KR101305066B1 - Barrel Plating Apparatus - Google Patents

Abstract

The present invention relates to a plating apparatus, and more particularly, to a barrel plating apparatus for plating an external electrode of a chip component by applying power while rotating the barrel after inserting the chip component into the barrel. According to the present invention, a plurality of rotating shafts including a universal joint for coupling the upper axis and the lower axis and the upper axis and the lower axis are installed, the rotary table rotating around an idle axis, and coupled to the upper axis, A plating liquid container configured to receive a plating object and a plating liquid, the plating liquid receiving part having an inlet through which the plating liquid flows in and an outlet through which the plating liquid flows out, a plurality of plating barrels rotating around the upper axis and revolving around the revolution axis; Rotating angle adjusting means for pushing and pulling the upper axis so that the upper axis is inclined with respect to the extension line of the lower axis, and a power supply for supplying current to the anode immersed in the plating liquid receiving portion of the plating barrel and the cathode inside the plating barrel; Barrel plating apparatus is provided. In the barrel plating apparatus according to the present invention, the barrel rotates and rotates while the barrel rotates. Therefore, by changing the rotation, the revolution speed and the angle of the rotation axis of the barrel in accordance with a predetermined plating profile, it is possible to easily find the optimum conditions that can prevent chip sticking and make the plating thickness uniform.

Description

Barrel Plating Apparatus

The present invention relates to a plating apparatus, and more particularly, to a barrel plating apparatus for plating an external electrode of a chip component by applying power while rotating the barrel after inserting the chip component into the barrel.

As electronic products become smaller and smaller, various components constituting the electronic products are also becoming smaller and chip parts. Representative examples include multilayer ceramic capacitors, chip inductors, and chip resistors. The multilayer ceramic capacitor has a structure in which external electrodes are formed at both ends of a chip-like body having a dielectric constant. Looking at the process of manufacturing such a chip-shaped capacitor is as follows. First, after coating the internal electrode on a ceramic green sheet, it is laminated and pressed to manufacture a green bar. The green bar is cut into the shape of each green chip and then sintered to form a body of a capacitor having a chip shape. Then, copper paste is applied to both ends of the chip-shaped body and sintered to form external electrodes.

Next, a plating layer is formed on the external electrode to be mounted on the printed circuit board. The forming of the plating layer is performed by plating nickel (Ni) on the external electrode and then plating tin (Sn) or tin-lead (Sn-Pb).

Plating of small parts, such as chip parts, adds a metal dummy ball at an appropriate ratio to smoothly energize the chip part and the chip part inside the barrel, and uses a barrel method of plating while rotating the barrel. Such a plating apparatus is connected to a plating bath containing a plating solution, a barrel rotating device for rotating the barrel clockwise and counterclockwise in the plating bath, an anode immersed in the plating bath, and a cathode inside the barrel to supply a direct current to the chip component. It consists of a power supply.

In the process of plating the chip parts put into the barrel, the external electrodes of the chip parts may be plated in a state in which they are stuck together. This is called chip sticking. When the chip sticking occurs, the thickness of the outer electrode on the attached side is insufficient enough to cause defects and to reduce the reliability of the parts, and in severe cases, the chip parts may not be used because they are not separated.

In order to solve this problem, a method of optimizing process variables such as a barrel type, a dummy ball size and a compounding ratio has been conventionally used. However, it is not easy to find an optimization condition for chip sticking by using a conventional device.

Therefore, there is a need in the art for a new barrel plating apparatus for preventing chip sticking.

Japanese Laid-Open Patent Publication No. 2011-058024 Japanese Laid-Open Patent Publication No. 2009-132954 Korean Laid-Open Patent Publication No. 2005-0041493

SUMMARY OF THE INVENTION The present invention aims to provide a new barrel plating apparatus capable of preventing chip sticking and plating uniformly, in order to solve the above problems.

