KR20100022715A - Circuit board with marks indicating bad patterns and manufacturing method of circuit board - Google Patents

Abstract

PURPOSE: A circuit board with marks indicating bad patterns and manufacturing method of a circuit board are provided to detect a position of a defective pattern unit included in a circuit board by scanning a marking unit. CONSTITUTION: A circuit board comprises a pattern unit(10), a rail(20), groove portion(41,42), and marking unit(31,32). The pattern unit comprises a plurality of pattern units. The rail is expanded along the edge of the pattern unit. The groove portion is formed at a predetermined location of the rail unit. The marking unit is formed in the groove portion. The marking unit shows the location of defective pattern units. The rail unit comprises a width extension unit(21). The width extension unit is expanded along in a row of the pattern units.

Description

Circuit board with marks indicating bad patterns and manufacturing method of circuit board

The present invention relates to a circuit board having a mark indicating a bad pattern and a method of manufacturing the circuit board, and more particularly, a mark indicating a position of a bad pattern unit included among the small pattern units of a small semiconductor package. The present invention relates to a circuit board having good readability of a label indicating a bad pattern unit because the circuit board is preserved even when the circuit board is bent or friction between the circuit boards is generated.

As electronic products become more complex, much of the wiring is being replaced by circuit boards. In addition, according to the trend of miniaturization, thinning, high density, and packaging of electronic products, fine patterning, miniaturization, and packaging of circuit boards are progressing.

Recently, circuit boards are manufactured in so-called strip units, in which a plurality of pattern units for producing one semiconductor package are connected in a row. According to the method of fabricating the circuit board in strip units, the semiconductor package can be mass produced by disposing the pattern units in a matrix form generally forming rows and columns, and by mounting a small semiconductor chip on each of the pattern units. .

When the circuit board is manufactured in strip units, it is produced in a large amount by an automated production line. In some cases, a portion of the circuit pattern is disconnected or the width of the pattern is formed to be inferior. When discarding strips in which some of the pattern units are defective, there is a problem that a large number of pattern units are included in one strip, so that the production yield is greatly reduced and the loss of raw materials is increased.

Therefore, in order to avoid using a bad pattern unit in a process of mounting and packaging a semiconductor chip on a manufactured circuit board, a technique of directly displaying a bad pattern on a bad pattern unit may be used. As a technique used for displaying a pattern unit in which a defect has occurred, there is a method of displaying on a surface of a circuit board using ink.

Recently, due to the miniaturization of the semiconductor package, the number of pattern units included in one strip has also increased greatly. As the size of the pattern unit has been miniaturized, the resolution of ink printing must also increase greatly. As a result, there is a problem in that the process of curing by spraying ink in a narrow space is complicated. In addition, after the ink is printed, the process of curing the ink is necessary, so there is a problem that the process is complicated and time-consuming.

In addition, after a label indicating a defect is printed on the surface of the substrate, friction may occur between the substrates during the process of transferring the product and processing the post-process, thereby causing a problem that the printed label is erased and thus the readability is reduced. . In addition, some of the printed portion due to friction can be erased, causing the resulting material to act as a source of contamination that contaminates the substrate and equipment.

The surface of the ink and the substrate printed by the impact or bending force applied to the substrate during the process is low because the interfacial bonding force between the ink and the material of the substrate is low even if the substrate is protected from friction while transferring the substrate. Interfacial separation occurs in part between and the printed marks may fall off, thereby reducing the readability of the information.

As a method for displaying a defective pattern unit in a semiconductor package process, the use of a marking technique using a laser may be considered. However, in the case of marking the mark on the surface of the circuit board using a laser, a portion of the laser marking protrudes from the surface of the substrate, which is a metal material, and carbides are generated, which requires a post-treatment process (polishing, etc.). there was. In addition, when the laser is used, heat is locally applied to the surface of the circuit board, and thermal deformation may occur, and expensive laser equipment is required to irradiate the laser.

In addition, if the marking of the surface of a metal circuit board using only a laser, there is no change in color and only a cover made of concave grooves on the marked portion, so that the recognition accuracy of the cover in the vision recognition step using an imaging device such as a camera is improved. There was a problem falling. In order to improve readability, a separate color treatment may be performed on the surface of the laser-marked part, but in this case, there is a problem in that a separate process needs to be added.

An object of the present invention is to provide a circuit board having a label capable of indicating a bad pattern with good readability, and a method of manufacturing the circuit board.

