KR101247306B1 - Circuit board with marks indicating bad patterns and manufacturing method of circuit board - Google Patents

Abstract

A circuit board having a mark indicating a bad pattern according to the present invention includes a pattern portion having a plurality of pattern units disposed adjacent to each other, a rail portion extending along an edge of the pattern portion, and a bad state among the pattern units. It is provided with a marking portion formed in the rail portion to indicate the position of the defective pattern units.

In addition, the method of manufacturing a circuit board according to the present invention includes scanning a row and a column at a position where a bad pattern unit exists among a plurality of pattern units arranged to form a plurality of rows and columns, and horizontally at the edges of the pattern units. Forming a horizontal marking portion indicative of the position of the row of the defective pattern units in the extension portion, and forming a vertical marking portion indicative of the position of the column of the defective pattern unit in the longitudinal extension of the edges of the pattern units.

Description

Circuit board with marks indicating bad patterns and manufacturing method of circuit board

The present invention relates to a circuit board having a mark indicating a bad pattern and a method of manufacturing the circuit board. More particularly, as the semiconductor package is miniaturized, the position of the bad pattern unit included among the small pattern units can be effectively and accurately. The present invention relates to a circuit board having an indication mark and a method of manufacturing the same.

As electronic products become more complex, much of the wiring is being replaced by circuit boards. In addition, according to the trend of miniaturization, thinning, high density, and packaging of electronic products, fine patterning, miniaturization, and packaging of circuit boards are progressing.

Recently, circuit boards are manufactured in so-called strip units in which a plurality of pattern units for producing one semiconductor package are connected in a row. According to the method of fabricating a circuit board in strip units, a semiconductor package can be mass-produced since the pattern units are generally arranged in a matrix form of rows and columns, and a small semiconductor chip is mounted on each of the pattern units. .

When the circuit board is manufactured in strip units, it is produced in a large amount by an automated production line. In some cases, a portion of the circuit pattern is disconnected or the width of the pattern is formed to be inferior. When discarding strips in which some of the pattern units are defective, there is a problem that a large number of pattern units are included in one strip, so that the production yield is greatly reduced and the loss of raw materials is increased.

Therefore, in order to avoid using a bad pattern unit in a process of mounting and packaging a semiconductor chip or the like on a manufactured circuit board, a technique of directly displaying a defect on a bad pattern unit has been used. In Korean Patent Laid-Open Publication No. 2006-55643 corresponding to this technique, a method of displaying a defect is used as a method of spraying and curing ink on a pattern unit in which the defect has occurred.

In addition, Japanese Patent Laid-Open Publication No. 2002-52586 discloses another technique for avoiding the use of a defective pattern unit in a semiconductor package process, and the like. Techniques for forming bad ID marks have been disclosed.

Recently, due to the miniaturization of the semiconductor package, the number of pattern units included in one strip has also increased greatly. According to a technique such as the above-described Patent Publication No. 2006-55643, a defect occurs in a process of mounting and packaging a semiconductor chip. There was a problem that it takes a long time to scan the pattern unit. In addition, since the resolution of ink printing must be greatly increased due to the miniaturization of the pattern unit, the process of spraying and curing the ink in a narrow space also has a problem of being complicated.

In addition, according to the technique described in the above-mentioned Patent Publication No. 2002-52586, the same number of defective ID marks as the number of rows should be formed in the rail. However, since the number of pattern units included in one strip is greatly increased, it is not easy to form a defective ID mark as many as the number of columns of the pattern units included in the strip. According to this technique, since the width of the rail must be increased to form the same number of defective ID marks as the number of pattern units, raw materials are wasted.

An object of the present invention is to provide a circuit board having a mark indicating a bad pattern, and a method of manufacturing the circuit board.

Another object of the present invention is to provide a strip-shaped circuit board having a plurality of circuit pattern units and a method of manufacturing the same for mass production of microminiature semiconductor packages.

It is still another object of the present invention to provide a circuit board having pattern units that are formed small as the semiconductor package is miniaturized, the circuit board having an indicator for effectively indicating a pattern unit having a defect, and a method of manufacturing the same. have.

