KR101248731B1 - Lighting apparatus having optic-semiconductor - Google Patents

Lighting apparatus having optic-semiconductor Download PDF

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Publication number
KR101248731B1
KR101248731B1 KR1020110037792A KR20110037792A KR101248731B1 KR 101248731 B1 KR101248731 B1 KR 101248731B1 KR 1020110037792 A KR1020110037792 A KR 1020110037792A KR 20110037792 A KR20110037792 A KR 20110037792A KR 101248731 B1 KR101248731 B1 KR 101248731B1
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KR
South Korea
Prior art keywords
light source
heat sink
optical semiconductor
vent
source module
Prior art date
Application number
KR1020110037792A
Other languages
Korean (ko)
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KR20120013880A (en
Inventor
김동수
강석진
정민아
Original Assignee
주식회사 포스코아이씨티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to KR1020110037792A priority Critical patent/KR101248731B1/en
Application filed by 주식회사 포스코아이씨티 filed Critical 주식회사 포스코아이씨티
Priority to CN201180044878.XA priority patent/CN103124876B/en
Priority to PCT/KR2011/005715 priority patent/WO2012018231A1/en
Priority to EP11814831.1A priority patent/EP2602546A4/en
Priority to CN201510138057.2A priority patent/CN104748095A/en
Priority to US13/198,963 priority patent/US20120033419A1/en
Priority to JP2011173368A priority patent/JP5166580B2/en
Publication of KR20120013880A publication Critical patent/KR20120013880A/en
Priority to JP2012111002A priority patent/JP5073118B2/en
Priority to JP2012233991A priority patent/JP5367898B2/en
Priority to US13/749,316 priority patent/US8894247B2/en
Priority to US13/748,981 priority patent/US8801231B2/en
Application granted granted Critical
Publication of KR101248731B1 publication Critical patent/KR101248731B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Disclosed are an optical semiconductor lighting apparatus capable of improving heat radiation efficiency and dustproof efficiency. Such an optical semiconductor lighting device includes a housing in which one side of the housing is open, a light source module disposed in the housing and including at least one optical semiconductor element, and disposed adjacent to the light source module to introduce air into the light source module. ) And a reflector configured to reflect light generated from the light source module to determine an irradiation range of the light. In the housing is formed a movement path for outflowing at least a portion of the air introduced by the fan to the outside through the light source module. As such, at least a part of the air blown into the light source module by the fan is leaked to the outside through the movement path in the housing, thereby preventing the external dust from moving to the light source module.

Description

LIGHTING APPARATUS HAVING OPTIC-SEMICONDUCTOR}

The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus disposed in a workplace such as a factory to generate light.

Generally, incandescent lamps, fluorescent lamps, and the like are used as light sources used in lighting devices, but recently, LED devices such as light emitting diodes (LEDs) are employed. The LED device has a number of advantages such as high luminous efficiency, low power consumption and environmentally friendly, the trend of increasing the technical field using the LED device.

The lighting device having the LED element may be used as a room light in a home or an office, but may also be used as a factory in a workshop where automobile assembly, steelmaking work, and sewing work are performed. However, a plurality of dusts or foreign matters may be present in the workplace, and the dusts or foreign matters may penetrate into the lighting apparatus, causing failure of the lighting apparatus, or reducing luminous efficiency and heat radiation efficiency. In particular, when the dust or foreign matter sticks to the reflection shade of the lighting device, the reflection efficiency and heat dissipation efficiency of the reflection shade may be reduced or the beauty of the appearance may be damaged. In addition, in order to remove the dust or foreign matter, the operator has to clean or repair the lighting device every predetermined period, which may cause a problem that the maintenance cost increases. In addition, the LED device has a longer lifespan than incandescent lamps, fluorescent lamps, etc., so that it can be used for a long time in the workplace, and the heat dissipation problem of lighting is emerging as an important issue.

Therefore, the present invention is to solve the above problems, the problem to be solved by the present invention to prevent dust or foreign matter penetrate into the inside or stick to the reflection shade, etc. to improve the luminous efficiency, heat radiation efficiency, reflection efficiency and maintenance It is to provide an optical semiconductor lighting device that can reduce the cost.

Optical semiconductor lighting apparatus according to an embodiment of the present invention includes a housing, a light source module, a fan (fan) and a reflector.

The housing is open at one side. The light source module is disposed in the housing and includes at least one optical semiconductor element. The fan is disposed adjacent to the light source module and introduces air into the light source module. The reflection shade reflects the light generated from the light source module to determine the irradiation range of the light. In the housing is formed a movement path for outflowing at least a portion of the air introduced by the fan to the outside through the light source module.

The optical semiconductor device may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electro-luminescence device (EL).

The optical semiconductor lighting apparatus may further include a heat dissipation unit for dissipating heat generated from the light source module. The heat dissipation unit may include at least one of a heat sink, a heat pipe, and a heat spreading member.

The heat dissipation unit may include a heat sink having a heat sink body disposed adjacent to the light source module to absorb and release heat generated from the light source module. The heat sink body may be provided with a heat sink vent for passing at least a portion of the air moved to the heat sink by the fan, the light source module to move the air passing through the heat sink vent to the lower portion of the light source module. The light source vent may be formed, and the movement path may be formed by the heat sink vent and the light source vent.

The light source module may include a printed circuit board having the semiconductor device disposed on one surface thereof, the other surface of the light source module facing the heat sink body adjacent to the heat sink body, and having the light source vent.

The heat sink may include an outer lower side wall formed along an edge of the heat sink body, and the light source module may be disposed in a light source receiving groove formed on one side of the heat sink body by the outer lower side wall. The optical semiconductor lighting apparatus may further include a diffuser plate coupled to the outer lower side wall to cover the light source receiving groove and having a plate vent formed at a position corresponding to the light source vent.

The heat sink vent may include a central vent formed at the center of the heat sink body, and the light source vent may include a center vent of the substrate formed on the printed circuit board to correspond to the central vent. The heat sink may further include a central protrusion wall formed in the heat sink body corresponding to the central vent hole, and the printed circuit board may be coupled to the center vent hole of the substrate by being inserted into the central protrusion wall.

The heat sink vents may further include a plurality of outer vents spaced apart from each other along an edge of the heat sink body, and the light source vents may be formed on the printed circuit board to correspond to the outer vents. It may further include them.

The heat sink body may include a base plate disposed adjacent to the light source module, and a plurality of heat dissipation protrusions formed on one surface of the base plate opposite to the light source module.

The heat dissipation protrusions may be radially and spirally shaped to rotate in the same direction as the rotation direction of the fan with respect to the center of the base plate, and may be spaced apart from each other. The heat dissipation protrusions have radial and helical shapes with respect to the center of the base plate and are spaced apart from each other, and have radial and helical shapes with respect to the center of the base plate and have an outer edge than the first protrusions. The second protrusions may be disposed between the first protrusions, respectively.

One side of the housing corresponding to the reflection shade may be formed with an outer vent for moving a portion of the air introduced by the fan to the outer surface of the reflection shade.

A plurality of lower support parts may be formed at a lower end of the housing to protrude toward the edge of the heat sink body and be spaced apart from each other, and to be coupled to an edge of the heat sink body.

A plurality of inner support parts may be formed on an inner surface of the housing to be spaced apart from each other by protruding toward some of the heat dissipation protrusions and to be coupled to some of the heat dissipation protrusions. Some of the heat dissipation protrusions may be formed with stepped projections for coupling with the inner support parts, respectively.