Another object of the present invention is to provide a strip-shaped circuit board having a plurality of circuit pattern units and a method of manufacturing the same for mass production of microminiature semiconductor packages. The circuit board may be a metal in its entirety, or may be a circuit board for a semiconductor device in which at least one conductive material and a non-conductive material are stacked.

It is still another object of the present invention to provide a circuit board having pattern units that are formed small as the semiconductor package is miniaturized, the circuit board having an indicator for effectively indicating a pattern unit having a defect, and a method of manufacturing the same. have.

Still another object of the present invention is to form a mark indicating a bad pattern unit on a circuit board in a simple and inexpensive process without using a curing process.

Another object of the present invention is to improve the bonding force between the defective pattern unit and the surface of the circuit board, so that even if friction or bending of the circuit board occurs, the printed label is not separated from the circuit board.

It is still another object of the present invention to provide a mark capable of accurately indicating the location of defective pattern units and greatly reducing the time for scanning the defective pattern units even if the number of pattern units included in one strip is greatly increased. The present invention provides a circuit board and a method of manufacturing the same.

The present invention provides a circuit board and a method of manufacturing the circuit board having a marking portion formed in the groove portion to indicate a bad pattern.

A circuit board having a mark indicating a bad pattern according to the present invention includes a pattern portion having a plurality of pattern units disposed adjacent to each other, a rail portion extending along an edge of the pattern portion, and a predetermined position at the rail portion. And a marking portion formed in the groove portion to indicate the position of the defective pattern units having a poor state among the pattern units.

In the present invention, the rail portion may include a horizontal extension portion extending along the row direction of the pattern units at the edge of the pattern portion.

In the present invention, the groove portion is formed at each position corresponding to each column of the pattern units of the horizontal extension portion, and the marking portion is formed at the groove portion at the position corresponding to the column of the defective pattern units to indicate the position of the row of the defective pattern units. Can be.

In the present invention, the groove portion may be formed in the horizontal extension to extend a predetermined length along the horizontal extension.

In the present invention, the groove portion can be formed by etching.

In the present invention, the marking portion may be formed by etching the surface of the groove portion except for the portion forming the marking portion. In addition, the height of the marking portion may be formed smaller than the length from the surface of the groove portion to the surface of the rail portion.

In the present invention, the marking portion can be formed in the groove portion by the ink printing method.

In the present invention, the marking portion is formed on the bottom surface of the groove portion, and the roughness of the bottom surface is larger than the roughness of the surfaces other than the groove portion.

In the present invention, an oxide layer may be formed on the surface of the groove portion, and the marking portion may be formed by laser processing the oxide layer.

In the present invention, the marking portion may be formed of letters, numbers, or a combination thereof, and may indicate a position of a row and a position of a column in which defective pattern units exist.

In the present invention, the rail portion may further include a perforated portion formed on the outside of the groove portion to reinforce the rigidity of the circuit board.

In the present invention, the rail portion may further include a stepped portion formed to have a depth lower than the depth of the groove portion on at least part of the edge of the groove portion to reinforce the rigidity of the circuit board.

The method for manufacturing a circuit board according to the present invention includes a preparation step of preparing a material of a circuit board, a plurality of pattern units arranged in rows and columns on a substrate, and a rail unit and a rail unit extending around the pattern unit. A pattern forming step of forming a groove portion formed at a predetermined position by etching, a scanning step of inspecting the pattern units to scan a bad pattern unit having a bad state, a position of a row and a column in which the bad pattern units exist in the groove portion It includes a marking step of forming a marking portion indicating.

In the present invention, the marking portion may be formed by a printing method.

The circuit board manufacturing method according to the present invention may further include forming an oxide layer on the surface of the circuit board after the pattern forming step, and the marking step may form a marking part by irradiating a laser to the oxide layer.

In the present invention, in the pattern forming step, the groove portion may be formed by half etching to form a resist on only one surface of the material to perform etching.

According to another aspect of the present invention, there is provided a method of manufacturing a circuit board, comprising: a substrate preparation step of preparing a circuit board having a plurality of pattern units arranged in rows and columns, and a rail portion extending around the pattern unit; A groove forming step of forming a groove in a predetermined position, a scanning step of inspecting the pattern units to scan rows and columns at a position where a bad pattern unit having a bad state exists, and a bad pattern unit by printing ink on the groove And a marking step of forming a marking portion indicative of the position of the row and the column in which they are present.

In another aspect of the present invention, the groove portion forming step, by pressing or cutting the surface of the circuit board to form a groove portion.