According to the present invention, a plurality of rotating shafts including a universal joint for coupling the upper axis and the lower axis and the upper axis and the lower axis are installed, the rotary table rotating around an idle axis, and coupled to the upper axis, A plating liquid container configured to receive a plating object and a plating liquid, the plating liquid receiving part having an inlet through which the plating liquid flows in and an outlet through which the plating liquid flows out, a plurality of plating barrels rotating around the upper axis and revolving around the revolution axis; Rotating angle adjusting means for pushing and pulling the upper axis so that the upper axis is inclined with respect to the extension line of the lower axis, and a power supply for supplying current to the anode immersed in the plating liquid receiving portion of the plating barrel and the cathode inside the plating barrel; Barrel plating apparatus is provided.

In addition, the rotating shaft is formed with a hollow, the outlet is provided with a barrel plating apparatus in communication with the hollow of the rotating shaft.

In addition, the rotary table is provided with a motor, a plurality of lower shafts of the rotating shaft is provided with a barrel plating apparatus is provided with a driven gear that rotates in engagement with the drive gear installed on the rotating shaft of the motor.

In addition, the barrel is disposed above the barrel, and has an inlet through which the plating liquid flows in, a flow path through which the plating liquid flowing through the inlet flows, and a plurality of outlets through which the plating liquid flowing along the flow path flows out. A plating solution supplying means for rotating around an extension line and one end thereof is connected to an outlet of the plating solution supplying means, and the other end is provided with a barrel plating apparatus further comprising a plurality of plating solution inflow pipes connected to an inlet of the barrel.

In addition, the rotary table is provided with a barrel plating apparatus which is connected to the rotary table drive motor provided on the outside of the rotary table and rotated by a belt.

In addition, the barrel is coupled to the upper shaft, the outer case is formed with an outlet, the inner case is disposed inside the outer case and the plating liquid receiving portion is formed therein, the upper portion of the plating liquid receiving portion has a mesh inner case, the plating liquid after use Is passed through the mesh of the inner case, passing through the space between the outer surface of the inner case and the inner surface of the outer case is provided with a barrel plating apparatus that is discharged through the outlet of the outer case.

In the barrel plating apparatus according to the present invention, the barrel rotates and rotates while the barrel rotates. Therefore, by changing the rotation, the revolution speed and the angle of the rotation axis of the barrel in accordance with a predetermined plating profile, it is possible to easily find the optimum conditions that can prevent chip sticking and make the plating thickness uniform.

1 is a perspective view from above of an embodiment of a barrel plating apparatus according to the present invention.
Figure 2 is a perspective view from below of one embodiment of a barrel plating apparatus according to the present invention.
3 is a front view of the barrel plating apparatus shown in FIG.
4 is a cross-sectional view of the barrel shown in FIG. 1.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a perspective view from above of an embodiment of a barrel plating apparatus according to the present invention, FIG. 2 is a perspective view from below of an embodiment of a barrel plating apparatus according to the present invention, and FIG. 3 is a barrel plating apparatus shown in FIG. Front view. 1 to 3, the barrel plating apparatus according to the present invention is a rotary table 10, a plurality of plating barrel 20, rotating angle adjusting means 30, power (not shown), plating solution supply means 40 , The plating liquid inlet pipe 50.

The rotary table 10 includes a lower disk 12 parallel to the upper disk 11 and the upper disk 11 and a connecting post 13 and a rotating shaft 14 connecting the upper disk 11 and the lower disk 12 to each other. Include. The rotary table 10 is rotatably installed on the main frame 1 with respect to the revolving shaft 2 which is the central axis.

2 and 3, the upper disk 11 is formed with six through slots 15 extending in the circumferential direction from the center. The lower disk 12 is formed with six through holes below the position where the through slot 15 of the upper disk 11 is formed. A groove 17 is formed around the lower disk 12 so that the lower disk 12 functions as a kind of driven pulley. The lower disk 12 is connected to the drive table pulley 62 installed on the rotary shaft 61 of the rotary table drive motor 60 fixed to the main frame 1 through the belt 63, the rotary table drive motor 60 Rotation of the rotary table 10 rotates.

