KR101455083B1 - Lighting device - Google Patents

Abstract

An illumination device according to an embodiment of the present invention includes a base including a fastening rim and a support plate provided inside the fastening rim; A housing which is fastened to the coupling rim and covers the support plate, and includes a flow path for guiding the inflow of air and an air inflow hole for introducing the air guided through the flow path into the internal space; A cooling fan disposed on one side of the support plate covered by the housing to draw air into the internal space of the housing and to discharge the intake air to the outside through an air release hole provided in the base; And a light source module mounted on the support plate, wherein the channel forms a stepped portion with the outer surface of the housing.

Description

LIGHTING DEVICE

The present invention relates to a lighting device.

2. Description of the Related Art In general, an illumination device using a light emitting diode (LED) as a light source of illumination transmits a heat generated from a light source through a substrate to a heat sink and emits the light to the outside (e.g., outside air). Heat transfer through natural convection was very inefficient and required a considerably large heat sink to cool the light source. There is a need for a method for improving various heat dissipation efficiency such as a method of increasing the contact between the light source and the substrate to increase the heat conduction or a method of increasing the heat transfer by using the material of the substrate as the material of the substrate.

There is a need in the art for an illumination device capable of increasing the lifetime of a light source and improving light output by overcoming the limited heat radiation efficiency of conventional natural convection to maximize heat radiation efficiency.

Further, there is also a demand for an illuminating device that allows the lighting device to have a size within the ANSI standard while improving heat radiation efficiency according to high output.

According to an embodiment of the present invention,

A base including a fastening rim and a support plate provided inside the fastening rim; A housing which is fastened to the coupling rim and covers the support plate, and includes a flow path for guiding the inflow of air and an air inflow hole for introducing the air guided through the flow path into the internal space; A cooling fan disposed on one side of the support plate covered by the housing to draw air into the internal space of the housing and to discharge the intake air to the outside through an air release hole provided in the base; And a light source module mounted on the support plate, wherein the flow path is formed as a stepped portion with the outer surface of the housing.

The air inlet hole may be formed in a ring shape along the circumference of the housing and may extend upward along the outer surface of the housing at the lower end of the housing to communicate with the air inlet hole.

Wherein the air inlet hole is formed in a ring shape along the circumference of the housing and the flow path is formed along the circumference of the housing at a position corresponding to the air inlet hole and communicated with the air inlet hole, And a second flow path extending from the first flow path to the lower end of the housing and opening to the outside.

At least one of the flow passages may be formed in a recessed structure on the outer surface of the housing to communicate with the air inlet hole.

The fastening rim may have a groove corresponding to the flow path at a position corresponding to the flow path, and may be connected to the flow path of the housing.

The fastening rim has a flange portion protruding outwardly at a lower end portion, and the flange portion has a plurality of vent holes formed along the circumference of the fastening rim, and may be connected to the flow path of the housing.

The base may include the air vent hole between the outer circumferential surface of the support plate and the inner surface of the tightening rim to discharge the air introduced into the inner space of the housing to the outside.

The base may include the air discharge hole at the center of the support plate to discharge the air introduced into the inner space of the housing to the outside.

The base may include a plurality of radiating fins on the one surface of the support plate facing the cooling fan.

According to an embodiment of the present invention,

A base having an air vent hole; A housing disposed at one side of the base, the housing having a flow path forming a depressed area with a stepped outer surface, and an air inflow hole for introducing the air guided through the flow path into the internal space; A cooling fan disposed in the housing for drawing air into the inner space of the housing and discharging the intake air to the outside through the air discharge hole; And a light source module disposed on the other side of the base and including a lens unit having at least one light emitting element and at least one lens disposed on the light emitting element.

It is possible to provide an illumination device capable of increasing the lifetime of the light source and improving the light output by maximizing the heat radiation efficiency by overcoming the limited heat radiation efficiency of the natural convection.

Further, it is possible to provide an illumination device capable of making the illumination device have a size within the ANSI standard while improving the heat radiation efficiency according to the high output.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1 is an exploded perspective view schematically showing a lighting apparatus according to an embodiment of the present invention.
2 is a cross-sectional view schematically showing a lighting apparatus according to an embodiment of the present invention.
3 is a perspective view schematically showing a base in the illumination device of FIG.
FIG. 4 is a perspective view schematically showing a state where a cooling fan is disposed on the base of FIG. 3. FIG.
Fig. 5 is a perspective view schematically showing a state in which the backflow prevention portion is disposed on the cooling fan of Fig. 4;
6 is a cross-sectional view schematically showing a state in which a lighting apparatus according to an embodiment of the present invention is mounted on a ceiling.
Fig. 7 is a perspective view of Fig. 6. Fig.
8 is an exploded perspective view schematically showing a lighting apparatus according to another embodiment of the present invention.
9 is a cross-sectional view schematically showing a lighting apparatus according to another embodiment of the present invention.
10 is a perspective view schematically showing a base in the illumination apparatus of FIG.
11 is a perspective view schematically showing a state in which a cooling fan is disposed on the base of Fig.
Fig. 12 is a perspective view schematically showing a state in which the backflow prevention portion is disposed on the cooling fan of Fig. 11. Fig.
13 is a cross-sectional view schematically showing a state in which a lighting apparatus according to another embodiment of the present invention is mounted on a ceiling.
14 is a perspective view of Fig.
15 is an exploded perspective view schematically showing a lighting apparatus according to still another embodiment of the present invention.
16 is a cross-sectional view schematically showing a lighting apparatus according to still another embodiment of the present invention.
17 is a cross-sectional view schematically showing a state in which a lighting apparatus according to another embodiment of the present invention is mounted on a ceiling.
FIG. 18 is a perspective view schematically showing a light source module in the illumination device of FIG. 15; FIG.
Fig. 19 is a perspective view schematically showing a lens unit in the light source module of Fig. 18; Fig.
Fig. 20 is an exploded perspective view schematically showing a lens in the lens unit of Fig. 19; Fig.
21 is a cross-sectional view schematically showing a light path in the light source module of Fig. 18;
22 is a graph showing a light distribution curve of the lens.
23A to 23C are cross-sectional views schematically showing steps of manufacturing a lens unit with a lens using a mold.
24A and 24B are cross-sectional views schematically showing a condensing lens of a general structure and a slim lens according to the present embodiment.
25 is a cross-sectional view schematically showing one embodiment of a substrate that may be employed in a lighting apparatus according to various embodiments of the present invention.
26 is a cross-sectional view schematically showing another embodiment of the substrate.
FIG. 27 is a cross-sectional view schematically showing a substrate according to a modification of FIG. 26; FIG.
Figs. 28 to 31 are cross-sectional views schematically showing still another various embodiments of the substrate, respectively.
32 is a cross-sectional view schematically showing an example of a light emitting device (LED chip) that can be employed in a lighting apparatus according to various embodiments of the present invention.
33 is a cross-sectional view schematically showing another example of the light emitting device (LED chip) of Fig. 32. Fig.
34 is a cross-sectional view schematically showing another example of the light emitting device (LED chip) of Fig. 32. Fig.
35 is a cross-sectional view showing an example of an LED chip mounted on a mounting substrate as a light emitting element (LED chip) that can be employed in a lighting apparatus according to various embodiments of the present invention.
36 is a CIE 1931 coordinate system.
37 is a block diagram schematically showing an illumination system according to an embodiment of the present invention.
Fig. 38 is a block diagram schematically showing the detailed configuration of the illumination unit of the illumination system shown in Fig. 37;
39 is a flowchart for explaining the control method of the illumination system shown in Fig.
Fig. 40 is a use example schematically illustrating the illumination system shown in Fig. 37. Fig.
41 is a block diagram of a lighting system according to another embodiment of the present invention.
42 is a format diagram of the ZigBee signal of the present invention.
43 is an explanatory diagram of a sensing signal analysis unit and an operation control unit of the present invention.
44 is a flowchart of the operation of the wireless lighting system of the present invention.
45 is a block diagram schematically illustrating components of an illumination system according to another embodiment of the present invention.
46 is a flowchart showing a control method of the illumination system.
47 is a flowchart showing a control method of a lighting system according to still another embodiment.
48 is a flowchart showing a control method of a lighting system according to still another embodiment.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below.

Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art.

Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

A lighting apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 and 2. Fig.

FIG. 1 is an exploded perspective view schematically showing a lighting apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically showing a lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 1 together with FIG. 2, the lighting apparatus 10 according to the present embodiment may include a base 100, a housing 200, a cooling fan 300, and a light source module 400.

The base 100 is a type of frame member to which the cooling fan 300 and the light source module 400 are mounted and fixed. The base 100 includes a rim 110 and a support plate (not shown) provided inside the coupling rim 110 120).

The fastening rim 110 may have a ring-shaped structure perpendicular to the center axis O and may have a flange portion 111 projecting outward at a lower end thereof. 6 and 7, the flange unit 111 is inserted into the hole 2 provided in the ceiling 1 when the lighting apparatus 10 is mounted on a structure such as the ceiling 1, 10) is fixed.

The fastening rim 110 may have a groove 112 recessed toward the center. The groove 112 has a shape corresponding to the flow path 220 of the housing 200 to be described later and is formed at a position corresponding to the flow path 220. The flow path 220 is continuous with the groove 112 so that the flow path 220 can be exposed to the outside through the lower portion of the coupling rim 110.

As used herein, the terms 'upper', 'lower', 'upper', 'lower' and the like are based on the drawings and the term may vary depending on the direction in which the lighting apparatus is disposed.

The base 100 employed in this embodiment can be described in detail with reference to Fig. 3, the support plate 120 has a horizontal structure perpendicular to the direction of the central axis O on the inner circumferential surface of the coupling rim 110, and may be partially connected to the coupling rim 110 have. The support plate 120 has a flat upper surface 120a and a lower surface 120b opposite to each other and a plurality of radiating fins 121 may be provided on the upper surface 120a. The plurality of radiating fins 121 may be arranged radially toward the rim from the center of the support plate 120. In this case, the plurality of radiating fins 121 may have a curved surface and may be arranged in a spiral shape as a whole. In the present embodiment, the plurality of radiating fins 121 having curved curved surfaces are arranged in a spiral structure. However, the present invention is not limited thereto, and the radiating fins 121 may have various other shapes such as straight lines .

The fixing portion 122 may protrude from the one surface 120a at a predetermined height. A screw hole is formed in the fixing part 122 to fix the housing 200 and the cooling fan 300 to be described later through fixing means such as a screw s.

A light source module 400 to be described later is mounted on the other surface 120b of the support plate 120. On the other surface 120b, a protruded side wall 123 having a predetermined height in the downward direction may be provided along the circumference of the rim. A space of a predetermined size is provided inside the side wall 123 to accommodate the light source module 400 therein.

The base 100 may include a slit-shaped air vent hole 130 between the outer circumferential surface of the support plate 120 and the inner surface of the concert rim 110. The air discharge hole 130 serves as a passage through which the air escapes from one surface 120a of the support plate 120 toward the other surface 120b so that the air flows continuously without being stagnated toward the one surface 120a. .

Since the base 100 directly contacts the light source module 400 as a heat source, the base 100 may be made of a material having a high thermal conductivity so as to perform a heat dissipating function like a heat sink. For example, the base 100 having the fastening rim 110 and the support plate 120 integrally formed by injection molding or the like can be formed using a metal or resin having a high thermal conductivity. Further, the fastening rim 110 and the support plate 120 may be individually manufactured and assembled as separate components. In this case, the support plate 120 may be made of a metal or resin having a good thermal conductivity, and may cause damage due to an image in the case of the fastening rim 110, It may be made of a material having a relatively low thermal conductivity.

1 and 2, the housing 200 is disposed on one side of the base 100, and specifically, the housing 200 is fastened to the fastening rim 110 to cover the support plate 120. The housing 200 has a convex parabolic shape at the top and a terminal portion 210 for fastening to an external power source such as a socket at an upper end thereof. An opening may be formed. Particularly, the housing 200 is provided with a flow path 220 forming a stepped portion with a step difference from the outer surface of the housing 200 to guide inflow of air from the outside, An air inlet hole 230 for introducing air into the inner space.

The air inlet hole 230 may be formed in a ring shape along the periphery of the housing 200 adjacent to the upper end of the housing 200. At least one of the flow paths 220 is formed in a recessed structure on the outer surface of the housing 200. The flow path 220 is formed at the lower end of the housing 200 along the outer surface of the housing 200, And may communicate with the air inlet hole 230.

Specifically, the flow path 220 includes a first flow path 221 formed along the circumference of the housing 200 at a position corresponding to the air inflow hole 230 and communicating with the air inflow hole 230, And a second flow path 222 extending from the first flow path 221 to the lower end of the housing 200 and opened to the outside. The second flow path 222 is continuous with the groove 112 of the coupling rim 110 fastened to the lower end of the housing 200 and extends to the lower portion of the coupling rim 110 And can be opened to the outside. Therefore, the outside air is guided in the inflow and upward direction along the passage 220 which is a part of the outer surface of the housing 200 in the downward direction of the coupling rim 110, And may be introduced into the inner space of the housing 200. In the present embodiment, the second flow paths 222 are arranged to be opposed to each other in a pair. However, the number and position of the second flow paths 222 may be variously changed.