As described above, the circuit board and the manufacturing method of the present invention include a marking portion for indicating a defective pattern unit in a rail portion, and a plurality of pattern units may be manufactured in a strip form in which a plurality of pattern units are arranged in a matrix shape, thereby mass production and automated processes. Suitable for

In the package equipment for manufacturing a semiconductor package using the circuit board of the present invention, it is possible to accurately determine the position of the defective pattern unit included in the circuit board by scanning the marking part formed on the circuit board. Therefore, the number of pattern units included in one strip of the circuit board is greatly increased, and the time for scanning the defective pattern units is greatly reduced.

In addition, since the marking unit indicating the defective pattern unit includes any one of letters, numbers, and symbols, or a combination thereof, the width of the rail unit does not need to be increased even when the number of pattern units included in one strip is greatly increased. The location of the defective pattern units can be accurately and simply indicated.

In addition, since the marking portion is formed in the groove portion formed at a predetermined position of the rail portion, even if friction or bending occurs between the circuit boards, the marking portion does not separate well from the circuit board, thereby greatly improving the readability of the marking indicating the bad pattern unit. do.

In addition, since the marking portion is formed in the groove portion, there is no need to use a curing process, so that the marking portion indicating the defective pattern unit can be formed in a simple and inexpensive process.

Hereinafter, the configuration and operation of a circuit board having a cover indicating a defect pattern according to the present invention and a method of manufacturing the circuit board through the embodiments of the accompanying drawings will be described in detail.

1 is a plan view of a circuit board having a mark indicating a bad pattern according to an embodiment of the present invention. FIG. 1 shows an example of a circuit board in which a plurality of pattern units 11 are arranged in a matrix form of a plurality of rows and columns on one strip.

A circuit board having a mark indicating a bad pattern according to the embodiment shown in FIG. 1 includes a pattern portion 10 having a plurality of pattern units 11 and a ledge extending along an edge of the pattern portion 10. Part 20, groove portions 41 and 42 formed at predetermined positions of the rail portion 20, and marking portions 31 formed in the groove portions 41 and 42 to indicate the position of the defective pattern unit 12; 32). The circuit board may be a metal in its entirety, or may be a circuit board for a semiconductor device in which at least one conductive material and a non-conductive material are stacked.

Each of the pattern units 11 includes a pad portion 11a on which a semiconductor chip is mounted, and a lead portion 11b radially connected around the pad portion 11a. The plurality of pattern units 11 are disposed adjacent to each other and form a plurality of rows and columns. For the sake of understanding, the numbers of the rows formed by the pattern units 11 are indicated by numbers (1, 2, 3, 4, ...), and the numbers of the columns are represented by the alphabet letters (A, B, C, D, E, ...). Marked as.

The rail part 20 forms a whole skeleton of the circuit board and functions to support the pattern units 11, and includes a horizontal extension part 21 and a vertical extension part 22. The horizontal extension part 21 extends along the row direction of the pattern units 11 at the edge of the pattern part 10. The vertical extension part 22 extends along the column direction of the pattern units 11 at the edge of the pattern part 10.

The groove portions 41 and 42 include a horizontal groove portion 41 formed in the horizontal extension portion 21 and a vertical groove portion 42 formed in the vertical extension portion 22. The horizontal groove portion 41 is formed at a position corresponding to each column of the pattern units 11, and the vertical groove portion 42 is formed at a position corresponding to each row of the pattern units 11.

The marking portions 31 and 32 are portions formed in the rail portion 20 to indicate the position of the defective pattern unit 12 in which the state of the pattern units 11 is in poor condition. It can be formed by the printing method. The marking parts 31 and 32 include a horizontal marking part 31 formed in the horizontal groove part 41 and a vertical marking part 32 formed in the vertical groove part 42.

Therefore, the horizontal marking part 31 may be formed at a position corresponding to each column of the defective pattern unit 12 among the pattern units 11 to indicate the position of the row where the defective pattern unit 12 exists. The vertical marking part 32 may be formed at a position corresponding to each row of the defective pattern unit 12 among the pattern units 11 to indicate the position of a column in which the defective pattern unit 12 exists.

As described above, the circuit board is manufactured in the form of a strip in which the plurality of pattern units 11 are arranged in a matrix shape, which is suitable for mass production and automated processes. Since the marking parts 31 and 32 indicating the defective pattern unit 12 are formed in the horizontal groove part 41 and the vertical groove part 42, the horizontal extension part may be used in inspection equipment and package equipment for inspecting a completed circuit board. By scanning the 21 and the vertical extension portion 22, the position of the defective pattern unit 12 can be accurately and quickly identified. The number of pattern units 11 disposed in one strip is not limited to the example shown in FIG. 1, and may increase or decrease depending on the size and shape of the semiconductor package to be designed.