The heat sink may include an outer upper side wall formed along an edge of the heat sink body and having an outer vent hole coupled to one end of the housing and moving some of the air introduced by the fan to an outer surface of the reflection shade. .

A plurality of edge vents may be formed at an edge of the heat sink body to move some of the air introduced by the fan to an inner side surface of the reflection shade.

An antifouling coating antifouling film may be formed on the surface of the reflecting shade to prevent dust or foreign matter from sticking.

The optical semiconductor lighting apparatus may further include a dust collecting module disposed on the reflecting shade to collect dust in the air. The dust collecting module may include a dust filter for collecting the dust, and a filter fixing unit having a plurality of filter ventilation holes for fixing the dust filter to the reflection shade and allowing air to pass through. A dust collecting module support part supporting the dust collecting module may be formed at a lower end of the reflection shade.

The optical semiconductor lighting apparatus may further include an illumination controller for controlling the fan and the light source module.

The lighting control unit may control the light source module to generate light of any color for notifying the failure of the fan when the fan does not rotate or rotates at a speed lower than a reference value.

The optical semiconductor lighting apparatus may further include a temperature sensor disposed in the housing and providing a temperature value in the housing to the lighting controller, wherein the lighting controller controls the fan so that the rotation speed is changed according to the temperature value. can do.

An air inlet may be formed at an upper end of the housing to allow external air to move into the housing, and the lighting controller controls the fan to rotate in a reverse direction at any time in order to remove dust accumulated around the air inlet. can do.

The housing may include a case body for opening and closing the upper and lower parts thereof, and a top cover coupled to the case body to cover an upper portion of the case body, and a case body accommodating the fan and the light source module therein.

The upper cover may be formed with an air inlet for moving outside air into the housing. The air inlet may include a plurality of air inlet holes spaced apart from each other in a radial and spiral shape rotating in the same direction as the rotation direction of the fan with respect to the center of the upper cover.

The upper cover may be spaced apart from the upper end of the case body to form a side inlet for moving outside air into the housing.

The outer surface of the case body may be formed with a plurality of stripe grooves or a plurality of stripe protrusions disposed spaced apart from each other.

According to the optical semiconductor lighting apparatus as described above, as some of the air blown by the light source module is moved to the lower part of the light source module through the movement path in the housing, it is possible to prevent the external dust from moving to the light source module side, the reflection shade Dust attached to the inner side of the can be removed. In addition, as some of the air blown by the light source module is moved to the outer surface of the reflecting shade through the outer vent formed between the lower end of the housing and the reflecting shade, it is possible to remove dust attached to the outer surface of the reflecting shade. . At this time, as the dust collecting module is disposed at the lower end of the reflection shade, it is possible to purify the air in the factory or workshop by removing the dust contained in the air.

Therefore, the optical semiconductor lighting apparatus of the present invention has a self-clearing function for removing dust inside and outside the housing, so that the failure of the lighting apparatus occurs due to dust or foreign matter, or the luminous efficiency and heat radiation efficiency are deteriorated. Preventive maintenance costs can be reduced as maintenance periods increase.

1 is a perspective view showing an optical semiconductor lighting apparatus according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view showing the optical semiconductor lighting device of FIG.
3 is a cross-sectional view illustrating one end surface of the optical semiconductor lighting apparatus of FIG. 1.
4 is a block diagram illustrating a driving relationship of the optical semiconductor lighting apparatus of FIG. 1.
5 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a second embodiment of the present invention.
6 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a third embodiment of the present invention.
7 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fourth embodiment of the present invention.
8 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fifth embodiment of the present invention.
9 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a sixth embodiment of the present invention.
10 and 11 are plan views illustrating the arrangement of the heat dissipation protrusions of the heat sink of FIG. 9.
FIG. 12 is an enlarged cross-sectional view of part A of FIG. 9.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text.

It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms “comprise,” “have,” “comprise,” and the like are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification. It should be understood that no other features or numbers, steps, actions, components, parts, or combinations thereof are excluded in advance. In addition, the word "A is formed on B" means "A can be formed anywhere above B" and is not interpreted to be limited to only "A is formed only on the surface of B".

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

≪ Example 1 >

1 is a perspective view showing an optical semiconductor lighting apparatus according to a first embodiment of the present invention, Figure 2 is an exploded perspective view showing an exploded optical semiconductor lighting apparatus of Figure 1, Figure 3 is an optical semiconductor lighting of Figure 1 It is sectional drawing which shows one end surface of an apparatus.

1, 2 and 3, the optical semiconductor lighting apparatus according to the present embodiment is a housing (HS), heat sink 300, fan (fan, 400), light source module 500, diffuser plate 600 ), A sealing member 610, a plate fixing unit 620 and a reflection shade 700.

The housing HS has an inner space capable of accommodating the fan 400 and the like. At this time, the lower portion of the housing (HS) is open (open), the upper portion of the housing (HS) is formed with an air inlet 210 for moving the outside air into the inner space.

Specifically, for example, the housing HS may include a case body 100 in which the internal space is formed and an upper cover 200 coupled to the case body 100. The upper and lower portions of the case body 100 are open, and the upper cover 200 is coupled to the case body 100 to cover the upper portion of the case body 100. The case body 100 may be formed in a cylindrical shape, as shown in FIG. The case body 100 may be formed of a synthetic resin, and the upper cover 200 may be formed of a synthetic resin or a metal material, for example, an aluminum alloy.

The upper cover 200 is formed with the air inlet 210 through which the outside air passes. The air inlet 210 includes first inlet holes 212 having a shape extending from the center of the upper cover 200 to the outside, and second inlet holes 214 having a circular or polygonal shape. can do. The first and second inflow holes 212 and 214 may be spaced apart from each other in a radial shape with respect to the center of the upper cover 200. In addition, the first and second inlet holes 212 and 214 may be formed in a spiral shape corresponding to the rotation direction of the fan 400 to be described later.

On the other hand, the lower end of the case body 100 is formed with an outer vent 110 for moving the air present in the inner space to the outer surface of the reflection shade 700 to be described later. The case body 100 has a plurality of bottom support parts 120 protruding downwardly to be spaced apart from each other, and as a result, the outer vent 110 may be divided into a plurality of parts by the bottom support parts 120. have.

The heat sink 300 is disposed to cover the lower portion of the case body 100 and is coupled to the case body 100. For example, the heat sink 300 may be fixed to the bottom support parts 120 of the case body 100. The heat sink 300 may be formed of a metal alloy including a material capable of absorbing heat generated from the light source module 500 to be described later to be released to the outside, for example, aluminum or magnesium. In addition, the heat sink 300 may be formed in a structure capable of well dissipating heat absorbed from the light source module 500 to the outside. Specifically, the heat sink 300 may include a base plate 310, a plurality of heat dissipation protrusions 320, an outer lower side wall 330, and a central protruding wall 340.

The base plate 310 may be disposed to cover a lower portion of the case body 100, coupled to the case body 100, and may receive heat directly from the light source module 500. At this time, the edge portion of the base plate 310 may be coupled to the lower support portions 120 of the case body 100 to be fixed. The base plate 310 may be provided with a heat sink vent 312 for moving the air present in the inner space to the lower portion of the heat sink 300, wherein the heat sink vent 312 is the base It may include a central vent (312a) formed in the center of the plate 310.