FIG. 4 schematically shows a state in which the cooling fan 300 is disposed on the base 100. As shown in FIG. 4, a cooling fan 300 may be installed in the housing 200. The cooling fan 300 is disposed on one surface 120a of the support plate 120 so as to force air from the outside into the inner space of the housing 200 and to supply the intake air to the base 100 The air is discharged through the air discharge hole 130 to the outside. The heat generated from the light source module 400 mounted on the base 100 can be rapidly released to the outside through the forced air flow, thereby lowering the temperature of the lighting apparatus 10. [

The cooling fan 300 may be supported and fixed on the fixing portion 122 of the support plate 120. The cooling fan (specifically, the upper surface of the cooling fan) may be disposed on at least the same horizontal line as the air inlet hole 230 provided in the housing 200 or at a lower position. Accordingly, air introduced into the internal space of the housing 200 through the air inlet hole 230 flows through the cooling fan 300 directly to the base 100, thereby simplifying the air flow path, Therefore, the flow of air can be made more smooth and the heat radiation efficiency can be improved.

5 schematically shows a state in which the backflow prevention part 500 is disposed on the cooling fan 300. As shown in FIG. 5, the backflow prevention part 500 is disposed on the cooling fan 300 to prevent the intake air from flowing back into the internal space of the housing 200 through the cooling fan 300 . The backflow prevention part 500 may include a ring-shaped body 510 having a center hole 511 and a plurality of guide pins 520 extending toward the center hole 511. In the present embodiment, the plurality of guide pins 520 are curved and have a curved surface and are arranged in a spiral structure, but the present invention is not limited thereto.

The body 510 may have a structure in which an outer circumferential surface thereof is in contact with an inner surface of the housing 200 to prevent a gap between the cooling fan 300 and the housing 200. The center hole 511 may have a size and shape corresponding to the cooling fan 300. The body 510 may be disposed on at least the same horizontal line as the air inlet hole 230 provided in the housing 200 or at a lower position. In this case, the cooling fan 300 may be disposed at a position lower than the backflow prevention part 500. The air sucked into the interior of the housing 200 through the air inlet hole 230 passes through the center hole 511 of the body 510 and flows into the cooling fan 300. [

1 and 2, the light source module 400 is mounted on the other surface 120b opposite to the one surface 120a of the support plate 120 having the plurality of heat radiation fins 121, Light is irradiated. The light source module 400 may include a substrate 410 and at least one light emitting device 420 mounted on the substrate 410.

The substrate 410 may be a general may be of FR4 type PCB, epoxy, triazine, silicone, and polyimide or the like or formed of an organic resin material, and other organic resin material containing a ceramic such as AlN, Al ₂ O ₃ Materials, or metal and metal compounds, and may include MCPCB and the like.

The light emitting device 420 is mounted on the substrate 410 and electrically connected thereto. The light emitting device 420 is a kind of semiconductor device that generates light of a predetermined wavelength by an external power source, and may include a light emitting diode (LED). The light emitting device 420 may emit blue light, green light, or red light, or may emit white light depending on the contained substance.

A plurality of the light emitting devices 420 may be arranged on the substrate 410. In this case, the light emitting devices 420 may be of the same type emitting light of the same wavelength, or may be of different types generating different light of different wavelengths. The light emitting device 420 may be an LED chip itself, or may be a single package having an LED chip therein.

Meanwhile, a cover 600 covering the substrate 410 and the light emitting device 420 may be mounted on the base 100. The cover 600 may be formed of a transparent or semitransparent material such as silicone or epoxy so that the light generated from the light emitting device 420 may be irradiated to the outside, .

The cover 600 may include a lens 610 corresponding to each light emitting device 420. The lens 610 is arranged to face each light emitting device 420 and can control a directivity angle of the light generated from the light emitting device 420. In the present embodiment, the structure in which the cover 600 is provided with the lenses 610 corresponding to the light emitting devices 420 is described, but the present invention is not limited thereto. Although not shown in the drawings, the cover 600 may have a structure protruding in the form of a convex lens so as to function as a lens itself.

The cover 600 may contain a light diffusing agent. Such a light diffusing agent may have a nano-sized particle size and may include one or more materials selected from the group consisting of SiO ₂ , TiO ₂ , Al ₂ O ₃ , and the like.

6 and 7 schematically show a state in which the lighting apparatus 10 according to the embodiment of the present invention is mounted on the ceiling 1. Fig. A fixing unit 3 is mounted on the ceiling 1 to fasten and fix the lighting device 10 and supply power to the lighting device 10. [ The lighting device 10 can be fixed in a closed state on the ceiling 1 by the fixing unit 3. [

As shown in the drawing, the lighting apparatus 10 can be fastened in such a structure that the fastening rim 110 is fitted in the hole 2 of the ceiling 1. [ The hole 2 of the ceiling 1 may be formed in a shape corresponding to the coupling rim 110 and may be formed between the coupling rim 110 and the hole 2, A gap is not generated except for the space corresponding to the formed groove 112. In the present embodiment, the lighting apparatus 10 is described as being fitted in the hole 2 of the ceiling 1, but the present invention is not limited thereto. That is, the fixing unit 3 can be mounted in a structure to be fitted in the hole 2 of the ceiling 1, and the lighting device 10 can be mounted on the fixing unit 3 via the fastening rim 110 And may be fastened with a fitting structure. In this case, no gap may be formed between the clamping rim 110 and the fixed unit 3 except for the space corresponding to the groove 112.

When the cooling fan 300 in the housing 200 is operated by the power supply, the external air A flows through the groove 112, which is a space between the coupling rim 110 and the ceiling 1, The introduced air A is guided from the lower end to the upper end of the housing 200 along the flow path 220 formed on the outer surface of the housing 200. The air A is sucked into the inner space of the housing 200 through the air inlet hole 230 of the housing 200. The air A sucked into the internal space of the housing 200 is transferred to the support plate 120 of the base 100 through the cooling fan 300 and is guided along the heat radiating fins 121 on the support plate 120 And flows radially toward the rim direction and is discharged to the outside through the air discharge hole 130. At this time, the heated air A 'on the support plate 120 is forced to be sucked into the housing 200 and is discharged to the outside along with the flow of air discharged to the outside, whereby the support plate 120 and the support plate 120' Thereby cooling the light source module 400 mounted on the display unit 120. In addition, the inside of the housing 200 is cooled by the cold air A which is continuously sucked into the inside of the housing 200. Particularly, in the case of the lighting apparatus 10 according to the embodiment of the present invention, the flow path 220 for the air (A) flow is provided on the outer surface of the housing 200, Even if the lighting apparatus 10 is mounted in a socket structure (for example, a socket structure having a shape corresponding to the housing and closely adhered to the outer surface of the housing), the external air A is supplied through the space formed by the flow path 220 It is possible to suck the air into the housing 200. Thus, the cooling efficiency of the lighting apparatus 10 can be maximized by forcibly blowing the external cold air A, thereby increasing the lifetime of the light source module 400 and improving the luminous efficiency. Can be obtained.

A lighting apparatus according to another embodiment of the present invention will be described with reference to Figs. 8 and 9. Fig.

FIG. 8 is an exploded perspective view schematically showing a lighting apparatus according to another embodiment of the present invention, and FIG. 9 is a sectional view schematically showing a lighting apparatus according to another embodiment of the present invention.

The constitution of the illumination device according to the embodiment shown in Figs. 8 and 9 is substantially the same as that of the embodiment shown in Figs. 1 to 7 above. However, since the structures of the base and the light source are different from those of the embodiments shown in Figs. 1 to 7, the description of the parts overlapping with those of the above-described embodiment will be omitted, and the structure related to the base and the light source module will be mainly described .

8 and 9, a lighting apparatus 10 'according to another embodiment of the present invention includes a base 100', a housing 200 ', a cooling fan 300', a light source module 400 ' .

The base 100 'may include a rim 110' and a support plate 120 'disposed inside the rim 110'.

The fastening rim 110 'has a ring-shaped structure perpendicular to the center axis O and may have a flange portion 111' protruding outward at a lower end thereof. 13 and 14, the flange part 111 'is fitted in the hole 2 provided in the ceiling 1 when the lighting device 10' is mounted on a structure such as the ceiling 1, 10 ') are fixed.

A plurality of ventilation openings 113 'may be formed in the flange portion 111' along the periphery of the fastening rim 110 '. The plurality of air vents 113 'are connected to a flow path 220' provided in the housing 200 'so that the air A flows through the air vents 113' to the flow path 220 '.

The base 100 'employed in this embodiment can be described in detail with reference to FIG. 10, the support plate 120 'has a structure perpendicular to the center axis O on the inner circumferential surface of the tightening rim 110', and the entire outer circumferential surface of the support plate 120 ' Can be connected.

The support plate 120 'may have a flat one surface (upper surface) 120a' and a lower surface 120b 'opposite to each other and a plurality of heat dissipation fins 121' may be provided on the one surface 120a ' have. The plurality of radiating fins 121 'may be radially arranged from the center of the support plate 120' toward the rim. In this case, the plurality of radiating fins 121 'may have a curved surface and may be arranged in a spiral shape as a whole. In the present embodiment, the plurality of radiating fins 121 'having curved curved surfaces are arranged in a spiral structure. However, the present invention is not limited thereto, and the radiating fins 121' may have other various forms such as straight lines It is possible.

The fixing part 122 'may protrude from the one surface 120a' at a predetermined height. A screw hole is formed in the fixing part 122 'to fix the housing 200' and the cooling fan 300 'through fixing means such as a screw S.

The light source module 400 'is mounted on the other surface 120b' of the support plate 120 '. On the other surface 120b ', a protruded side wall 123' having a predetermined height in the downward direction may be provided around the rim. A space of a predetermined size is provided inside the side wall 123 'to accommodate the light source module 400' therein.

The base 100 'may include the air discharge hole 130' at the center of the support plate 120 '. The air discharge hole 130 'serves as a passage through which the air A' escapes from one surface 120a 'of the support plate 120' to the other surface 120b ', and thus the air A' So that the flow can be maintained continuously on the one surface 120a 'side without stagnation.

FIG. 11 schematically shows a state in which the cooling fan 300 'is disposed on the base 100'. As shown in FIG. 11, the cooling fan 300 'is disposed on the one surface 120a' of the support plate 120 '. The cooling fan 300 'may be fixed to the fixing portion 122'.

As shown in FIG. 12, a backflow prevention part 500 'may be disposed on the cooling fan 300'.

The housing 200 'is fastened to the fastening rim 110' of the base 100 'to cover the support plate 120'. The housing 200 'has a convex parabolic shape with an upper portion and a terminal portion 210' for fastening with the socket. An opening may be formed at the lower end portion of the housing 200 ' have. The housing 200 'has a flow path 220' forming a stepped portion with the outer surface of the housing 200 'to guide the inflow of air A from the outside and a flow path 220' And an air inflow hole 230 'for introducing air (A) guided through the air inlet hole 230' into the inner space.

The air inlet hole 230 'may be formed in a ring shape along the periphery of the housing 200' adjacent to the upper end of the housing 200 '. At least one of the flow channels 220 'is formed in a recessed structure on the outer surface of the housing 200' to communicate with the air inlet holes 230 ', and the housing 200' And the air inlet hole 230 'may extend upward along the outer surface of the housing 200' at a lower end of the housing 200 '.

The flow path 220 'is continuous with the vent 113' of the fastening rim 110 'fastened to the lower end of the housing 200' and is connected to the outside through the vent 113 ' Can be opened. Accordingly, the external air A flows along the flow path 220 ', which is a part of the outer surface of the housing 200', through the air vent 113 'in the downward direction of the tightening rim 110' And may be introduced into the inner space of the housing 200 'through the air inlet hole 230'. The flow path 220 'according to the embodiment shown in FIG. 8 differs from the embodiment of FIG. 1 in that it occupies most of the surface area of the housing 200'. In this embodiment, the flow paths 220 'are shown as being opposed to each other in a pair. However, the number and the sizes of the flow paths 220' can be variously changed.

The light source module 400 'is mounted on the other surface 120b' opposite to the one surface 120a 'of the support plate 120' having the plurality of radiating fins 121 'to irradiate light. The light source module 400 'may include a substrate 410' and at least one light emitting device 420 'mounted on the substrate 410'.

The substrate 410 'may be a general FR4 type PCB or may be formed of an organic resin material containing epoxy, triazine, silicon, and polyimide, or other organic resin material, or may be formed of AlN, Al ₂ O ₃ , Ceramics, or metal and metal compounds, and may include MCPCB and the like.

The substrate 410 'may include a through hole 430' for discharging air at a position corresponding to the air discharge hole 130 'of the support plate 120'. The light emitting device 420 'may be arranged along the perimeter of the through hole 430'.

The light emitting device 420 'is mounted on the substrate 410'. The light emitting device 420 'is a kind of semiconductor device that generates light of a predetermined wavelength by an external power source, and may include a light emitting diode (LED). The light emitting device 420 'may emit blue light, green light, or red light, or may emit white light, depending on the contained substance.

A plurality of the light emitting devices 420 'may be arranged on the substrate 410'. In this case, the light emitting device 420 'may be composed of the same kind of light emitting the same wavelength or different kinds of light emitting different light of different wavelength. The light emitting device 420 'may be an LED chip itself, or may be a single package having an LED chip therein.

Meanwhile, a cover 600 'covering the substrate 410' and the light emitting device 420 'may be mounted on the base 100'. The cover 600 'may be formed of a transparent or semitransparent material, preferably silicon or epoxy resin, so that the light generated from the light source module 400' may be irradiated to the outside, .

The cover 600 'may include a discharge pipe 620' connected to the through hole 430 'of the substrate 410'. Accordingly, the air A 'in the housing 200' passes through the air discharge hole 130 'of the support plate 120' and the through hole 430 'of the substrate 410' And may be discharged to the outside through the opening 620 '.