Conventionally, in order to display the position of the defective pattern unit on the circuit board, the marking portion is printed on the surface of the circuit board, so that a curing process must be performed. However, in the present invention, since the marking parts 31 and 32 are formed inside the groove parts 41 and 42 having the concave shape, the marking parts 31 and 32 are not exposed to the outside in the process of transferring the circuit board. After scanning the defective pattern unit of the circuit board and forming the marking portions 31 and 32 by the ink printing method, there is no need to use a curing process.

In addition, since the marking parts 31 and 32 are formed inside the groove parts 41 and 42, even if friction occurs between the circuit boards during the transfer of the circuit board or the post-processing process, the printed cover may be erased. There is no problem of poor readability. In addition, there is less concern that part of the printed portion may fall off due to friction, which can greatly reduce the possibility of generating pollutants that contaminate the substrate and the equipment.

2 is a plan view of a circuit board according to another embodiment of the present invention. Also in FIG. 2, the numbers of the rows formed by the pattern units 11 are represented by numbers (1, 2, 3, 4, ...), and the numbers of the columns are represented by alphabet letters (A, B, C, D, E). ,…).

The circuit board according to the embodiment illustrated in FIG. 2 includes a pattern portion 10 having a plurality of pattern units 11, a rail portion 20 extending along an edge of the pattern portion 10, and a rail portion ( And a groove portion 141 formed at a predetermined position of 20 and marking portions 131 and 132 formed in the groove portion 141 to indicate positions of the defective pattern units 12, 15, and 16.

The rail portion 20 includes a horizontal extension portion 21 and a vertical extension portion 22. The horizontal extension part 21 extends along the row direction of the pattern units 11 at the edge of the pattern part 10. The vertical extension part 22 extends along the column direction of the pattern units 11 at the edge of the pattern part 10.

The groove part 141 and the marking parts 131 and 132 are formed only in the horizontal extension part 21 of the rail part 20. The groove part 141 is formed in each position corresponding to each row of the pattern units 11 of the horizontal extension part 21. The marking parts 131 and 132 are formed in the groove part 141 at a position corresponding to the column in which the defective pattern units 12, 15, and 16 are present, and are composed of a combination of letters and numbers. , 16) may indicate the position of a row and the position of a column.

In the embodiment shown in FIG. 2, letters and numbers are used for the marking parts 31 and 32, but the present invention is not limited thereto. Therefore, the marking parts 31 and 32 may include any one or a combination thereof selected from the group consisting of letters, numbers, and symbols to indicate the position of the defective pattern unit.

As described above, even when the marking portions 131 and 132 are formed only in the horizontal extension portion 21 without the marking portion being formed in the vertical extension portion 22 of the rail portion 20, the pattern units 11 of the horizontal extension portion 21 are formed. Since the marking parts 131 and 132 can specify the number of rows including numbers, letters, etc. at positions corresponding to the respective columns of), the positions of the defective pattern units 12, 15, and 16 can be accurately indicated. .

The rail unit 20 may further include a perforation part 151 formed outside the groove part 141 to reinforce rigidity of the circuit board. Since the perforation part 151 is formed to penetrate the circuit board, it performs a function of reinforcing the rigidity of the circuit board so that the circuit board is not bent or folded by bending force or the like given from the outside during the transfer or the post process.

The present invention is not limited to the means for reinforcing the rigidity of the circuit board only in such a perforation portion 151, the stepped portion having a depth lower than the depth of the groove portion 141 at the edge of the groove portion 141 to reinforce the rigidity It may be formed.

3 is a plan view of a circuit board according to still another embodiment of the present invention.

In the circuit board according to the embodiment illustrated in FIG. 3, the groove 241 and the marking parts 231 and 232 are formed only in the vertical extension part 22 of the rail part 20. Although the marking part is not formed on the horizontal extension part 21 of the rail part 20 but is formed only on the vertical extension part 22, the defective pattern units 12 and 17 of the pattern units 11 of the vertical extension part 22 are formed. , The markings 231 and 232 can specify the number of columns including numbers, letters, and the like at positions corresponding to the respective rows of, 18), so that the positions of the defective pattern units 12, 17, 18 can be accurately indicated. Can be.

4 is a plan view of a circuit board according to still another embodiment of the present invention.