Referring to FIG. 1, the rotating shaft 14 has an upper shaft 141 inserted into the through slot 15 of the upper disk 11 and a lower shaft 142 inserted into the through hole 16 of the lower disk 12. And a universal joint 143 connecting the upper shaft 141 and the lower shaft 142. The universal joint 143 is a coupling connecting the lower shaft 142 and the upper shaft 141. Even though the upper shaft 141 is inclined with respect to the lower shaft 142, the rotational force of the lower shaft 142 is the upper shaft 141. ) To be delivered to

Referring to FIG. 3, the motor 18 is installed at the center of the lower surface of the lower disk 12, and the drive gear 19 is installed at the rotation shaft of the motor 18. The drive gear 19 meshes with six driven gears 144 provided on the lower shaft 142 of each rotating shaft 14. When the drive gear 19 rotates, the lower shaft 142 of each rotating shaft 14 rotates, and the upper shaft 141 connected through the universal joint 143 rotates.

Since the rotary table 10 is rotated by a separate rotary table driving motor 60, the rotational speed of the rotary table 10 and the rotational speed of the rotating shaft 14 can be adjusted independently.

As shown in FIG. 4, the plurality of plating barrels 20 includes an outer case 21, an inner case 22, and a lid 23. The outer case 21 is open at the top, and the receiving space is formed to accommodate the inner case 22 mounted through the open top. The upper shaft 141 of the rotating shaft 14 is coupled to the lower end of the outer case 21. An outlet 24 is formed at a lower end of the outer case 21, and the outlet 24 is connected to the hollow 145 of the rotating shaft 14.

The inner case 22 is open at the upper end, and the periphery of the upper end protrudes toward the inner surface of the outer case 21. When the inner case 22 is mounted, a circumference of the upper end of the inner case 22 is fitted to the inner surface of the outer case 21 and is fixed. A space is formed between the outer surface of the inner case 22 and the inner surface of the outer case 21. . The inner case 22 consists of two parts. The upper part of the inner case 22 is made of a mesh 25, the lower part is made of a metal. The lower part of the inner case 22 is a plating liquid container 26 for accommodating the plating liquid and the chip component. The lower metal of the inner case 22 acts as a cathode used for electroplating chip components.

Lid 23 is coupled to the open top of the outer case 21 serves to seal the outer case 21. An inlet 27 is formed in the center of the lid 23. The plating liquid is introduced through the inlet 27, and the introduced plating liquid is stored in the plating liquid container 26 at the lower portion of the inner case 22. The inlet 27 also serves as a passage through which the wire 29 for applying power to the anode 28 contained in the plating liquid stored in the plating liquid container 26 passes.

The rotation angle adjusting means 30 pushes and pulls the upper shaft 141 of the rotating shaft 14 to adjust an angle (declination) formed by the upper shaft 141 and the lower shaft 142. The rotation angle adjusting means 30 has six racks engaged with the pinion 33 and the pinion 33 coupled to the motor 31 installed on the upper disk 11 and the rotating shaft 32 of the motor 31 and performing linear motion. (34). Each rack 34 adjusts the declination by pushing and pulling the top shaft 141.

The power supply (not shown) supplies a pulse current for plating by using the anode 28 and the cathode, which is the inner case 22 of the barrel 20, as two electrodes. The pulsed current ionizes the anode 28 in the plating solution to form a plating layer on the external electrode of the chip component in the plating solution receiving portion 26 of the inner case 22.

The plating liquid supply means 40 is disposed above the barrel 20 as a means for supplying the plating liquid to the barrel 20. The plating liquid supply means 40 is in the form of a hollow disc. An inlet 41 through which the plating liquid flows is formed at the center of the upper surface of the plating liquid supply means 40. The plating liquid introduced through the inlet 41 is discharged through the six outlets 42 formed at regular intervals around the plating liquid supplying means 40 via the interior of the plating liquid supplying means 40. At the inlet 41 of the plating liquid supply means 40, a nickel (Ni) plating liquid supply line 43, tin (Sn) or tin-lead (Sn-Pb) plating liquid supply line 44, and a pure water supply line 45 are provided. Connected. Nickel (Ni) plating liquid, tin (Sn) or tin-lead (Sn-Pb) plating liquid and pure water are introduced into the plating liquid supply means 40 according to the plating step. Pure water is used to wash the plating liquid.

