KR100901581B1 - Chip part processing device before plating process using barrel - Google Patents

Abstract

An apparatus for performing a pre-treatment for plating of a chip part is provided to efficiently perform treatment, cleaning, and drying of a chip part by using a rotary barrel. An apparatus for performing a pre-treatment for plating of a chip part includes a rotary barrel(110), a transfer device(120), a silicon-infiltrated part(130), a chip part cleaning part(140), and a chip part drying part. A plurality of chip parts is received in a rotary barrel. The transfer device transfers the rotary barrel to the silicon-infiltrated part. The silicon-infiltrated part infiltrates silicon into the chip part. The chip part cleaning part cleans foreign material attached in an outer surface of the chip part inside the rotary barrel by rotating the rotary barrel inside a cleaning bath. The chip part drying part dries the chip part inside the rotary barrel by rotating the rotary barrel inside a drying chamber(151).

Description

Chip Part Processing Device Before Plating Process Using Barrel}

The present invention relates to a chip component pre-plating apparatus used in the pre-treatment step for plating before the step of plating on the outer surface of the chip component, such as a multi-layer ceramic capacitor (MLCC).

In general, the process of manufacturing chip components such as varistors, chip inductors, and multi-layer ceramic capacitors (MLCCs) includes: 1) uniformly reacting ceramic capacitor main raw materials with additives 2) mix the synthesized ceramic raw material, polymer binder and solvent, 3) mature the mixed slurry in a stable state, and 4) coat the mature ceramic slurry with a certain thickness on the polymer film (PET). And 5) drying the molded tape through a drying furnace, and 6) forming an internal electrode by printing a desired capacitance design value pattern using a silk screen, and 7) forming a paste shape of the printed internal electrode. In order to maintain the ceramic sheet is dried in a drying furnace, 8) the ceramic sheet is laminated in several layers to obtain the desired capacity value, 9) the laminated state Pressed at a strong pressure from the outside to maintain, 10) cutting the stacked ceramic bars into chips of a predetermined size, 11) debinding so that only the binder contained in the cut ceramic chip is removed, 12 ) The chips that have been debindered are fired by heat treatment in a high temperature electric furnace, and 13) the baked chips are polished to handle sharp edges, and 14) external electrodes are formed outside the chip for connection with internal electrodes formed inside the chip. , 15) heat-treating the chip terminated with internal and external electrodes to fix it on the ceramic surface, and 16) apply nickel and tin plating on the external surface of the chip to give solderability to the external electrode of the chip. The chip parts are sorted by capacity variation (J, K, M, Z), the insulation resistance (IR) defects are sorted, and 18) the chip parts are taped and packaged to enable surface mounting.

As described above, since the soldering cannot be immediately performed on the external electrode which has been terminated during the manufacturing process of the chip components, nickel (Ni) and tin (Sn) are sequentially plated with the outermost electrode so that soldering can be performed smoothly. The present invention is directed to an apparatus used before such a plating step and no similar prior art exists. The chip part of the pre-plating step has a gap in the chip part itself does not achieve the purpose of existence of the chip part itself or had a problem of poor performance.

The present invention penetrates silicon into chip components in the pre-plating process of chip parts such as MLCC, washes silicon, etc., which are deposited on electrodes in the process of silicon penetration, and dries the cleaning solution on the outer surface of chip parts during the washing process to chip such as MLCC. An object of the present invention is to provide a chip component pre-plating apparatus for performing a pre-plating process.

In the present invention, in the plating or plating cloth treatment of small chip parts, such as MLCC, chip parts having a rotary barrel for processing chip parts having excellent processing efficiency and excellent drying or cleaning efficiency in the processing, washing and drying steps of the chip parts. It is to provide a pre-plating treatment apparatus.

The present invention penetrates silicon into chip components in the pre-plating process of chip parts such as MLCC, washes silicon, etc., which are deposited on electrodes in the process of silicon penetration, and dries the cleaning solution on the outer surface of chip parts during the washing process to chip such as MLCC. An object of the present invention is to provide a chip component pre-plating apparatus equipped with a rotary barrel for chip component processing, which can efficiently perform a component pre-plating step.