In the circuit board according to the embodiment illustrated in FIG. 4, only the groove portion 341 and the marking portions 331, 332, and 333 are formed only in the horizontal extension portion 21 of the rail portion 20. However, in the embodiment shown in FIG. 2, in contrast to the grooves formed at positions on the transverse extensions corresponding to the positions of the rows of pattern units, respectively, the grooves 341 in one embodiment of the transverse extensions 21. Formed only in the area.

The marking portions 331, 332, and 333 formed in the groove 341 correspond to signs indicating the positions of the defective pattern units 17a, 18a, and 19a included in the circuit board, respectively.

The length of the groove part 341 may extend a predetermined length along the length direction of the horizontal extension part 21 so that the plurality of marking parts 331, 332, and 333 may be formed. In general, since the number of defective pattern units occurring in one strip of the circuit board is within a certain level of error depending on the process and equipment, the marking units are capable of indicating all the maximum number of defective pattern units that may occur. It is possible to secure the length of the groove portion 341 to be formed.

As such, if the position where the groove 341 is formed is limited to only a predetermined region of the horizontal extension 21, the process for forming the groove 341 can be simplified, and the defective pattern units generated on the circuit board can be accurately and efficiently. Can be indicated. In addition, in order to check the position of the defective pattern unit on the side of the equipment carrying the circuit board and carrying out the post-processing, the groove 341 is provided without scanning the entire area of the horizontal extension part 21 or the vertical extension part 22. Since only a predetermined position formed needs to be scanned, the time for scanning the defective pattern unit can be greatly shortened.

5 is a process flowchart showing a circuit board manufacturing method according to an embodiment of the present invention.

In the method of manufacturing a circuit board shown in FIG. 5, the circuit board includes a step of preparing a material (S110), a pattern forming step (S120) of forming a pattern and a groove in the material by etching, and a scan for scanning a defective pattern unit. Step S160, and the marking step (S180) for forming a marking portion indicating the position of the bad pattern unit.

FIG. 6 is a side view of a resist-coated material used in the method of manufacturing a circuit board shown in FIG. 5, and FIG. 7 is a side view showing a state where the resist is removed to form a pattern unit in the material of FIG. 6.

Preparing the material 301 of the circuit board, by preparing a material 301 coated with a photosensitive resist 302 on the surface (Fig. 5), by applying an exposure and development process, etc. to the resist 302 And forming a resist pattern 303 for etching on the surface of the material 301 (FIG. 6).

The resist pattern 303 may include a full etching region 304 in which etching is performed to penetrate the material 301 according to the type of pattern to be formed on the circuit board, a non-etching region 305 in which etching is not performed, and only a part of the material. The half etched region 306 is etched away. The half-etching region 306 is a portion for forming a recess in the rail portion of the circuit board by forming a resist only on one side of the material 301.

FIG. 8 is a side view illustrating a step of etching the material of FIG. 7, and FIG. 9 is a side view illustrating a state where etching is completed in FIG. 8.

When the etching solution is supplied to the material 301 as shown in FIG. 8, etching is performed in the shape as shown in FIG. 9. In the circuit board 310 which has been etched, a plurality of pattern units arranged in rows and columns and a rail unit extending around the pattern units are formed. In particular, the rail portion is provided with a groove portion 311 which is formed concave by half etching.

10 is a side view illustrating a state in which a resist is removed from the circuit board of FIG. 9, and FIG. 11 is a side view illustrating a state in which a marking part is formed on the circuit board of FIG. 10.

After removing the resist pattern 303 remaining on the surface of the circuit board 310, a scanning step of inspecting the pattern units to scan the bad pattern unit in a bad state and a marking step indicating the position of the bad pattern unit are performed.

Before performing the scanning step and the marking step, the surface of the circuit board having the pattern formed by etching is subjected to PPF plating (pre-plated lead frame plating pretreatment lead frame plating) (S130), and cut into strips (S140). May be additionally carried out. The strip of the circuit board manufactured through a series of automated steps is fed into the vision inspection equipment, and a defect pattern scan and marking operation by automatic image recognition (vision inspection) on the strip of the circuit board is performed.

Scanning the defective pattern unit shown in FIG. 5 (S160) is a step of finding a defective pattern unit having a problem such as disconnection of a circuit pattern or defective pattern width due to the occurrence of foreign matter or other causes in an automated production facility. . The scanning of the bad pattern unit (S160) may be automatically performed by comparing the shape of the good pattern unit in which the automated imaging equipment is stored in advance with the pattern unit included in the strip of the circuit board, but the present invention is not limited thereto. . Therefore, the step S160 of scanning the defective pattern unit may be performed manually by an operator, for example.