13 and Fig. 14 schematically show a state in which the lighting apparatus 10 'according to the present embodiment is mounted on the ceiling 1. Fig. As shown, the lighting device 10 'can be fastened with a structure in which the fastening rims 110' fit into the holes 2 of the ceiling 1. The hole 2 of the ceiling 1 may have a shape corresponding to the coupling rim 110 'so that there is no gap between the coupling rim 110' and the hole 2.

When the cooling fan 300 'in the housing 200' is operated by the power supply, the outside air A flows through the plurality of air vents 113 'provided in the flange portion 111' Is guided from the lower end to the upper end of the housing 200 'along the flow path 220' formed on the outer surface of the housing 200 '. The air A is sucked into the inner space of the housing 200 'through the air inlet hole 230' of the housing 200 '. The air A sucked into the internal space of the housing 200 'is transferred to the support plate 120' of the base 100 'through the cooling fan 300' Passes through the discharge hole 130 'and the through hole 430' of the substrate 410 'and is discharged to the outside through the discharge pipe 620'. At this time, the heated air A 'on the support plate 120' is forcibly drawn into the housing 200 'and is discharged to the outside along with the flow of air discharged to the outside, Thereby cooling the light source module 400 'mounted on the support plate 120'.

The lighting apparatus 10 'according to the embodiment of the present invention is provided with the flange 111', even if it is fitted with a structure in which no gap is formed between the hole 2 of the ceiling 1 and the fastening rim 110 ' Even if the illumination device 10 'is fastened to the closed fixed unit 3 like the socket structure, the external air A can be sucked through the ventilation hole 113' provided on the surface of the housing 200 ' It is possible to cool the lighting apparatus 10 'by forcibly introducing the outside air A through the space formed by the flow path 220'.

A lighting apparatus according to another embodiment of the present invention will be described with reference to Figs. 15 to 21. Fig.

The construction of the lighting apparatus according to the embodiment shown in Figs. 15 to 21 is substantially the same as that of the embodiment shown in Figs. 1 to 7 above. However, since the structure of the light source is different from the embodiment shown in Figs. 1 to 7, the description of the parts overlapping with the embodiments described above will be omitted, and the structure related to the light source module will be mainly described.

15 and 16, the lighting apparatus 10 '' according to the present embodiment includes a base 100 '', a housing 200 '', a cooling fan 300 '', and a light source module 400 ''').

The base 100 '' comprises a fastening rim 110 '' and a support plate 120 '' disposed inside the fastening rim 110 '', and the support plate 120 ''. And an air vent hole 130 '' in the form of a slit may be provided between the outer peripheral surface of the coupling rim 110 '' and the inner peripheral surface of the coupling rim 110 ''.

The housing 200 '' is disposed at one side of the base 100 '' and is fastened to the fastening rim 110 '' to cover the support plate 120 ''. A flow path 220 '' for forming a depressed area with a step difference from the outer surface to guide inflow of air into the housing 200 '', and air guided through the flow path 220 ' An air inlet hole 230 "

The cooling fan 300 '' is provided in the housing 200 '' to forcibly draw air into the inner space of the housing 200 '', and to supply the intake air to the base 200 ' Through the air discharge hole 130 ''.

Since the base 100 '', the housing 200 '' and the cooling fan 300 '' are substantially the same as those of the lighting device 10 according to the embodiment of FIG. 1, Is omitted.

On the other hand, a spacer 700 '' for blocking a gap between the cooling fan 300 '' and the housing 200 '' may be provided on the cooling fan 300 ''. The spacer 700 '' may have a ring-shaped structure formed with a center hole 710 '', and the outer circumferential surface thereof may be in contact with the inner surface of the housing 200 ''. The center hole 710 " may be formed in a size and shape corresponding to the cooling fan 300 ". Therefore, air sucked in through the air inlet hole 230 '' of the housing 200 '' flows completely through the center hole 710 '' to the cooling fan 300 ''.

As shown in FIGS. 15 and 16, the housing 200 '' includes a power supply unit (PSU) 800 '' accommodated in the terminal unit 210 '' and supplying external power to the light source module 400 ''. Can be mounted. The power supply device 800 '' includes a driving circuit 810 '' in which a capacitor or the like is mounted and an electrode pin 810 '' which is connected to the driving circuit 810 '' and protrudes out of the terminal portion 210 ' 820 "). The electrode pin 820 " may be fixed through a pin holder 830 ".

The power supply 800 '' may be disposed above the air inlet hole 230 '' of the housing 200 '', and thus through the air inlet hole 230 '' The air sucked into the inner space of the housing 200 '' flows through the cooling fan 300 '' and directly to the base 100 ''. In this case, the heat generated in the power supply device 800 '' may be discharged to the outside by the intake air (A).

The light source module 400 '' is mounted on the support plate 120 '' and emits light by a power source applied through the power source device 800 ''. The light source module 400 '' according to the present embodiment includes a lens unit 440 'having at least one light emitting device 420''and a lens 450''disposed on the light emitting device 420''.'), And may further include a substrate 410''on which the light emitting device 420''is mounted.

The lens unit 440 '' may be disposed on the other side of the base 100 '' to cover the substrate 410 '' and the plurality of light emitting devices 420 ''. The lens unit 440 '' may be made of a light transmitting material to protect the light emitting device 420 '' from the external environment or to improve light extraction efficiency to the outside of the light emitting device 420 ''. The translucent material may include, for example, polycarbonate (PC), polymethyl methacrylate (PMMA), acrylic, and the like. Further, it may be made of a glass material, but is not limited thereto.

FIG. 18 schematically shows the light source module 400 '', and FIG. 19 schematically shows a lens unit 440 '' of the light source module 400 ''.

18 and 19, the lens unit 440 '' includes a first surface 440 '' - 1 facing the light emitting device 420 '', and a first surface 440 '' - 1 facing the first surface 440 ''. And a plurality of lenses 450 '' disposed on the lens unit 440 '' so as to face each of the light emitting devices 420 ''. May be provided. The plurality of lenses 450 '' may be disposed on each light emitting device 420 '' to control a region irradiated with light generated from the light emitting device 420 ''. The plurality of lenses 450 '' may integrally lead to form the lens unit 440 ''.

The lens 450 " employed in this embodiment can be described in more detail with reference to Figs. 20 and 21. Fig. 20 and 21, the lens 450 '' is provided on the first surface 440-1 '' and has a central incidence surface 451 'through which the light of the light emitting device 420''is incident ', A reflector 452''projecting toward the light emitting device 420''along the central incidence surface 451''and symmetrical with respect to the optical axis Z at the center, Lt; / RTI > The lens 450 '' is provided on the second surface 440 '' - 2 and protrudes in a direction opposite to the light emitting device 420 '', and is symmetric with respect to the optical axis Z May have a refracting portion 455 "

The central incidence surface 451 '' is disposed directly above the light emitting device 420 '' perpendicular to the optical axis Z passing through the center thereof and has a generally planar or gently curved surface shape . ≪ / RTI > A depression 456 '' having a stepped structure may be formed on the central incidence surface 451 ''. The depression 456 '' may be formed in a shape corresponding to an eject pin to be described later, and may be in contact with the above-mentioned milipin.

The reflective portion 452 " is formed in a ring shape along the periphery of the central incidence surface 451 '', and has a first radius of rotation with respect to the optical axis Z, And may include a reflective portion 452a '' and a second reflective portion 452b ''. For example, the first reflecting portion 452a '' is provided along the periphery of the central incidence surface 451 '' so as to surround the first reflecting portion 452a ' The second reflecting portion 452b " may be provided along the periphery. The first and second reflecting portions 452a '' and 452b '' may have a ring-shaped structure having different diameters with respect to the optical axis Z. [

The first reflector 452a '' and the second reflector 452b '' each have a side incident surface 453 '' on which the light of the light emitting device 420 '' is incident, And a reflective surface 454 " that reflects to the second surface 440 " - 2.

The side incident surface 453 '' receives light radiated laterally out of the light of the light emitting device 420 '', and the side incident surface 453 '' is formed on the first surface 440 '-1) to the light emitting device 420' 'and extend a predetermined length along the optical axis Z.

The reflective surface 454 '' reflects the received light through the side incidence surface 453 '' toward the second surface 440 '' - 2, and the reflective surface 454 '' ' May be formed in a parabolic shape that connects the extended end of the side incident surface 453 '' to the first surface 440 '' - 1.

In the present embodiment, the reflective surface 454 " is illustrated as having a parabolic surface shape, but is not limited thereto. For example, the reflective surface 454 " may be formed in a straight inclined shape, and the light received through the side incident surface 453 " may be formed on the second surface 440 " 2, it can be freely changed.

The reflector 452 '' may have a structure in which the length of the protrusion 452 '' projected from the first surface 440 '' - 1 increases as the distance from the optical axis Z increases. That is, the second reflective portion 452b '' protrudes more toward the light emitting device 420 '' than the first reflective portion 452a '', and thus the second reflective portion 452b ' May be formed to have a larger overall size than the first reflecting portion 452a ''.

In the present embodiment, the reflective portion 452 '' is exemplified as having a two-height structure including the first and second reflective portions 452a '' and 452b '', but the present invention is not limited thereto. For example, the reflector 452 '' may further include a third reflector (not shown) having a size and a diameter larger than that of the second reflector 452b '', .

The second surface 440 " - 2 facing the first surface 440 " - 1 is disposed on a light exit surface that emits light incident on the first surface 440 " . The second surface 440 '' - 2 is provided with a refracting portion 455 '' that protrudes in a direction opposite to the light emitting device 420 '' and is symmetrical with respect to the optical axis Z.

The refraction portion 455 '' may include a first refraction portion 455a '' at the center and a second refraction portion 455b '' surrounding the first refraction portion 455a ''.

The first refraction portion 455a '' is disposed directly above the light emitting device 420 '' and may have a convex curved surface with the optical axis Z as a vertex. The second refraction portion 455b '' has a plurality of concentric circles with respect to the optical axis Z and may have a concavo-convex structure formed along the circumference of the first refraction portion 455a ". The concavo-convex form of the second refraction portion 455b '' may include, for example, a Fresnel pattern.

The refraction portion 455 " may be formed on the flat second surface 440 " That is, the curved surface of the first refraction portion 455a '' and the concavo-convex shape of the second refraction portion 455b '' are coplanar with or at least coplanar with the second surface 440 " And may be formed at a low height. Therefore, the height (or thickness) T _L of the lens 450 '' does not protrude from the first surface 440 '' - 2, and the refractive portion 455 '' does not protrude above the second surface 440 ' May be defined as the distance between the end of the reflective portion 452 " protruding from the second surface 440 " - 1 and the second surface 440 " - 2.

In the present embodiment, the refraction portion 455 " does not protrude from the second surface 440 " - 2, but the present invention is not limited thereto. For example, the refracting portion 455 " may partially protrude above the second surface 440 " - 2. However, the degree of protrusion is only a small fraction of the total height (or thickness) T _{L of} the lens 450 ", so that the height T _L of the lens 450 " Do not.

On the other hand, in the lens 450 '', the reflecting portion 452 '' is disposed outside the refracting portion 455 '' with respect to the optical axis Z so as to surround the refracting portion 455 '' Can have a structure. Specifically, the central incidence surface 451 "'on the first surface 440 " - 1 opposes the refracting portion 455 " formed on the second surface 440 " Is formed with a size corresponding to the refraction portion 455 ", so that the reflection portion 452 " is disposed outside the refraction portion 455 " to surround the refraction portion 455 " Structure.

22 is a graph showing a light distribution curve of the lens 450 ". As shown in the figure, it can be confirmed that the condensed light distribution distribution having a directivity angle in a range of approximately 24 to 25 degrees is obtained. This can be understood that there is not a large difference in the condensing ability compared with the conventional condensing lens having the directivity angle of about 24.4 degrees.

The lens 450 '' may be integrally formed with the lens unit 440 '' in such a manner that a fluid solvent is injected into the mold and solidified. For example, injection molding, transfer molding, compression molding and the like may be included.

23A to 23C schematically show a process of manufacturing a lens unit including the lens using a molding frame. 23A to 23C are cross-sectional views schematically showing steps of manufacturing the lens unit according to the present embodiment.

First, as shown in Fig. 23A, molds M1 and M2 provided with a space having a lens shape are prepared, a fluidic solvent such as resin is injected into the molds M1 and M2, Is completed. The lens unit 440 "

Next, as shown in Fig. 23B, the molds M1 and M2 are separated to allow the completed lens unit 440 '' to be partly separated from the molds M1 and M2.

Next, as shown in Fig. 23C, the lens unit 440 '' is completely removed from the molds M1 and M2 through an eject pin P provided in the molds M1 and M2 To be separated. At least three of the microns P may be provided, thereby minimizing the occurrence of deformation of the lens unit 440 '' in the process of separating the lens unit 440 ''. For example, the microneedle (P) is arranged at both side edge regions of the lens 450 '' and at the center of the lens 450 '' so that the force applied to the lens 450 ' Regions, respectively. In this case, the microneedle P arranged to contact the central region of the lens 450 '' contacts the depression 456 '' formed on the central incidence plane 451 '' of the lens 450 '' can do.

That is, since the conventional condensing lens has a certain thickness (for example, about 10 mm), there is no problem even if the micrind pin is disposed outside the lens during injection molding. However, as in the present embodiment, There is a possibility that deformation may occur when the thickness (i.e. Therefore, it is possible to prevent the lens unit 440 '' from being deformed by disposing the pinhole P in the central portion so that the force applied to the lens 450 '' can be uniformly dispersed as a whole.

The lens 450 '' according to this embodiment thus manufactured may have a thin thickness (or height) T _L of about 2 mm to 4.5 mm, for example, as shown in FIG. Namely, it is suitable for miniaturization because it has a thickness as thin as about half compared with the conventional condensing lens (having a thickness of about 10 mm, see FIG. 24A), and when it is used in a lighting device, it is ANSI standard (ANSI C78.24-2001) It is possible to have a size within the range.

