KR101234147B1 - Printing Plate for Large-area Fine Pattern Printing With Improved Endurance, and Method of Manufacture The Same - Google Patents

Abstract

The present invention relates to a printing plate for a large-area micropattern printer with improved durability, and a method of manufacturing the same, by patterning a photosensitive resin layer on a base layer of a substrate and forming a structural reinforcement part using a conductive material in the micropattern portion, Disclosed are a printing plate for a large area fine pattern printer and a method of manufacturing the same, which can greatly improve the strength of the fine pattern portion essential for producing a large area printing plate.
The manufacturing method of the printing plate for large-area micropattern printing according to the present invention comprises the steps of: (a) forming a photosensitive resin layer on a substrate; (b) patterning the photosensitive resin layer to form a fine pattern; And (c) forming a structural reinforcement between the fine patterns.

Description

Printing Plate for Large-area Fine Pattern Printing With Improved Endurance, and Method of Manufacture The Same}

The present invention relates to a printing plate for a large-area micropattern printer with improved durability and a method of manufacturing the same, and more particularly, by inserting a plating layer between the micropatterns, thereby greatly improving the strength of the micropattern, which is essential for manufacturing a large-area printing plate. A printing plate for an area fine pattern printer and a method of manufacturing the same.

To print circuits and various patterns of electronic parts by using printing, use a direct printing method such as Inkjet or an indirect printing method such as gravure printing or offset printing using a printing plate on which a pattern is printed. Will be used.

Conventional methods for making a printed plate include a method of forming a pattern by corroding a substrate, or a method of forming a pattern using photolithography on a plate to which a photosensitive resin is first attached. However, in this conventional method, the depth of the formed pattern remains constant regardless of which method is used. In order to print using such a printing plate, the pattern depth of the printing plate must be at least a certain level so that the printing roll does not touch the bottom of the pattern. This depth is different for fine line widths and for normal patterns.

1A and 1B show a printing electronic printing plate according to an embodiment of the prior art, FIG. 1A is a sectional view of a wet etched printing plate, and FIG. 1B is a sectional view showing a printing error according to the depth of the printing plate. .

As shown in FIGS. 1A and 1B, in the case of the portion A of the fine pattern portion, the depth of the pattern is not required deeply, but in the case of the portion b of which the pattern line width is relatively larger than the fine pattern, the printing roll 20 touches the floor. The pattern may be printed incorrectly, so the depth should be larger. For this reason, in the printing plate 10 manufactured by wet etching, the depth t of the pattern to be formed is determined to be 1/2 or less of the minimum fine line width of the printing plate. That is, the minimum line width that can be implemented in the printing plate is determined as follows.

[Minimum Line Width ≥ Minimum Pattern Depth × 2]

In general, since the minimum pattern depth that can be printed using a printing plate is about 5 μm, the minimum line width that can be realized by the conventional method is about 10 μm. Therefore, in the prior art, it is difficult to manufacture a printing plate having a fine line width within 10 μm.

In order to solve this problem, a method of forming an anisotropic vertical pattern on the substrate 30 using dry etching or imprinting techniques as shown in FIG. 2A has recently been proposed. However, even in such a pattern, as shown in FIG. 2B, there is a problem in that the fine pattern portion is damaged by the pressure of the roll 20 in the printing process, and thus it is difficult to enlarge the size.

SUMMARY OF THE INVENTION The present invention has been made in an effort to solve the above-mentioned problems, and proposes a printing plate for a large-area fine pattern printer and a method of manufacturing the same, which can produce a printing plate on which a fine pattern is formed that could not be realized in a printing plate manufactured by a conventional technology. There is.

In addition, another technical problem to be achieved by the present invention is to pattern the photosensitive resin layer on the underlying layer of the substrate and to form a structural reinforcement using a conductive material in the fine pattern portion, the strength of the fine pattern portion essential for the production of large area printing plate The present invention provides a printing plate for a large-area fine pattern printer and a method of manufacturing the same, which can greatly improve the performance of the present invention.