According to another object of the present invention, even if the number of pattern units included in one strip is greatly increased, the time for scanning the defective pattern units is greatly reduced, and a mark having an indication capable of accurately indicating the position of the defective pattern units is provided. The present invention provides a circuit board and a method of manufacturing the same.

Another object of the present invention is to simply form a mark indicating a bad pattern unit on a circuit board.

The present invention provides a circuit board having a marking portion formed on the rail portion to indicate the position of the defective pattern unit, and a manufacturing method thereof.

A circuit board having a mark indicating a bad pattern according to the present invention includes a pattern portion having a plurality of pattern units disposed adjacent to each other, a rail portion extending along an edge of the pattern portion, and a state among the pattern units. And a marking portion formed on the rail portion to indicate the position of the bad defect pattern units.

In the present invention, the marking unit may represent at least one of a position of a row and a position of a column where the defective pattern units exist.

In the present invention, the marking portion may be formed at a predetermined position of the rail portion.

In the present invention, the pattern units may be arranged to form a plurality of rows and columns.

In the present invention, the marking portion may include letters, numbers, or a combination thereof.

In the present invention, the rail portion may include a horizontal extension portion extending along the row direction of the pattern units at the edge of the pattern portion.

In the present invention, the marking portion may be provided at a position corresponding to each column of the defective pattern units of the horizontal extension part and may include a horizontal marking portion indicating at least one of the position of the row of the defective pattern unit and the position of the column. The horizontal marking portion may include letters, numbers, or a combination thereof.

In the present invention, the rail portion may include a horizontal extension portion extending along the row direction of the pattern units at the edge of the pattern portion, and a vertical extension portion extending along the column direction of the pattern units at the edge of the pattern portion.

In the present invention, the marking portion is formed in a position corresponding to each column of the defective pattern units of the horizontal extension portion, the horizontal marking portion representing at least one of the position of the row and the position of the column in which the defective pattern unit exists, and the failure of the vertical extension portion The vertical marking part may be provided at a position corresponding to each row of the pattern units to indicate at least one of a row position and a column position in which the defective pattern unit exists. The horizontal marking unit and the vertical marking unit may include letters, numbers, or a combination thereof.

In the present invention, the marking portion may be formed by laser processing the rail portion.

In the present invention, the marking portion may be formed by printing ink on the surface of the rail portion.

In the present invention, the circuit board may further include a pattern unit marking formed on the defective pattern unit.

In the present invention, the marking unit may include a bar code.

In the method of manufacturing a circuit board having a mark indicating a bad pattern according to the present invention, a plurality of pattern units arranged to form a plurality of rows and columns are inspected to provide rows and columns at positions where a bad pattern unit having a bad state exists. Scanning a; forming a horizontal marking portion indicating a position of a row of the defective pattern unit at a position corresponding to each column of the defective pattern units of the horizontal extension extending along the row direction of the pattern units at the edges of the pattern units; And forming a vertical marking portion indicating a position of a column of the defective pattern unit at a position corresponding to each row of the defective pattern units of the longitudinal extension extending along the column direction of the pattern units at the edges of the pattern units.

The circuit board of the present invention as described above has a marking portion for indicating a defective pattern unit in the rail portion, and can be manufactured in a strip form in which a plurality of pattern units are arranged in a matrix shape, which is suitable for mass production and automated processes. .

In the package equipment for manufacturing a semiconductor package using the circuit board of the present invention, the location of the defective pattern unit included in the circuit board can be accurately determined by scanning the marking part formed on the circuit board. Therefore, the number of pattern units included in one strip of the circuit board is greatly increased, and the time for scanning the defective pattern units is greatly reduced.

In addition, the marking portion indicating the bad pattern unit includes a horizontal marking portion of the horizontal extension portion and the vertical marking portion of the vertical extension portion, the marking portion includes any combination of letters, numbers, or symbols, and thus included in one strip Even when the number of pattern units increases greatly, the position of the defective pattern units can be accurately and simply indicated without increasing the width of the rail portion.

