there are other modified forms of known conventional printed circuit boards, for example, as shown in FIG. The opening may be formed in the first film 11 and the second film 12 to expose a portion of the conductive pattern 21 between the first film 11 and the second film 12. .

However, such a conventional printed circuit board has a problem that the thickness of the conventional printed circuit board is not suitable for use in a flat panel display device requiring a thin thickness due to its thickness, and also due to the complicated structure, the manufacturing yield is lowered and the manufacturing cost of materials is reduced. It had a problem that it is expensive.

The present invention has been made to solve various problems including the above problems, and an object of the present invention is to provide a printed circuit board and a flat panel display device having the same, which can reduce manufacturing cost and improve yield.

The present invention provides a printed circuit board comprising a conductive pattern, a first film covering an upper surface of the conductive pattern, and a second film covering a lower surface of the conductive pattern.

According to another aspect of the present invention, at least a part of the conductive pattern of the soldering portion of the printed circuit board may be exposed to the outside of the first film and the second film.

According to another feature of the invention, the upper surface of the front end of the conductive pattern of the soldering portion of the printed circuit board is covered with the first film, the lower surface of the front end of the conductive pattern of the soldering portion of the printed circuit board is the second It can be covered with a film.

According to another feature of the invention, when the printed circuit board is viewed from above the first film, the edge of the second film adjacent to the exposed portion of the conductive pattern of the soldering portion of the conductive pattern of the conductive pattern It may be extended to the outside of the edge of the first film adjacent to the exposed portion.

According to another feature of the invention, one side of the first film and one side of the second film of the soldering portion of the printed circuit board is indented inward, so that a portion of the conductive pattern of the soldering portion of the printed circuit board It can be made to expose through the indentation part of a 1st film and a said 2nd film.

According to still another feature of the present invention, one side of the first film and the second film may be a side parallel to the longitudinal direction of the conductive pattern of the soldering portion of the printed circuit board.

According to another feature of the invention, the upper surface of the front end of the conductive pattern of the soldering portion of the printed circuit board is covered with the first film, the lower surface of the front end of the conductive pattern of the soldering portion of the printed circuit board is the second It can be covered with a film.

According to another feature of the invention, when the printed circuit board is viewed from above the first film, the edge of the second film adjacent to the exposed portion of the conductive pattern of the soldering portion of the conductive pattern of the conductive pattern It may be extended to the outside of the edge of the first film adjacent to the exposed portion.

According to another feature of the present invention, the edge of the indentation of the second film may be exposed to the outside of the edge of the indentation of the first film.

According to another feature of the invention, an opening is formed in the first film and the second film of the soldering portion of the printed circuit board, a portion of the conductive pattern of the soldering portion of the printed circuit board is the first film and the It may be exposed through the opening part of a 2nd film.

According to another feature of the invention, when the printed circuit board is viewed from above the first film, the edge of the second film adjacent to the exposed portion of the conductive pattern of the soldering portion of the conductive pattern of the conductive pattern It may be extended to the outside of the edge of the first film adjacent to the exposed portion.

According to another feature of the invention, the size of the opening of the second film is smaller than the size of the opening of the first film, when the printed circuit board is viewed from above the first film in the opening of the first film The edge of the said 2nd film can be observed.

The present invention also includes a printed circuit board as described above, a terminal disposed on the display panel, and a solder connecting the exposed portion of the conductive pattern of the printed circuit board to the terminal of the display panel. Provided is a display device.

According to such another feature of the present invention, the second film of the printed circuit board may be directed toward the display panel.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a cross-sectional view schematically illustrating a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the printed circuit board according to the present embodiment may include a conductive pattern 200, a first film 111 covering the top surface of the conductive pattern 200, and a bottom surface of the conductive pattern 200. 2 film 112 is provided. The conductive pattern 200 is formed of a conductive material that can transmit an electrical signal, and the first film 111 and the second film 112 are formed of an insulating material that can insulate the conductive pattern 200 from the outside.

In some cases, the printed circuit board may preferably have flexible characteristics. In this case, the conductive pattern 200 may also be formed of a material having electrical conductivity and flexible characteristics. Such materials include silver, copper, gold or aluminum. In some cases, the first film 111 and the second film 112 also require flexible properties, for example, a material such as polyimide may be used.

At this time, the conductive pattern 200 of the soldering portion of the printed circuit board, that is, the portion to be connected to the terminal of the flat panel display panel by soldering, has at least a portion of the first film 111 and the second film ( 112) By exposing to the outside, connection with the terminal of a flat panel display panel can be made easy.

In the case of such a printed circuit board, the structure thereof is simple, and thus the manufacturing yield can be improved. In addition, compared to the conventional printed circuit board, the required amount of material can be drastically reduced, thereby reducing the manufacturing cost.