For example, according to the lamp standard (ANSI C78.24-2001) established by the American National Standards Institute, the maximum T ₁ : 46 mm, T ₂ : 4.5 mm, T _T : 50.5 mm to meet the standards.

In high power lamps such as the current 50W MR16 products, it is difficult to achieve sufficient cooling with the natural heat dissipation method, so it is essential to use the cooling fan. In this case, the size of the product increases according to the installation of the cooling fan, which causes a problem that it exceeds the ANSI standard.

In the case of a housing limited to the dimension of T ₁ , since it has a standardized structure for fastening with a socket or the like, in this embodiment, the lens which is limited to the dimension of T ₂ can be slimmed to solve the problem exceeding the ANSI standard . Figs. 24A and 24B schematically show a condenser lens of a general structure and a slim lens according to the present embodiment, respectively. As can be seen in the drawings, the height (or thickness) of the lens is reduced to about half, while maintaining the same optical characteristics, so that an illumination lamp conforming to the ANSI standard can be realized.

Meanwhile, the substrate 410 '' corresponds to a base member constituting a circuit board for mounting the light emitting device 420 '', which is an electronic device, and may be a so-called printed circuit board (PCB). In addition, the substrate 410 '' may be a package body that supports the light emitting device 420 '' as a base member.

The substrate 410 '' may be made of, for example, FR-4 or CEM-3, but is not limited thereto. For example, the substrate 410 " may be formed of glass, epoxy, ceramic, or the like. Further, it may be formed of a metal and a metal compound, and may include MCPCB, MCCL, and the like.

Fig. 17 schematically shows a state in which the lighting apparatus 10 " according to the present embodiment is mounted on the ceiling 1. Fig. A fixing unit 3 is mounted on the ceiling 1 to fix and fix the lighting device 10 '' and to supply power to the lighting device 10 ''. The lighting device 10 '' may be hermetically fixed to the upper portion of the ceiling 1 by the fixing unit 3.

As shown, the lighting device 10 '' can be fastened in a structure in which the fastening rim 110 '' fits into the hole 2 in the ceiling 1. The holes 2 of the ceiling 1 may be formed in a shape corresponding to the fastening rim 110 '' so that the fastening rim 110 ' There is no gap except a space corresponding to the groove 112 " formed in the groove 110 "

When the cooling fan 300 '' in the housing 200 '' is operated by power supply, the cooling fan 300 '' is operated through the groove 112 '', which is a space between the coupling rim 110 '' and the ceiling 1, The air A flows in from the lower end to the upper end of the housing 200 '' along the flow path 220 '' formed on the outer surface of the housing 200 ''. do. The air A is sucked into the inner space of the housing 200 '' through the air inlet hole 230 '' of the housing 200 ''. The air A sucked into the inner space of the housing 200 '' flows through the spacer 700 '' and the cooling fan 300 '' to the support plate 120 '' of the base 100 '' Flows radially toward the rim along the radiating fins 121 '' on the support plate 120 '', and is radiated to the outside through the air discharge hole 130 ''. At this time, the heated air A 'on the support plate 120''is forcibly drawn into the housing 200''and is discharged to the outside along with the flow of air discharged to the outside, 'And the light source module 400''mounted on the support plate 120''. Further, the inside of the housing 200 '' is cooled by the cold air A which is continuously sucked into the housing 200 ''. Particularly, the lighting device 10 '' according to the embodiment of the present invention includes the housing 200 '' having the flow path 220 '' for flow of the air A on the outer surface of the housing 200 '', Even if the illuminating device 10 " is mounted in the closed fixed unit 3 (for example, a socket structure having a shape corresponding to the housing and in close contact with the outer surface of the housing) It is possible to draw the outside air A into the inside of the housing 200 '' through the formed space. As described above, the heat radiation efficiency can be maximized by cooling the illumination device 10 '' by forcibly blowing the external cold air A, thereby increasing the lifetime of the light source module 400 '', An improvement effect can be obtained.

Hereinafter, various substrate structures that can be employed in the light source module according to various embodiments of the present invention described above will be described.

25, the substrate 1100 includes an insulating substrate 1110 having predetermined circuit patterns 1111 and 1112 formed on one surface thereof, an insulating substrate 1110 contacting the circuit patterns 1111 and 1112, An upper thermal diffusion plate 1140 formed on the other surface of the insulating substrate 1110 for emitting heat generated by the light emitting device 120 and a heat transfer member The upper thermal diffusion plate 1140 and the lower thermal diffusion plate 1160 are connected to each other through the insulating substrate 1110 so as to allow mutual thermal conduction between the upper thermal diffusion plate 1140 and the lower thermal diffusion plate 1160, And can be connected by one through hole 1150.

The insulating substrate 1110 is coated with a copper foil on a ceramic or epoxy resin-based FR4 core, and circuit patterns 1111 and 1112 can be formed through an etching process. The lower surface of the substrate may be thinly coated with an insulating material to form an insulating thin film 1130.

Fig. 26 shows another embodiment of the substrate. The substrate 1200 may include an insulating layer 1220 formed on the first metal layer 1210 and a second metal layer 1230 formed on the insulating layer 1220. Referring to FIG. A step region R for exposing the insulating layer 1220 may be formed on at least one end of the substrate 1200.

The first metal layer 1210 may be formed of a material having good heat generating characteristics and may be formed of a metal or an alloy such as aluminum (Al) or iron (Fe), and may be formed as a single layer or a multilayer structure . The insulating layer 1220 may be formed of a material having an insulating property, and may be formed using an inorganic or organic material. For example, the insulating layer 1220 may be formed of an epoxy-based insulating resin, and may include a metal powder such as aluminum (Al) powder to improve thermal conductivity. The second metal layer 1230 may be formed of a copper (Cu) thin film.

26, the metal substrate according to the present embodiment can be formed such that the distance of the exposed region at one side end of the insulating layer 1220, that is, the insulating distance is larger than the thickness of the insulating layer 1220. [ In this specification, the insulation distance refers to the distance of the exposed region of the insulating layer 1220 between the first metal layer 1210 and the second metal layer 1230. The width of the exposed region of the insulating layer 1220 when viewed from above the metal substrate is referred to as an exposure width W1. The R region shown in FIG. 26 is removed by a grinding process or the like in the process of manufacturing a metal substrate, and is removed by a depth h downward from the surface of the second metal layer 1230, so that the insulating layer 1220 is exposed And shows a stepped structure. If the end portion of the metal substrate is not removed, the insulation distance is the thickness (h1 + h2) of the insulation layer 1220, and a part of the end portion is removed, thereby securing an insulation distance of about W1. Accordingly, when the withstand voltage test of the metal substrate is performed, it is possible to provide a metal substrate having a structure capable of minimizing the possibility of contact between the two metal layers 1210 and 1230 at the ends.

FIG. 27 schematically shows the structure of the metal substrate according to the modification of FIG. Referring to FIG. 27, the metal substrate 1200 'includes an insulating layer 1220' formed on a first metal layer 1210 'and a second metal layer 1230' formed on the insulating layer 1220 ' do. In addition, the insulating layer 1220 'and the second metal layer 1230' include regions removed at a predetermined tilt angle? 1, and the first metal layer 1210 'is also removed at a predetermined tilt angle? Region may be included.

Here, the inclination angle? 1 represents the angle formed by the interface between the insulating layer 1220 'and the second metal layer 1230' and the end of the insulating layer 1220 ', and considering the thickness of the insulating layer 1220' Can be selected so as to secure the desired insulation distance (I). The inclination angle? 1 can be selected in a range of 0 <? 1 <90 (degree). The larger the inclination angle? 1, the larger the insulating distance I and the width W2 of the exposed region of the insulating layer 1220 '. Therefore, in order to secure a larger insulating distance, the inclination angle? For example, 0 <? 1? 45 (degrees).

Fig. 28 schematically shows another embodiment of the substrate. 28, the substrate 1300 includes a resin-coated copper thin film made of a copper foil 1322 laminated on the insulating layer 1321 and the insulating layer 1321 on a metal supporting substrate 1310, (RCC) 1320, and at least one groove for mounting the light emitting device 420 may be formed by removing a part of the coated thin film 1320. The metal substrate is removed from the light emitting device 420 because the metal thin film 1320 is removed from the lower region of the light emitting device 420 and the light emitting device 420 contacts the metal supporting substrate 1310 directly. The heat is directly transferred to the metal supporting substrate 1310, so that the heat radiation performance is improved. The light emitting device 420 may be electrically connected or fixed through soldering 1340 and 1341. On the upper side of the copper foil 1322, a protective layer 1330 made of a liquid PSR may be formed.

29 schematically shows another embodiment of the substrate. The substrate according to the present embodiment includes an anodized metal substrate having excellent heat radiation characteristics and low manufacturing cost. 29, an anodized metal substrate 1400 includes a metal plate 1410, an anodic oxide film 1420 formed on the metal plate 1410, and an electrical wiring 1430 formed on the anodic oxide film 1420 .

The metal plate 1410 may be aluminum (Al) or aluminum alloy, which can be easily obtained at a relatively low cost. Alternatively, the metal plate 1410 may be made of another metal that is anodisable. For example, materials such as titanium and magnesium Is possible.

The aluminum anodic oxide film (Al 2 O 3) 1420 obtained by anodizing aluminum also has a relatively high heat transfer characteristic of about 10 to 30 W / mK. Therefore, the anodized metal substrate exhibits better heat emission characteristics compared to PCBs or MCPCBs of conventional polymer substrates.

30 schematically shows another embodiment of the substrate. The substrate 1500 may include an insulating resin 1520 applied to the metal substrate 1510 and a circuit pattern 1530 formed on the insulating resin 1520. [ The insulating resin 1520 may have a thickness of 200 μm or less and may be laminated on the metal substrate 1510 in the form of a solid film or may be coated by a casting method using a spin coating or a blade in liquid form . The circuit pattern 1530 may be formed by filling metal patterns such as copper in the pattern of the circuit pattern engraved on the insulating resin 1520. The light emitting device 420 may be mounted to be electrically connected to the circuit pattern 1530.

Meanwhile, the substrate may include a flexible circuit board (FPCB) that is deformable. 31, the substrate 1600 includes a flexible circuit board 1610 on which at least one through hole 1611 is formed and a support substrate 1620 on which the flexible circuit board 1610 is mounted, The through hole 1611 may be provided with a heat dissipation adhesive 1640 for bonding the bottom surface of the light emitting device 420 and the upper surface of the support substrate 1620. Here, the bottom surface of the light emitting device 420 may be the bottom surface of the chip package or the bottom surface of the lead frame on which the chip is mounted, or a metal block. A circuit wiring 1630 is formed on the flexible circuit board 1610 to be electrically connected to the light emitting device 420.

As described above, the flexible circuit board 1610 can be used to reduce the thickness and weight of the light emitting device 420, thereby making it possible to make the light emitting device 420 slimmer and lighter, So that heat radiation efficiency of heat generated in the light emitting device 420 can be increased.

The above-described substrate may be formed into a flat and flat plate shape. However, the size and structure of the substrate may be variously modified in correspondence with the structure of an apparatus, for example, a lighting apparatus in which the light source module according to the present embodiment is to be used.

A light emitting device may be mounted on the substrate and electrically connected thereto. The light emitting device 420 may be any photoelectric device that generates light having a predetermined wavelength by a power source applied from the outside. Typically, a semiconductor light emitting diode (LED) having a semiconductor layer epitaxially grown on a growth substrate, . &Lt; / RTI &gt; The light emitting device 420 may emit blue light, green light, or red light, or may emit white light, depending on the contained substance.

For example, the light emitting device 420 may have a stacked structure of an n-type semiconductor layer, a p-type semiconductor layer, and an active layer disposed therebetween. The active layer may be a nitride semiconductor containing In _x Al _y Ga _{1 -x- y} N (0? X? 1, 0? _Y? 1, x + y? 1) Lt; / RTI &gt;

On the other hand, the light emitting device which can be employed in the illumination apparatus according to the above-described embodiment may be variously configured LED chips or various types of LED packages including such LED chips. Hereinafter, various LED chips and LED packages which can be advantageously employed in the present lighting apparatuses will be described.

&Lt; Light emitting device - First example >

32 is a side sectional view schematically showing an example of a light emitting element as an LED chip.

As shown in FIG. 32, the light emitting device 2000 may include a light emitting stack L formed on a growth substrate 2001. The light emitting stack L may include a first conductive semiconductor layer 2004, an active layer 2005, and a second conductive semiconductor layer 2006.

The ohmic contact layer 2008 may be formed on the second conductive semiconductor layer 2006. The first conductive semiconductor layer 2004 and the ohmic contact layer 2008 may be formed on the upper surface of the first conductive semiconductor layer 2004 and the ohmic contact layer 2008, Two electrodes 2009a and 2009b may be formed.

In the present specification, terms such as 'upper', 'upper surface', 'lower surface', 'lower surface', 'side surface' and the like are based on the drawings and may actually vary depending on the direction in which the light emitting device is disposed.

Hereinafter, the main components of the light emitting device will be described in more detail.

[Board]

The substrate constituting the light emitting element is a substrate for growth for epitaxial growth. As the substrate 2001, an insulating, conductive, or semiconductor substrate may be used if necessary. It may be, for example, sapphire, SiC, Si, MgAl ₂ O _4, MgO, LiAlO _2, LiGaO _2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates, and sapphire substrates are used more than silicon carbide substrates, which are expensive. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using the buffer layer 2002 between the substrate 2001 and the GaN-based light emitting laminate L. [

The substrate 2001 may be completely or partially removed or patterned in the chip fabrication process to improve the light or electrical characteristics of the LED chip before or after the growth of the light emitting stack L. [

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the support substrate may be bonded by using a reflective metal, or the reflection structure may be inserted in the middle of the bonding layer can do.