When the scanning step S160 of scanning the bad pattern unit is completed, information on the location of the bad pattern unit, that is, location information of the rows and columns, is stored in the memory or the storage device. The stored location information may be utilized in the marking step S180 of forming a marking unit to be performed later.

In order to perform the marking step S180 of forming the marking part, the strip of the circuit board on which the scan is completed is loaded into the printing apparatus (S170). In addition, the printing apparatus forms a marking unit by using the position information of the defective pattern unit acquired in the scanning of the defective pattern unit (S160).

In FIG. 11, the marking portion 313 is formed on the bottom surface 312 of the groove 311 of the circuit board 310.

The marking portion 313 formed in the groove portion 311 may be formed by an ink printing method in which ink is applied or sprayed on the bottom surface 312 in a contact manner.

The finished circuit board may be supplied wound on a reel, cut into strips, and several circuit boards may be transferred in an overlapped state, or a post process may be performed. In this process, the circuit board may be bent. In order to accurately recognize the position of the defective pattern unit in the equipment, the marking part 313 should not be removed or dropped from the circuit board.

In the present invention, in order to improve the interfacial bonding force between the marking portion 313 and the circuit board, the roughness of the bottom surface 312 of the groove portion 311 can be adjusted larger than the roughness of the surface other than the groove portion 311. When the marking portion 313 is formed on the bottom surface 312 with the roughness controlled by ink printing, the interface bonding force between the bottom surface 312 and the marking portion 313 may be greatly increased. Therefore, the marking part 313 does not easily fall off from the circuit board due to the impact or bending force applied to the circuit board during the additional process of the circuit board, and thus the readability of the information may be greatly improved.

In the present invention, the method of forming the marking portion 313 is not necessarily limited to the ink printing method, but a method using a laser, a method of burning the bottom surface of the groove 311 using high temperature heat, and an electropolishing method Various methods such as an etching method or a thermal transfer marking method may be used. In addition, a method of drilling or punching the bottom surface 312 of the groove 311 using a physical force may be used to form the marking portion 313.

FIG. 12 is a side view illustrating another example of the method of manufacturing the circuit board of FIG. 5, in which an oxide layer is formed on the circuit board of FIG. 9 to form a marking unit using a laser. FIG. 13 is a circuit diagram of the circuit board of FIG. 12. It is a side view which shows the state in which the marking part was formed in the board | substrate.

12 illustrates a circuit board 320 completed through the same steps as those shown in FIGS. 6 to 10, and an oxide layer 327 is additionally formed on the surface of the circuit board 320.

In the modified example shown in FIGS. 12 and 13, the marking part 323 is formed in the groove part 321 of the circuit board 320. The marking unit 323 may be formed by processing the oxide layer 327 with a laser. When the oxide layer 327 includes, for example, a black oxide layer, if the marking portion 323 is marked with a laser, vision recognition is easy because the portion marked with the laser is brighter than the surroundings.

Referring to FIG. 5, when the formation of the marking part is completed, the strip S190 of the circuit board is unloaded, and the circuit board is packaged as a finished product (S200). The circuit board completed through this process is manufactured in the form of a strip in which a plurality of pattern units are arranged in a matrix form, which is suitable for mass production and automated processes.

Since the marking portion indicating the position of the defective pattern unit is formed in the groove of the rail portion, the packaging equipment for packaging the semiconductor using the completed circuit board can scan the groove to accurately and quickly determine the position of the defective pattern unit. have.

14 is a flowchart showing a circuit board manufacturing method according to another embodiment of the present invention.

The manufacturing method of the circuit board shown in FIG. 14 includes a substrate preparation step (S300) for preparing a circuit board, a step (S301) for forming a groove, a scan step (S302) for scanning a bad pattern unit, and a bad pattern unit. It includes a marking step (S303) for marking.

15 to 17 illustrate a process diagram of a substrate preparation step of preparing a circuit board. FIG. 15 is a side view of a material coated with a resist used in the method of manufacturing a circuit board shown in FIG. 143, FIG. 16 is a side view showing a state in which a part of the resist of FIG. 15 is removed, and FIG. 17 is a material of FIG. 16. It is a side view which shows the state which applies an etching to.

The preparing of the circuit board may include applying a photosensitive resist 402 to the surface of the material 401 and applying an exposure and development process to the resist 402 to form a resist pattern for etching on the surface of the material 401 ( After the 403 is formed, supplying an etching solution to the material 401 includes completing a circuit board including a pattern unit and a rail unit.