In addition, another technical problem to be achieved by the present invention is to propose a printing plate for a large-area micropattern printer and a method of manufacturing the structure reinforcing portion formed by using a technique such as plating on the fine pattern portion.

In addition, another technical problem to be achieved by the present invention is to provide a printing plate for a large-area micropattern printer and a manufacturing method thereof by inserting a plating layer between the micropattern to prevent the destruction of the micropattern.

The solution to the problem of the present invention is not limited to those mentioned above, and other solutions not mentioned can be clearly understood by those skilled in the art from the following description.

As a means for solving the above-described technical problem, the invention as set forth in claim 1, "In the manufacturing method of a printing plate for large-area fine pattern printing, (a) forming a base layer on a substrate; (b) patterning the underlayer so that the top of the substrate is exposed; (c) forming a photosensitive resin layer on the base layer and the exposed substrate; (d) forming a fine pattern by patterning the photosensitive resin layer to expose the upper base layer; And (e) forming a structural reinforcing part between the fine patterns. &Quot; The method of manufacturing a printing plate for printing a large area fine pattern.

The invention according to claim 2, wherein the substrate according to claim 1, wherein the substrate comprises: a polymer comprising PC (polycarbonate), PET (polyethylene terephthalate resin), PMMA (polymethylmethacrylate), glass, film, metal ( And a method for producing a printing plate for large-area fine pattern printing, which is formed of any one material from the group including Metal. &Quot;

The method according to claim 3, wherein the substrate according to claim 1 has a thermal expansion coefficient of less than twice the thermal expansion coefficient of the transfer substrate in order to maintain the accuracy of the pattern. Is provided.

According to the invention of claim 4, "The method of manufacturing the printing plate according to claim 1 comprises: forming a base layer on the substrate and then forming the photosensitive resin layer, and then simultaneously forming the base layer and the photosensitive resin layer. The manufacturing method of the printing plate for large-area micropattern printing which patterns and forms a micropattern. "Is provided.

Invention of Claim 5 provides "The manufacturing method of the printing plate for large area fine pattern printing of Claim 4 in which the said base layer is formed by vapor-depositing or sputtering a metal."

The invention according to claim 6, wherein the base layer is selected from the group comprising: Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn. The manufacturing method of the printing plate for large-area fine-pattern printing formed from the at least 1 sort (s) of metal or alloy containing these metals. "

The invention according to claim 7, wherein the base layer is: a large-area fine pattern to be used as a conductive layer for forming the structural reinforcement portion, with the role of improving adhesion between the photosensitive resin layer and the substrate; The manufacturing method of the printing plate for printing. "Is provided.

The invention according to claim 8, wherein the photosensitive resin layer is formed using any one of a coating method including spin coating and slit coating. The manufacturing method of the printing plate for. "Is provided.

According to the ninth aspect of the present invention, "the photosensitive resin layer according to claim 1 is formed by using any one of a photosensitive material including a photoresist, a dry film resist, and an ultraviolet curable resin. Method for producing a printing plate for printing a large area fine pattern. &Quot;

The invention according to claim 10 provides "The method of manufacturing a printing plate for large-area fine pattern printing according to claim 1, wherein the photosensitive resin layer is formed of a positive or negative photosensitive material.

Invention of Claim 11 provides "The manufacturing method of the printing plate for large-area fine pattern printing of Claim 1 by which the said structural reinforcement part is plated and formed by the electrolytic or electroless-plating process using a conductive material."

The invention according to claim 12, "The production of a printing plate for large-area fine pattern printing according to claim 1, wherein the thickness t1 of the structural reinforcing part is formed smaller than the thickness t2 of the photosensitive resin layer forming the fine pattern. Method.