Substrate patterning improves the light extraction efficiency by forming irregularities or slopes before or after growth of the light emitting stack on the main surface (front surface or both sides) or the side surface of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the lattice constants of the hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry are 13.001 Å and 4.758 Å in the c-axis and the a- , R (1102), and the like. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

As another material of the substrate 2001, a Si substrate can be exemplified, which is more suitable for large-scale curing and relatively low in cost, and the mass productivity can be improved. There is a need for a technique for suppressing the occurrence of crystal defects due to the difference in lattice constant between the Si substrate having the (111) plane as the substrate surface and the lattice constant difference of about 17% with GaN. Further, the difference in thermal expansion coefficient between silicon and GaN is about 56%, and a technique for suppressing the wafer warping caused by the difference in thermal expansion rate is needed. Wafer warpage can cause cracking of the GaN thin film, and process control is difficult, which can cause problems such as a large scattering of the emission wavelength in the same wafer.

Since the external quantum efficiency of the light emitting device is lowered by absorbing the light generated from the GaN-based semiconductor, the silicon (Si) substrate may be removed, if necessary, and Si, Ge, SiAl, Or the like is further formed and used.

[Buffer layer]

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI &gt; The buffer layer 2002 is disposed between the substrate 2001 and the light emitting stacked body L for the purpose of preventing dislocation and cracking of the light emitting stacked body L. [ The buffer layer 2002 also functions to reduce the scattering of the wavelength of the wafer by controlling the degree of warping of the substrate during the growth of the active layer.

The buffer layer 2002 may be made of Al _x In _y Ga _{1 -x- y} N (0? X? 1, 0? _Y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. ZrB ₂ , HfB ₂ , ZrN, HfN, TiN and the like can also be used. Further, a plurality of layers may be combined, or the composition may be gradually changed.

Since the Si substrate has a large difference in thermal expansion coefficient from that of GaN, the GaN thin film is grown at a high temperature when the GaN thin film is grown on the silicon substrate, and then the tensile stress is applied to the GaN thin film due to the difference in thermal expansion coefficient between the substrate and the thin film And cracks are likely to occur. Tensile stress is compensated by using a method to prevent cracks by growing the thin film so that the thin film undergoes compressive stress during growth.

Silicon (Si) has a high probability of occurrence of defects due to a difference in lattice constant with GaN. In case of using Si substrate, a complex structure buffer layer is used because it is necessary not only to control defects but also to control stress to suppress warpage.

For example, first, AlN is formed on the substrate 2001. It is advisable to use a material that does not contain Ga to prevent Si and Ga reactions. AlN as well as materials such as SiC can be used. And grown at a temperature between 400 and 1300 ° C using an Al source and an N source. If necessary, an AlGaN intermediate layer for controlling the stress in the middle of GaN can be inserted between the plurality of AlN layers.

[Luminescent laminate]

More specifically, the first and second conductivity-type semiconductor layers 2004 and 2006 are made of semiconductors doped with n-type and p-type impurities, respectively, .

However, the present invention is not limited thereto, and conversely, it may be a p-type and an n-type semiconductor layer, respectively. For example, the first and second conductivity type semiconductor layer (2004, 2006), group III nitride semiconductor, for example, Al _x In _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0? X + y? 1). Of course, the present invention is not limited to this, and materials such as AlGaInP series semiconductor and AlGaAs series semiconductor may be used.

Meanwhile, the first and second conductivity type semiconductor layers 2004 and 2006 may have a single-layer structure, but may have a multi-layer structure having different compositions and thicknesses as needed. For example, the first and second conductivity type semiconductor layers 2004 and 2006 may have a carrier injection layer capable of improving injection efficiency of electrons and holes, respectively, and may have various superlattice structures You may.

The first conductive semiconductor layer 2004 may further include a current diffusion layer (not shown) at a portion adjacent to the active layer 2005. The current diffusion layer may have a structure in which a plurality of In _x Al _y Ga _(1-xy) N layers having different compositions or having different impurity contents are repeatedly laminated, or a layer of an insulating material may be partially formed.

The second conductivity type semiconductor layer 2006 may further include an electron blocking layer (not shown) at a portion adjacent to the active layer 2005. The electron blocking layer may have a structure in which a plurality of different In _x Al _y Ga _(1-xy) N layers are stacked or a single layer or more of Al _y Ga _(1-y) N, (P-type) semiconductor layer 2006. The second conductive type (p-type) semiconductor layer 2006 has a bandgap larger than that of the second conductive type

The light emitting laminate L may be an MOCVD apparatus and may be fabricated by using an organic metal compound gas such as trimethyl gallium (TMG), trimethyl aluminum (TMA), or the like as a reaction gas in a reaction vessel provided with a growth substrate 2001, , Etc.) and a nitrogen-containing gas (ammonia (NH 3) or the like) are supplied to the substrate, the temperature of the substrate is maintained at a high temperature of 900 ° C to 1100 ° C and a gallium nitride compound semiconductor is grown on the substrate. And a gallium nitride compound semiconductor is laminated in an undoped, n-type, or p-type. As the n-type impurity, Si is well known. As the p-type impurity, Zn, Cd, Be, Mg, Ca, Ba, etc. are mainly used.

The active layer 2005 disposed between the first and second conductivity type semiconductor layers 2004 and 2006 may be a multiple quantum well (MQW) structure in which a quantum well layer and a quantum barrier layer are alternately stacked, for example, a nitride semiconductor , A GaN / InGaN structure may be used, but a single quantum well (SQW) structure may also be used.

[The ohmic contact layer and the first and second electrodes]

The ohmic contact layer 2008 may have a relatively high impurity concentration to lower the ohmic contact resistance, thereby lowering the device operating voltage and improving the device characteristics. The ohmic contact layer 2008 may be composed of GaN, InGaN, ZnO, or a graphene layer.

The first and second electrodes 2009a and 2009b may include materials such as Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, , Ni / Al, Zn / Al, Pd / Ag, Pd / Al, Ir / Ag. Or two or more layers such as Ir / Au, Pt / Ag, Pt / Al, and Ni / Ag / Pt.

The LED chip shown in FIG. 32 includes, for example, a structure in which the first and second electrodes face the same surface as the light extracting surface, a flip chip structure in which the first and second electrodes are opposite to the light extracting surface, The vertical structure formed on the opposite surface, the structure for increasing the efficiency of current dispersion and the heat dissipation efficiency, and the vertical and horizontal structure employing the electrode structure by forming multiple vias on the chip.

&Lt; Light emitting device - Example 2 &

In the case of manufacturing a large-area light emitting device for high output, the LED chip shown in FIG. 33 may be a structure for efficiency of current dispersion and heat dissipation efficiency.

33, the LED chip 2100 includes a first conductive semiconductor layer 2104, an active layer 2105, a second conductive semiconductor layer 2106, a second electrode layer 2107, an insulating layer 2102 ), A first electrode layer 2108, and a substrate 2101. The first electrode layer 2108 is electrically insulated from the second conductivity type semiconductor layer 2106 and the active layer 2105 to be electrically connected to the first conductivity type semiconductor layer 2104, And at least one contact hole (H) extending from one surface to at least a partial region of the first conductive type semiconductor layer (2104). The first electrode layer 2108 is not an essential component in the present embodiment.

The contact hole H is formed in the first conductive semiconductor layer 2104 through the second electrode layer 2107, the second conductivity type semiconductor layer 2106, and the active layer 2105 from the interface of the first electrode layer 2108, . At least to the interface between the active layer 2105 and the first conductivity type semiconductor layer 2104 and preferably to a portion of the first conductivity type semiconductor layer 2104. [ However, since the contact hole H is for electrical connection and current dispersion of the first conductivity type semiconductor layer 2104, the contact hole H may be formed in contact with the first conductivity type semiconductor layer 2104, 2104, &lt; / RTI &gt;

A second electrode layer 2107 connected to the second conductivity type semiconductor layer 2106 may be formed of Ag, Ni, Al, Rh, Pd, or the like in consideration of the light reflection function, the second conductivity type semiconductor layer 2106, , Ir, Ru, Mg, Zn, Pt, and Au, and may be sputtered or deposited.

The contact hole H has a shape penetrating the second electrode layer 2107, the second conductivity type semiconductor layer 2106, and the active layer 2105 to be connected to the first conductivity type semiconductor layer 2104. Such a contact hole H can be performed using an etching process, for example, ICP-RIE.

An insulating layer 2102 is formed to cover the side wall of the contact hole H and the lower surface of the second electrode layer 2107. In this case, at least a part of the first conductivity type semiconductor layer 2104 may be exposed by the contact hole H. The insulating layer 2102 may be formed by depositing an insulating material such as SiO ₂ , SiO _x N _y , or Si _x N _y . The insulating layer 2102 may be deposited to a thickness of approximately 0.01 μm to 3 μm at 500 ° C. or lower through a CVD process.

A first electrode layer 2108 including a conductive via filled with a conductive material is formed in the contact hole H. The plurality of conductive vias may be formed in one light emitting device region. The number of vias and the contact area can be adjusted so that the area occupied by the plurality of vias on the plane of the region in contact with the first conductivity type semiconductor layer 2104 is in the range of 1% to 5% of the area of the light emitting device region. The radius on the plane of the region of the via contacting the first conductive type semiconductor layer 2104 may be, for example, in the range of 5 to 50 占 퐉, and the number of vias may be, Can be from 1 to 50 per one. The distance between the vias may be a matrix structure having rows and columns in the range of 100 to 500 mu m, more preferably 150 to 450 mu m, and more preferably, Lt; / RTI &gt; If the distance between the vias is less than 100 탆, the number of vias increases, the light emission area decreases, and the luminous efficiency decreases. If the distance is larger than 500 탆, current diffusion becomes difficult and the luminous efficiency may become poor. The depth of the contact hole H may be in a range of approximately 0.5 탆 to 5.0 탆 though it depends on the thickness of the second conductivity type semiconductor layer and the active layer.

Subsequently, a substrate 2101 is formed under the first electrode layer 2108. In this structure, the substrate 2101 may be electrically connected by the conductive vias connected to the first conductive type semiconductor layer 2104.

Material that the substrate 2101 includes any one of, but are not limited to Au, Ni, Al, Cu, W, Si, Se, GaAs, SiAl, Ge, Sic, AlN, Al 2 O 3, GaN, AlGaN And may be formed by a process such as plating, sputtering, vapor deposition or adhesion.

The number, shape, pitch, contact area of the first and second conductivity type semiconductor layers 2104 and 2106, and the like can be appropriately adjusted so that the contact resistance of the contact hole H is lowered. The current flow can be improved. At this time, the second electrode layer 2107 may include at least one exposed region E, that is, a portion of the interface between the second conductive semiconductor layer 2106 and the second conductive semiconductor layer 2106. And an electrode pad portion 2109 for connecting an external power source to the second electrode layer 2107 may be provided on the exposed region E. [

32, the LED chip 2100 includes first and second conductive semiconductor layers 2104 and 2102 having first and second major surfaces opposite to each other and providing the first and second main surfaces, respectively, A contact hole H connected to one region of the first conductive type semiconductor layer 2104 from the second main surface through the active layer 2105 and a second conductive type semiconductor layer 2104 formed between the second main surface and the active layer 2105; A first electrode layer 2108 formed on a second main surface of the light emitting structure and connected to one region of the first conductivity type semiconductor layer 2104 through the contact hole H, And a second electrode layer 2107 formed on the second conductive semiconductor layer 2106 and connected to the second conductive semiconductor layer 2106. Here, one of the first and second electrode layers 2108 and 2107 may have a structure that is drawn out laterally of the light emitting structure.

&Lt; Light emitting device - third example &

Although the illumination device using the LED provides the improved heat dissipation characteristic, it is preferable that the LED chip itself used in the illumination device is used as an LED chip having a small heat generation amount in terms of overall heat radiation performance. An LED chip (hereinafter referred to as a "nano LED chip") including a nano structure may be used as the LED chip satisfying these requirements.

In recent years, there has been developed a core / shell type nano LED chip as a nano LED chip. Particularly, since the bonding density is relatively small, the heat generation is relatively small and the light emitting area is increased by utilizing the nano structure, The efficiency can be increased, and the nonpolar active layer can be obtained, so that the decrease in efficiency due to polarization can be prevented, and droop characteristics can be improved.

Fig. 34 exemplifies a nano-LED chip as another example of the LED chip that can be employed in the light source module.

As shown in FIG. 34, the nano-LED chip 2200 includes a plurality of nano-light-emitting structures N formed on a substrate 2201. In this example, the nano-light-emitting structure N is illustrated as a rod-like structure as a core-shell structure, but it is not limited thereto and may have another structure such as a pyramid structure.

The nano-LED chip 2200 includes a base layer 2202 formed on a substrate 2201. The base layer 2202 may be a first conductive semiconductor layer as a layer for providing a growth surface of the nano-light emitting structure N. On the base layer 2202, a mask layer 2203 having an open region for growing the nano-light-emitting structure N (in particular, a core) may be formed. The mask layer 2203 may be a dielectric material such as SiO ₂ or SiN _x .

