KR101251962B1 - LED package - Google Patents
LED package Download PDFInfo
- Publication number
- KR101251962B1 KR101251962B1 KR1020110085159A KR20110085159A KR101251962B1 KR 101251962 B1 KR101251962 B1 KR 101251962B1 KR 1020110085159 A KR1020110085159 A KR 1020110085159A KR 20110085159 A KR20110085159 A KR 20110085159A KR 101251962 B1 KR101251962 B1 KR 101251962B1
- Authority
- KR
- South Korea
- Prior art keywords
- light
- wavelength
- led chip
- led package
- molding part
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a light emitting diode package capable of improving luminance by improving light extraction efficiency for a specific wavelength, comprising: a mold frame in which a pair of lead electrodes are coupled and an accommodation space is formed therein; An LED chip mounted on the lead electrode on one side; A molding part filling the storage space while sealing the LED chip; And a wavelength conversion layer disposed above the molding portion.
Description
The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package capable of improving luminance by improving light extraction efficiency for a specific wavelength.
Light emitting diodes (hereinafter referred to as LEDs) are light emitting devices made of semiconductors, which are more stable and reliable than other light emitting devices, and have a longer lifespan. In addition, since it can be driven by a voltage of several V and several tens of mA, the power consumption is small. Recently, an LED package capable of implementing white light or various colors has been developed, and its application field is gradually expanding. .
As a method of manufacturing a white light LED package, a combination of red, green, and blue LED chips causes white to appear or a combination of LED chips emitting a specific color and phosphors emitting a specific color. The white light LED package currently commercially used is mainly used in the latter way of sealing a resin in which yellow phosphor is dispersed in a blue LED chip. That is, the light generated from the blue LED chip and the yellow phosphor emits light of different wavelengths, and the two light having different wavelengths are mixed to output white light.
1 is a longitudinal cross-sectional view showing a LED package according to the prior art, Figure 2 is a graph showing the wavelength of light emitted from the LED package of FIG. As can be seen in FIG. 1, the
In general, the
In addition, the light emitted from the
The present invention has been proposed to solve the above problems, and an object of the present invention is to provide a LED package that can improve the light emission efficiency by forming a pattern for inducing light emission on the surface of the molding part.
Another object of the present invention is to provide an LED package capable of improving luminance by improving light emission efficiency for light of a specific wavelength band substantially contributing to the appearance of white light.
The present invention for achieving the above object, a pair of lead electrodes are coupled, the mold frame is formed in the storage space therein; An LED chip mounted on the lead electrode on one side; A molding part filling the storage space while sealing the LED chip; And a wavelength conversion layer disposed above the molding portion.
The wavelength conversion layer may be disposed at a predetermined interval so as to secure an air layer between the molding parts, and a light scattering pattern is formed on at least one surface of the upper and lower surfaces. In addition, a light extraction pattern may be formed on the upper surface of the molding part.
According to the present invention having the structure as described above, by inducing the light emitted from the LED chip to the outside by the light extraction pattern formed on the surface of the molding part can improve the light output efficiency, in particular wavelength conversion disposed on the molding part The layer can improve the extraction efficiency of light in the wavelength band exhibiting white light, thereby improving the brightness of the LED package.
1 is a longitudinal sectional view showing an LED package according to the prior art;
2 is a graph showing the spectral characteristics of the light emitted from the LED package of FIG.
3 is a longitudinal sectional view showing an LED package according to an embodiment of the present invention;
4 is a graph showing the spectral characteristics of the light emitted from the LED package of FIG.
5 is a longitudinal sectional view showing an LED package according to another embodiment of the present invention, and
6 is a longitudinal cross-sectional view showing an LED package according to another embodiment of the present invention.
The technical problem achieved by the present invention and the practice of the present invention will be apparent from the preferred embodiments described below. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
3 is a longitudinal cross-sectional view showing an LED package according to an embodiment of the present invention, Figure 4 is a graph showing the spectral characteristics of the light for the LED package of FIG. As shown in Figure 3, the
Here, the
The
The
In the
In general, the
Meanwhile, in the present invention, the
In addition, in the present invention, the
In addition, the
In the
5 and 6 are longitudinal cross-sectional views illustrating an LED package according to another embodiment of the present invention. FIG. 5 illustrates another example of the wavelength conversion layer, and FIG. 6 illustrates another example of the molding part.
First, in the
In addition, the LED package according to the embodiment of FIG. 6 may be configured to intervene the
Although the embodiments of the present invention have been described with reference to the present invention, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.
100: LED package 110: mold frame
120: lead electrode 130: LED chip
140: Molding part
141: phosphor 142: fluorescent film
150: light extraction sheet 151: light extraction pattern
160: wavelength-changing layer 161: light scattering pattern
170: air layer
Claims (4)
An LED chip mounted on the lead electrode on one side;
A molding part filling the storage space while sealing the LED chip; And
Including; a wavelength conversion layer disposed on the molding portion above,
The wavelength conversion layer is disposed at a predetermined interval so that an air layer is secured between the molding parts.
LED scattering pattern is formed on at least one surface of the upper and lower surfaces.
LED package, characterized in that the light extraction pattern is formed on the upper surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110085159A KR101251962B1 (en) | 2011-08-25 | 2011-08-25 | LED package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110085159A KR101251962B1 (en) | 2011-08-25 | 2011-08-25 | LED package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130022251A KR20130022251A (en) | 2013-03-06 |
KR101251962B1 true KR101251962B1 (en) | 2013-04-08 |
Family
ID=48174959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110085159A KR101251962B1 (en) | 2011-08-25 | 2011-08-25 | LED package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101251962B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022145567A1 (en) * | 2020-12-28 | 2022-07-07 | 삼성전자주식회사 | Display apparatus and method for producing same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102075574B1 (en) * | 2013-05-20 | 2020-02-11 | 엘지이노텍 주식회사 | Light emitting device, method for fabricating the same and lighting system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100665219B1 (en) * | 2005-07-14 | 2007-01-09 | 삼성전기주식회사 | Wavelengt-converted light emitting diode package |
JP2007109947A (en) * | 2005-10-14 | 2007-04-26 | Toyoda Gosei Co Ltd | Phosphor plate and light-emitting device provided with the same |
JP2009105379A (en) * | 2007-10-05 | 2009-05-14 | Panasonic Electric Works Co Ltd | Light-emitting device |
-
2011
- 2011-08-25 KR KR1020110085159A patent/KR101251962B1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100665219B1 (en) * | 2005-07-14 | 2007-01-09 | 삼성전기주식회사 | Wavelengt-converted light emitting diode package |
JP2007109947A (en) * | 2005-10-14 | 2007-04-26 | Toyoda Gosei Co Ltd | Phosphor plate and light-emitting device provided with the same |
JP2009105379A (en) * | 2007-10-05 | 2009-05-14 | Panasonic Electric Works Co Ltd | Light-emitting device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022145567A1 (en) * | 2020-12-28 | 2022-07-07 | 삼성전자주식회사 | Display apparatus and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
KR20130022251A (en) | 2013-03-06 |
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