KR101238862B1 - Illuminating apparatus using led and method for manufacturing the same - Google Patents

Abstract

An LED lighting device and a method of manufacturing the same are disclosed. LED lighting device that can be compatible to the bulb-type lighting device, the heat sink is provided with a plurality of heat dissipation fins of concave-convex shape on the outer surface; A main body coupled to the inside of the heat sink; A first substrate coupled to an upper surface of the heat sink by a fitting method and mounted with a plurality of LEDs that illuminate light on the upper surface; A cover member for transmitting the light emitted from the plurality of LEDs to the outside; A second substrate mounted with a converter for applying direct current power to the LED module and coupled to the inside of the main body; And a terminal portion electrically connected to the second substrate. As a result, it is possible to effectively replace a light bulb such as a conventional incandescent lamp, a three-wavelength light, etc., and to configure a heat dissipation fin on the outside to efficiently dissipate heat generated from the light source by convection and conduction, as well as a substrate on which an LED is mounted. It is possible to increase the efficiency of the manufacturing process by combining by the fitting method, by coupling the substrate mounted with the LED driving circuit by the sliding method.

Description

LED lighting device and its manufacturing method {ILLUMINATING APPARATUS USING LED AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to an LED lighting apparatus and a method of manufacturing the same, and more particularly, to an LED lighting apparatus and a method of manufacturing the same that can be applied to the bulb-type luminaires.

Recently, a lighting device using an LED (Light Emitting Diode) as a light source is emerging. This LED luminaire has low power consumption, which is 20% lower than that of a general light bulb, which provides good power-saving effect, and can be used semi-permanently due to the characteristics of the LED.

However, since the LED lighting device uses a high output LED composed of a chip of high current and high brightness as a light source, a lot of heat is generated during illumination.

In addition, the spread of the LED lighting device has a disadvantage in that it can cause a huge economic loss when replacing the conventional light bulb type lamps, such as incandescent lamps, three-wavelength lighting and the like for the LED lighting device dedicated.

On the other hand, the LED lighting apparatus of the structure applicable to the bulb-type lighting fixture is conventionally disclosed.

However, the conventional bulb-type luminaire is coupled to the LED module using a screw, that is, a bolt coupling method using a driver, there is a disadvantage that takes a lot of work time.

In addition, since the LED driving circuit is coupled by the filling molding method, the weight of the bulb-type luminaire is unnecessarily heavy.

The present invention has been made in view of the above problems, and can be applied to a bulb-type luminaire, the LED having a structure that can effectively radiate heat generated from the light source by convection and conduction by forming a heat radiation fin on the outside An object of the present invention is to provide a lighting device and a method of manufacturing the same.

In addition, the present invention is to provide a LED lighting device and a method for manufacturing the LED mounting device that can be coupled to the mounting method by mounting the substrate mounted LED, shorten the working time and increase the efficiency of the manufacturing process than the conventional screw coupling method. There is a purpose.

In addition, the present invention is coupled to the substrate mounted with the LED drive circuit by a sliding method, it is lighter than the conventional lighting device using a filling molding method, and therefore provides a portable LED lighting device and a method of manufacturing the same is another object. have.

In order to achieve the above object, the LED lighting device that can be compatible to the bulb-type lamp according to the present invention, the heat sink is provided with a plurality of heat dissipation fins of the concave-convex shape on the outer surface; A main body coupled to the inside of the heat sink; A first substrate coupled to an upper surface of the heat sink by a fitting method and mounted with a plurality of LEDs that illuminate light on the upper surface; A cover member for transmitting the light emitted from the plurality of LEDs to the outside; A second substrate mounted with a converter for applying direct current power to the LED module and coupled to the inside of the main body; And a terminal portion electrically connected to the second substrate.

The first substrate is formed in a circle formed with a plurality of protrusions along the outer circumference, the upper surface of the heat sink is made of a circle formed with a cover portion, the inner side is opened along the outer circumference, the cover portion is formed in the plurality of projections A plurality of corresponding grooves are formed, and the heat sink and the first substrate may be coupled by a screwing method in which the plurality of protrusions are inserted into and rotated in the plurality of grooves.

The plurality of heat dissipation fins may be repeatedly formed with a pair of heat dissipation fins having uneven portions of different lengths from the cover member in the direction of the terminal portion to widen the outer surface area of the heat sink.

The second substrate may be slidingly coupled to the inside of the main body.

A plurality of coupling protrusions are formed along an inner circumferential surface of the heat sink, a plurality of coupling grooves corresponding to the plurality of protrusions are formed along an outer circumferential surface of the body, and a plurality of coupling protrusions are formed on the plurality of coupling protrusions. The coupling protrusion of the hook may be coupled to the plurality of coupling grooves.