The chip component pre-plating apparatus using the barrel according to the present invention for achieving the object of the present invention, in the chip component processing apparatus, a plurality of chip components in the state of being transferred by the conveying device 120 built-in Barrel 110;

A transfer device 120 provided at an upper portion of the frame 101 to transfer the rotary barrel 110 to the silicon penetration unit 130;

It is provided on one side of the frame 101, by rotating the rotary barrel 110 in the pressure regulating tank 131 to the first rotating means 135 by varying the pressure in the pressure regulating tank 131 inside the silicon. A silicon penetrating unit 130 for penetrating the chip component;

The chip component provided in the frame 101 adjacent to the silicon penetrating unit 130 and positioned inside the barrel 110 while rotating the rotary barrel 110 in the washing tank 141 by the second rotating means 145. A chip component washing unit 140 for washing foreign substances including silicon attached to an outer surface of the washing machine with washing water;

Adjacent to the chip component cleaning unit 140 is provided in the frame 101, by spraying hot air while rotating the rotary barrel 110 in the drying chamber 151 to the third rotating means 155 barrel 110 The chip component drying unit 150 for drying the chip component therein;

In accordance with the present invention, the problems of the prior art are solved, and infiltrates silicon into the chip component in the pre-plating process of the chip component such as MLCC, washes the silicon, etc., which are buried in the electrode in the silicon penetration process, and the outer surface of the chip component in the washing process. There is provided a chip component pre-plating processing apparatus for drying the cleaning liquid on the surface to perform a pre-plating process for chip components such as MLCC.

In addition, in the plating or plating cloth treatment of small chip parts such as MLCCs, the chip parts pre-plating apparatus is equipped with a rotary barrel having excellent processing efficiency and excellent drying or cleaning efficiency in the processing, washing and drying steps of the chip parts. It is to provide.

The present invention penetrates silicon into chip components in the pre-plating process of chip parts such as MLCC, washes silicon, etc., which are deposited on electrodes in the process of silicon penetration, and dries the cleaning solution on the outer surface of chip parts during the washing process to chip such as MLCC. An object of the present invention is to provide a chip component pre-plating apparatus equipped with a rotary barrel capable of efficiently performing a component pre-plating process.

Hereinafter, a chip component pre-plating apparatus equipped with a rotary barrel according to the present invention will be described in detail according to the embodiment shown in the accompanying drawings. 1 is a front view of a chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, Figure 2 is a plan view of a chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, Figure 3 is a present invention 4 is a front view of a chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, FIG. 4 is a front view of a silicon penetration part of the pre-plating apparatus for chip component using a barrel according to an embodiment of the present invention, and FIG. Front view of the chip component cleaning unit of the chip component pre-plating apparatus using a barrel according to an embodiment.

As shown in Figures 1 to 5, the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, the rotary barrel 110, the transfer device 120, the silicon penetrating unit 130 and the chip The component washing unit 140 and the chip component drying unit 150 are configured to be included.

As shown in FIG. 1, the rotary barrel 110 is moved by the transfer device 120 to the place where the device for each process is provided, containing a large number of small chip parts to be processed. That is, it is conveyed by the transfer device 120 in a state where a plurality of chip parts are embedded.

1 to 5, in the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, the transfer device 120 is provided on the top of the frame 101 and the rotary barrel ( 110 is transferred to the silicon infiltration unit 130. The conveying apparatus 120 is driven by a servo motor (not shown) and lifts the barrel 110 in the Z-axis direction and moves it in the X-axis direction.

As shown in Figures 1 to 5, in the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, the silicon penetrating portion 130 is provided on one side of the frame 101, By rotating the rotary barrel 110 in the pressure regulating tank 131 with the first rotating means 135, the pressure inside the pressure regulating tank 131 is varied to infiltrate the silicon into the chip component.

As shown in Figures 1 to 5, in the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, the chip component cleaning unit 140 is adjacent to the silicon penetration unit 130, the frame The water is provided in the 101, the foreign matter containing silicon attached to the outer surface of the chip component located inside the barrel 110, while rotating the rotary barrel 110 in the washing tank 141 to the second rotating means 145 Wash with.

