KR101312005B1 - Contactor device for split type semiconductor device of large area - Google Patents

Abstract

PURPOSE: A large sized division type semiconductor device contactor apparatus is provided to reduce a path which moves a contactor to the test site outside. CONSTITUTION: A contactor unit (100) divides a contactor and successively connects to a test site. A contactor driving unit (200) drives the intersection of the contactor which is installed on the top of the contactor unit and is divided. A shuttle unit (300) supplies a semiconductor device to the divided contactor in order to perform loading and unloading at the same time and discharges a device on which a test is finished. A shuttle cam block unit (400) is installed on the top of the shuttle unit and changes a pitch of the shuttle unit. The contactor driving unit drives the contactor of one group and electrically contacts the semiconductor device to a test site. The contactor driving unit drives the contactor of the other group and grasps a device to be tasted by putting the tested semiconductor device on the shuttle unit. [Reference numerals] (500) Contactor torque sensing unit

Description

Large area split type semiconductor element contactor device {CONTACTOR DEVICE FOR SPLIT TYPE SEMICONDUCTOR DEVICE OF LARGE AREA}

The present invention relates to a handler for a high speed test of a test head having a large area or a pitch-to-pitch distance of the semiconductor device. More particularly, the semiconductor device contactor is divided into two sets so as to be operated in unstable contact. The large area division type semiconductor element contactor device which can prevent the yield fall by this is provided.

The test of the conventional semiconductor device is mainly performed by the "semiconductor device handler system". The conventional semiconductor device handler system uses an electronic connector (hereinafter referred to as a "contactor") by using a shuttle for supplying and discharging semiconductor elements outside the test site. ), The contactor is vacuum-adsorbed the materials arranged in the shuttle to maintain electrical contact with the test socket to perform the test, and the test device is discharged by placing the tested device in the shuttle.

However, this method increases the shuttle and contactor mechanical volume as the area of the contactor increases, thereby increasing the distance between the test sockets in the shuttle and thus the time at which the test starts at the end of the test, that is, the index time time 'increases. Increasing the index time will lead to a decrease in production volume, so it is necessary to develop a way to solve it.

When the test sockets for testing at the same time increase, and the distance between the test sockets, that is, the pitch (Pitch) increases, the area of the contactor pressing plate for pressing the semiconductor devices must be increased in order to simultaneously operate the semiconductor devices.

Increasing the area of the presser plate causes horizontal problems between the contactor blades for pressing the material. This causes a difference in height of the test socket or deformation, processing, and assembly error of the pressing plate, and thus needs to be solved.

Various methods have already been developed and applied to a method of testing a semiconductor device by a contactor, which is a component of the semiconductor device test handler system having such a configuration.

On the other hand, with respect to the conventional contactor device, a number of applications and publications other than Korea Patent Publication No. 10-2003-0085519 (hereinafter referred to as "prior document") is disclosed.

The contactor device according to the prior art is a contactor device for obtaining electrical conduction with respect to a plurality of semiconductor devices formed on the semiconductor wafer 6 as shown in FIG. The first contactors 2 and 8 having contacts 2b and 8b in direct contact with the terminal 6a of the system, and a separate path electrically independent of the first contactor, It is characterized by including the 2nd contactor 4 which is movable with respect to 1 contactor, and has the contact 4a which is conductive with the terminal 6b of the 2nd system | system | group of the said semiconductor device.

However, in the conventional apparatus including the above-mentioned literature, the size of the contactor base is increased when the quantity to be tested at the same time increases, and the mechanical time and volume increase, so that the index time increases the number of sockets tested at the same time. Inversely, there is no big difference in performance. In addition, the mechanical part needs to be reinforced to apply a large area contactor.

In particular, in the trend of increasing the number of pins contacted per unit area of the current semiconductor device, if a large area and a large number of sockets are applied, it is necessary to increase the pressing force when the semiconductor device contacts the test socket. Therefore, the power of the motor pressing the contactor must be increased, and the volume and mass of the motor are increased, thereby increasing the size of the entire installation.

The present invention has been made in view of the above problems, and a first object of the present invention is to minimize the movement distance of the contactor, that is, the movement distance in operating a large-scale test site, and increase the number of simultaneous test sockets. Even if the index time is minimized or the index time is not increased.

A second object of the present invention is to prevent a decrease in yield of a test socket due to contact instability between the socket and the device when testing a semiconductor device by a large contactor.