In the embodiments shown in FIGS. 6 to 9, grooves are also formed in the rail portion of the circuit board when etching is performed, but in the embodiments shown in FIGS. 15 to 20, the grooves are not formed when etching is performed. The groove is formed through a separate additional process performed after the etching is completed.

FIG. 18 is a side view illustrating a state in which laser processing is applied to a circuit board on which a pattern unit is formed by etching of FIG. 17, and FIG. 20 is a side view illustrating a state in which laser processing in FIG. 18 is completed.

When the resist pattern 403 is removed after the etching solution is supplied to the material 401 as shown in FIG. 17, the circuit board 410 having the shape as shown in FIG. 18 is completed. The circuit board 410 on which the etching is completed is formed with a plurality of pattern units arranged in rows and columns, and a rail portion extending around the pattern units.

When the rail portion of the completed circuit board 410 is processed using a CO ₂ laser drill, a groove 411 is formed in the circuit board 410 as shown in FIG. 20. As such, the method of forming the groove 411 in the circuit board 410 by using a laser drill instead of the etching method is not easy to apply etching because the circuit board is made of a multi-layered substrate rather than being formed in a single layer. Useful in the case.

The means for forming the groove portion 411 is not necessarily limited to the laser drill, and may be cut using other mechanical drills, pressing a portion of the circuit board 410, or of the circuit board 410 Various means may be used, such as coating a conductive layer on a surface and then etching the conductive layer.

When the groove 411 is formed in the rail portion of the circuit board 410, a scanning step of inspecting the pattern units to scan a bad pattern unit having a bad state and a marking step indicating the position of the bad pattern unit are performed.

Scanning the bad pattern unit illustrated in FIG. 14 (S302) is a step of finding a bad pattern unit having a problem such as disconnection of a circuit pattern or poor pattern width due to the occurrence of foreign matter or other causes in an automated production facility. .

When the scanning step S302 of scanning the bad pattern unit is completed, information on the location of the bad pattern unit, that is, location information of the rows and columns, is stored in the memory or the storage device. The stored position information may be utilized in the marking step S303 of forming a marking unit to be performed later.

Forming a marking portion indicating the position of the row and the position of the column in which the defective pattern units are present (S303), by the ink printing method of applying or spraying ink on the bottom surface 412 of the groove portion 411 in contact The portion 413 may be formed.

In order to improve the interface bonding force between the marking portion 413 and the circuit board 410, the roughness of the bottom surface 412 of the groove 411 may be adjusted to be larger than the roughness of the surface of the groove 411. When the marking portion 413 is formed on the bottom surface 412 of which the roughness is controlled by ink printing, the interface bonding force between the bottom surface 412 and the marking portion 413 may be greatly increased. Therefore, even when an impact or bending force is applied to the circuit board, the marking part 413 does not easily fall off the circuit board 410, and thus the readability of the information may be greatly improved.

Although the present invention has been described with reference to the above-described embodiments, these are merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the appended claims.

1 is a plan view of a circuit board having a mark indicating a bad pattern according to an embodiment of the present invention.

2 is a plan view of a circuit board according to another embodiment of the present invention.

3 is a plan view of a circuit board according to still another embodiment of the present invention.

4 is a plan view of a circuit board according to still another embodiment of the present invention.

5 is a process flowchart showing a circuit board manufacturing method according to an embodiment of the present invention.

FIG. 6 is a side view of a resist coated material used in the method of manufacturing a circuit board shown in FIG. 5.

FIG. 7 is a side view illustrating a state in which a resist is removed to form a pattern unit in the material of FIG. 6.

FIG. 8 is a side view illustrating a step of etching the material of FIG. 7. FIG.

FIG. 9 is a side view illustrating a state in which etching is completed in FIG. 8.

FIG. 10 is a side view illustrating a state in which a resist is removed from the circuit board of FIG. 9.

FIG. 11 is a side view illustrating a state in which a marking part is formed on the circuit board of FIG. 10.

12 is a side view illustrating a step of forming a marking part with a laser by forming an oxide layer on the circuit board of FIG. 8 as another modified example of the manufacturing method of the circuit board of FIG. 5.

FIG. 13 is a side view illustrating a state in which a marking part is formed on a circuit board by the step of FIG. 12.

14 is a flowchart showing a circuit board manufacturing method according to another embodiment of the present invention.

FIG. 15 is a side view of a resist-coated material used in the method of manufacturing a circuit board shown in FIG. 14.