The nano-light-emitting structure N may be formed by selectively growing a first conductive type semiconductor layer using a mask layer 2203 having an open region to form a first conductive type nanocore 2204, An active layer 2205 and a second conductivity type semiconductor layer 2206 are formed as a shell layer on the surface. The nano-light-emitting structure N may include a core-shell structure in which the first conductivity type semiconductor layer becomes a nanocore, the active layer 2205 that surrounds the nanocore, and the second conductivity type semiconductor layer 2206 form a shell layer. ) Structure.

The nano-LED chip 2200 according to the present example includes a filling material 2207 filled between the nano-light-emitting structures N. The filling material 2207 may be employed as needed to structurally stabilize and optically improve the nano-luminous structure N. [ The filling material 2207 is not limited thereto, but may be formed of a transparent material such as SiO ₂ . The ohmic contact layer 2208 may be formed on the nano-light-emitting structure N so as to be connected to the second conductive semiconductor layer 2206. The nano-LED chip 2200 includes first and second electrodes 2209a and 2209b connected to the base layer 2202 and the ohmic contact layer 2208, respectively.

At least one of the diameter, the component and the doping concentration of the nanostructured structure N may be differently applied to emit light of two or more different wavelengths in a single device. White light can be realized without using a phosphor in a single device by appropriately controlling light of other wavelengths and it is possible to combine other LED chips with such a device or to combine wavelength conversion materials such as phosphors to obtain desired color light or color temperature Different white light can be realized.

&Lt; Light emitting device - fourth example &

35 shows a semiconductor light emitting element 2300 having an LED chip 2310 mounted on a mounting substrate 2320 as a light source which can be employed in an illumination apparatus.

The semiconductor light emitting device 2300 shown in FIG. 35 includes a mounting substrate 2320 and an LED chip 2310 mounted on the mounting substrate 2320. The LED chip 2310 is shown as an LED chip different from the example described above.

The LED chip 2310 includes a light emitting stacked body L disposed on one side of the substrate 2301 and first and second light emitting element units 2301 and 2302 disposed on the side opposite to the substrate 2301 with respect to the light emitting stacked body L, Electrodes 2308a and 2308b. In addition, the LED chip 2310 includes an insulating portion 2303 formed to cover the first and second electrodes 2308a and 2308b.

The first and second electrodes 2308a and 2308b may include first and second electrode pads 2319a and 2319b electrically connected to each other by first and second electrical connection portions 2309a and 2309b.

The light emitting layered product L may include a first conductive type semiconductor layer 2304, an active layer 2305, and a second conductive type semiconductor layer 2306. The first electrode 2308a may be provided as a conductive via connected to the first conductive type semiconductor layer 2304 through the second conductive type semiconductor layer 2306 and the active layer 2305. [ The second electrode 2308b may be connected to the second conductive type semiconductor layer 2306. [

The plurality of conductive vias may be formed in one light emitting device region. The number of vias and the contact area can be adjusted so that the area occupied by the plurality of vias on the plane of the region in contact with the first conductivity type semiconductor layer 2304 is in a range of 1% to 5% of the area of the light emitting device region. The radius on the plane of the region of the via contact with the first conductivity type semiconductor layer 2304 may be, for example, in the range of 5 占 퐉 to 50 占 퐉, and the number of vias depends on the width of the light emitting element region, And may be from 1 to 50 per region. The distance between the vias may be a matrix structure having rows and columns in the range of 100 to 500 mu m, more preferably 150 to 450 mu m, and more preferably, Lt; / RTI &gt; If the distance between the vias is less than 100 탆, the number of vias increases, the emission area decreases, and the luminous efficiency decreases. If the distance is larger than 500 탆, current diffusion becomes difficult and the luminous efficiency may become poor. The depth of the via depends on the thickness of the second conductivity type semiconductor layer 2306 and the active layer 2305, but may be in the range of 0.5 μm to 5 μm.

A conductive ohmic material is deposited on the light emitting stacked body (L) to form the first and second electrodes 2308a and 2308b. The first and second electrodes 2308a and 2308b may be formed of a material such as Ag, Al, Ni, Cr, Cu, Au, Pd, Pt, Sn, Ti, W, Rh, Ir, Ru, Mg, Zn, Or the like. For example, the second electrode 2308b may be an ohmic electrode of the Ag layer stacked with respect to the second conductive type semiconductor layer 2306. The Ag ohmic electrode also serves as a light reflection layer. A single layer of Ni, Ti, Pt, or W, or an alloy layer thereof may alternatively be stacked on the Ag layer. Specifically, a Ni / Ti layer, a TiW / Pt layer, or a Ti / W layer may be laminated on the Ag layer, or these layers may be alternately laminated.

The first electrode 2308a may include a Cr layer stacked on the first conductive type semiconductor layer 2304, an Au / Pt / Ti layer stacked on the Cr layer in order, An Al layer is stacked on the Al layer 2306, and a Ti / Ni / Au layer is stacked on the Al layer in this order. The first and second electrodes 2308a and 2308b may be formed of various materials or laminated structures in addition to the above embodiments in order to improve ohmic characteristics or reflection characteristics.

The insulating portion 2303 may have an open region to expose at least a portion of the first and second electrodes 2308a and 2308b and the first and second electrode pads 2319a and 2319b may be formed in the first and second electrodes 2308a and 2308b. And may be connected to the second electrodes 2308a and 2308b. The insulating portion 2303 may be deposited to a thickness of 0.01 탆 to 3 탆 at a temperature of 500 캜 or lower through a SiO 2 and / or SiN CVD process.

The first and second electrodes 2308a and 2308b may be disposed in the same direction as each other. The first and second electrodes 2308a and 2308b may be mounted on a lead frame or the like in a so-called flip-chip manner.

In particular, the first electrode 2308a penetrates the second conductive type semiconductor layer 2304 and the active layer 2305 and is electrically connected to the first conductive type semiconductor layer 2304 in the light emitting layered structure (L) May be connected to the first electrical connection 2309a having a via.

The number, shape, pitch, contact area with the first conductive type semiconductor layer 2304, and the like of the conductive via and the first electrical connection portion 2309a can be appropriately adjusted so that the contact resistance is lowered, 1 electrical connection portions 2309a are arranged in rows and columns so that current flow can be improved.

The other electrode structure may include a second electrode 2308b directly formed on the second conductive type semiconductor layer 2306 and a second electrical connection portion 2309b formed on the second electrode 2308b. The second electrode 2308b is formed of a light reflecting material in addition to the function of forming an electrical ohmic contact with the second conductive type semiconductor layer 2306. As a result, The light emitted from the active layer 2305 can be effectively radiated toward the substrate 2301. [0154] FIG. Of course, depending on the main light emitting direction, the second electrode 2308b may be made of a light-transmitting conductive material such as a transparent conductive oxide.

The two electrode structures described above can be electrically separated from each other by an insulating portion 2303. The insulating portion 2303 may be any material having an electrically insulating property, but it is preferable to use a material having a low light absorptivity. For example, silicon oxide such as SiO ₂ , SiO _x N _y , Si _x N _y , or silicon nitride may be used. If necessary, a light reflecting structure can be formed by dispersing a light reflecting filler in a light transmitting substance.

The first and second electrode pads 2319a and 2319b may be connected to the first and second electrical connection portions 2309a and 2309b to function as external terminals of the LED chip 2310, respectively. For example, the first and second electrode pads 2319a and 2319b may be Au, Ag, Al, Ti, W, Cu, Sn, Ni, Pt, Cr, NiSn, TiW, AuSn, have. In this case, since the solder bumps can be bonded to the mounting substrate 2320 using eutectic metals, a separate solder bump generally required for flip chip bonding can be omitted. There is an advantage that the heat dissipation effect is more excellent in the mounting method using the eutectic metal than in the case of using the solder bump. In this case, in order to obtain an excellent heat radiation effect, the first and second electrode pads 2319a and 2319b may be formed to occupy a wide area.

The substrate 2301 and the light emitting stack L can be understood with reference to the description with reference to FIG. 32, unless otherwise described. Although not shown in detail, a buffer layer (not shown) may be formed between the light-emitting stacked body L and the substrate 2301, and the buffer layer is employed as an undoped semiconductor layer made of nitride or the like, The lattice defects of the light emitting structure can be relaxed.

The substrate 2301 may have first and second major surfaces opposite to each other, and at least one of the first and second major surfaces may have a concave-convex structure. The concavo-convex structure formed on one surface of the substrate 2301 may be formed of the same material as the substrate 2301, or may be formed of a different material from the substrate 2301.

Since the path of the light emitted from the active layer 2305 may be varied by forming the concave-convex structure on the interface between the substrate 2301 and the first conductive type semiconductor layer 2304, The rate of absorption of the light is reduced and the light scattering ratio is increased, so that the light extraction efficiency can be increased.

Specifically, the concavo-convex structure may be formed to have a regular or irregular shape. A transparent conductor, a transparent insulator, or a material having excellent reflectivity may be used as the heterogeneous material forming the unevenness. As the transparent insulator, a material such as SiO ₂ , SiN _x , Al ₂ O ₃ , HfO, TiO ₂ or ZrO is used as the transparent conductor, ZnO or the additive (Mg, Ag, Zn, Sc, Hf, Zr, A transparent conductive oxide (TCO) such as indium oxide containing indium tin oxide (ITO), tin oxide (ITO), tin oxide DBRs having a multi-layer structure can be used, but the present invention is not limited thereto.

The substrate 2301 may be removed from the first conductive semiconductor layer 2304. For removing the substrate, a laser lift off (LLO) process or an etching and polishing process can be used. In addition, the surface of the first conductivity type semiconductor layer from which the substrate has been removed can be provided with irregularities.

As shown in FIG. 35, the LED chip 2310 is mounted on a mounting substrate 2320. The mounting substrate 2320 includes upper and lower electrode layers 2312b and 2312a formed on the upper and lower surfaces of the substrate body 2311 and the substrate body 2311 to connect the upper and lower electrode layers 2312b and 2312a. And a via 2313 penetrating therethrough. The upper and lower electrode layers 2312b and 2312a may be a metal layer such as Au, Cu, Ag, or Al. The substrate body 2311 may be made of resin, ceramic, or metal.

Of course, the substrate on which the above LED chip 2310 is mounted is not limited to the form of the mounting substrate 2320 shown in FIG. 35, and any substrate having a wiring structure for driving the LED chip 2310 can be applied Do. For example, either of the substrates of Figs. 25 to 31 or a package structure in which an LED chip is mounted on a package body having a pair of lead frames may be provided.

&Lt; Other Example of Light Emitting Element >

In addition to the LED chips described above, LED chips of various structures can be used. For example, an LED chip having greatly improved light extraction efficiency by interacting with quantum well excitons by forming surface-plasmon polarites (SPP) on the metal-dielectric boundary of the LED chip may be usefully used.

The light emitting device 420 may include at least one of a light emitting device that emits white light in combination with a phosphor of yellow, green, red, or orange and a purple, blue, green, red, or infrared light emitting device have. In this case, the light emitting device 420 can adjust the color rendering index (CRI) from sodium (Na) or the like (color rendering index 40) to the level of sunlight (color rendering index 100), and can change the color temperature from 2000K to 20000K If necessary, the visible light or the infrared light of purple, blue, green, red, or orange may be generated to adjust the illumination color according to the ambient atmosphere or mood. In addition, light of a special wavelength capable of promoting plant growth may be generated.

(X, y) coordinates of the CIE 1931 coordinate system shown in FIG. 36 is (0.4476) in the case where the white light made of the combination of yellow, green, red phosphors and / or green and red LEDs in the blue LED has two or more peak wavelengths. , 0.4074), (0.3484, 0.3516), (0.3101, 0.3162), (0.3128, 0.3292), (0.3333, 0.3333). Or may be located in an area surrounded by the line segment and the blackbody radiation spectrum. The color temperature of the white light corresponds to between 2000K and 20000K.

The phosphor may have the following composition formula and color.

Oxide system: yellow and green Y3Al5O12: Ce, Tb3Al5O12: Ce, Lu3Al5O12: Ce

(Ba, Sr) 2SiO4: Eu, yellow and orange (Ba, Sr) 3SiO5: Ce

Eu, Sr2Si5N8: Eu, SrSiAl4N7: Eu, Eu3O3: Eu, Eu3O3: Eu,

Fluoride system: KSF system Red K2SiF6: Mn4 +

The phosphor composition should basically conform to the stoichiometry, and each element can be replaced with another element in each group on the periodic table. For example, Sr can be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y can be replaced with lanthanide series Tb, Lu, Sc, Gd and the like. In addition, Eu, which is an activator, can be substituted with Ce, Tb, Pr, Er, Yb or the like according to a desired energy level.

In addition, materials such as Quantum Dots (QD) can be applied as a substitute for a fluorescent material, and fluorescent materials and QDs can be mixed with LEDs or used alone.

QD can be composed of a core (3 to 10 nm) such as CdSe and InP, a shell (0.5 to 2 nm) such as ZnS and ZnSe, and a ligand for stabilizing core and shell , And various colors can be implemented depending on the size.

Table 1 below shows the types of phosphors for application fields of white light emitting devices using blue LEDs (440 to 460 nm).