The present invention for achieving the above technical problem relates to a large-area split type semiconductor device contactor device, the contactor portion for dividing the contactor so that the test site can be sequentially connected; A contactor driver for driving the divided contactors to cross each other; In order to achieve loading and unloading of the semiconductor device at the same time, the shuttle unit for supplying the semiconductor device to the divided contactor, the discharged device after the test; And a shuttle cam block unit installed on the shuttle unit to change a pitch of the shuttle unit. .

According to the present invention as described above, the use of a split contactor, the tester head must operate a large test site or the number of sockets to test at the same time a large number of cases and the pitch between the test socket is large, the contactor This minimizes the number of copper wires and reduces the index time. Accordingly, when a plurality of sockets are operated or the test site has scalability, the output time is not reduced because the index time of the contactor is minimized.

In addition, since the shuttle according to the present invention uses a method of entering the test site from the shuttle, which is operated outside the test site, the path for the contactor to move outside the test site is shortened.

In addition, since the split type contactor according to the present invention minimizes the area by dividing the area of the contactor base for large test site operation, the contactor base is bent due to machining, assembly, and other influences, and the slope of the contactor base is generated. This minimizes the effect of preventing yields from being lowered. In addition, the split type contactor operates a contact force (a force that counteracts the reaction force with the pin that presses the semiconductor element to make electrical contact) in a device having a large number of contacts using a motor having a smaller force than that of a large area contactor. There is also a possible effect.

1 is a block diagram of a conventional contactor device.
2 is an overall configuration diagram of a large area divided semiconductor device contactor device according to the present invention.
3a and 3b is an exemplary view showing a contactor unit according to the present invention.
Figure 4 is an exemplary view showing a shuttle cam block portion installed on the shuttle portion and the shuttle portion according to the present invention.
5 is an exemplary view showing a pitch change of the shuttle unit through the shuttle cam block unit according to the present invention.

Specific features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. It is to be noted that the detailed description of known functions and constructions related to the present invention is omitted when it is determined that the gist of the present invention may be unnecessarily blurred.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

A large area divided semiconductor device contactor device according to the present invention will be described with reference to FIGS. 2 to 5 as follows.

2 is an overall configuration of a large area split type semiconductor device contactor device (D) according to the present invention, as shown in the contactor unit 100, the contactor drive unit 200, the shuttle unit 300, the shuttle It includes a cam block 400 and a contactor torque sensing unit 500.

3a and 3b is an exemplary view showing a contactor unit 100 according to the present invention.

As shown in the drawing, the contactor 100 divides the contactor so as to minimize the index time and enable sequential connection of a large test site.

In this case, the plurality of contactors are driven simultaneously in a group, and are divided into N, preferably, a pair of contactors 110 and a pair of contactors 120.

In this case, in order to minimize the amount of deformation during semiconductor device contact, the contactor is divided into two groups as described above, rather than a conventional single large area contactor, and each contactor is separated by an air damper 10 and a blade per vertical axis. 11) is configured.

This type is designed to be installed continuously when the vertical axis is extended, it is possible to install so that even if the number of sockets to increase in the N array in addition to eight as shown in the figure.

The contactor driver 200 drives the divided contactors to cross each other.

In detail, the contactor driver 200 drives the contactor including the contactor pair 110 and the contactor pair 120 to cross each other.

At this time, the contactor driver 200 operates the contactor pair 110 to make electrical contact with the semiconductor element at the test site, and simultaneously shuttles the semiconductor element tested with the pair of contactors 120. ) And drive to take action to grab the device to be tested.

Here, although there is a method of installing the motor in the vertical direction for each contactor, it can be installed so as to drive by connecting the vertical axis motor 210 in one divided into two divided or N divided. As shown, the vertical shaft motor 210 is installed separately, the entire contactor unit is installed so as to move horizontally with one horizontal shaft motor 220 installed.

That is, one or more horizontal shaft motors 220 may be configured, and the vertical shaft motors 210 may be configured by the number of all contactors, respectively, or may be configured by the number of vertical shafts in which a plurality of contactors are synchronized.

This is for the two split contactor pairs 110 and 120 to share one test head, while one pair of contactors (eg 110) enters the test while the other pair 120 is shuttled. This is to place the device in the position 300, and to move to the shuttle 300 position to catch the device again.

4 is an exemplary view showing the shuttle 300 and the shuttle cam block 400 installed on the shuttle 300 according to the present invention.

The shuttle unit 300 is to load and unload the semiconductor device at the same time, and enters the test site to shorten the moving distance of the contactor. That is, the semiconductor device is supplied to the divided contactor, and the tested device is discharged.

At this time, the shuttle unit 300 is located under the set of tested contactors in order to minimize the movement path of the contactor, in the case of a single shuttle at the same time loading (unloading) and loading (unloading) of the semiconductor device Since it must be implemented, two pockets 320 per test socket 310 are installed in a pair so that the device can be loaded and unloaded.