FIG. 16 is a side view illustrating a state in which part of the resist of FIG. 15 is removed.

17 is a side view illustrating a state in which etching is applied to the material of FIG. 16.

FIG. 18 is a side view illustrating a state in which laser processing is applied to a circuit board on which a pattern unit is formed by etching of FIG. 17.

19 is a side view illustrating a state in which the laser processing of FIG. 18 is completed.

* Explanation of symbols for main parts of the drawings

10: pattern portion 42: vertical groove portion

11b: lead portion 151: perforation portion

11a: pad portion 304: full etching area

11: pattern units 305: non-etching area

20: rail portion 306: half etching area

21: transverse extension 327: oxide layer

22: vertical extension part 301, 401: material

31: horizontal marking portion 302, 402: photosensitive resist

32: vertical marking portion 303, 403: resist pattern

41: horizontal groove 312, 412: bottom surface

310, 320, 410: circuit board

41, 42, 141, 241, 311, 321, 341, 411: groove

12, 15, 16, 17, 18, 17a, 18a, 19a: bad pattern units

131, 132, 231, 232, 313, 323, 331, 332, 333, 413: marking part

Claims (19)

A pattern portion having a plurality of pattern units disposed adjacent to each other; A rail unit extending along an edge of the pattern unit; A groove portion formed at a predetermined position of the rail portion; And And a marking portion formed in the groove portion to indicate positions of the defective pattern units having a bad state among the pattern units. The method of claim 1, And the rail part includes a horizontal extension part extending in a row direction of the pattern units at an edge of the pattern part. The method of claim 2, The groove portion is formed at each position corresponding to each column of the pattern units of the horizontal extension portion, and the marking portion is formed at the groove portion at a position corresponding to the column of the defective pattern units to position the row of the defective pattern unit. Circuit board. The method of claim 2, And the groove portion is formed in the horizontal extension portion to extend a predetermined length along the horizontal extension portion. The method of claim 1, And the groove portion is formed by etching. The method of claim 5, And said marking portion is formed in said groove portion by an ink printing method. The method of claim 6, And the marking portion is formed on the bottom surface of the groove portion, and the roughness of the bottom surface is larger than the roughness of the surface other than the groove portion. The method of claim 1, An oxide layer is formed on a surface of the groove portion, and the marking portion is formed by processing the oxide layer with a laser. The method of claim 1, The marking portion is formed by etching the surface of the groove except for the portion forming the marking portion, the circuit board. The method of claim 9, And the height of the marking portion is smaller than the length from the surface of the groove portion to the surface of the rail portion. The method of claim 1, And said marking portion is composed of letters, numbers, or a combination thereof, indicating a position of a row and a position of a column in which the defective pattern units exist. The method of claim 1, The rail portion further comprises a perforated portion formed on the outside of the groove portion to reinforce the rigidity of the circuit board. The method of claim 1, The rail portion further comprises a stepped portion formed to have a depth lower than the depth of the groove portion on at least a portion of the edge of the groove portion to reinforce the rigidity of the circuit board. A preparatory step of preparing a material of the circuit board; A pattern forming step of forming a plurality of pattern units arranged in rows and columns on the substrate, a rail portion extending around the pattern unit, and a groove portion formed at a predetermined position of the rail portion by etching; A scan step of inspecting the pattern units to scan a bad pattern unit having a bad state; And And forming a marking portion indicative of a position of a row and a position of a column in which the defective pattern units are present in the groove portion. The method of claim 14, The marking portion is formed by a printing method, a circuit board manufacturing method. The method of claim 14, After the pattern forming step, further comprising the step of forming an oxide layer on the surface of the circuit board, The marking step is a method of manufacturing a circuit board by irradiating the laser to the oxide layer to form the marking. The method of claim 14, In the pattern forming step, the groove portion is formed by a half etching to form a resist on only one surface of the material to perform etching, circuit board manufacturing method. A substrate preparation step of preparing a circuit board having a plurality of pattern units arranged in rows and columns and a rail unit extending around the pattern unit; A groove portion forming step of forming a groove portion at a predetermined position of the rail portion; A scan step of inspecting the pattern units to scan rows and columns at positions where a bad pattern unit having a bad state exists; And And a marking step of printing ink on the groove part to form a marking part representing a row position and a column position in which the defective pattern units exist. The method of claim 18, Wherein the groove portion forming step, by pressing or cutting the surface of the circuit board to form the groove portion, the circuit board manufacturing method.

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