According to the invention described in claim 13, "The minimum line width (w) of the fine pattern according to claim 1 is: when the thickness of the structural reinforcing portion is t1 and the thickness of the photosensitive resin layer is t2, 0 <t1 <t2 A method of manufacturing a printing plate for printing a large-area fine pattern, wherein the thickness t2 of the photosensitive resin layer is changed according to the line width w of the fine pattern by a formula of −w <40 μm. .

The invention according to claim 14 provides "The method of manufacturing the printing plate for large-area fine pattern printing according to claim 1, wherein the structural reinforcing portion is formed only at a portion where the base layer is formed. ''

The invention according to claim 15, wherein the structure reinforcing portion includes: electrical conductivity containing Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn. The manufacturing method of the printing plate for large-area micropattern printing formed using the at least 1 sort (s) of metal chosen from the group.

In addition, as another means for solving the above-described technical problem, the invention described in claim 16, "In the printing plate for large-area fine pattern printing, a photosensitive resin layer having a pattern formed on a substrate; And a structural reinforcing part formed between the fine patterns of the photosensitive resin layer. ”The printing plate for large-area fine pattern printing.

According to claim 17, "The substrate according to claim 16, wherein the substrate is: a polymer (PC), a polyethylene (polyethylene terephthalate resin), PET (Polymethylmethacrylate), glass, film (Film), metal ( Metal plate). A printing plate for printing a large-area fine pattern formed of any one material from a group including Metal.

The invention according to claim 18 provides the printing plate for printing a large-area fine pattern according to claim 16, wherein the printing plate further comprises an underlayer on which a pattern is formed between the substrate and the photosensitive resin layer.

The invention according to claim 19, wherein the base layer is selected from the group consisting of: Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn. It provides a printing plate for a large-area fine pattern printing formed of at least one metal or an alloy containing these metals.

The invention according to claim 20, wherein the photosensitive resin layer is formed using any one of photosensitive materials including photoresist, dry film resist, and ultraviolet curable resin. Printing plate for printing an area fine pattern. "

The invention according to claim 21 provides "The structure reinforcement part of Claim 16: The printing plate for large-area fine pattern printing formed by plating by the electrolytic or electroless-plating process using a conductive material."

The invention according to claim 22, "The printing plate for large-area fine pattern printing according to claim 16, wherein the thickness t1 of the structural reinforcing portion is smaller than the thickness t2 of the photosensitive resin layer forming the fine pattern. to provide.

According to the invention described in claim 23, "The minimum line width (w) of the fine pattern according to claim 16 is: when the thickness of the structural reinforcing part is t1 and the thickness of the photosensitive resin layer is t2, 0 <t1 <t2 It exists in the range of 1-20 micrometers by the formula of -w <40 micrometer, and the thickness t2 of the said photosensitive resin layer changes with the line width w of the said micropattern. to provide.

The invention as set forth in claim 24, "The structure reinforcing portion of claim 16, wherein the structural reinforcement comprises: electrical conductivity comprising Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn The large-area fine-pattern printing printing plate formed using the at least 1 sort (s) of metal chosen from the group. "Is provided.

Moreover, as another means for solving the above-mentioned technical problem, the invention of Claim 25 is "The printing plate for large area fine pattern printing uses the manufacturing method in any one of Claims 1-15. And a printing plate for printing a large area fine pattern. &Quot;

According to the present invention, it is possible to print the pattern of the micro area that was impossible using the existing printing plate by indirect printing method, thereby making it possible to manufacture electronic circuits and patterns quickly and inexpensively.

In addition, in the case of a printing plate manufacturer, by using the present invention to manufacture a fine pattern that could not be implemented in the existing printing plate it can broaden the application range of the printing plate.

The effects of the present invention are not limited to those mentioned above, and other effects that are not mentioned will be clearly understood by those skilled in the art from the following description.