The heat dissipation protrusions 320 are formed on an upper surface of the base plate 310 facing the case body 100 and are disposed in the inner space, and receive heat from the base plate 310 to be discharged to the outside. Can be. The heat dissipation protrusions 320 may have various structures and arrangements having excellent heat dissipation efficiency. For example, the heat dissipation protrusions 320 may correspond to the first and second air inlet holes 212 and 214 of the upper cover 200. It may have a layout. Specifically, the heat dissipation protrusions 320 are radially and helically shaped and spaced apart from each other to correspond to the first and second air inlet holes 212 and 214 with respect to the center of the base plate 310. Can be deployed. That is, the heat dissipation protrusions 320 may be radially and spirally formed and spaced apart from each other to correspond to the rotation direction of the fan 400 about the central vent hole 312a.

The outer lower side wall 330 protrudes from a lower surface of the base plate 310 facing the upper surface on which the heat dissipation protrusions 320 are formed, and is disposed along an edge of the lower surface of the base plate 310. As a result, a light source accommodating groove 332 is formed in the lower portion of the base plate 310 to accommodate the light source module 500 by the outer lower side wall 330. On the other hand, the central protrusion wall 340 is formed to protrude from the lower surface of the base plate 330, is formed along the edge of the central vent (312a). Therefore, when the central vent 312a is formed in a circular shape as shown in the drawing, the central protrusion wall 340 may be formed in the same cylindrical shape.

Meanwhile, in addition to the heat sink 300, another heat dissipation part may be disposed inside or outside the housing HS. For example, the heat dissipation unit may be configured to include at least one of a heat pipe and a heat spreading member, in addition to or separately from the heat sink 300.

The fan 400 is disposed in the inner space of the case body 100 to move external air provided through the air inlet 210 to the heat sink 300 to cool the heat flowing from the heat sink. In charge of. The fan 400 may include a fan case in which upper and lower portions are open, a central axis disposed in the center of the fan case, and a plurality of rotary blades disposed in the fan case and rotating based on the central axis. In this case, the central axis is preferably coincident with the center of the heat sink 300 and the center of the upper cover 200. On the other hand, the inner surface of the case body 100 may be formed with a fan mounting portion 130 for coupling with the fan case. The fan mounting unit 130 may be a stepped portion formed on the inner surface of the case body 100 as shown in FIG. 3 and coupled to the edge of the fan case. Alternatively, the fan mounting unit 130 may protrude from the inner surface of the case body 100. It may be a support protrusion (not shown) that can be coupled to the heat dissipation case while supporting the edge of the fan case.

The light source module 500 is accommodated in the light source receiving groove 332 formed in the lower portion of the base plate 310 by the outer lower side wall 330, and is in contact with the bottom surface of the base plate 310. Light is generated in the downward direction with respect to the plate 310.

The light source module 500 includes at least one optical semiconductor element 520 capable of generating light. For example, the optical semiconductor device may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electroluminescent device (EL). . Specifically, for example, the light source module 500 may further include a printed circuit board 510 and optical cover units 530 in addition to the optical semiconductor elements 520.

The printed circuit board 510 is in contact with the bottom surface of the base plate 310. The printed circuit board 510 is provided with a light source vent 512 corresponding to the heat sink vent 312 formed in the base plate 310. In this case, the light source vent 512 includes a substrate central vent 512a formed at the center of the printed circuit board 510 corresponding to the central vent 312a, and the printed circuit board 510 is formed at the center of the substrate. The vent 512a may be in contact with the bottom surface of the base plate 310 while the central protrusion wall 340 is inserted.

The optical semiconductor elements 520 are spaced apart from each other on the bottom surface of the printed circuit board 510 and generate light by a driving voltage provided from the printed circuit board 510. Each of the optical semiconductor elements 520 may include at least one light emitting diode (LED) for generating light, and the light emitting diode may generate light having various wavelengths according to its purpose, for example, red It can generate light in the yellow, blue or ultraviolet wavelength band.

The optical cover units 530 may cover each of the optical semiconductor elements 520 to improve optical characteristics of light generated by each of the optical semiconductor elements 520, for example, brightness uniformity of light. For example, the optical cover units 530 may cover and protect each of the optical semiconductor elements 520 and may diffuse light generated from each of the optical semiconductor elements 520.

The diffusion plate 600 is spaced apart from the lower portion of the printed circuit board 510 and diffuses light generated from the optical semiconductor elements 520. Specifically, the diffusion plate 600 is disposed on the lower surface of the outer lower side wall 330 and the central protruding wall 340 to cover the light source receiving groove 332. The diffusion plate 600 is provided with a plate vent 602 corresponding to the light source vent 512 formed on the printed circuit board 510. In this case, the plate vent 602 includes a plate central vent 602a formed at the center of the diffusion plate 600 to correspond to the substrate central vent 512a. Meanwhile, the diffusion plate 600 may be made of, for example, polymethylmethacrylate (PMMA) resin or polycarbonate (PC) resin.

The sealing member 610 is interposed between the diffusion plate 600 and the outer lower side wall 330 or between the diffusion plate 600 and the central protruding wall 340 to prevent external moisture and foreign matters. It can be prevented from being applied to the light source module 500 side. Specifically, the sealing member is interposed between the diffusion plate 600 and the outer lower side wall 330 is interposed between the outer sealing ring 612, and the diffusion plate 600 and the central protrusion wall 340. May include a central sealing ring 614. In this case, the outer sealing ring 612 and the central sealing ring 614 may be, for example, a rubber ring.

The plate fixing unit 620 is disposed along the edge of the diffuser plate 600 at the lower portion of the diffuser plate 600 to surround the diffuser plate 600 with a plurality of coupling screws (not shown). It is fixed to the lower side wall (330). That is, as each of the coupling screws is coupled to the outer lower side wall 330 through the plate fixing unit 620 and the diffusion plate 600, the edge of the diffusion plate 600 to the outer lower side wall Can be strongly fixed to the (330). Meanwhile, the central portion of the diffusion plate 600 may be strongly fixed to the central protrusion wall 340 by separate coupling screws. That is, as each of the separate coupling screws penetrates through the diffusion plate 600 and then is coupled to the central protrusion wall 340, the central portion of the diffusion plate 600 is strongly attached to the central protrusion wall 340. Can be fixed

The reflection shade 700 is disposed under the case body 100 to reflect the light generated by the light source module 500 and diffused by the diffusion plate 600 to determine the irradiation range of the light. The reflection shade 700 may be fixed to the side of the heat sink 300, for example, the side of the base plate 310. The reflection shade 700 may be made of a metal material, for example, aluminum alloy so as to absorb the heat generated by the light source module 500 to be emitted to the outside.

On the other hand, a dust prevention film (not shown) may be formed on the surface of the reflection shade 700 to prevent dust or foreign matter from sticking well. For example, the anti-dust coating may be an antifouling coating film such as a nano-green coating film. In addition, a plurality of concave-convex shapes may be formed on the surface of the reflection shade 700 to increase the surface area to effectively release the heat absorbed from the light source module 500.

Referring to FIG. 3 again, the flow of air when the fan 400 rotates in the forward direction will be briefly described.

First, air introduced into the inner space through the air inlet 210 of the upper cover 200 is blown to the heat sink 300 by the fan 400. At this time, the heat sink 300 absorbs heat generated from the light source module 500, and the air blown into the heat sink 300 receives heat from the heat sink 300 to receive the heat sink ( 300) can be reduced.