The plating liquid inflow pipe 50 supplies the plating liquid discharged from the plating liquid supply means 40 to the barrel 20. One end of the plating liquid inlet pipe 50 is connected to the outlet 42 of the plating liquid supply means 40, and the other end is connected to the inlet 27 of the barrel 20.

The plating liquid supply means 40 is installed on the main frame 1 so as to be rotatable, and when the rotary table 10 rotates, the plating solution supply means 40 rotates at the same speed as the rotary table 10.

In addition, the barrel plating apparatus may include a controller (not shown). The controller is a rotary table drive motor 60 for revolving the rotary table 10, a motor 18 for adjusting the rotation speed of the barrel 20, a motor 31 for adjusting the rotation angle of the barrel 20 The valve of the plating solution supply line (not shown), the power supply (not shown) for supplying a pulse current for performing the plating to control the plating to proceed automatically.

In addition, the barrel plating apparatus includes a nickel (Ni) plating solution, tin (Sn) or tin-lead (Sn-Pb) plating solution, a nickel (Ni) plating solution storage tank 4 for storing pure water, tin (Sn) or A tin-lead (Sn-Pb) plating liquid storage tank 5 and a pure water storage tank 6 are provided. The storage tanks 4, 5, 6 are connected to the storage tank 3 disposed below the rotating shaft 14 and are installed in the main frame 1.

The operation of the above-described barrel plating apparatus will be described below.

First, nickel (Ni) plating time, tin (Sn) or tin-lead (Sn-Pb) plating time, cleaning time, idle time in nickel plating, rotation speed and rotation angle, idle time in tin or tin-lead plating, Enter plating profile such as rotation speed and rotation angle, idle during cleaning, rotation speed and rotation angle.

Next, the lid 23 of the barrel 20 is opened, and the chip component is put into the inner case 22. At this time, a metal dummy ball for smoothly energizing the chip component and the chip component is added at an appropriate ratio.

Next, when the lid 23 of the barrel 20 is closed and the barrel plating apparatus is operated, the valve of the pure water supply line (not shown) connected to the plating liquid supply means 40 is opened and pure water flows into the plating liquid supply means 40. do. The introduced pure water is supplied to the barrel 20 through the plating liquid inflow pipe 50.

When pure water is sufficiently supplied to the barrel 20, the declination is adjusted by the rotation angle adjusting means 30 operating in accordance with a predetermined plating profile.

Next, the rotary table 10 revolves, and the barrel 20 rotates. Pure water is continuously supplied to the barrel 20, and the pure water overflowed through the mesh 25 from the inner case 22 of the barrel 20 is disposed between the inner case 22 and the outer case 21 of the barrel 20. After passing through the space, the outlet 24 of the outer case 21, the hollow of the rotating shaft 14 in order and is stored in the pure storage tank (6).

When the washing is completed, the supply of pure water is stopped and the nickel plating solution is supplied. At this time, the revolution speed, the rotation speed, and the declination angle are reset according to the plating profile. The power supply supplies a pulse current to the electrode for nickel plating. The pulse current ionizes the anode 28 in the plating liquid to form a nickel plating layer on the external electrode of the chip component in the plating liquid receiving portion 26 of the inner case 22. The nickel plating liquid is stored in the nickel plating liquid storage tank 4 in the same order as pure water.