In addition, since the marking portion may be formed on the rail portion of the circuit board by using a laser or the like, it is possible to easily form a mark indicating the defective pattern unit on the circuit board at an accurate position.

Hereinafter, with reference to the embodiments of the accompanying drawings, the configuration and operation of the circuit board having a cover indicating a bad pattern according to the present invention will be described in detail.

1 is a plan view of a circuit board having a mark indicating a bad pattern according to an embodiment of the present invention, and FIG. 2 is an enlarged plan view of a part of the circuit board of FIG. 1. FIG. 1 shows an example of a circuit board on which a plurality of pattern units 11 are arranged in a matrix form forming a plurality of rows and columns on one strip.

A circuit board having a mark indicating a bad pattern according to the embodiment shown in FIGS. 1 and 2 includes a pattern portion 10 having a plurality of pattern units 11 and an edge of the pattern portion 10. The extended rail part 20 and the marking parts 31 and 32 which show the position of the bad pattern unit 12 formed in the rail part 20 are provided.

Each of the pattern units 11 includes a pad portion 11a on which a semiconductor chip is mounted, and a lead portion 11b radially connected around the pad portion 11a. The plurality of pattern units 11 are disposed adjacent to each other and form a plurality of rows and columns. In FIG. 2, the numbers of the rows formed by the pattern units 11 are represented by numbers 1, 2, 3, 4,..., And the numbers of the columns are denoted by the letters A, B, C, D, E. ,…).

The rail part 20 forms a whole skeleton of the circuit board and functions to support the pattern units 11, and includes a horizontal extension part 21 and a vertical extension part 22. The horizontal extension part 21 extends along the row direction of the pattern units 11 at the edge of the pattern part 10. The vertical extension part 22 extends along the column direction of the pattern units 11 at the edge of the pattern part 10.

The marking portions 31 and 32 are portions formed in the rail portion 20 to indicate the position of the defective pattern unit 12 having a poor state among the pattern units 11. The marking parts 31 and 32 include a horizontal marking part 31 formed in the horizontal extension part 21 and a vertical marking part 32 formed in the vertical extension part 22.

The horizontal marking part 31 is formed at positions A, B, C, D,... Corresponding to each column of the defective pattern unit 12 among the pattern units 11, so that the defective pattern unit 12 exists. Indicates the position of a row. The vertical marking portion 32 is formed at positions 1, 2, 3, 4,... Of the pattern units 11 corresponding to each row of the defective pattern units 12, so that the defective pattern units 12 exist. Indicates the position of the column.

In the embodiment shown in FIG. 2, letters and numbers are used for the marking parts 31 and 32, but the present invention is not limited thereto. Therefore, the marking parts 31 and 32 may include any one or a combination thereof selected from the group consisting of letters, numbers, and symbols to indicate the position of the defective pattern unit.

As described above, the circuit board is manufactured in the form of a strip in which the plurality of pattern units 11 are arranged in a matrix shape, which is suitable for mass production and automated processes. Since the marking portions 31 and 32 indicating the defective pattern unit 12 are formed in the horizontal extension portion 21 and the vertical extension portion 22, the marking portions 31 and 32 extend horizontally in inspection equipment and package equipment for inspecting a completed circuit board. By scanning the portion 21 and the vertical extension portion 22, the position of the defective pattern unit 12 can be accurately and quickly identified. The number of pattern units 11 disposed in one strip is not limited to the example shown in FIG. 1, and may increase or decrease depending on the size and shape of the semiconductor package to be designed.

The marking parts 31 and 32 may be formed by processing the surface of the rail part 20 with a laser. Since the rail part 20 is made of a conductive metal material such as copper, letters or numbers of the marking parts 31 and 32 may be formed on the surface of the rail part 20 using a laser.

In the present invention, the method of forming the marking portions 31 and 32 is not limited to a method using a laser, but a method of burning the surface of the rail portion 20 using high temperature heat, an electropolishing method or an etching method, Alternatively, various methods such as a thermal transfer marking method may be used. In addition, a method of punching or marking the rail unit 20 using physical force to form the marking units 31 and 32 may be used, or ink may be applied to the surface of the rail unit 20 by contact. Printing by spraying may also be used.