A part of the air blown into the heat sink 300 by the fan 400 is provided to the outer surface of the reflector 700 through the outer vent 110 formed at the lower end of the case body 100 again. The dust adhering to the outer surface of the reflection shade 700 may be removed, such as dust and foreign matter.

In the housing HS, a movement path for moving air blown into the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed. May be formed by the heat sink vent 312, the light source vent 512, and the plate vent 602. As such, the air moving to the lower part of the light source module 500 through the movement path moves the dust moving from the lower part of the lighting device to the light source module 500 to the lower part so that the dust is reflected by the reflector ( Sticking to the outer side of the 700 can be prevented.

4 is a block diagram illustrating a driving relationship of the optical semiconductor lighting apparatus of FIG. 1.

3 and 4, the optical semiconductor lighting apparatus may further include a power supply module 810, an illumination controller 820, and a temperature sensor 830.

The power supply module 810 generates and provides driving power for the fan 400 and the light source module 500. Although not shown in the drawing, the lighting controller 820 and the temperature sensor 830 may be generated and provided. The power supply module 810 may be disposed outside or inside the housing HS. However, when the power supply module 810 is disposed inside the housing HS, the power supply module 810 is disposed in a space between the upper cover 200 and the fan 400. It is preferable to be.

The lighting controller 820 may be electrically connected to the fan 400 and the light source module 500 to control driving of the fan 400 and the light source module 500, respectively. The lighting controller 820 may be disposed on the bottom surface of the printed circuit board 510 in the same manner as the optical semiconductor elements 520, but may be disposed anywhere inside or outside the housing HS. .

If the lighting controller 820 determines that the fan 400 has failed because the fan 400 is not properly driven even though power is supplied to the fan 400, the lighting controller 820 may notify the fan 400 of the failure. The light source module 500 may be controlled to generate light of a color, for example, red. For example, the lighting controller 820 receives the fan rotation speed information from the fan 400 and the fan 400 is broken when the fan 400 does not rotate or rotates at a speed lower than a reference value. You can judge. On the other hand, the operator can determine the failure of the fan 400 through the lighting color of the lighting device to repair and repair the lighting device.

The lighting control unit 820 may remove the dust or foreign matter accumulated around the air inlet 210 of the upper cover 200 at any time, for example, every six hours for 10 minutes. The fan 400 may be controlled to rotate in the reverse direction.

On the other hand, the temperature sensor 830 is disposed in the interior space of the housing (HS) to sense the temperature of the interior space. In this case, the lighting controller 820 may control the rotation speed of the fan 400 according to the temperature value applied from the temperature sensor 830. That is, when the temperature value detected by the temperature sensor 830 is higher than the reference value, the rotation speed of the fan 400 is increased, and when the temperature value detected by the temperature sensor 830 is lower than the reference value, Reduce the rotational speed of the fan 400.

In addition, a dust measuring unit (not shown) is further disposed in the housing HS to provide the amount of dust in the housing HS to the lighting control unit 820 in real time or intermittently, and the lighting control unit 820 The rotation speed of the fan 400 may be controlled according to the amount of dust measured by the dust measuring unit.

According to the present embodiment as described above, the air moved by the fan 400 primarily absorbs heat of the heat sink 300 and cools the heat sink 300, and a part of the outer vent 110. Is provided to the outer surface of the reflector 700 through the dust to be stuck to the outer surface of the reflector 700, the other part is the heat sink vent 312, the light source vent 512 and the plate It is provided to the lower portion of the light source module 500 through the vent 602, the dust moving from the lower portion of the lighting device to the light source module 500 can be moved back to the lower portion. On the other hand, as the fan 400 is rotated in the reverse direction itself every predetermined time, it is possible to remove the dust and foreign matter stuck to the air inlet hole 210 itself.

As described above, the optical semiconductor lighting apparatus of the present invention has a self-clearing function, and thus, the failure of the lighting apparatus may be prevented or the luminous efficiency and heat dissipation efficiency may be reduced due to dust or foreign matter, and the maintenance may be performed. As the period is increased, maintenance costs are reduced, and the reflection efficiency and heat dissipation efficiency of the reflection shade can be prevented from being lowered by the dust and foreign substances.

In addition, the operator can easily determine the failure of the fan 400 through the color of the light generated from the lighting device, it is possible to repair, repair and replace the fan 400 in a short time. In addition, by measuring the temperature of the interior space of the housing (HS) in real time, and determine the rotational speed of the fan 400 according to the measured temperature value, the heat generated from the light source module 500 It can be removed efficiently.

<Example 2>

5 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a second embodiment of the present invention.

5, except for a part of the base plate 310 of the heat sink 300, the printed circuit board 510 of the light source module 500, and the diffusion plate 600. Since the lighting apparatus of the first exemplary embodiment described with reference to FIGS. 2 and 3 is substantially the same, detailed description of the same components as those of the first exemplary embodiment will be omitted, and the same reference numerals as those of the first exemplary embodiment will be given. .

2 and 5, the base plate 310 of the heat sink 300 has a heat sink vent 312 for moving air moved by the fan 400 to an inner side surface of the reflection shade 700. ) Is formed.

The heat sink vent 312 includes a central vent 312a formed at the center of the base plate 310 and a plurality of outer vents 312b formed at the edge of the base plate 310. In this case, the outer vent holes 312b may be formed to be spaced apart from each other along the edge of the base plate 310. Meanwhile, as shown in FIG. 5, both the outer vent holes 312b and the central vent hole 312a may be formed, but only one of them may be formed.

A light source vent 512 is formed at a position corresponding to the heat sink vent 312 on the printed circuit board 510 of the light source module 500, and the light source vent 512 is formed at the diffusion plate 600. The plate vent 602 is formed at the position. In this case, the light source vent 512 includes substrate central vents 512b formed at positions corresponding to the central vent 312a and substrate vents 512b formed at positions corresponding to the outer vents 312b, respectively. The plate vent 600 includes a plate central vent 602a formed at a position corresponding to the substrate central vent 512a and a plate outer vent 602b respectively formed at positions corresponding to the substrate outer vents 512b. ).

As described above, according to the present exemplary embodiment, the air provided to the heat sink 300 by the fan 400 is connected to the inner surface of the reflector 700 through the outer vents 312b together with the central vent 312a. It may be provided as. That is, the air provided to the heat sink 300 by the fan 400 sequentially passes through the outer vents 312b, the substrate outer vents 512b, and the plate outer vents 602b. It may be provided directly to the inner side of the reflection shade 700. The air provided to the inner side surface of the reflecting shade 700 may remove dust, foreign matter, and the like that are attached to the inner side of the reflecting shade 700.

<Example 3>

6 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a third embodiment of the present invention.

The optical semiconductor illuminating device shown in FIG. 6 is substantially the same as the illuminating device of the second embodiment described with reference to FIG. Detailed description will be omitted, and the same reference numerals as in the second embodiment will be given.

2 and 6, an outer vent 112 is formed at a lower end of the case body 100 to move air moved by the fan 400 to an outer surface of the reflection shade 700. At this time, the outer vent 112 is formed in a shape in which air moved by the fan 400 can be directly guided to the outer surface of the reflector 700. For example, the outer vent 112 may be formed at an angle inclined from the bottom of the case body 100 to correspond to the position of the outer surface of the reflection shade 700 as shown in FIG. At this time, the inclined angle of the outer vent 112 is preferably equal to or slightly larger than the inclined angle of the reflection shade 700.