Usage Phosphor LED TV BLU ? -SiAlON: Eu2 +
(Ca, Sr) AlSiN3: Eu &lt; 2 + &gt;
L3Si6O11: Ce3 +
K2SiF6: Mn4 + light Lu3Al5O12: Ce3 +
Ca-α-SiAlON: Eu2 +
L3Si6N11: Ce3 +
(Ca, Sr) AlSiN3: Eu &lt; 2 + &gt;
Y3Al5O12: Ce3 +
K2SiF6: Mn4 + Side View
(Mobile, Note PC) Lu3Al5O12: Ce3 +
Ca-α-SiAlON: Eu2 +
L3Si6N11: Ce3 +
(Ca, Sr) AlSiN3: Eu &lt; 2 + &gt;
Y3Al5O12: Ce3 +
(Sr, Ba, Ca, Mg) 2SiO4: Eu2 +
K2SiF6: Mn4 + Battlefield
(Head Lamp, etc.) Lu3Al5O12: Ce3 +
Ca-α-SiAlON: Eu2 +
L3Si6N11: Ce3 +
(Ca, Sr) AlSiN3: Eu &lt; 2 + &gt;
Y3Al5O12: Ce3 +
K2SiF6: Mn4 +

The coating method of the fluorescent substance or the quantum dot may be at least one of a method of sprinkling on the light emitting device, a method of covering with a film form, and a method of attaching a sheet form such as a film or a ceramic fluorescent substance.

Dispensing, spray coating and the like are generally used as a rooting method, and dispensing includes a mechanical method such as a pneumatic method and a screw or a linear type. It is also possible to control the amount of dyeing through a small amount of jetting by a jetting method and to control the color coordinates thereof. The method of collectively applying the phosphor on the wafer level or the light emitting element by a spray method can easily control productivity and thickness.

The method of directly covering the light emitting device in a film form can be applied by a method of electrophoresis, screen printing or phosphor molding, and there may be a difference in the method depending on necessity of application of the chip side.

In order to control the efficiency of the long wavelength light emitting phosphor that reabsers light emitted from a short wavelength among two or more kinds of phosphors having different emission wavelengths, it is possible to distinguish two or more kinds of phosphor layers having different emission wavelengths, And a DBR (ODR) layer between each layer to minimize interference. In order to form a uniform coating film, the phosphor may be formed into a film or ceramic form and then attached to a chip.

In order to differentiate the light efficiency and the light distribution characteristic, the photoelectric conversion material may be located in a remote format. In this case, the photoelectric conversion material may be positioned together with the light transmission polymer, glass, etc. depending on the durability and heat resistance.

Since the phosphor coating technique plays a great role in determining the optical characteristics in the light emitting device, control techniques such as the thickness of the phosphor coating layer and uniform dispersion of the phosphor have been studied variously.

QD can also be located in the light emitting device in the same manner as the phosphor, and can be positioned between the glass or transparent polymer material to perform photo conversion.

In the present embodiment, the light emitting device exemplifies a package single unit having an LED chip therein, but the present invention is not limited thereto. For example, the light emitting device may be an LED chip itself. In this case, the LED chip may be mounted on the substrate in a COB type and directly electrically connected to the substrate by a flip chip bonding method or a wire bonding method.

In addition, a plurality of the light emitting devices may be arranged on the substrate. In this case, the light emitting devices may all be the same type that emits light of the same wavelength. In addition, they may be variously configured to generate light of mutually different wavelengths. In the present embodiment, a plurality of light emitting devices are exemplified, but the present invention is not limited thereto, and a single device may be used.

The lighting apparatus using the above-described LEDs can be roughly divided into indoor and outdoor depending on the use thereof. Indoor LED lighting equipment is mainly used for lamps, fluorescent lamps (LED-tubes) and flat-panel lighting devices. Outdoor LED lighting devices are street lights, security lights, floodlights, And so on.

Further, the illumination device using the LED can be utilized as an internal and external light source for a vehicle. As an internal light source, it can be used as a vehicle interior light, a reading light, various light sources of a dashboard, etc. It is an external light source for a vehicle and can be used for all light sources such as headlights, brakes, turn signals, fog lights,

In addition, an LED lighting device can be applied as a light source used in a robot or various kinds of mechanical equipment. In particular, LED lighting using a special wavelength band can stimulate the growth of plants, emotional lighting can stabilize a person's mood or heal disease.

An illumination system employing the above-described illumination device will be described with reference to Figs. 37 to 40. Fig. The illumination system according to the present embodiment can automatically adjust the color temperature according to the surrounding environment (for example, temperature and humidity), and can provide a lighting device as emotional lighting capable of satisfying human sensibility, can do.

37 is a block diagram schematically showing an illumination system according to an embodiment of the present invention.

Referring to FIG. 37, an illumination system 10000 according to an embodiment of the present invention may include a sensing unit 10010, a control unit 10020, a driver 10030, and an illumination unit 10040.

The sensing unit 10010 may be installed indoors or outdoors and includes a temperature sensor 10011 and a humidity sensor 10012 to measure at least one of ambient temperature and humidity. The sensing unit 10010 transmits the measured air condition, that is, temperature and humidity, to the controller 10020 electrically connected thereto.

The control unit 10020 compares the temperature and humidity of the measured air with the air condition (temperature and humidity range) preset by the user, and determines the color temperature of the illumination unit 10040 corresponding to the air condition as a result of the comparison. The control unit 10020 is electrically connected to the driving unit 10030 and controls the driving unit 10030 so that the lighting unit 10040 can be driven at the determined color temperature.

The illumination unit 10040 operates according to the power supplied from the driving unit 10030. The illumination unit 10040 may include at least one illumination device shown in FIGS. 1, 8, and 15. For example, as shown in FIG. 38, the illumination unit 10040 may include a first illumination device 10041 and a second illumination device 10042 having different color temperatures, and each illumination device 10041, 10042 may include a plurality of light emitting elements emitting the same white light.

The first illuminator 10041 emits white light of the first color temperature and the second illuminator 10042 emits white light of the second color temperature and the first color temperature may be lower than the second color temperature. Alternatively, the first color temperature may be higher than the second color temperature. Here, a relatively white color having a relatively low color temperature corresponds to a warm white color, and a relatively white color having a relatively high color temperature corresponds to a cool white color. When power is supplied to the first and second illuminating devices 10041 and 10042, white light having the first and second color temperatures is emitted, and the white light is mixed with the white light having the color temperature determined by the control unit 10020 Can be implemented.

Specifically, when the first color temperature is lower than the second color temperature, if the color temperature determined by the control unit 10020 is determined to be relatively high, the amount of light of the first illuminating apparatus 10041 is decreased and the light amount of the second illuminating apparatus 10042 So that the mixed white light has the determined color temperature. Conversely, if the determined color temperature is determined to be relatively low, it is possible to increase the amount of light of the first illuminating device 10041 and reduce the amount of light of the second illuminating device 10042 so that the mixed white light becomes the determined color temperature. At this time, the light quantity of each of the illumination devices 10041 and 10042 may be realized by adjusting the power of the light emitting devices by adjusting the power, or by adjusting the number of the light emitting devices to be driven.

39 is a flowchart for explaining the control method of the illumination system shown in Fig. Referring to FIG. 39, the user sets a color temperature according to the temperature and humidity range through the control unit 10020 (S10). The set temperature and humidity data is stored in the control unit 10020.

In general, when the color temperature is 6000K or more, it can produce a feeling of cool feeling such as blue, and when the color temperature is 4000K or less, it is possible to produce a warm feeling feeling such as red. Therefore, in the present embodiment, when the temperature and humidity exceed 20% and 60% through the control unit 10020, the color temperature of the illumination unit 10040 is set to be lit up to 6000K or more, The color temperature of the illumination unit 10040 is set to be between 4000 and 6000K and the temperature and humidity of the illumination unit 10040 are set to 1040 degrees or less and 40% .

Next, the sensing unit 10010 measures at least one of the ambient temperature and humidity (S20). The temperature and humidity measured by the sensing unit 10010 are transmitted to the controller 10020.

Next, the control unit 10020 compares the measured value transmitted from the sensing unit 10010 with the set value (S30). Here, the measurement value is the temperature and humidity data measured by the sensing unit 10010, and the set value is the temperature and humidity data preset by the user in the control unit 10020. That is, the controller 10020 compares the measured temperature and humidity with preset temperatures and humidity.

As a result of the comparison, it is determined whether the measurement value satisfies the set value range (S40). If the measurement value satisfies the set value range, the current color temperature is maintained, and the temperature and humidity are again measured (S20). On the other hand, if the measured value does not satisfy the set value range, the set value corresponding to the measured value is detected and the corresponding color temperature is determined (S50). The control unit 10020 controls the driving unit 10030 to drive the illumination unit 10040 at the determined color temperature.

Then, the driving unit 10030 drives the illumination unit 10040 so as to obtain the determined color temperature (S60). That is, the driving unit 10030 supplies a power source necessary for driving the determined color temperature to the illumination unit 10040. Thus, the illumination unit 10040 can be adjusted to the color temperature corresponding to the temperature and humidity preset by the user according to the ambient temperature and humidity.

Thus, the illumination system can automatically adjust the color temperature of the indoor lighting unit according to the ambient temperature and humidity change, thereby satisfying the human sensibility that changes according to the change of the natural environment, and also providing the psychological stability feeling.

Fig. 40 is a use example schematically illustrating the illumination system shown in Fig. 37. Fig. As shown in FIG. 40, the illumination unit 10040 can be installed on the ceiling as an indoor illumination light. At this time, the sensing unit 10010 may be implemented as a separate unit and installed in the outer wall to measure outdoor air temperature and humidity. The controller 10020 may be installed in the room to facilitate user setting and confirmation. However, the illumination system of the present invention is not limited thereto, and may be applied to a wall mounted on a wall instead of an interior light, or an illumination light which can be used indoors or outdoors, such as a stand.

Another embodiment of the lighting system using the above-described lighting apparatus will be described with reference to Figs. 41 to 44. Fig. The illumination system according to the present embodiment can provide an illumination system capable of detecting the motion and illuminance of the monitored position and automatically performing a predetermined control.

41 is a block diagram of a lighting system according to another embodiment of the present invention.

Referring to Fig. 41, an illumination system 10000 'according to the present embodiment includes a wireless sensing module 10100 and a wireless lighting control apparatus 10200. [

The wireless sensing module 10100 includes a motion sensor 10110 for sensing motion, an illuminance sensor 10120 for sensing the illuminance, a motion sensing signal from the motion sensor 10110, And a first wireless communication unit including a roughness sensing signal to generate and transmit a wireless signal conforming to a predetermined communication protocol. The first wireless communication unit may include a first Zigbee communication unit 10130 that generates and transmits a ZigBee signal conforming to a predetermined ZigBee communication protocol.

The wireless lighting control apparatus 10200 includes a second wireless communication unit for receiving a wireless signal from the first wireless communication unit and restoring the wireless signal to a sensing signal, a sensing signal analysis unit 10220 for analyzing a sensing signal from the second wireless communication unit And an operation control unit 10230 for performing predetermined control according to an analysis result of the sensing signal analysis unit 10220. The second wireless communication unit may include a second Zigbee communication unit 10210 receiving the zigbee signal from the first zigbee communication unit and restoring the received signal as a sensing signal.

42 is a format diagram of the ZigBee signal of the present invention.

42, the ZigBee signal of the first Zigbee communication unit 10130 includes channel information defining a communication channel, wireless network identification information (PAN_ID) defining a wireless network, a device address specifying a target device, And sensing data including an illuminance signal.

The ZigBee signal of the second Zigbee communication unit 10210 includes channel information defining a communication channel, wireless network identification information (PAN_ID) defining a wireless network, a device address specifying a target device, and a motion and illumination signal The sensing data may include the sensing data.

The sensing signal analyzing unit 10220 may analyze the sensing signal from the second Zigbee communication unit 10210 and find a satisfying condition among a plurality of conditions according to the sensed motion and illuminance.

At this time, the operation control unit 10230 sets a plurality of controls according to a plurality of predetermined conditions in the sensing signal analysis unit 10220, and performs control corresponding to the conditions detected by the sensing signal analysis unit 10220 .

43 is an explanatory diagram of a sensing signal analysis unit and an operation control unit of the present invention. 43, for example, the sensing signal analyzing unit 10220 analyzes the sensing signal from the second Zigbee communication unit 10210 and outputs the first, second, and third sensing signals according to the sensed motion and illuminance. 3 conditions (condition 1, condition 2, condition 3).

At this time, the operation control unit 10230 controls the operation of the first, second, and third sensing signals according to the first, second, and third conditions (condition 1, condition 2, condition 3) Control (control 1, control 2, control 3), and perform control corresponding to the condition detected by the sensing signal analyzer 10220. [

44 is a flowchart of the operation of the wireless lighting system of the present invention.

In Fig. 44, S110 is a process in which the motion sensor 10110 of the present invention detects motion. S120 is a process in which the illuminance sensor 10120 of the present invention detects illuminance. S200 is a transmission / reception process of a ZigBee signal, which includes a process of transmitting the ZigBee signal by the first Zigbee communication unit 10130 and a process of receiving the ZigBee signal by the second Zigbee communication unit 10210. In step S220, the sensing signal analyzing unit 10220 analyzes the sensing signal. S230 is a process in which the operation control unit 10230 of the present invention performs predetermined control. In step S240, it is determined whether the system is terminated.

41 to 44, the operation of the wireless sensing module and the wireless lighting control apparatus of the present invention will be described.

First, the wireless sensing module 10100 of the wireless lighting system according to the present invention will be described with reference to FIGS. 41, 42 and 44. The wireless sensing module 10100 according to the present invention is installed in a place where lights are installed, Detects the illuminance of the current illumination, and detects the movement of a person around the illumination.

That is, the motion sensor 10110 of the wireless sensing module 10100 includes an infrared sensor capable of sensing a person, and senses motion and provides the sensed motion to the first Zigbee communication unit 10130 (S110 in FIG. 43). The illuminance sensor 10120 of the wireless sensing module 10100 senses the illuminance and provides the sensed illuminance to the first Zigbee communication unit 10130 (S120).

Accordingly, the first Zigbee communication unit 10130 generates a zigbee signal according to a predetermined communication protocol including the motion sensing signal from the motion sensor 10110 and the roughness sensing signal from the roughness sensor 10120 And transmits it wirelessly (S130).