1 to 5, in the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention, the chip component drying unit 150, adjacent to the chip component cleaning unit 140 The chip 101 is provided in the frame 101 and the hot air is sprayed while rotating the rotary barrel 110 in the drying chamber 151 by the third rotating means 155 to dry the chip components inside the barrel 110.

As shown in FIG. 1 or 4, in the chip component pre-plating apparatus using the barrel according to the embodiment of the present invention, the silicon penetrating part 130 is provided with a cover 132 and the cover 132. The first rotating means for rotating the pressure control tank 131 and the rotating barrel 110 located inside the pressure control tank 131 formed by the pressure adjusting means in a closed state) 135 and the silicon supply tank 134 for storing the silicon liquid which is introduced and discharged through the connection pipe 133 into the pressure regulating tank 131.

As shown in FIG. 1 or 4, the silicon infiltration unit 130 further includes a clamp 137 for strongly closing the cover 132 and a cylinder 136 for operating the clamp 137. The cylinder 136 is supported by the frame 101, and the end of the piston rod reciprocating by the cylinder 136 is pinned to the clamp 137.

The operation of the silicon penetrating portion 130 will be described. In the silicon penetrating part 130, when the barrel 110 including the chip component is positioned inside the pressure regulating tank 131 by the moving means 120, the pressure regulating tank 131 is closed and the pressure regulating tank The pressure inside the 131 drops to a vacuum state, and the first rotating means 135 rotates the barrel 110, and when the valve of the connecting pipe 133 is opened, the connecting pipe 133 is opened by a negative pressure. Silicon is introduced into the pressure control tank 131 from the silicon supply tank 134 through the silicon, and the silicon is infiltrated into the chip parts. The silicon supply tank 134 is again reduced.

As shown in FIG. 5, in the chip component pre-plating apparatus using the barrel according to the embodiment of the present invention, the chip component washing unit 140 includes four washing tanks 141a, 141b, 141c, and 141d. It consists of two wash water storage tanks (146a, 146b, 146c, 146d) and a plurality of pipes (T) connecting the wash tank and the wash water storage tank.

As shown in FIG. 5, in the chip component pre-plating apparatus using the barrel according to the exemplary embodiment of the present invention, the new liquid is used in the first chip component cleaning unit 140a and the first chip component cleaning unit 140a. The washing water used in) is sent to the second chip component washing unit 140b for reuse, and the washing water used in the second chip component washing unit 140b is sent to the third chip component washing unit 140c for reuse. The wash water used in the chip component cleaning unit 140c is sent to the fourth chip component washing unit 140d and reused, and the moving unit 120 acquires the barrel 110 from the silicon infiltration unit 130 to obtain the first chip component. The cleaning unit 140a, the second chip component cleaning unit 140b, the third chip component cleaning unit 140c, and the fourth chip component cleaning unit 140d are sequentially moved.

As shown in FIG. 1, in the chip component pre-plating apparatus using the barrel according to the exemplary embodiment of the present invention, the chip component drying unit 150 sprays the hot drying air upward from the lower portion of the drying chamber 151. It is preferable.

Hereinafter, the barrel will be described in detail. 6 is a perspective view of a rotary barrel for chip parts processing (blade and side cover removed state) according to an embodiment of the present invention, Figure 7 is a perspective view of a rotary barrel for chip parts processing (side cover removed state) according to an embodiment of the present invention 8 is a perspective view of a rotary barrel for chip parts processing (side cover removed) according to an embodiment of the present invention, and FIG. 9 is a perspective view of a rotating barrel for chip parts processing according to an embodiment of the present invention (blade and side cover). Mounted state), FIG. 10 is a front view of a rotary barrel for processing chip components according to an embodiment of the present invention, FIG. 11 is a plan view of a rotary barrel for processing chip components according to an embodiment of the present invention, and FIG. It is a side view of the rotary barrel for chip component processing according to the embodiment.