5 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

In the printed circuit board according to the above-described embodiment as shown in FIG. 4, when the tip portions of the first film 111 and the second film 112 coincide with each other, as shown in part A of FIG. Portions exposed to the outside of the first film 111 and the second film 112 of the pattern 200 may be disconnected in the portion A of FIG. 4 or cracks may occur in the portion A, thereby causing defects later. have.

Therefore, as illustrated in FIG. 5, the edges of the first film 111 on the upper surface of the conductive pattern 200 and the second film 112 on the lower surface do not coincide, that is, the printed circuit board is disposed on the first film 111. When viewed, the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 of the soldering portion is observed outside the edge of the first film 111 adjacent to the exposed portion of the conductive pattern 200 of the soldering portion. do. As such, the edges of the first film 111 and the second film 112 do not coincide with each other in the vicinity of the exposed portion of the conductive pattern 200 of the soldering portion of the printed circuit board. ) Can be effectively prevented in advance of disconnection or cracking in the A part.

6 is a cross-sectional view schematically illustrating a printed circuit board according to another exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6.

6 and 7, the first film 111 and the second film 112 are provided on the upper and lower portions of the conductive pattern 200, respectively. The upper surface of the tip of the conductive pattern 200 of the soldering part of the printed circuit board is also covered with the first film 111, and the lower surface of the tip of the conductive pattern 200 of the soldering part of the printed circuit board is also the second film 112. Covered.

As described above, in the case of the printed circuit board illustrated in FIG. 4, the tip portions of the first film 111 and the second film 112 coincide with each other as illustrated in part A of FIG. 4. Portions exposed to the outside of the first film 111 and the second film 112 may be disconnected from the portion A of FIG. 4 or a crack may occur in the portion A, thereby causing a defect later. This failure occurs when the soldering portion of the printed circuit board is mounted on a flat panel display panel, etc., since there is no element supporting the conductive pattern 200 on upper and lower portions of the exposed tip portion of the conductive pattern 200 in FIG. 4.

Therefore, as shown in FIGS. 6 and 7, the first film 111 and the second film 112 are also provided on upper and lower ends of exposed portions of the conductive pattern 200, thereby causing the conductive pattern 200 to be disconnected. Alternatively, cracks may be prevented from occurring in the conductive pattern 200.

8 is a cross-sectional view schematically illustrating a printed circuit board according to another exemplary embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along the line IX-IX of FIG. 8.

8 and 9, the first film 111 and the second film 112 are also provided on upper and lower ends of the exposed portion of the conductive pattern 200, and at the same time, the conductive pattern of the soldering portion of the printed circuit board is provided. By preventing the edges of the first film 111 and the second film 112 from coinciding with the exposed portion of the 200, the exposed conductive pattern 200 of the soldering portion of the printed circuit board may be disconnected or the conductive pattern 200 may be broken. ) Can further prevent cracking.

10 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 10, the first film 111 and the second film 112 are provided on the upper and lower portions of the conductive pattern 200, respectively. At this time, one side of the first film 111 of the soldering portion of the printed circuit board and one side of the second film 112 are indented inward, so that a part of the conductive pattern 200 of the soldering portion of the printed circuit board is the first film 111. ) And through the indentation of the second film 112. As shown in FIG. 10, an indentation of the first film 111 and the second film 112 may be formed at one side parallel to the longitudinal direction of the conductive pattern 200 of the soldering part of the printed circuit board.

As described above, even when the indentation is formed in the first film 111 and the second film 112 to expose the conductive pattern 200, as illustrated in FIG. 10, the conductive pattern 200 of the soldering part of the printed circuit board is formed. The top surface of the tip portion is covered with the first film 111, and the bottom surface of the tip portion of the conductive pattern 200 of the soldering portion of the printed circuit board is also covered with the second film 112, so that the conductive pattern 200 is exposed. It is possible to effectively prevent disconnection or cracking in the conductive pattern 200 at the portion where the portion is cut.

In particular, when the printed circuit board is viewed from above the first film 111 as shown in FIG. 10, the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 of the soldering portion may be electrically conductive. By being observed outside the edge of the first film 111 adjacent to the exposed portion of the pattern 200, it is more efficient to disconnect the conductive pattern 200 from the exposed portion or to generate cracks in the conductive pattern 200. You can prevent it.

In FIG. 10, only the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 is observed to be outside the edge of the first film 111 adjacent to the exposed portion of the conductive pattern 200 of the soldering portion. Although illustrated as being illustrated, various modifications are of course possible. That is, not only the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 but also all the edges of the indentation of the second film 112 are exposed outside the edge of the indentation of the first film 111. It may be. This will be described with reference to the drawings in the following embodiments.