When the nickel plating is completed, the supply of the nickel plating solution is stopped, and the tin or tin-lead plating solution is supplied. The revolution speed, rotation speed, and declination are reset according to the plating profile. The power supply supplies current according to a defined profile. The pulsed current ionizes the anode in the plating solution to form a tin or tin-lead plating layer on the nickel plating layer of the external electrode of the chip component in the plating solution receiving portion 26 of the inner case 22. The tin or tin-lead plating liquid is stored in the tin or tin-lead plating liquid storage tank 5.

When the tin or tin-lead plating is completed, supply of the tin or tin-lead plating solution is stopped, and pure water is supplied again to proceed with washing. The idle speed, rotation speed and declination are reset according to the plating profile, and no current is supplied.

Finally, when the cleaning is completed, the plating is completed in the barrel 20, the chip component is separated, and dried.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.

10: rotary table 11: upper disc
12: lower disk 14: rotating shaft
141: upper axis 142: lower axis
143: universal joint 144: driven gear
15: through slot 16: through hole
18: Motor 19: Drive Gear
20: barrel 21: outer case
22: inner case 23: lid
24: outlet 25: mesh
26: plating liquid receiving portion 27: inlet
28: anode 30: rotation angle adjusting means
31: motor 33: pinion
34: rack 40: plating liquid supply means
41: entrance 42: exit
50: plating liquid inlet tube 60: rotary table drive motor

Claims (6)

A rotating table including a plurality of rotating shafts including a universal joint coupling the upper shaft and the lower shaft and the upper shaft and the lower shaft, the rotary table rotating about an idle axis;
It is coupled to the upper shaft, the plating liquid receiving portion for receiving the plating object and the plating liquid therein is formed, and having an inlet through which the plating liquid flows in and an outlet through which the plating liquid flows out, and rotates around the upper axis and rotates around the revolving shaft. A plurality of plating barrels to revolve,
A rotation angle adjusting means for pushing and pulling the upper shaft such that the upper shaft is inclined with respect to an extension line of the lower shaft;
And a power supply for supplying current to the anode immersed in the plating liquid receiving portion of the plating barrel and the cathode inside the plating barrel,
The hollow shaft is formed in the rotating shaft, the outlet port barrel plating apparatus in communication with the hollow of the rotating shaft. delete The method of claim 1,
The rotating table is provided with a motor, a plurality of lower shafts of the rotating shaft barrel plating apparatus is provided with a driven gear to rotate in engagement with the drive gear installed on the rotating shaft of the motor. The method of claim 1,
Is disposed above the barrel, and has an inlet through which the plating liquid flows in, a flow path through which the plating liquid flows through the inlet flows, and a plurality of outlets through which the plating liquid flowing along the flow path flows out. Plating solution supply means rotating to the center
One end is connected to the outlet of the plating liquid supply means, the other end of the barrel plating apparatus further comprises a plurality of plating liquid inlet pipe connected to the inlet of the barrel. The method of claim 1,
The rotating table is a barrel plating apparatus that is rotated in connection with a rotary table driving motor installed on the outside of the rotary table by a belt. A rotating table including a plurality of rotating shafts including a universal joint coupling the upper shaft and the lower shaft and the upper shaft and the lower shaft, the rotary table rotating about an idle axis;
It is coupled to the upper shaft, the plating liquid receiving portion for receiving the plating object and the plating liquid therein is formed, and having an inlet through which the plating liquid flows in and an outlet through which the plating liquid flows out, and rotates around the upper axis and rotates around the revolving shaft. A plurality of plating barrels to revolve,
A rotation angle adjusting means for pushing and pulling the upper shaft such that the upper shaft is inclined with respect to an extension line of the lower shaft;
And a power supply for supplying current to the anode immersed in the plating liquid receiving portion of the plating barrel and the cathode inside the plating barrel,
The plating barrel has an outer case coupled to the upper shaft and formed with an outlet, a plating liquid receiving portion disposed inside the outer case, and an upper portion of the plating liquid receiving portion formed of a mesh,
After use, the plating liquid passes through the mesh of the inner case, passes through the space between the outer surface of the inner case and the inner surface of the outer case and is discharged through the outlet of the outer case.

Images