6 to 12, the barrel 110, the gear 12 is provided at both ends, the support shaft 80 is rotatably supported by a rotating shaft (rotated by the power of the driving motor M ( 10) and,

The mesh 30 is coupled to the rotating shaft 10 to rotate integrally with the rotating shaft 10 to form a skeleton of the container, and the container 30 is connected to the skeletal portion 20 to form a vessel through which the container is perforated. And a cylindrical container part 50 configured to be adjacent to the skeletal part 20 and configured of a lid part 40 which penetrates the chip parts into the container and closes the container in a state where the container is perforated.

A blade 60 formed on an outer circumferential surface of the cylindrical container part 50 in a direction parallel to the rotation shaft 10;

It is fixed to the support frame 80 so as not to rotate and its inner diameter is larger than the rotation radius formed by the outer line 62 of the blade 60 is formed in a shape surrounding the tubular container portion 50 and a part of the circumference facing It is configured to include a cut side cover 70.

As shown in FIGS. 6 to 12, the support frame 80 includes two side wall frames 81 rotatably supporting both points of the rotation shaft 10 and a connector 82 connecting the side wall frames 81. ) And the blocking side plates 75 are fixed to the inside of the side wall frame 81, and the side cover 70 is fixed to the blocking side plates 75.

As shown in Figs. 6 to 12, the cylindrical container portion 50 is formed of two rooms, the skeleton portion 20 includes two side skeleton portions 21 and 22, and the side valleys The partition frame skeleton 23 is formed between the partitions 21 and 22, the side meshes 21 and 22 are provided with side meshes, and the partition frame 23 is provided with a partition mesh. The outer peripheral surface mesh is provided between the side frame parts 21 and 22 and the partition frame parts 23.

As shown in Figure 6 to 12, the rotary barrel for chip component processing according to an embodiment of the present invention is the support frame 80, the rotating shaft 10, the cylindrical container portion 50 and the blade 60 and It consists of a side cover 70.

As shown in Figure 6 to 10, in the rotary barrel for processing chip parts according to an embodiment of the present invention, the rotary shaft 10 is provided with gears 12 at both ends or one end and the support frame 80 It is rotatably supported and is rotated by the power of the driving motor (M). As is known, the gear 12 is provided at the end of the rotating shaft 10 and rotates by receiving power from the driving motor M through the gear 12 during the chip component processing. Both ends of the rotating shaft 10 are supported by the support frame 80 through bearings. Unlike shown, only one end of the gear 12 may be provided.

6 to 10, the cylindrical container portion 50 is coupled to the rotary shaft 10, rotates integrally with the rotary shaft 10, and the skeleton portion 20 and the skeleton portion of the container skeleton ( 20 is connected to the mesh 30 to form a container through which the inside and the outside, and the cover portion 40 is formed adjacent to the skeleton portion 20 and penetrates the chip parts into the container and closes the container in a state through which it can be perforated. It consists of. The skeleton portion 20 is configured to include two side skeleton portions 21 and 22 positioned inside the side wall frame 81 and having side openings. Preferably, the partition frame 23 is formed between the side frame portions 21 and 22. As shown, the cylindrical container portion 50 is preferably a hexagonal cylindrical shape, but is not necessarily limited thereto, and the cross-sectional shape may be a polygonal or cylindrical body.

As shown in Figure 7 and 8, in the rotary barrel for chip component processing according to an embodiment of the present invention, the blade 60 is parallel to the rotation axis 10 on the outer peripheral surface of the cylindrical container portion 50 Is formed in the direction. The blade 60 rotates integrally with the cylindrical container part 50. Four blades 60 are preferably formed on each of the outer circumferential surfaces of the hexagonal cylindrical container part 50, one each on the surface where the cover 40 is not formed, but the number is not limited to four.

As shown in Figure 9, in the rotary barrel for chip component processing according to an embodiment of the present invention, the side cover 70 is fixed to the support frame 80 is not rotated and its inner diameter is the outside of the blade 60 Larger than the rotation radius formed by the line 62 is formed in a shape surrounding the cylindrical container portion 50 is a shape in which a portion of the circumference is cut facing each other. Although only the upper part of the side cover 70 seems to be opened by FIG. 4, in fact, the lower part is also opened symmetrically.