As such, according to the present exemplary embodiment, as the outer vent 112 is formed in a shape in which air moved by the fan 400 may be directly guided to the outer surface of the reflecting shade 700, the reflecting shade 700 Dust and foreign matter accumulated on the outer surface of the) can be more effectively removed.

<Example 4>

7 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fourth embodiment of the present invention.

Since the optical semiconductor lighting apparatus shown in FIG. 7 is substantially the same as the lighting apparatus of the third embodiment described with reference to FIG. 6 except for a part of the heat sink 300 and the case body 100, the optical semiconductor lighting apparatus shown in FIG. Detailed description of the same components will be omitted, and the same reference numerals as in the third embodiment will be given.

2 and 7, the outer vent 114 for moving the air moved by the fan 400 to the outer surface of the reflector 700 is different from the outer surface of the reflector 700 unlike FIG. 7. It is formed on the edge portion of the heat sink 300 facing the.

Specifically, the heat sink 300 may further include an outer upper side wall 350 protruding from the upper surface of the base plate 310 toward the case body 100, and the outer upper side wall 350 The outer vent 114 may be formed. On the other hand, the case body 100 is preferably shorter than the case body 100 of FIG. 7 by the length of the outer upper side wall 350 protrudes from the upper surface of the base plate 310.

As described above, the outer vent 114 is formed at the edge of the heat sink 300 instead of the lower end of the case body 100 to reflect the air moved by the fan 400. It can be moved to the outer side of 700.

<Example 5>

8 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fifth embodiment of the present invention.

Since the optical semiconductor lighting apparatus shown in FIG. 8 is substantially the same as the lighting apparatus of the fourth embodiment described with reference to FIG. 7 except for a part of the heat sink 300, the printed circuit board 514, and the diffusion plate 600. Detailed description of the same components as in the fourth embodiment will be omitted, and the same reference numerals as those in the fourth embodiment will be given.

2 and 7, a plurality of edge vents 312c are provided at an edge of the heat sink 300 to directly move air moved by the fan 400 to an inner side surface of the reflection shade 700. Are spaced apart from each other. Specifically, each of the edge vents 312c is formed to penetrate the base plate 310 and the outer lower side wall 330, and the air moved by the fan 400 is directed to the inner surface of the reflector 700. It may be formed into a shape that can be directly guided. For example, the edge vents 312c may be formed at an inclined angle to the base plate 310 and the outer lower side wall 330 corresponding to the position of the inner side of the reflector 700 as shown in FIG. 8. Can be. In this case, the inclined angles of the edge vents 312c may be equal to or slightly smaller than the inclined angle of the reflection shade 700.

In the present embodiment, the substrate outer vents 512b and the plate outer vents 602b in FIG. 7 are not formed in the printed circuit board 510 and the diffusion plate 600, respectively. In addition, the diffusion plate 600 is disposed on the outer lower side wall 330 so as not to cover the edge vents 312c.

As such, according to the present exemplary embodiment, as the edge vents 52 are formed at the edge of the heat sink 300 in addition to the outer vent 114, the heat sink 300 alone may be used for the reflection shade 700. Dust and foreign matter accumulated on the outer side and inner side can be removed.

<Example 6>

9 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a sixth embodiment of the present invention, Figures 10 and 11 are plan views for explaining the arrangement of the heat radiation projections of the heat sink of Figure 9, Figure 12 9 is an enlarged cross-sectional view of a portion A of FIG.

9 to 12, the optical semiconductor lighting apparatus according to the present embodiment includes a housing HS, a heat sink 300, a fan 400, a light source module 500, a diffusion plate 600, and a seal. A member, a plate fixing unit, a reflection shade 700 and a dust collecting module 900.

The housing HS includes at least a case body 100 having an inner space therein, an upper cover 250 disposed on the case body 100, and an upper cover 250 coupled to the case body 100. One cover coupling portion 260 may be included.

The upper and lower portions of the case body 100 are open and accommodate the fan 400 and the like. The case body 100 may be formed in a cylindrical shape or a polygonal shape such as a square cylinder, a hexagonal cylinder, or the like. The case body 100 may be formed of a synthetic resin.

The inner surface of the case body 100 has a plurality of inner support parts disposed to be spaced apart from each other to be combined with the fan mounting portion 132 and the heat sink 300 to be described later (to be described later) 140 is formed. In addition, an outer vent 110 is formed at a lower end of the case body 100 to move air existing in the inner space to an outer surface of the reflection shade 700 to be described later.

The outer surface of the case body 100 may be formed with a plurality of stripe grooves 150 are spaced apart from each other in the upper and lower portions of the case body 100. In this case, a plurality of stripe protrusions (not shown) may be formed on the outer surface of the case body 100 instead of the stripe grooves 150. As such, the stripe grooves 150 or the stripe protrusions may increase the frictional force with the hand of the worker so that the worker does not drop and break the lighting device during transportation.

The upper cover 250 is spaced apart from the upper end of the case body 100 to cover the upper portion of the case body 100. As a result, side inlets 252 are formed between the upper cover 250 and the upper end of the case body 100 to allow the outside air to move into the case body 100. As such, as the side inlet 252 is formed between the upper cover 250 and the upper end of the case body 100, external dust may be accumulated to prevent the side inlet 252 from being blocked.

On the upper side of the upper cover 250, an installation ring 254 may be formed so that the lighting device can be installed on the ceiling of a factory or a workshop, and at this time, a predetermined groove is formed in a portion where the installation ring 254 is formed. This may be formed. On the other hand, the upper cover 200 may be formed of a synthetic resin or a metal material, for example, aluminum alloy.

The cover coupling part 260 is disposed between the upper cover 250 and the case body 100 to fix the upper cover 250 to the case body 100. For example, the plurality of cover coupling parts 260 may be spaced apart from each other between a lower side surface of the upper cover 250 and an upper side surface of the fan mounting portion 132 formed on the case body 100. 250 may be fixed to the case body 100. Here, the cover coupling portion 260 may be formed to be separated from the inner surface of the upper cover 250 or the case body 100, as shown in the drawing, otherwise, the upper cover 250 or the case body ( It may be formed integrally with the inner surface of the 100).

The heat sink 300 is disposed to cover the lower portion of the case body 100 and is coupled to the case body 100. For example, the heat sink 300 may be coupled to and fixed to the inner support parts 140 of the case body 100. The heat sink 300 may be formed of a metal alloy including a material capable of absorbing heat generated from the light source module 500 to be described later to be released to the outside, for example, aluminum or magnesium. In addition, the heat sink 300 may be formed in a structure capable of well dissipating heat absorbed from the light source module 500 to the outside. Specifically, the heat sink 300 may include a base plate 310, a plurality of heat dissipation protrusions 320, an outer lower side wall 330, and a central protruding wall 340.

The base plate 310 may be disposed to cover a lower portion of the case body 100, coupled to the case body 100, and may receive heat directly from the light source module 500. The base plate 310 may be provided with a heat sink vent 312 for moving the air present in the housing (HS) to the lower portion of the heat sink 300, wherein the heat sink vent 312 is It may be formed in the center of the base plate 310.