Here, the X-axis horizontal drive unit 330 is configured to have a position where a set of contactors can pick up and pick down the device, and the Y-axis horizontal drive unit 340 for loading and unloading the device outside the test site. ) Is installed. That is, the shuttle 300 is composed of two driving units (330, 340) as shown in FIG.

Meanwhile, the shuttle 300 may handle loading and unloading in one shuttle, but in order to prevent copper wire overlap between the loading robot for loading the semiconductor elements into the shuttle and the unloading robot for transferring the tested devices, The shuttle may be separated from the test site to install a loading shuttle on one side of the test site, and an unloading shuttle on the opposite side of the test site.

5 is an exemplary view showing a pitch change of the shuttle 300 through the shuttle cam block 400 according to the present invention.

The shuttle cam block 400 is installed on the shuttle 300 to change the pitch of the shuttle 300.

Specifically, as shown in (a) of FIG. 5, the shuttle cam block 400 pitch-extends the blade 11 when entering the test site, and as shown in (b) of FIG. 5. The pitch is reduced when the device is discharged out of the test site and the device is transferred to the loading and unloading picker.

The contactor torque sensing unit 500 detects the torque of the contactor motor so that the contactor picking up the semiconductor device descends and maintains contact between the device and the test pin at the set torque when the socket of the device is inserted. .

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be appreciated by those skilled in the art that numerous changes and modifications may be made without departing from the invention. Accordingly, all such appropriate modifications and changes, and equivalents thereof, should be regarded as within the scope of the present invention.

D: Large Area Split Semiconductor Device Contactor Device
100: contactor unit 200: contactor drive unit
300: shuttle 400: shuttle cam block
500: contactor torque detection unit 110: 1 contactor pair
120: contactor 2, 10: air damper
11: blade 210: vertical shaft motor
220: horizontal shaft motor 310: socket
320: pocket 330: X axis horizontal drive unit
340: Y axis horizontal drive unit

Claims (10)

A contactor unit 100 dividing the contactor so that the test site can be sequentially connected;
A contactor driver installed at an upper portion of the contactor unit 100 to drive the divided contactors to cross each other;
A shuttle unit 300 for supplying a semiconductor device to the divided contactor and discharging the tested device to simultaneously perform loading and unloading of the semiconductor device; And
A shuttle cam block 400 installed at an upper portion of the shuttle 300 to change a pitch of the shuttle 300; Including,
The contactor drive unit 200,
While operating a set of contactors to make electrical contact with the semiconductor elements at the test site, the tester is placed on the shuttle 300 and the other contactors are operated to take an operation to hold the device to be tested. A large area divided semiconductor device contactor device, characterized in that.
The method of claim 1,
The contactor unit,
A large-area split type semiconductor device contactor device, characterized in that it is divided into two groups, wherein each contactor comprises at least one contactor driven simultaneously, so as to cross-drive with another contactor.
delete The method of claim 1,
A large-area split type semiconductor device contactor device, characterized in that a vertical axis motor (210) for vertically moving a divided contactor pair and a horizontal axis motor (220) for horizontal movement are configured.
5. The method of claim 4,
At least one horizontal shaft motor 220 is configured, and the vertical shaft motor 210 is configured as the number of all the contactors, respectively, or a large area, characterized in that a plurality of contactors are configured as the number of the vertical axis synchronously connected Split semiconductor device contactor device.
The method of claim 1,
The shuttle unit 300,
Located under the set of tested contactors,
2. A large area split type semiconductor device contactor device, characterized in that two pockets are used per test socket for simultaneously loading and unloading semiconductor devices.
The method of claim 1,
The shuttle unit 300,
The X axis horizontal drive unit is configured to have a position where a pair of contactors can pick up and pick down the device, and the Y axis horizontal drive unit is installed to load and unload the device outside the test site. A large area split type semiconductor device contactor device.
The method of claim 1,
The contactor is,
A large area split type semiconductor device contactor device, characterized in that an air damper and a blade are configured for each vertical axis.
The method of claim 1,
The shuttle cam block 400,
A large area split type semiconductor device contactor device, characterized in that the pitch is expanded to the blade (11) when entering the test site, and the pitch is reduced when the device is discharged to the outside of the test site and transferred to the loading and unloading picker.
The method of claim 1,
A contactor torque sensing unit configured to sense torque of the contactor motor so that the contactor picking up the semiconductor element descends and maintains contact between the device and the test pin at a predetermined torque when the socket is inserted into the device; The large-area split type semiconductor device contactor device further comprises.

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