As shown in FIG. 6, in the rotary barrel for processing chip components according to the exemplary embodiment of the present invention, the support frame 80 includes two sidewall frames 81 rotatably supporting both points of the rotation shaft 10. ) And a connector 82 connecting the side wall frame 81. Of course, the shape of the connector 82 in the present invention is not limited to the rod shape.

As shown in FIG. 6, the side wall frame 81 connects the inner closed curved edge 81a, the outer closed curved edge 81b, and the inner closed curved edge 81a and the outer closed curved edge 81b. It may be composed of a radial reinforcing rod (81c). The inner closed curved edge 81a may have a quadrangular shape, and four rod-shaped connecting holes 82 may be provided at each quadrangular point.

As shown in Figure 7 to 9, in the rotary barrel for chip component processing according to an embodiment of the present invention, the blocking side plate 75 is fixed to the inner side of the side wall frame 81 and the side cover 70 ) Is preferably fixed to the blocking side plate (75). Since the blocking side plate 75 is fixed to the side wall frame 81, it does not rotate even when the rotating shaft 10 rotates. The side cover 70 may be fixed to one point of the support frame 80 when the blocking side plate 75 does not exist separately, even in this case it belongs to the scope of the present invention.

As shown in FIG. 6, the side wall frame 81 includes an opening portion 81d, and the skeleton portion 20 is positioned inward of the side wall frame 81 and has two side opening portions. The side frame portions 21 and 22 are included, and the side openings of the side frame portions 21 and 22 are provided with side meshes, and the fluid outside the cylindrical container portion 50 receives the side meshes. It is preferable to be configured to be freely introduced into the cylindrical container portion 50 through.

As shown in FIG. 6, in the rotary barrel for chip component processing according to an embodiment of the present invention, the cylindrical container part 50 is formed of two rooms, and the skeleton part 20 is two side skeletons. It is comprised including the parts 21 and 22, The partition frame skeleton part 23 is formed between the side frame parts 21 and 22, The side frame parts 21 and 22 are provided with the side mesh, and the partition wall It is preferable that the partition mesh is provided in the skeletal structure 23 for the outer wall, and the outer peripheral mesh is provided between the side skeletal sections 21 and 22 and the partition frame 23.

As shown in Figure 6, in the rotary barrel for chip component processing according to an embodiment of the present invention, the cover portion 40 is formed on each of the two symmetrical surface of the six-cylindrical cylindrical container portion 50 are all four It is preferably formed. The side cover 70 is preferably a cylindrical side cover 70 in which a portion of the circumference is cut out facing each other, but it is obvious that the shape of the side cover 70 is not necessarily limited to the cylindrical body in which it is cut.

The operation of the rotary barrel for chip component processing according to an embodiment of the present invention will be described. For example, in the post-silicon washing process performed in the pre-plating step, the barrel is rotated at 10 to 20 RPM in the washing tank while being immersed in the washing water, wherein the blade 60 causes the washing water to vortex to wash water into the barrel. It is advantageous to increase the cleaning efficiency by increasing the effective speed of the entry of and the washing water flowing on the outer peripheral surface of the chip parts. This advantageous action is increased as the chip parts such as MLCC to a very small (0.5 ~ 1mm) and this action can occur even in the plating step performed in the immersion state in the plating bath to increase the plating efficiency.

In a drying process performed after plating or washing, for example, air drying air is sprayed upward from the lower part of the barrel, and the hot air is raised upward into the side cover 70 through a cutout formed in the lower part of the side cover 70. It enters and exits through an incision formed in the top of the side cover 70. At this time, the side cover 70 serves to concentrate the hot air toward the cylindrical container part 50.

In this drying process, the barrel is rotated at a low speed of about 5 RPM in the drying chamber, and the blade 60 is more resistant to the rotation of the blade 60 than the flow rate of the dry air sprayed because the static characteristics are stronger than the vortex generated by the rotation. The flow velocity of the vortices generated by the airflow is negligible, and the blade 60 cuts dry air that enters the inside of the side cover 70 at a certain moment to guide the inside of the cylindrical container part 50. Will perform. This increases the drying efficiency and this advantageous action is more advantageous for small chip parts.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, and the scope of the present invention is defined by the following claims, and equivalent scope of the present invention. It will include various modifications and variations belonging to.