FIG. 3 is a plan view showing an enlarged part of a circuit board of FIG. 1 and showing a different use state. In FIG. 3, the same reference numerals are used for the same components as those of FIGS. 1 and 2.

In the circuit board of FIG. 3, there are two defective pattern units 12 and 13 in one row 4. Therefore, in order to represent these defective pattern units 12 and 13, the vertical marking portion 32a is provided with two letters GM to indicate a row of respective positions of the defective pattern units 12 and 13.

Therefore, in a device for manufacturing a semiconductor package using the completed circuit board, a simple operation of scanning the horizontal marking parts 31a and 31b and the vertical marking part 32a formed on the horizontal extension part 21 and the vertical extension part 22. The position of the defective pattern units 12 and 13 can be accurately detected.

In addition, when the number of the pattern units 11 included in one strip constituting the circuit board increases significantly, the number of columns of the defective pattern units existing in one row of the pattern units or the defective pattern unit existing in one column The number of rows may be plural. However, by using a plurality of letters or numbers in the marking portions 31a, 31b, 32a, it is possible to simply and accurately indicate the positions of all the defective pattern units. Therefore, even if the number of pattern units is greatly increased, it is not necessary to increase the width of the horizontal extension portion 21 and the vertical extension portion 22.

4 is a plan view of a circuit board according to another embodiment of the present invention.

The circuit board according to the embodiment illustrated in FIG. 4 includes a pattern portion 10 having a plurality of pattern units 11 disposed adjacent to each other, and a horizontal extension portion 21 extending along an edge of the pattern portion 10. And a rail portion 20 having a vertical extension portion 22, a horizontal marking portion 31 and a vertical marking portion 32 formed on the rail portion 20 to indicate the position of the defective pattern unit 12, The pattern unit marking part 33 formed in the bad pattern unit 12 is provided.

In the embodiment shown in FIG. 4, the pattern unit marking portion 33 is formed in the pad portion of the defective pattern unit 12. The pattern unit marking portion 33 may also be formed in various ways, such as by processing the surface of the pad portion with a laser or by using a printing method in which ink or silicon is applied to the pad portion.

As described above, when the circuit board including the horizontal marking part 31, the vertical marking part 32, and the pattern unit marking part 33 is fabricated, the circuit boards are each prepared in a semiconductor package process or the like that proceeds after the production of the circuit board is completed. Even if cut individually in units of the pattern units 11 of the has a merit that the defective pattern unit 12 can be easily selected using the pattern unit marking part 33. Furthermore, the defective pattern unit 12 exists by comparing the position of the defective pattern unit 12 indicated by the horizontal marking part 31 and the vertical marking part 32 with the position indicated by the pattern unit marking part 33. The accuracy and reliability of positioning can be improved.

5 is a plan view of a circuit board according to still another embodiment of the present invention.

In the circuit board according to the embodiment shown in FIG. 5, the position at which the pattern unit marking part 34 is formed is modified from the embodiment shown in FIG. 4. That is, the pattern units 11 include a pad portion 11a and a lead portion 11b as in the above-described embodiments, and the pattern unit marking portion 34 is provided on the lead portion 11b of the defective pattern unit 12. Is formed.

6 is a plan view of a circuit board according to another embodiment of the present invention.

In the circuit board according to the embodiment illustrated in FIG. 6, horizontal marking parts 131 and 132 are formed only in the horizontal extension part 21 of the rail part 20. Positions corresponding to the respective rows of the pattern units 11 of the horizontal extension part 21 even if only the horizontal marking parts 131 and 132 are formed in the vertical extension part 22 of the rail part 20. Since the horizontal marking units 131 and 132 may designate the number of rows including numbers or letters, the position of the defective pattern units 12 and 16 may be accurately indicated.

In FIG. 6, the horizontal marking parts 131 and 132 are formed at positions where the defective pattern units 12 and 16 are present in the horizontal extension part 21, but the present invention is not limited thereto. Since the horizontal marking parts 131 and 132 may include both information about the position of the row and the column of the defective pattern units 12 and 16, they may be formed at a predetermined position of the horizontal extension part 21. . For example, the horizontal marking parts 131 and 132 may be formed at the left end or the right end of the horizontal extension part 21. In addition, the horizontal markings 131 and 132 may be formed at the left or right end of the lower edge of the rail unit 20.