The heat sink may be made of a thermally conductive synthetic resin.

On the other hand, in order to achieve the above another object, the manufacturing method of the LED lighting apparatus can be applied to the bulb-type luminaire according to the present invention, the second substrate mounted with a converter for applying a DC power to the LED module to the main body Sliding coupling; Coupling the main body to a heat sink having a plurality of heat dissipation fins having irregularities on the outside; Coupling a first substrate on which a plurality of LEDs illuminating light on an upper surface thereof is mounted to the upper surface of the heat sink by fitting; And coupling a cover member for transmitting the light emitted from the plurality of LEDs to the outside.

Since the LED lighting device and the manufacturing method according to the present invention configured as described above can be applied to a bulb-type luminaire, there is an advantage that can effectively replace a conventional light bulb, such as incandescent lamp, three-wavelength lighting.

In addition, the LED lighting apparatus and the manufacturing method according to the present invention has the advantage that can be efficiently radiated heat generated from the light source by the convection and conduction by configuring a heat radiation fin on the outside. Furthermore, the present invention may further improve the heat dissipation efficiency by repeatedly forming heat dissipation fins having different lengths on the outside of the heat sink, thereby widening the inner and outer surface areas of the heat sink.

In addition, the LED lighting apparatus and the manufacturing method according to the present invention is coupled to the mounting method by mounting the substrate on which the LED is mounted, there is an advantage that can shorten the working time and increase the efficiency of the manufacturing process than the conventional screw coupling method have.

In addition, the LED lighting apparatus and the manufacturing method according to the present invention is coupled to the substrate mounted with the LED driving circuit by a sliding method, lighter than the conventional lighting device using the filling molding method is good portability, so that the user's convenience There is an advantage of being improved.

1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention.
Figure 2 is an exploded perspective view of Figure 1;
3 and 4 is a view showing a coupling structure of the heat sink and the first substrate of the LED lighting apparatus according to an embodiment of the present invention.
5 is a view showing a coupling structure of the body and the second substrate of the LED lighting apparatus according to an embodiment of the present invention.
6 and 7 is a view showing a coupling structure of the heat sink and the body of the LED lighting apparatus according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail an LED lighting apparatus and a manufacturing method according to an embodiment of the present invention.

1 is a perspective view showing an LED lighting apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view of FIG. 3 and 4 are views showing a coupling structure of the heat sink and the first substrate of the LED lighting apparatus according to the embodiment of the present invention.

LED lighting apparatus according to an embodiment of the present invention has a structure that can be compatible to the conventional bulb-type luminaires, such as incandescent bulbs, three-wavelength lighting.

1 and 2, the LED lighting apparatus of the present invention includes a heat sink 10, a first substrate 20 on which a plurality of LEDs 21 are mounted, a cover member 30, and a heat sink ( 10) includes a main body 40 and the terminal portion 50 coupled to the inside. The second substrate 41 on which the elements 43 for driving the plurality of LEDs 21 are mounted is coupled to the inside of the main body 40.

The heat sink 10 has a cylindrical shape and emits heat generated when the plurality of LEDs 21 illuminate light to the outside. In the heat sink 10 according to the embodiment of the present invention, the top surface 11 may be configured to be larger than the bottom surface 13 as shown in FIG. 3.

As shown in Figure 1 and 2, the heat sink 10 of the LED lighting apparatus of the present invention is formed with a plurality of heat dissipation fins (12, 14) of the concave-convex shape on the outer surface. Since a heat dissipation space 15 is formed between the plurality of heat dissipation fins 12 and 14 to increase the outer surface area of the heat sink 10, heat dissipation efficiency may be improved.

Here, since the upper surface 11 of the heat sink 10 is formed larger than the bottom surface 13 as shown in FIG. 3, the heat dissipation space 15 is directed from the cover member 30 toward the terminal portion 50, that is, from top to bottom. Its depth is gradually reduced.

As shown in FIG. 3, the plurality of heat dissipation fins according to the embodiment of the present invention has a pair of first heat dissipation fins 12 and second heat dissipation fins having uneven parts having different lengths and heights from the cover member 30 toward the terminal portion 50. 14) may be formed repeatedly. Thus, since the outer surface area of the heat sink 10 can be widened, the heat dissipation efficiency can be further improved.

In addition, the heat sink 10 of the LED lighting apparatus according to the embodiment of the present invention is made of a thermally conductive synthetic resin (or thermally conductive plastic), it is possible to further improve the heat dissipation performance compared to a light source device using a conventional aluminum die casting method.