11 is a schematic cross-sectional view of a printed circuit board according to another exemplary embodiment of the present invention.

Referring to FIG. 11, the first film 111 and the second film 112 are provided on the upper and lower portions of the conductive pattern 200, and the first film 111 and the second film of the soldering portion of the printed circuit board are provided. An opening is formed in the 112, and a part of the conductive pattern 200 of the soldering portion of the printed circuit board is exposed through the opening.

As described above, even when openings are formed in the first film 111 and the second film 112 to expose the conductive pattern 200, as illustrated in FIG. 11, the conductive pattern 200 of the soldering part of the printed circuit board is formed. The top surface of the tip portion is covered with the first film 111, and the bottom surface of the tip portion of the conductive pattern 200 of the soldering portion of the printed circuit board is also covered with the second film 112, so that the conductive pattern 200 is exposed. It is possible to effectively prevent disconnection or cracking in the conductive pattern 200 at the portion where the portion is cut.

In particular, when the printed circuit board is viewed from above the first film 111 as illustrated in FIG. 11, the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 of the soldering portion may be electrically conductive. By being observed outside the edge of the first film 111 adjacent to the exposed portion of the pattern 200, it is more efficient to disconnect the conductive pattern 200 from the exposed portion or to generate cracks in the conductive pattern 200. It can prevent.

At this time, like the printed circuit board according to another preferred embodiment of the present invention shown in Figure 12, the size of the opening of the second film 112 is smaller than the size of the opening of the first film 111, When viewed from above the first film 111, the edge of the second film 112 is observed in the opening of the first film 111, that is, the second film 112 in the opening of the first film 111. You can also have all the edges of) be observed. At the end of the above-described embodiment described with reference to FIG. 10, not only the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 but also all the edges of the indentation of the second film 112 are formed of the first film 111. The meaning that it may be exposed to the outside of the edge of the indentation of the) is similar to that described with reference to FIG.

13 is a schematic cross-sectional view of a portion of a flat panel display device according to another exemplary embodiment of the present invention.

The printed circuit board according to the above embodiments may be provided in a flat panel display device, particularly a thin flat panel display device, which is schematically illustrated in FIG. 13.

That is, the terminal 510 is provided on the substrate 500 of the display panel 400, and the exposed portion of the conductive pattern 200 of the printed circuit board 300 and the terminal 510 of the display panel 400 are provided. Is connected by solder (not shown). In FIG. 13, although the solder is not illustrated, there is a space between the conductive pattern 200 and the terminal 510. However, when soldering, the conductive pattern 200 and the terminal 510 are electrically connected.

By using the printed circuit board 300 as described above in coupling the printed circuit board 300 and the display panel 400 as described above, it is possible to significantly reduce the manufacturing cost and improve the yield. In particular, by allowing the edge of the second film 112 adjacent to the exposed portion of the conductive pattern 200 to extend outside the edge of the first film 111, the conductive pattern 200 of the printed circuit board is disconnected or the conductive pattern ( The cracks may be prevented from occurring in the 200, and in particular, the second film 112 of the printed circuit board 300 may face the display panel 400, as shown in FIG. 13, thereby further maximizing such an effect. You can.

According to the printed circuit board and the flat panel display device having the same according to the present invention made as described above, it is possible to implement a printed circuit board and a flat panel display device having the same that can significantly reduce the manufacturing cost and improve the yield.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (14)

And a conductive film, a first film covering an upper surface of the conductive pattern, and a second film covering a lower surface of the conductive pattern, wherein a part of the conductive pattern is exposed to the outside of the first film and the second film and soldered. Forming a portion, the front end and the lower surface of the soldering portion is covered with the first film and the second film, respectively, Openings are formed in the first film and the second film of the soldering portion of the printed circuit board, and a portion of the conductive pattern of the soldering portion of the printed circuit board is exposed through the openings of the first film and the second film. Printed circuit board, characterized in that. delete delete delete delete delete delete delete delete delete The method of claim 1, When the printed circuit board is viewed from above the first film, the edge of the second film adjacent to the exposed portion of the conductive pattern of the soldering portion is the first film adjacent to the exposed portion of the conductive pattern of the soldering portion. Printed circuit board, characterized in that it extends outside the edge of the. The method of claim 1, The size of the opening of the second film is smaller than the size of the opening of the first film, so that the edge of the second film is observed in the opening of the first film when the printed circuit board is viewed from above the first film. Printed circuit board, characterized in that. A printed circuit board according to any one of claims 1, 11 and 12; A terminal disposed on the display panel; And And a solder connecting the exposed portion of the conductive pattern of the printed circuit board to the terminal of the display panel. 14. The method of claim 13, And the second film of the printed circuit board faces the display panel.

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