As such, the horizontal marking parts 131 and 132 are formed at predetermined positions of the rail part 20, so that the equipment for scanning the positions of the defective pattern units 12 and 16 is a horizontal extension part 21 or a vertical extension part. It is possible to quickly obtain the positional information of the defective pattern units 12 and 16 by scanning only a predetermined partial region of the rail portion 20 without having to scan all the regions of 22.

7 is a plan view of a circuit board according to still another embodiment of the present invention.

In the circuit board according to the exemplary embodiment shown in FIG. 7, vertical marking parts 231 and 232 are formed only on the vertical extension part 22 of the rail part 20. Although the marking part is not formed in the horizontal extension part 21 of the rail part 20, but only the vertical marking parts 231 and 232 are formed, the defective pattern units 12 of the pattern units 11 of the vertical extension part 22 are formed. The positions of the defective pattern units 12, 17, and 18 may be determined by the vertical marking units 231 and 232 that may specify the number of columns including numbers, letters, and the like at positions corresponding to the respective rows of, 17, and 18. Can be accurately indicated.

8 is a plan view of a circuit board according to another embodiment of the present invention.

The circuit board according to the embodiment illustrated in FIG. 8 includes a pattern portion 10 having a plurality of pattern units 11, a rail portion 20 extending along an edge of the pattern portion 10, and a barcode 331; and a marking part 330 formed on the rail part 20.

The bar code 331 of the marking unit 330 includes information regarding the position (row and column position) of the defective pattern unit included in the pattern units 11. Therefore, the equipment for manufacturing the semiconductor package using the completed circuit board can accurately detect the position of the defective pattern unit by a simple operation of scanning the barcode 331 of the marking unit 330.

9 is a process flowchart showing a circuit board manufacturing method according to an embodiment of the present invention.

The circuit board is prepared by preparing an raw material (S110), forming a pattern by etching (S120), and performing PPF plating (pre-plated lead frame plating) on the surface of the pattern formed by etching ( S130), it is manufactured through a series of steps (S140) to cut into strips. The strip of the circuit board manufactured through this automated series of steps is fed into the vision inspection equipment, and the defect pattern scan and marking operation by automatic image recognition (vision inspection) on the strip of the circuit board is performed.

According to an aspect of the present invention, there is provided a method of manufacturing a circuit board, the method comprising: inspecting a plurality of pattern units arranged to form a plurality of rows and columns and scanning rows and columns at positions where a bad pattern unit having a bad state exists ( S160, and forming a marking portion in the horizontal extension portion and the vertical extension portion of the circuit board (S180). Forming the marking part (S180) may include forming a horizontal marking part and forming a vertical marking part. The horizontal marking portion and the vertical marking portion may include letters or numbers formed by a laser.

Scanning the defective pattern unit (S160) is a step of finding a defective pattern unit having a problem such as disconnection of a circuit pattern or defective pattern width due to generation of foreign matter or other causes in an automated production facility. The scanning of the bad pattern unit (S160) may be automatically performed by comparing the shape of the good pattern unit in which the automated imaging equipment is stored in advance with the pattern unit included in the strip of the circuit board, but the present invention is not limited thereto. . Therefore, the step S160 of scanning the defective pattern unit may be performed manually by an operator, for example.

When the scanning of the bad pattern unit (S160) is completed, information about the location of the bad pattern unit, that is, location information of rows and columns, is stored in a memory or a storage device. The stored location information may be utilized at step S180 of forming a marking unit to be performed later.

In order to perform the forming of the marking unit (S180), the strip of the circuit board on which the scan is completed is loaded into the printing apparatus (S170). In addition, the printing apparatus forms a marking unit by using the position information of the defective pattern unit acquired in the scanning of the defective pattern unit (S160).