Referring to FIG. 42, the Zigbee signal of the first Zigbee communication unit 10130 includes channel information defining a communication channel, wireless network identification information (PAN_ID) defining a wireless network, device address specifying a target device, And the sensing data includes a motion value and an illumination value.

Next, a wireless lighting control apparatus 10200 of a wireless lighting system according to the present invention will be described with reference to FIGS. 41 to 44. A wireless lighting control apparatus 10200 according to the present invention includes: It is possible to control the predetermined operation according to the illumination value and the motion value included in the Zigbee signal.

That is, the second Zigbee communication unit 10210 of the wireless lighting control apparatus 10200 of the present invention receives the Zigbee signal from the first Zigbee communication unit 10130, restores the sensing signal from the Zigbee signal, 10220 (S210 in FIG. 44).

Referring to FIG. 42, the Zigbee signal of the second Zigbee communication unit 10210 includes channel information defining a communication channel, wireless network identification information (PAN_ID) defining a wireless network, device address specifying a target device, And can identify the wireless network based on the channel information and the wireless network identification information (PAN_ID), and recognize the device sensed based on the device address. The sensing signal includes the motion value and the illumination value.

41, the sensing signal analyzing unit 10220 analyzes the illuminance value and the motion value included in the sensing signal from the second Zigbee communication unit 10210 and outputs the analysis result to the operation control unit 10230 (S220 in FIG. 44).

Accordingly, the operation control unit 10230 may perform predetermined control according to the analysis result of the sensing signal analysis unit 10220 (S230).

The sensing signal analyzing unit 10220 analyzes the sensing signal from the second Zigbee communication unit 10210 and finds a satisfying condition among a plurality of conditions according to the sensed motion and illuminance. At this time, the operation control unit 10230 sets a plurality of controls according to a plurality of predetermined conditions in the sensing signal analysis unit 10220, and performs control corresponding to the conditions detected by the sensing signal analysis unit 10220 can do.

43, the sensing signal analysis unit 10220 analyzes a sensing signal from the second Zigbee communication unit 10210 and outputs the first, second, and third sensing signals according to sensed motion and illuminance. It is possible to find a satisfying condition among the third condition (condition 1, condition 2, condition 3).

At this time, the operation control unit 10230 controls the operation of the first, second, and third sensing signals according to the first, second, and third conditions (condition 1, condition 2, condition 3) Control (control 1, control 2, control 3) is set, and control corresponding to the conditions found in the sensing signal analyzer 10220 can be performed.

For example, if the first condition (condition 1) is motion on the porch, and the front illuminance is not dark, the first control may turn off all predetermined lamps. If the second condition (condition 2) is motion of the entrance and the front illumination is dark, the second control may turn on some of the predetermined lamps (part of the lamp of the entrance hall and part of the lamp of the living room) have. If the third condition (condition 3) is motion in the entrance and the front illumination is very dark, the third control may turn on all the predetermined lamps.

Alternatively, the first, second, and third controls may be variously applied in addition to the operation of turning on or off the lamp. For example, when the lamp and the air conditioner are operated in summer, . &Lt; / RTI &gt;

Another embodiment of the illumination system using the above-described illumination device will be described with reference to Figs. 45 to 48. Fig.

45 is a block diagram briefly showing components of the illumination system according to the present embodiment. The illumination system 10000 '' according to the present embodiment may include a motion sensor unit 11000, an illumination sensor unit 12000, an illumination unit 13000, and a control unit 14000.

The motion sensor unit 11000 detects motion of itself. The illumination system can be attached to an object having motion, such as a container or an automobile, for example, and the motion sensor unit 11000 detects the self motion of such a moving object. When self motion is detected, the controller 14000 outputs a signal and the illumination system is activated. The motion sensor unit 11000 may include an acceleration sensor or a geomagnetic sensor.

The illuminance sensor unit 12000 is a type of optical sensor and measures the illuminance of the surrounding environment. The illuminance sensor unit 12000 is activated according to a signal output from the controller 14000 when the motion sensor unit 11000 detects its own motion. The lighting system illuminates the operator in night work or in a dark environment, allowing the operator to see the surroundings and ensuring the visible distance to the driver in the nighttime. There is no need to reveal. Also, even in the case of daylight, since the ambient illuminance is low in the rainy weather, it is necessary to notify the operator of the movement of the container, so the illumination of the illumination unit is necessary. Accordingly, the emission of the illumination unit 13000 is determined according to the illumination value measured by the illumination sensor unit 12000. [

The illuminance sensor unit 12000 measures the illuminance of the surrounding environment and outputs the measured value to the control unit 14000 to be described later. On the other hand, when the illuminance value is equal to or higher than the set value, the illumination of the illumination unit 13000 is unnecessary, and the entire system is ended.

The illuminating unit 13000 emits light when the illuminance value measured by the illuminance sensor unit 12000 indicates a set value or less. The operator recognizes the light emission of the illumination unit 13000 and recognizes the movement of the container or the like. The illuminating unit 13000 may employ the above-described illuminating apparatus.

In addition, the illumination unit 13000 can adjust the intensity of light according to the illuminance value of the external environment. When the illuminance value is low, the intensity of the light emission is increased. When the illuminance value is relatively large, the emission intensity is decreased to prevent power waste.

The control unit 14000 controls the motion sensor unit 11000, the illumination sensor unit 12000, and the illumination unit 13000 as a whole. When the motion sensor unit 11000 detects its own motion and outputs a signal to the control unit, the control unit 14000 outputs an operation signal to the illumination sensor unit 12000 and outputs the illumination value measured by the illumination sensor unit 12000 And determines whether the illumination unit 13000 emits light.

46 is a flowchart showing a control method of the illumination system. Hereinafter, a control method of the illumination system will be described with reference to these.

First, it detects its own motion and outputs an operation signal (S310). The motion sensor unit 11000 senses the motion of the container or the vehicle equipped with the illumination system, and outputs an operation signal when the self motion is detected. The operation signal can be regarded as a signal that activates the entire power source. That is, when self motion is detected, the motion sensor unit 11000 outputs an operation signal to the controller 14000.

Next, the illuminance of the external environment is measured according to the operation signal, and the illuminance value is output (S320). When an operation signal is applied to the control unit 14000, the control unit 14000 outputs a signal to the illumination sensor unit 12000, and the illumination sensor unit 12000 measures the illuminance of the external environment accordingly. Then, the illuminance sensor unit 12000 outputs the illuminance value of the external environment to the controller 14000 again. Thereafter, whether or not to emit light is determined according to the illuminance value, and the light is emitted.

First, the illuminance value and the set value are compared and judged (S330). When the illuminance value is input to the controller 14000, the controller 14000 compares the illuminance value with a previously stored set value and determines whether the illuminance value is smaller than the set value. Here, the set value is a value for determining whether or not the light is emitted. For example, the set value may be a value corresponding to an illuminance value that is difficult to identify an object with the operator's or driver's eyes or may cause a mistake.

If the illuminance value measured by the illuminance sensor unit 12000 is larger than the set value, the controller 14000 terminates the entire system because the illumination is not necessary.

On the other hand, if the illuminance value is smaller than the set value, the controller 14000 outputs a signal to the illumination unit 13000 and the illumination unit 13000 emits light (S340).

47 is a flowchart showing a control method of a lighting system according to still another embodiment of the present invention. Hereinafter, a control method of the illumination system will be described with reference to these. However, the description of the same procedure as the control method of the illumination system described with reference to FIG. 46 will be omitted.

As shown in FIG. 47, the control method of the illumination system according to the present embodiment is characterized in that the light emission intensity of the illumination can be adjusted according to the illuminance value of the external environment.

As described above, the illuminance sensor unit 12000 outputs the illuminance value to the control unit 14000 (S320). If the illuminance value is smaller than the set value (S330), the controller 14000 determines the range of the illuminance value (S340-1). A range of illumination values is subdivided in the controller 14000, and the controller 14000 determines a range of the measured illumination values.

Next, when the range of the illuminance value is determined, the controller 14000 determines the intensity of the illumination light (S340-2), and the illumination unit 13000 emits light according to the determined intensity (S340-3). The intensity of illumination light emission can be subdivided according to the illumination value, and the illumination value varies depending on the weather, time, and the surrounding environment, so that the intensity of illumination light can be adjusted accordingly. It is possible to prevent the waste of the power source by adjusting the light emission intensity according to the range of the illuminance value, and it is possible to call attention to the operator.

48 is a flowchart showing a control method of a lighting system according to still another embodiment of the present invention. Hereinafter, a control method of the illumination system will be described with reference to these. However, the description of the same procedure as the control method of the illumination system described with reference to Figs. 46 and 47 will be omitted.

The control method of the illumination system according to the present embodiment further includes a step S350 of determining whether or not the self-motion is maintained when the illumination of the illumination unit 13000 occurs, and determining whether to maintain the self-motion.

First, when light emission is started in the illumination unit 13000, the end of light emission can be determined by the movement of the container or the vehicle equipped with the illumination system. This can determine that the operation is completed when the movement of the container is terminated, or stop the light emission of the vehicle in case of a temporary stop in the crosswalk, thereby preventing the driver from interfering with the operation.

When the container is moved or the automobile is moved again, the motion sensor unit 11000 may operate again and the light emission of the illumination unit 14000 may start again.

The determination of whether or not to maintain the light emission is determined depending on whether or not the motion sensor unit 11000 detects its own motion. When the motion sensor unit 11000 continues to detect motion itself, the illuminance is measured again and it is determined whether or not to maintain the emission. On the other hand, if the self motion is not detected, the system is shut down.

The above-described illumination device using LEDs may vary in optical design depending on the product type, place and purpose. For example, in connection with the emotional illumination described above, there is a technique of controlling illumination using a wireless (remote) control technique utilizing a portable device such as a smart phone, in addition to a technique of controlling the color, temperature, brightness, and color of illumination .

In addition, a visible light wireless communication technology is also available in which a communication function is added to the LED illumination device and the display devices to simultaneously achieve the intrinsic purpose of the LED light source and the purpose of the communication means. This is because the LED light source has a longer lifetime than the conventional light sources, has excellent power efficiency, can realize various colors, and has a fast switching speed for digital communication and digital control.

The visible light wireless communication technology is a wireless communication technology that wirelessly transmits information using light of a visible light wavelength band that can be perceived by human eyes. Such a visible light wireless communication technology is distinguished from existing wired optical communication technology and infrared wireless communication in that it uses light in a visible light wavelength band and is distinguished from wired optical communication technology in terms of wireless communication environment.

In addition, unlike RF wireless communication, visible light wireless communication technology has the advantage that it can be freely used without being regulated or licensed in terms of frequency utilization, has excellent physical security, and has a difference in that a user can visually confirm a communication link. And has the characteristic of being a convergence technology that can obtain the intrinsic purpose of the light source and the communication function at the same time.

The present invention is not limited to the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims.

It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

100 ... base 110 ... fastening rim
111 ... flange portion 120 ... support plate
130 ... air release hole 200 ... housing
210 ... terminal portion 220 ... flow path
300 ... cooling fan 400 ... light source module
410 ... substrate 420 ... light emitting element
500 ... reverse flow prevention portion 600 ... cover
610 ... Lens

Claims (10)

A base including a fastening rim and a support plate provided inside the fastening rim;
A housing which is fastened to the coupling rim and covers the support plate, and includes a flow path for guiding the inflow of air and an air inflow hole for introducing the air guided through the flow path into the internal space;
A cooling fan disposed on one side of the support plate covered by the housing to draw air into the internal space of the housing and to discharge the intake air to the outside through an air release hole provided in the base; And
And a light source module mounted on the support plate,
Wherein the channel forms a stepped section with the outer surface of the housing.
The method according to claim 1,
The air inlet hole is provided in a ring shape along the periphery of the housing,
And the flow path extends upward along the outer surface of the housing at a lower end of the housing to communicate with the air inlet hole.
The method according to claim 1,
The air inlet hole is provided in a ring shape along the periphery of the housing,
Wherein the flow path includes a first flow path formed along a circumference of the housing at a position corresponding to the air inflow hole and communicating with the air inflow hole, a second flow path extending from the first flow path to a lower end of the housing, And a flow path.
The method according to claim 1,
Wherein at least one of the flow paths is formed in a recessed structure in a recessed form on an outer surface of the housing to communicate with the air inlet hole.
The method according to claim 1,
Wherein the fastening rim has a groove corresponding to the flow path at a position corresponding to the flow path and is connected to the flow path of the housing.
The method according to claim 1,
Wherein the fastening rim has a flange portion protruding outwardly at a lower end portion, and a plurality of vent holes are formed in the flange portion along the periphery of the fastening rim to connect to the flow path of the housing.
The method according to claim 1,
Wherein the base includes the air discharge hole between an outer circumferential surface of the support plate and an inner surface of the concave rim to discharge air introduced into the inner space of the housing to the outside.
The method according to claim 1,
Wherein the base includes the air discharge hole at the center of the support plate to discharge the air introduced into the inner space of the housing to the outside.
The method according to claim 1,
Wherein the base includes a plurality of radiating fins on the one surface of the support plate facing the cooling fan.
A base having an air vent hole;
A housing disposed at one side of the base, the housing having a flow path forming a depressed area with a stepped outer surface, and an air inflow hole for introducing the air guided through the flow path into the internal space;
A cooling fan disposed in the housing for drawing air into the inner space of the housing and discharging the intake air to the outside through the air discharge hole; And
A light source module disposed on the other side of the base and including a lens unit having at least one light emitting element and at least one lens disposed on the light emitting element;
&Lt; / RTI &gt;

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