The reference numerals set forth in the claims below are merely to aid the understanding of the present invention, not to affect the interpretation of the scope of the claims, and the scope of the claims should not be construed narrowly.

1 is a front view of a chip component pre-plating apparatus using a barrel according to an embodiment of the present invention.

Figure 2 is a plan view of a chip component pre-plating apparatus using a barrel in accordance with an embodiment of the present invention.

Figure 3 is a side view of the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention.

Figure 4 is a front view of the silicon penetrating portion of the chip component pre-plating apparatus using a barrel in accordance with an embodiment of the present invention.

5 is a front view of a chip component cleaning unit of the chip component pre-plating apparatus using a barrel according to an embodiment of the present invention.

Figure 6 is a perspective view of a rotary barrel (chip and side cover removed) for processing chip parts according to an embodiment of the present invention.

7 is a perspective view of a rotary barrel (side cover removed) for processing chip parts according to an embodiment of the present invention.

8 is a perspective view of a rotary barrel (side cover removed) for processing chip parts according to an embodiment of the present invention.

Figure 9 is a perspective view of a rotating barrel for chip parts processing (blade and side cover mounting state) according to an embodiment of the present invention.

10 is a front view of a rotary barrel for processing chip parts according to an embodiment of the present invention.

11 is a plan view of a rotary barrel for chip component processing according to an embodiment of the present invention.

12 is a side view of a rotary barrel for chip component processing according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

101: frame 110: rotary barrel

120: transfer device 130: silicon penetration

131: pressure control tank 132: cover

133: connector 134: silicon supply tank

135: first rotating means 136: cylinder

137: clamp

140, 140a, 140b, 140c, 140d: chip parts cleaning part

141, 141a, 141b, 141c, 141d: washing tank

145: second rotating means 146, 146a, 146b, 146c, 146d: washing water storage tank

150: chip component drying unit 151: drying chamber

155: third rotating means

10: shaft 12: gear

20: skeletal part 21, 22: side skeleton

23: bulkhead skeleton portion 30: mesh

40: cover 50: cylinder type container

60: blade 62: blade outer line

70 side cover 75 blocking side plate

80: support frame 81: side wall frame

81a: Inner closed curve border 81b: Outer closed curve border

81c: radial reinforcement 81d: side wall frame opening

82: connector

Claims (10)