1A and 1B show a printed electronic printing plate according to an embodiment of the prior art,
1A is a cross-sectional view of a wet etched printing plate,
1B is a cross-sectional view showing a printing error according to the depth of the printing plate.
2A and 2B show a printed electronic printing plate according to another embodiment of the prior art,
2A is a cross-sectional view of a printing plate on which an anisotropic pattern is formed,
Figure 2b is a cross-sectional view showing the appearance of damage according to the depth of the printing plate.
3 to 7 are cross-sectional views illustrating a manufacturing process of a printing plate for printing a large area fine pattern according to a preferred embodiment of the present invention.
8 is a cross-sectional view of a printing plate using a photosensitive resin layer and a structural reinforcing portion.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In order to clearly explain the present invention in the drawings, parts not related to the description are omitted, and similar parts are denoted by similar reference numerals throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Large Area Fine Pattern For printing  Embodiment of the manufacturing method of the printing plate

3 to 7 are cross-sectional views illustrating a manufacturing process of a printing plate for printing a large area fine pattern according to a preferred embodiment of the present invention.

First, as shown in FIG. 3, the substrate 100 is cleaned, and then a base layer 110 is formed on the substrate.

The substrate 100 may have a flat surface and may be enlarged, and may be used as long as the substrate 100 is made of a material having a similar coefficient of thermal expansion to the substrate after being transferred. For example, the substrate 100 may include any one of a group including a polymer including glass carbonate (PC), polyethylene terephthalate resin (PET), and polymethylmethacrylate (PMMA), glass, film, and metal. It is formed of a material. In order to maintain the accuracy of the pattern, the substrate 100 may be selected to have a coefficient of thermal expansion within two times the thermal expansion coefficient of the transfer substrate.

The base layer 110 is formed by depositing or sputtering a metal, and any material that can be used for plating may be used as the material. For example, formed of at least one metal selected from the group consisting of Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn or an alloy containing these metals. can do. The base layer 110 serves to improve adhesion between the photosensitive resin (see 120 of FIG. 5) and the substrate 100 to be formed later, and a conductive layer for forming a structural reinforcement part (see 130 of FIG. 7). Used as

Subsequently, referring to FIG. 4, a pattern is formed on a portion requiring a pattern by using the base layer 110.

Thereafter, as shown in FIG. 5, a photosensitive material is coated on a portion of the base layer 110 on which the pattern is formed and an upper portion of the substrate 100 is exposed to form the photosensitive resin layer 120. The photosensitive resin layer 120 is coated through a conventional coating method. In this case, the conventional coating method is typically spin coating (Spin Coating) and slit coating (Slit Coating), any method that can maintain the coating uniformity can be applied.

The photosensitive resin layer 120 may be a photoresist, a dry film resist, an ultraviolet curable resin, or the like, and the structure of the present invention is not limited to the material. In addition, the photosensitive resin layer 120 may be formed of a positive or negative photosensitive material.

Thereafter, as shown in FIG. 6, a pattern is formed on a portion where a pattern is required using the photosensitive resin layer 120. At this time, the fine pattern formed by using the photosensitive resin layer 120 is formed only in the portion where the base layer 111 is formed.

Finally, as shown in FIG. 7, the structural reinforcement 130 is formed between the fine patterns formed on the base layer 111. In this case, the thickness t1 of the structural reinforcement part 130 may be smaller than the thickness t2 of the photosensitive resin layer forming the fine pattern.

The structural reinforcement unit 130 is formed by a plating method using a conductive material, and the plating may include both electrolytic and electroless plating methods, but it is preferable to use electroless plating. More specifically, the structural reinforcement unit 130 is at least one selected from the group having electrical conductivity including Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn It can be formed by a method such as plating using a metal.

As such, since the structural reinforcement part 130 is formed only at the portion where the base layer 111 is formed, it is possible to selectively reinforce only the fine pattern portion.

8 shows a cross section of a printing plate using a photosensitive resin layer and a structural reinforcing portion.

Referring to FIG. 8, a minimum pattern depth is required even in a fine pattern because pattern shape defects may occur depending on the depth of the printing plate when transferring the ink to the roll using the manufactured printing plate. In this regard, there is a relationship between the thickness t1 of the structural reinforcement 130, the thickness t2 of the photosensitive resin layer 121, and the minimum implementation line width w.