The heat dissipation protrusions 320 are formed on an upper surface of the base plate 310 facing the case body 100, are disposed in the housing HS, and receive heat from the base plate 310 to the outside. Can be released. Here, some of the heat dissipation protrusions 320 are coupled to the lower ends of the inner support parts 140 formed on the inner side surface of the case body 100, thereby connecting the heat sink 300 to the case body 100. Can be fixed Specifically, for example, the inner support parts 140 protrude toward some of the heat dissipation protrusions 320, and a protrusion for being coupled to the inner support parts 140 to some of the heat dissipation protrusions 320. Steps 322 may be formed, respectively. On the other hand, the heat sink 300 may be coupled to the case body 100 by a portion other than the heat dissipation protrusions 320.

The heat dissipation protrusions 320 may have various structures and arrangements with excellent heat dissipation efficiency. For example, the heat dissipation protrusions 320 may have radial and spiral shapes with respect to the center of the base plate 310 and may be spaced apart from each other. Specifically, the heat dissipation protrusions 320 may be spaced apart from each other in a radial and spiral form corresponding to the rotation direction of the fan 400 around the heat sink vent 312 as shown in FIG. 10. have.

Alternatively, the heat dissipation protrusions 320 may include first protrusions 320a and second protrusions 320b as shown in FIG. 10. The first protrusions 320a have radial and helical shapes with respect to the heat sink vent 312 and are spaced apart from each other. The second protrusions 320b have radial and spiral shapes with respect to the heat sink vent 312, and are disposed between the first protrusions 320a on the outer side of the first protrusions 320a. .

The outer lower side wall 330 protrudes from a lower surface of the base plate 310 facing the upper surface on which the heat dissipation protrusions 320 are formed, and is disposed along an edge of the lower surface of the base plate 310. As a result, a light source accommodating groove 332 is formed in the lower portion of the base plate 310 to accommodate the light source module 500 by the outer lower side wall 330. Meanwhile, the central protrusion wall 340 protrudes from the bottom surface of the base plate 330 and is formed along an edge of the heat sink vent 312. Therefore, when the heat sink vent 312 is formed in a circular shape as shown in the drawing, the central protrusion wall 340 may be formed in the same cylindrical shape.

The fan 400 is disposed in the inner space of the case body 100 to move external air provided through the air inlet 210 to the heat sink 300 to cool the heat flowing from the heat sink. In charge of. The fan 400 may include a fan case in which upper and lower portions are open, a central axis disposed in the center of the fan case, and a plurality of rotary blades disposed in the fan case and rotating based on the central axis. In this case, the central axis is preferably coincident with the center of the heat sink 300 and the center of the upper cover 250. On the other hand, the fan case may be mounted and fixed to the fan mounting portion 132 formed on the inner surface of the case body 100.

The light source module 500 is accommodated in the light source receiving groove 332 formed in the lower portion of the base plate 310 by the outer lower side wall 330, and is in contact with the bottom surface of the base plate 310. Light is generated in the downward direction with respect to the plate 310. In detail, the light source module 500 may include a printed circuit board 510, a plurality of optical semiconductor elements 520, and optical cover units 530.

The printed circuit board 510 is in contact with the bottom surface of the base plate 310. The printed circuit board 510 is provided with a light source vent corresponding to the heat sink vent 312 formed in the base plate 310. In this case, the light source vent may be formed at the center of the printed circuit board 510 corresponding to the heat sink vent 312. The printed circuit board 510 may be in contact with the bottom surface of the base plate 310 while the light source vent is inserted into the central protrusion wall 340.

The optical semiconductor elements 520 are spaced apart from each other on the bottom surface of the printed circuit board 510 and generate light by a driving voltage provided from the printed circuit board 510. Each of the optical semiconductor elements 520 includes at least one light emitting device (LED) for generating light. In addition, the light emitting diode may generate light in various wavelength bands according to its use, for example, light in red, yellow, blue or ultraviolet light bands.

The optical cover units 530 may cover each of the optical semiconductor elements 520 to improve optical characteristics of light generated by each of the optical semiconductor elements 520, for example, brightness uniformity of light. For example, the optical cover units 530 may cover and protect each of the optical semiconductor elements 520 and may diffuse light generated from each of the optical semiconductor elements 520.

The diffusion plate 600 is spaced apart from the lower portion of the printed circuit board 510 and diffuses light generated from the optical semiconductor elements 520. Specifically, the diffusion plate 600 is disposed on the lower surface of the outer lower side wall 330 and the central protruding wall 340 to cover the light source receiving groove 332. The diffusion plate 600 is provided with a plate vent 602 corresponding to the light source vent 512 formed on the printed circuit board 510. In this case, the plate vent 602 is formed in the center of the diffusion plate 600 to correspond to the light source vent 512. Meanwhile, the diffusion plate 600 may be made of, for example, polymethylmethacrylate (PMMA) resin or polycarbonate (PC) resin.

The sealing member is interposed between the diffusion plate 600 and the outer lower side wall 330 or between the diffusion plate 600 and the central protruding wall 340 so that external moisture, foreign matter, etc. are stored in the light source module ( 500) can be prevented from being applied to the side. In detail, the sealing member includes an outer sealing ring interposed between the diffusion plate 600 and the outer lower side wall 330, and a central sealing interposed between the diffusion plate 600 and the central protrusion wall 340. It may include a ring. In this case, the outer sealing ring and the central sealing ring may be, for example, a rubber ring.

The plate fixing unit is disposed along the edge of the diffusion plate 600 at the bottom of the diffusion plate 600 to fix the diffusion plate 600 to the outer lower side wall 330 through a plurality of coupling screws. . That is, as each of the coupling screws is coupled to the outer lower side wall 330 through the plate fixing unit and the diffusion plate 600, the edge of the diffusion plate 600 is the outer lower side wall 330 Strongly fixed to

The reflection shade 700 is disposed under the case body 100 to reflect the light generated by the light source module 500 and diffused by the diffusion plate 600 to determine the irradiation range of the light. The reflection shade 700 may be fixed to the side of the heat sink 300, for example, the side of the base plate 310. Meanwhile, a dust collecting module support part 710 for supporting the dust collecting module 900 to be described later may be formed at a lower end of the reflecting shade 700.

The reflection shade 700 may be made of a metal material, for example, aluminum alloy so as to absorb the heat generated by the light source module 500 to be emitted to the outside. In addition, a dust prevention film (not shown) may be formed on the surface of the reflection shade 700 in order to prevent dust or foreign matter from sticking well. For example, the anti-dust coating may be an antifouling coating film such as a nano-green coating film.

The dust collecting module 900 is disposed on the outer surface of the reflection shade 700 so as to correspond to the outer vent 110, and serves to filter out dust contained in the air. In this case, the dust collecting module 900 may be disposed and fixed on the dust collecting module support 710. Specifically, for example, the dust collecting module 900 is a dust filter 910 for filtering and collecting the dust contained in the air, and the filter fixing unit for fixing the dust filter 910 on the dust collecting module support 710 920 may be included. The filter fixing unit 920 may be formed, for example, in a c-shaped cross section for accommodating the dust filter 910, and spaced apart from each other to allow air passing through the dust filter 910 to pass therethrough. It may have a plurality of filter ventilation holes 922 formed.

The dust collecting module 900 may be formed on the inner side of the reflecting shade 700 as well as the outer surface of the reflecting shade 700 to filter and collect dust contained in the air inside the reflecting shade 700. In addition, the dust collecting module 900 may extend up and down based on the reflection shade 700 or may have a shape bent in the L-shape at the lower end of the reflection shade 700.