delete In the chip component processing apparatus, A rotary barrel 110 which is conveyed by the conveying apparatus 120 in a state where a plurality of chip parts are embedded; A transfer device 120 provided at an upper portion of the frame 101 to transfer the rotary barrel 110 to the silicon penetration unit 130; It is provided on one side of the frame 101, by rotating the rotary barrel 110 in the pressure regulating tank 131 to the first rotating means 135 by varying the pressure in the pressure regulating tank 131 inside the silicon. A silicon penetrating unit 130 for penetrating the chip component; The chip component provided in the frame 101 adjacent to the silicon penetrating unit 130 and positioned inside the barrel 110 while rotating the rotary barrel 110 in the washing tank 141 by the second rotating means 145. A chip component washing unit 140 for washing foreign substances including silicon attached to an outer surface of the washing machine with washing water; Adjacent to the chip component cleaning unit 140 is provided in the frame 101, by spraying hot air while rotating the rotary barrel 110 in the drying chamber 151 to the third rotating means 155 barrel 110 The chip component drying unit 150 for drying the chip components therein; The barrel 110, A rotary shaft 10 provided at both ends thereof and rotatably supported by the support frame 80 and rotated by the power of the driving motor M; The mesh 30 is coupled to the rotating shaft 10 to rotate integrally with the rotating shaft 10 to form a skeleton of the container, and the container 30 is connected to the skeletal portion 20 to form a vessel through which the container is perforated. And a cylindrical container part 50 configured to be adjacent to the skeletal part 20 and configured of a lid part 40 which penetrates the chip parts into the container and closes the container in a state where the container can be perforated. A blade 60 formed on an outer circumferential surface of the cylindrical container part 50 in a direction parallel to the rotation shaft 10; It is fixed to the support frame 80 so as not to rotate and its inner diameter is larger than the rotation radius formed by the outer line 62 of the blade 60 is formed in a shape surrounding the tubular container portion 50 and a part of the circumference facing Chip parts pre-plating apparatus using a barrel, characterized in that the barrel 110 is configured to include a cut side cover (70). In the barrel 110 of claim 2, The support frame 80 is composed of two side wall frame 81 for rotatably supporting both points of the rotation shaft 10 and the connector 82 for connecting the side wall frame 81, Blocking side plate (75) is provided inside each of the side wall frame (81) and the side cover 70 is fixed to the block side plate (75), characterized in that the chip component pre-plating apparatus using a barrel. In the barrel 110 of claim 2, The cylindrical container part 50 is formed of two rooms, The skeleton portion 20 includes two side skeleton portions 21 and 22, A partition frame 23 is formed between the side frame portions 21 and 22, Side meshes are provided on the side frame portions 21 and 22, The partition mesh is provided in the partition frame 23 for partition walls, An apparatus for pre-plating chip parts using barrels, wherein an outer circumferential mesh is provided between the side frame portions (21, 22) and the partition frame portions (23). The method of claim 2, The transfer device 120 is driven by a servo motor (not shown) and the chip component pre-plating apparatus using a barrel, characterized in that to lift the barrel 110 in the Z-axis direction and move in the X-axis direction. The method of claim 2, The silicon penetrating unit 130, A pressure adjusting tank 131 provided with a cover 132 and configured to control internal pressure by a pressure adjusting means in a state where the cover 132 is closed; First rotating means 135 for rotating the rotary barrel 110 located in the pressure control tank 131, Pre-plating device for chip parts using a barrel, characterized in that consisting of a silicon supply tank (134) for storing the silicon liquid introduced, discharged through the connection pipe 133 into the pressure control tank (131). The method of claim 6, The silicon penetrating portion 130 further includes a clamp 137 for strongly closing the cover 132 and a cylinder 136 for operating the clamp 137, wherein the cylinder 136 is a frame ( An end of the piston rod supported by 101 and reciprocating by the cylinder 136 is pinned to the clamp 137, When the barrel 110 including the chip component is positioned inside the pressure regulating tank 131 by the moving means 120, the pressure regulating tank 131 is closed and the pressure inside the pressure regulating tank 131 is in a vacuum state. The first rotating means 135 rotates the barrel 110, and when the valve of the connecting pipe 133 is opened, the pressure from the silicon supply tank 134 through the connecting pipe 133 by a negative pressure Silicon flows into the control tank 131 and the silicon is infiltrated into the chip component. When the silicon penetration is completed, the pressure inside the pressure control tank 131 is increased above atmospheric pressure so that the silicon is returned to the silicon supply tank 134. Chip component pre-plating apparatus using a barrel, characterized in that the reduction. The method of claim 2, The chip component cleaning unit 140 has a plurality of pipes (T) connecting four washing tanks (141a, 141b, 141c, and 141d) and four washing water storage tanks (146a, 146b, 146c, and 146d) to the washing tank and the washing water storage tank. Chip component pre-plating apparatus using a barrel, characterized in that consisting of). The method of claim 8, The new liquid is used in the first chip component cleaning unit 140a, The wash water used in the first chip part washing unit 140a is sent to the second chip part washing unit 140b for reuse.  The washing water used in the second chip part washing unit 140b is sent to the third chip part washing unit 140c for reuse.   The washing water used in the third chip part washing unit 140c is sent to the fourth chip part washing unit 140d for reuse. The moving unit 120 acquires the barrel 110 from the silicon penetrating unit 130 to obtain the first chip component cleaning unit 140a, the second chip component cleaning unit 140b, the third chip component cleaning unit 140c, And a chip component pre-plating apparatus using a barrel, which moves to the fourth chip component washing unit 140d in order. The method of claim 2, The chip component drying unit 150 is a chip component pre-plating apparatus using a barrel, characterized in that for spraying the hot drying air upward from the drying chamber 151.

Images