A plurality of LEDs 21 for illuminating light are mounted on the first substrate 20, and are coupled to the top surface 11 of the heat sink 10 by a turn-fit method. Here, the LED 21 itself has a modular configuration in the form of a semiconductor chip, which is well known per se, and a detailed description thereof will be omitted.

In the exemplary embodiment of the present invention, the plurality of LEDs 21 may be arranged to be evenly distributed on the first substrate 20.

Here, the connector 22 for electrical connection with the second substrate 41 may be further mounted on the first substrate 20.

As shown in FIG. 3, the first substrate 20 has a circular shape, and a plurality of coupling protrusions 27 are formed along the outer circumference.

The upper surface 11 of the heat sink 10 is formed with a cover portion 16, the inner side of which is opened along an outer circumference, and the cover portion 16 has a plurality of coupling grooves at positions corresponding to the plurality of coupling protrusions 27. (17) is formed. In addition, a coupling groove 18 for coupling the cover member 30 to the outside of the cover portion 16 may be further formed.

Referring to FIG. 4, a plurality of coupling protrusions 27 of the first substrate 20 are inserted and rotated into a plurality of coupling grooves 17 formed on the upper surface 11 of the heat sink 10 by a turn-fit method. The heat sink 10 and the first substrate 20 are combined.

As such, since the substrate 20 on which the LED 21 is mounted is coupled by rotating by fitting, the work efficiency may be higher than that of the conventional screw coupling. In addition, since there is no need for a separate space for screwing, the LED 21 can be disposed in the space of the first substrate 20 that was previously used for screwing, thereby making it possible to create a more uniform light source distribution. .

Through holes 20a and 11a may be further formed on the upper surface 11 of the first substrate 20 and the heat sink 10 to radiate heat by convection.

The cover member 30 transmits the light emitted from the plurality of LEDs 21 to the outside.

The cover member 30 has a hollow semi-spherical structure and is inserted into the coupling groove 18 formed along the outer circumferential surface of the upper surface 11 of the heat sink 10 to be coupled to the heat sink 11.

The cover member 30 may maintain the state coupled to the heat sink 11 by its elastic force. That is, the cover member 30 is press-coupled to the coupling groove 18 while the end thereof is temporarily expanded by the elastic force when pressed from the upper side to the lower side of FIG. 2, and maintains the coupled state unless an external force of a predetermined size or more is applied. It can be maintained.

On the other hand, the coupling of the cover member 30 and the heat sink 10 is not limited to the structure in which the end of the cover member 30 is inserted into the coupling groove 18, it can be modified in various forms. For example, by forming a hook structure between the end of the cover member 30 and the top of the heat sink 10, it may be implemented to be coupled by sliding.

The cover member 30 performs various optical functions according to the material and processing form. For example, the cover member 30 may be formed of glass or plastic material of transparent or translucent material. The cover member 30 can diffuse the incident light by matte processing on the surface and embossing. In addition, the cover member 30 may include an additive that absorbs light having a predetermined wavelength, thereby correcting the color of the illumination light.

The main body 40 has a hollow cylindrical structure and is inserted and coupled to the inside of the heat sink 10. The second substrate 41 is slidingly coupled to the inside of the main body 40.

5 is a view showing a coupling structure of the body and the second substrate of the LED lighting apparatus according to an embodiment of the present invention.

Referring to FIG. 5, a circuit element 43 including a converter as the LED 21 driving circuit is mounted on the second substrate 41. The converter converts the AC power input through the terminal unit 50 into DC power and supplies it to the LED 21.

As such, when the LED lighting apparatus includes a converter, the lighting apparatus according to the present invention may be applied to an environment in which AC power is applied without a separate external converter structure. Therefore, the LED lighting apparatus according to the embodiment of the present invention can be applied interchangeably to a conventional lamp luminaire.

Under the main body 40, the terminal part 50 is comprised. The terminal unit 50 is electrically connected to a socket (not shown) formed in a conventional bulb-type luminaire to which an LED lighting device is coupled, and receives AC power to supply the component 43 mounted on the second substrate 41. .

The terminal portion 50 is electrically insulated from the heat sink 10 and electrically connected to the second substrate 41 to supply power to the electronic component 43 mounted on the second substrate 41 including the converter. .

The second substrate 41 is electrically connected to the connector 22 of the first substrate 20 to supply power to the plurality of LEDs 21 mounted on the first substrate 20.

As shown in FIG. 5, a pair of rail parts 42 and 44 are formed on the inner side surface of the main body 40 to form sliding grooves in the longitudinal direction such that the second substrate 41 slides.

The second substrate 41 is coupled to the sliding groove formed between the pair of rail portions 42 and 44 by a sliding method. After sliding engagement, the second substrate 41 is bonded to the main body 40.