On the other hand, it will be briefly described the flow of air when the fan 400 rotates in the forward direction.

First, air introduced into the case body 100 through the side inlet 252 formed between the upper cover 250 and the upper end of the case body 100 is transferred to the heat sink by the fan 400. Blowing). At this time, the heat sink 300 absorbs heat generated from the light source module 500, and the air blown into the heat sink 300 receives heat from the heat sink 300 to receive the heat sink ( 300) can be reduced.

A part of the air blown into the heat sink 300 by the fan 400 is provided to the outer surface of the reflector 700 through the outer vent 110 formed at the lower end of the case body 100 again. Pass through the dust collecting module 900. As a result, dust included in the air or stuck to the outer surface of the reflector 700, that is, dust and foreign matters, may be collected and removed by the dust collecting module 900. As such, the dust collecting module 900 may purify the air in the factory or the workplace by removing dust contained in the air.

Meanwhile, a movement path for moving a part of the air blown to the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed in the housing HS. In this case, the movement path may be formed by the heat sink vent 312, the light source vent 512, and the plate vent. As such, the air moving to the lower part of the light source module 500 through the movement path moves the dust moving from the lower part of the lighting device to the light source module 500 to the lower part so that the dust is reflected by the reflector ( Sticking to the outer side of the 700 can be prevented.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

HS: Housing 100: Case Body
110: outer vent 120: lower support
130, 132: fan mounting portion 140: inner support portion
150: stripe groove 200, 250: top cover
210: air inlet 252: side inlet
260: cover coupling portion 300: heat sink
310: base plate 312: heat sink vent
312a: central vent 312b: outer vent
312c: edge vent 320: heat dissipation protrusion
322: protrusion step 330: outer lower side wall
332: light source receiving groove 340: central protrusion wall
350: outer upper side wall 400: fan
500: light source module 510: printed circuit board
512: light source vent 512a: substrate central vent
512b: Ventilation holes outside the substrate 520: Optical semiconductor device
530: optical cover unit 600: diffuser plate
602: plate vent 602a: plate center vent
602b: plate outer vent 610: sealing member
620: plate fixing unit 700: reflection shade
810: power supply module 820: lighting control unit
830: temperature sensor 900: dust collecting module
910: dust filter 920: filter fixing unit

Claims (35)

A housing in which one side is open;
A light source module disposed in the housing and including at least one optical semiconductor element;
A fan disposed adjacent to the light source module and configured to introduce air into the light source module; And
It includes a reflector for reflecting the light generated by the light source module to determine the irradiation range of the light,
In the housing is formed a movement path for outflowing at least a portion of the air introduced by the fan to the outside through the light source module,
A plurality of lower support parts are formed at a lower end of the housing to couple the housing and the reflecting shade, and outward at least a portion of the air introduced by the fan to the outside through the space between the lower support parts. Semiconductor lighting equipment. The method of claim 1, wherein the optical semiconductor device
An optical semiconductor lighting device comprising at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electroluminescent device (EL). The optical semiconductor lighting apparatus of claim 1, further comprising a heat dissipation unit for dissipating heat generated by the light source module. The heat dissipation unit of claim 3, wherein the heat dissipation unit
An optical semiconductor lighting apparatus comprising at least one of a heat sink, a heat pipe, and a heat spreading member. The heat dissipation unit of claim 3, wherein the heat dissipation unit
And a heat sink having a heat sink body disposed adjacent to the light source module to absorb and release heat generated from the light source module. According to claim 5, The heat sink body is formed with a heat sink vent for passing at least a portion of the air moved to the heat sink by the fan,
The light source module is formed with a light source vent for moving the air passing through the heat sink vent to the lower portion of the light source module,
The movement path is an optical semiconductor lighting device, characterized in that formed by the heat sink vent and the light source vent. The method of claim 6, wherein the light source module
The optical semiconductor device is disposed on one surface, and the other surface opposite to the one surface facing the heat sink body adjacent to the optical semiconductor lighting device comprising a printed circuit board having the light source vent. 8. The heat sink of claim 7, wherein the heat sink comprises an outer lower side wall formed along an edge of the heat sink body.
The light source module is an optical semiconductor lighting device, characterized in that disposed in the light source receiving groove formed on one side of the heat sink body by the outer lower side wall. The optical semiconductor lighting apparatus of claim 8, further comprising a diffuser plate coupled to the outer lower side wall to cover the light source receiving groove and having a plate vent formed at a position corresponding to the light source vent. 8. The heat sink of claim 7, wherein the heat sink vent includes a central vent formed at the center of the heat sink body.
The light source vent may include a central vent of a substrate formed in the printed circuit board to correspond to the central vent. The method of claim 10, wherein the heat sink further comprises a central protrusion wall formed in the heat sink body corresponding to the central vent,
The printed circuit board is an optical semiconductor lighting device, characterized in that the central vent hole is inserted into the center protruding wall and coupled. The method of claim 10, wherein the heat sink vents further comprises a plurality of outer vents formed spaced apart from each other along the edge of the heat sink body,
The light source vent may further include a plurality of substrate outer vents formed on the printed circuit board to correspond to the outer vents. The method of claim 5, wherein the heat sink body is
A base plate disposed adjacent to the light source module; And
And a plurality of heat dissipation protrusions formed on one surface of the base plate opposite to the light source module. The method of claim 13, wherein the heat dissipation projections
Optical semiconductor lighting device, characterized in that spaced apart from each other having a radial and spiral shape rotating in the same direction as the rotation direction of the fan relative to the center of the base plate. The method of claim 14, wherein the heat dissipation protrusions
First protrusions radially and helically formed with respect to the center of the base plate and spaced apart from each other; And
An optical semiconductor lighting apparatus having radial and spiral shapes with respect to the center of the base plate, and including second protrusions disposed between the first protrusions on the outer side of the first protrusions. According to claim 5, One side of the housing corresponding to the reflection shade
The optical semiconductor lighting device, characterized in that the outer vent opening for moving a portion of the air introduced by the fan to the outer surface of the reflecting shade through the space between the lower support. delete The method of claim 16, wherein the heat sink body comprises a base plate, and a plurality of heat dissipation projections formed on one surface of the base plate,
The inner surface of the housing is an optical semiconductor lighting device, characterized in that a plurality of inner support parts are formed to be spaced apart from each other protruding toward the heat dissipation projections, and coupled to some of the heat dissipation projections. 19. The method of claim 18, wherein some of the heat radiation projections
Optical semiconductor lighting device, characterized in that the projection stepped for coupling with the inner support portion, respectively formed. The method of claim 5, wherein the heat sink is
And an outer upper side wall formed along an edge of the heat sink body and coupled to one end of the housing and having an outer vent for moving a part of the air introduced by the fan to an outer surface of the reflecting shade. Semiconductor lighting equipment. The method of claim 5, wherein the edge of the heat sink body
And a plurality of edge vents for moving a part of the air introduced by the fan to an inner side surface of the reflector. The light source module of claim 1, wherein a light source vent is formed at the light source module to allow at least some of the air moved to the light source module by the fan to flow out.
And the movement path is formed by the light source vent. According to claim 1, wherein the surface of the reflecting shade
Optical semiconductor lighting device, characterized in that the anti-fouling coating dust prevention film is formed in order to prevent the dust or foreign matter sticking. The optical semiconductor lighting apparatus of claim 1, further comprising a dust collecting module disposed on the reflecting shade to collect dust in the air. The method of claim 24, wherein the dust collecting module
A dust filter collecting the dust; And
And a filter fixing unit which fixes the dust filter to the reflection shade and has a plurality of filter ventilation holes through which air passes. The optical semiconductor lighting device of claim 25, wherein a dust collecting module support part is formed at a lower end of the reflecting shade to support the dust collecting module. The optical semiconductor lighting apparatus of claim 1, further comprising an illumination control unit for controlling the fan and the light source module. The method of claim 27, wherein the lighting control unit
When the fan does not rotate or rotates at a speed lower than the reference value, the optical semiconductor lighting device, characterized in that for controlling the light source module to generate a light of any color to inform the failure of the fan. 28. The apparatus of claim 27, further comprising a temperature sensor disposed in the housing for providing a temperature value in the housing to the lighting control unit.
The lighting controller is an optical semiconductor lighting device, characterized in that for controlling the fan so that the rotational speed is changed in accordance with the temperature value. 28. The method of claim 27, wherein the upper end of the housing is formed with an air inlet for moving the outside air into the housing,
And the lighting controller controls the fan to rotate in a reverse direction at any time in order to remove dust accumulated around the air inlet. 2. The apparatus of claim 1, wherein the housing
A case body having an upper and lower parts open and accommodating the fan and the light source module therein; And
And an upper cover coupled to the case body to cover an upper portion of the case body. The method of claim 31, wherein the upper cover
The optical semiconductor lighting device, characterized in that the air inlet for the outside air is moved into the housing is formed. 33. The system of claim 32, wherein the air inlet is
And a plurality of air inlet holes spaced apart from each other in radial and spiral shapes rotating in the same direction as the rotation direction of the fan with respect to the center of the upper cover. 32. The optical semiconductor lighting apparatus of claim 31, wherein the upper cover is spaced apart from an upper end of the case body to form a side inlet for moving outside air into the housing. The method of claim 31, wherein the outer surface of the case body
An optical semiconductor lighting apparatus, characterized in that a plurality of stripe grooves or a plurality of stripe protrusions are formed spaced apart from each other.
KR1020110037792A 2010-08-06 2011-04-22 Lighting apparatus having optic-semiconductor KR101248731B1 (en)