In the forming of the horizontal marking portion, the position of the row of the defective pattern units is indicated at a position corresponding to each column of the defective pattern units among the pattern units in the horizontal extension portion extending along the row direction of the pattern units at the edges of the pattern units. The horizontal marking portion is formed.

In the forming of the vertical marking portion, the position of the column of the defective pattern unit is indicated at a position corresponding to each row of the defective pattern units among the pattern units in the longitudinal extension portion extending along the column direction of the pattern units at the edges of the pattern units. A vertical marking portion is formed.

 When the formation of the marking part is completed, the strip (S190) of the circuit board is unloaded, and the circuit board is packaged as a finished product (S200). The circuit board completed through this process is manufactured in the form of a strip in which a plurality of pattern units are arranged in a matrix form, which is suitable for mass production and automated processes.

Since the marking portion indicating the position of the defective pattern unit is formed in the horizontal extension portion and the vertical extension portion, the package equipment for packaging the semiconductor using the completed circuit board, etc., scans the horizontal extension portion and the vertical extension portion to position the defective pattern unit. Can be accurately and quickly identified.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the appended claims.

1 is a plan view of a circuit board having a mark indicating a bad pattern according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view of a portion of the circuit board of FIG. 1.

3 is an enlarged plan view illustrating another use state by enlarging a part of the circuit board of FIG. 1.

4 is a plan view of a circuit board according to another embodiment of the present invention.

5 is a plan view of a circuit board according to still another embodiment of the present invention.

6 is a plan view of a circuit board according to another embodiment of the present invention.

7 is a plan view of a circuit board according to still another embodiment of the present invention.

8 is a plan view of a circuit board according to another embodiment of the present invention.

9 is a process flowchart showing a circuit board manufacturing method according to an embodiment of the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

10: pattern part 31, 31a, 31b, 131, 132: horizontal marking part

11b: lead portion 32, 32a, 231, 232: vertical marking portion

11a: pad portion 33, 34: pattern unit marking portion

11: pattern unit 12, 13, 16, 17, 18: bad pattern unit

20: rail portion 330: marking portion

21: horizontal extension 331: barcode

22: longitudinal extension

Claims (16)

A pattern portion having a plurality of pattern units disposed adjacent to each other; A rail part having a horizontal extension part extending in a row direction of the pattern units at an edge of the pattern part and a vertical extension part extending in a column direction of the pattern units at an edge of the pattern part; And And a marking portion formed on the rail portion to indicate positions of the defective pattern units having a poor state among the pattern units. The marking unit may include a horizontal marking unit formed at a position corresponding to each column of the defective pattern units of the horizontal extension unit to indicate at least one of a row position and a column position where the defective pattern unit exists, and the vertical extension unit At least one vertical marking portion formed at a position corresponding to each row of the defective pattern units to represent at least one of a position of a row and a column of the defective pattern unit, And the horizontal marking portion and the vertical marking portion include letters, numbers, bar codes, or a combination thereof. delete delete delete delete delete delete delete delete delete Claim 11 was abandoned when the registration fee was paid. The method of claim 1, The marking portion is formed by laser processing the rail portion, the circuit board. Claim 12 is abandoned in setting registration fee. The method of claim 1, The marking portion is formed by printing ink on the surface of the rail portion. Claim 13 was abandoned upon payment of a registration fee. The method of claim 1, The circuit board further comprises a pattern unit marking portion formed on the bad pattern unit. delete Inspecting a plurality of pattern units arranged to form a plurality of rows and columns to scan rows and columns at positions where a bad pattern unit having a bad state exists; A horizontal marking portion indicating a position of the row of the defective pattern units at a position corresponding to each column of the defective pattern units of the horizontal extension part extending along the row direction of the pattern units at the edges of the pattern units; And forming at least one vertical marking portion indicating a position of a column of the defective pattern unit at a position corresponding to each row of the defective pattern units of the longitudinal extension extending along the column direction of the pattern units at an edge thereof. , And the horizontal marking portion and the vertical marking portion include letters, numbers, bar codes, or a combination thereof. 16. The method of claim 15, The horizontal marking portion and the vertical marking portion are formed by a laser, the circuit board manufacturing method.

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