Accordingly, it is lighter than the conventional lighting apparatus using the filling molding method, and the user's portability is improved.

6 and 7 are views showing a coupling structure of the heat sink and the main body of the LED lighting apparatus according to the embodiment of the present invention.

6 and 7, a plurality of locking protrusions 18 are formed on the inner circumferential surface of the heat sink 10, and a plurality of locking protrusions corresponding to the plurality of locking protrusions 19 are formed on the outer circumferential surface of the main body 40. The jaw 49 is formed, and the locking projection 19 is hooked to the locking jaw 49.

That is, the heat sink 10 is slidingly coupled to the outside of the main body 40 while temporarily expanding outward by elastic force when pressed from the upper side to the lower side of FIG. 2, and the locking protrusion 19 is connected to the locking step 49. Hook is inserted into the inserted form, it is possible to maintain the coupled state even if an external force is applied.

Hereinafter, a manufacturing process of the LED lighting apparatus according to the embodiment of the present invention will be described in detail with reference to the drawings.

First, as shown in FIG. 5, the second substrate 41 on which the driving circuit of the LED 21 is mounted is slidably coupled to the main body 40.

The main body 40 to which the second substrate 41 is coupled is inserted into the heat sink 10 in a sliding manner as shown in FIG. 6, and is hooked by the locking protrusion 19 and the locking jaw 49.

3 and 4, a plurality of coupling grooves 17 in which a plurality of coupling protrusions 27 of the first substrate 20 on which the plurality of LEDs 21 are mounted are formed on the top surface 11 of the heat sink 10. ), The heat sink 10 and the first substrate 20 are coupled to each other by a rotational method of insertion and rotation.

The cover member 30 is coupled to the coupling groove 18 formed on the upper surface 11 of the heat sink 10.

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.

10: Heat sink 11: Heat sink top surface
20: first substrate 21: LED
30: cover member 40: main body
41: second substrate 50: terminal portion

Claims (7)

In the LED lighting device that can be compatible with the bulb luminaire,
A heat sink having a plurality of heat dissipation fins having irregularities on an outer surface thereof;
A main body coupled to the inside of the heat sink;
A first substrate coupled to an upper surface of the heat sink by a fitting method and mounted with a plurality of LEDs that illuminate light on the upper surface;
A cover member for transmitting the light emitted from the plurality of LEDs to the outside;
A second substrate mounted with a converter for applying direct current power to an LED module and coupled to the inside of the main body;
A terminal part electrically connected to the second substrate,
The first substrate is made of a circle formed with a plurality of protrusions along the outer periphery,
The upper surface of the heat sink is formed in a circular shape formed with a cover portion open on the inner circumference,
A plurality of grooves corresponding to the plurality of protrusions are formed in the cover part, and the heat sink and the first substrate are coupled by a screwing method in which the plurality of protrusions are inserted into and rotated in the plurality of grooves. LED lighting device. delete The method of claim 1,
The plurality of heat dissipation fins of the LED lighting apparatus, characterized in that a pair of heat dissipation fins having a concave-convex portion of different lengths from the cover member in the direction of the terminal portion is formed repeatedly, thereby increasing the outer surface area of the heat sink. The method of claim 1,
LED lighting device, characterized in that the second substrate is slidingly coupled to the inside of the main body. The method according to any one of claims 1, 3, and 4,
A plurality of coupling protrusions are formed along the inner circumferential surface of the heat sink, and a plurality of coupling grooves corresponding to the plurality of protrusions are formed along the outer circumferential surface of the body,
The engaging projection is formed in the plurality of coupling projections, LED lighting apparatus, characterized in that the plurality of coupling projections are hooked to the plurality of coupling grooves. The method according to any one of claims 1, 3, and 4,
The heat sink is an LED lighting device, characterized in that made of a thermally conductive synthetic resin. In the manufacturing method of the LED lighting device that can be applied to the bulb-like luminaires,
Slidingly coupling a second substrate on which a converter for applying a DC power to the LED module is mounted on a main body;
Coupling the main body to a heat sink having a plurality of heat dissipation fins having irregularities on the outside;
Coupling a first substrate on which a plurality of LEDs illuminating light on an upper surface thereof is mounted to the upper surface of the heat sink by fitting;
Combining a cover member for transmitting the light emitted from the plurality of LEDs to the outside;
The step of coupling by the screwing method, a plurality of protrusions formed along the outer periphery of the first substrate, the screwing method of inserting and rotating in a plurality of grooves of the cover portion formed along the outer periphery of the upper surface of the heat sink. Combining by,
The cover part is made of an open circular shape, the method of manufacturing an LED lighting device, characterized in that the plurality of projections are inserted into and rotated in the plurality of grooves formed in the corresponding position.

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