Priority Applications (11)

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KR1020110037792A KR101248731B1 (en) 2010-08-06 2011-04-22 Lighting apparatus having optic-semiconductor
PCT/KR2011/005715 WO2012018231A1 (en) 2010-08-06 2011-08-04 Optical semiconductor lighting apparatus
EP11814831.1A EP2602546A4 (en) 2010-08-06 2011-08-04 Optical semiconductor lighting apparatus
CN201510138057.2A CN104748095A (en) 2010-08-06 2011-08-04 Optical semiconductor lighting apparatus
CN201180044878.XA CN103124876B (en) 2010-08-06 2011-08-04 Optical semiconductor lighting apparatus
US13/198,963 US20120033419A1 (en) 2010-08-06 2011-08-05 Optical semiconductor lighting apparatus
JP2011173368A JP5166580B2 (en) 2010-08-06 2011-08-08 Optical semiconductor lighting device
JP2012111002A JP5073118B2 (en) 2010-08-06 2012-05-14 Optical semiconductor lighting device
JP2012233991A JP5367898B2 (en) 2010-08-06 2012-10-23 Optical semiconductor lighting device
US13/749,316 US8894247B2 (en) 2010-08-06 2013-01-24 Optical semiconductor lighting apparatus
US13/748,981 US8801231B2 (en) 2010-08-06 2013-01-24 Optical semiconductor lighting apparatus

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101387087B1 (en) * 2013-11-08 2014-04-18 주식회사 금영 Street lamp using led
KR101570969B1 (en) 2014-07-10 2015-11-23 알미늄프라자 주식회사 Lighting apparatus
KR101574084B1 (en) 2014-04-25 2015-12-03 김동수 Optiacl semiconductor illuminating apparatus
KR101575860B1 (en) * 2013-06-28 2015-12-08 (주)우미앤씨 Led lighting apparatus for ceiling
WO2017155354A1 (en) * 2016-03-11 2017-09-14 엘지이노텍(주) Lighting device

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101389136B1 (en) * 2012-04-13 2014-04-25 홍현필 Led light device
KR101379687B1 (en) * 2012-07-12 2014-04-01 (주)솔라루체 Lighting device unified cooling pan with structure of heat sink having high heat disspation
KR101455083B1 (en) * 2012-08-10 2014-10-28 삼성전자주식회사 Lighting device
KR101376110B1 (en) * 2012-08-28 2014-03-19 한재섭 LED cooling device of air inflow type from side and bottom, and LED lighting lamp thereby
KR101326217B1 (en) * 2013-03-15 2013-11-11 (주) 동광라이팅 The led lamp
KR101459090B1 (en) * 2014-06-17 2014-12-10 루넥스 주식회사 Air-cooled LED light that equipped separation plate
WO2018128278A1 (en) * 2017-01-06 2018-07-12 박준표 Illumination device cooling module and cooling device including same
KR102282100B1 (en) * 2017-08-04 2021-07-27 세메스 주식회사 Substrate processing apparatus and method
KR20190015666A (en) * 2017-08-04 2019-02-14 세메스 주식회사 Substrate processing apparatus and method
US10900723B2 (en) * 2018-09-17 2021-01-26 Pony Ai Inc. Cover for creating circular airflows inside an enclosure
KR200492375Y1 (en) * 2019-05-09 2020-09-25 주식회사 이노루체 Track lighting
KR102402623B1 (en) * 2020-06-11 2022-05-26 박찬수 Plant growth supplemental lighting apparatus
CN112780977A (en) * 2021-01-19 2021-05-11 广东悦亮科技有限公司 Ceiling lamp

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103195A (en) 2006-10-19 2008-05-01 Matsushita Electric Works Ltd Led lighting device
KR100900405B1 (en) * 2008-12-18 2009-06-02 류성환 Led lamp for illumination
EP2154419A2 (en) 2008-07-31 2010-02-17 Toshiba Lighting & Technology Corporation Self-ballasted lamp
JP2010153198A (en) * 2008-12-25 2010-07-08 Nec Lighting Ltd Luminaire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103195A (en) 2006-10-19 2008-05-01 Matsushita Electric Works Ltd Led lighting device
EP2154419A2 (en) 2008-07-31 2010-02-17 Toshiba Lighting & Technology Corporation Self-ballasted lamp
KR100900405B1 (en) * 2008-12-18 2009-06-02 류성환 Led lamp for illumination
JP2010153198A (en) * 2008-12-25 2010-07-08 Nec Lighting Ltd Luminaire

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101575860B1 (en) * 2013-06-28 2015-12-08 (주)우미앤씨 Led lighting apparatus for ceiling
KR101387087B1 (en) * 2013-11-08 2014-04-18 주식회사 금영 Street lamp using led
KR101574084B1 (en) 2014-04-25 2015-12-03 김동수 Optiacl semiconductor illuminating apparatus
KR101570969B1 (en) 2014-07-10 2015-11-23 알미늄프라자 주식회사 Lighting apparatus
WO2017155354A1 (en) * 2016-03-11 2017-09-14 엘지이노텍(주) Lighting device
US10584862B2 (en) 2016-03-11 2020-03-10 Lg Innotek Co., Ltd. Lighting device

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