0 <t1 <t2-w <40 µm

Typically, the minimum line width w of the micropattern mentioned in the present invention is present in a range of 1 to 20 μm, and the thickness of the photosensitive resin layer 120 may vary according to the minimum line width w of the micropattern. have.

Large Area Fine Pattern For printing  Embodiment of the printing plate

As shown in FIGS. 7 and 8, the printing plate for large-area fine pattern printing according to the present invention has a pattern formed on a base layer 111 and an upper base layer 111 formed with a pattern on the substrate 100. The photosensitive resin layer 121 and the structural reinforcement part 130 formed between the fine pattern of the photosensitive resin layer 121 are included.

In this case, as described above, the surface of the substrate 100 may be secured and large in size, and may be used if the substrate 100 is made of a material having a similar thermal expansion coefficient to the substrate after being transferred. For example, the polymer may be formed of any one of a polymer including glass (carbonate), film (film) and metal (metal) including polycarbonate (PC), polyethylene terephthalate resin (PET) and polymethylmethacrylate (PMMA). have.

The base layer 111 includes at least one metal selected from the group consisting of Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn or these metals. The photosensitive resin layer 121 may be formed of an alloy, and may be formed using any one of photosensitive materials including photoresist, dry film resist, and ultraviolet curable resin.

The structural reinforcement part 130 is formed by plating by an electrolytic or electroless plating process using a conductive material, and the thickness t1 of the structural reinforcement part 130 is formed of the photosensitive resin layer 121 forming the fine pattern. It is preferable to form smaller than thickness t2.

The structural reinforcement unit 130 includes at least one metal selected from the group having electrical conductivity including Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, and Zn. It can be formed by a method such as plating.

The printing plate for the large-area micropattern printer and the manufacturing method thereof according to the present invention configured as described above are formed by patterning a photosensitive resin layer on a base layer of a substrate and forming a structural reinforcement part using a conductive material in the micropattern, The problem can be solved.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong.

Therefore, it should be understood that the present invention is not limited to these combinations and modifications. In addition, the above description has been made with reference to the embodiments, which are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains may be illustrated in the above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

The printing plate for a large-area micropattern printer and a manufacturing method thereof according to the present invention have been described using LED packages as an example, but the present invention is not limited thereto.

100 substrate 110 base layer
111: base layer with pattern 120: photosensitive resin layer
121: photosensitive resin layer formed pattern 130: structural reinforcement

Claims (25)

(a) forming a photosensitive resin layer on the substrate;
(b) patterning the photosensitive resin layer to form a fine pattern; And
(c) forming a structural reinforcement part of the conductive material between the fine patterns;
Method of manufacturing a printing plate for large-area fine pattern printing comprising a.
The method of claim 1, wherein the substrate is:
Large-area micropattern printing formed of any one of a group including polymers including glass carbonate, polyethylene terephthalate resin (PET) and polymethylmethacrylate (PMMA), and glass, film, and metal Method for producing a printing plate for
The method of claim 1, wherein the substrate is:
A method of manufacturing a printing plate for printing a large area fine pattern, which has a coefficient of thermal expansion within two times the thermal expansion coefficient of the transfer substrate in order to maintain the accuracy of the pattern.
The method of claim 1, wherein the printing plate is manufactured by:
And forming the photosensitive resin layer on the substrate, and then patterning the underlayer and the photosensitive resin layer simultaneously to form a fine pattern.
The method of claim 4, wherein the underlayer is:
A manufacturing method of a printing plate for printing a large area fine pattern formed by depositing or sputtering a metal.
The method of claim 4, wherein the underlayer is:
Large area fine formed of at least one metal selected from the group consisting of Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn or alloys containing these metals The manufacturing method of the printing plate for pattern printing.
The method of claim 4, wherein the underlayer is:
A method of manufacturing a printing plate for large-area fine pattern printing, used as a conductive layer for forming the structural reinforcement part, together with a role of improving adhesion between the photosensitive resin layer and the substrate.
The method of claim 1, wherein the photosensitive resin layer is:
A method of manufacturing a printing plate for printing a large area fine pattern formed using any one of a coating method including spin coating and slit coating.
The method of claim 1, wherein the photosensitive resin layer is:
A method of manufacturing a printing plate for printing a large area fine pattern using any one of photosensitive materials including photoresist, dry film resist, and ultraviolet curable resin.
The method of claim 1, wherein the photosensitive resin layer is:
A method of manufacturing a printing plate for printing a large-area fine pattern formed of a positive or negative photosensitive material.
The method of claim 1 wherein the structural reinforcement is:
A manufacturing method of a printing plate for large-area fine pattern printing, which is formed by plating by electrolytic or electroless plating using a conductive material.
The method of claim 1,
The thickness t1 of the structural reinforcing part is smaller than the thickness t2 of the photosensitive resin layer forming the fine pattern.
The method of claim 1, wherein the minimum line width w of the fine pattern is:
When the thickness of the structural reinforcement part is t1 and the thickness of the photosensitive resin layer is t2,
It exists in the range of 1-20 micrometers by the formula of 0 <t1 <t2-w <40micrometer,
The thickness t2 of the said photosensitive resin layer is a manufacturing method of the printing plate for large area fine pattern printing which changes according to the line width (w) of the said fine pattern.
5. The structural reinforcement part of claim 4 wherein:
The manufacturing method of the printing plate for large area fine pattern printing formed only in the part in which the said base layer was formed.
The method of claim 1 wherein the structural reinforcement is:
Large area micropattern formed using at least one metal selected from the group having electrical conductivity including Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn The manufacturing method of the printing plate for printing.
In the printing plate for large area fine pattern printing,
A photosensitive resin layer having a pattern formed on the substrate; And
A structural reinforcement part formed of a conductive material between the fine patterns of the photosensitive resin layer;
Printed plate for printing a large area fine pattern comprising a.
The method of claim 16, wherein the substrate is:
For printing large-area micropatterns formed of any one of a group of polymers including glass carbonate, film, film, and metal, including polycarbonate (PC), polyethylene terephthalate resin (PET), and polymethylmethacrylate Printing edition.
The method of claim 16, wherein the printing plate is:
The printing plate for large-area fine pattern printing, further comprising a base layer having a pattern formed between the substrate and the photosensitive resin layer.
19. The method of claim 18, wherein the underlayer is:
Large area micropattern formed of at least one metal selected from the group consisting of Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn or alloys containing these metals Printing plate for printing.
The method of claim 16, wherein the photosensitive resin layer is:
A printing plate for printing a large area fine pattern formed by using any one of photoresist, photoresist, dry film resist, and ultraviolet curable resin.
The method of claim 16, wherein the structural reinforcement:
A printing plate for printing a large area fine pattern formed by plating by an electrolytic or electroless plating process using a conductive material.
17. The method of claim 16,
And a thickness t1 of the structural reinforcement part is smaller than a thickness t2 of the photosensitive resin layer forming the fine pattern.
The method of claim 16, wherein the minimum line width w of the fine pattern is:
When the thickness of the structural reinforcement part is t1 and the thickness of the photosensitive resin layer is t2,
It exists in the range of 1-20 micrometers by the formula of 0 <t1 <t2-w <40micrometer,
The printing plate for printing a large area fine pattern, wherein the thickness t2 of the photosensitive resin layer is changed according to the line width w of the fine pattern.
The method of claim 16, wherein the structural reinforcement:
Large-area micropattern printing formed using at least one metal selected from the group having electrical conductivity including Cu, Ag, Ni, Au, Al, Cr, Ru, Re, Pb, Cr, Sn, In, Zn Dragon Edition.
In the printing plate for large area fine pattern printing,
The printing plate for large-area fine pattern printing formed using the manufacturing method in any one of Claims 1-15.

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