KR101231110B1 - Vitrified bond grindstone and manufacturing process thereof - Google Patents

Abstract

An object of the present invention is that even a difficult material does not need to be frequently dressed, so that it can be efficiently ground and the quality of the workpiece is not degraded. And, while at the same time by at least impregnated with the non-tree vitrified bond material and organic bond material and abrasive sponge member a liquid abrasive kneading a liquid formed of a resin composed mainly of SiO _2, the oxidation of organic bonding material and the sponge member, The whetstone particles are sintered with a non-bonded bond material to form a non-fine bonded whetstone having pores. Since pores tend to cause spontaneous action, productivity is not required because dressing is often required, and the grinding surface of the workpiece is not burned or damaged, thereby improving the quality of the workpiece.

Grinding, Bit-Refined Bond, Sharpener

Description

VITRIFIDED BOND GRINDSTONE AND MANUFACTURING PROCESS THEREOF}

1 is a perspective view showing a sponge member.

2 is a perspective view showing a state in which the sponge member is immersed in flowable grindstone particles.

It is a perspective view which shows the state which shape | molds a sintered compact.

Fig. 4 is a perspective view showing a grinding wheel having a fixed segment shaped bite bonded grinding wheel.

It is a perspective view which shows the grinding apparatus which mounts the said grinding wheel.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a vitrified bond whetstone having a good self-sharpening effect and a method of manufacturing the same.

Wafers in which a plurality of devices such as ICs and LSIs are formed on a surface thereof are ground to a predetermined thickness and then divided into individual devices by a dicing apparatus or the like. The divided devices are used in various electronic devices.

The wafer to be ground is formed of silicon, silicon nitride, gallium arsenide, sapphire, lithium tantalate, silicon carbide, or the like. On the other hand, grinding grindstones include non-bonded grindstones, resin-bonded grindstones, metal-bonded grindstones, etc. Among them, grindstones suitable for the material of the wafer are selected and used for grinding. Since silicon nitride, sapphire, and silicon carbide have a high hardness, when grinding wafers formed by these materials, whetstones having a firmly held diamond whetstone such as non-refined bonded grindstone or metal bonded grindstone are used. . Such a technique is described in Japanese Patent Laid-Open No. 2003-136410.

However, since the spontaneous action hardly occurs on the whetstone of the structure in which the grindstone particles are firmly held by the non-refined bond or the metal bond, the hole is blocked in a relatively short time, and thus frequent dressing is required, and continuous operation is difficult. There is a problem of low productivity. On the other hand, the spontaneous action refers to the action that the grinding wheel particles become worn out during use and the new grinding particles come out next.

In addition, since the spontaneous action hardly occurs, the grinding surface of the workpiece is burned or small defects are generated, which causes a problem of degrading the quality of the workpiece.

Therefore, the problem to be solved by the present invention is that even a difficult-to-cut material is efficiently ground without frequent dressing, so as not to degrade the quality of the workpiece.

The first invention is a bitless bonded grindstone having pores, in which a non-refined bond material composed of at least SiO ₂ , an organic bond material, a flowable grindstone obtained by kneading a grindstone particle and a liquid is made of a resin. The member is impregnated to oxidize the organic bond material and the sponge member, and the grindstone particles are sintered with the non-lipid bond material.

The second invention is a manufacturing method of a non-tree vitrified bonded grinding wheel having a porosity, at least in kneading the non-tree vitrified bond material and organic bond material and abrasive with a liquid composed mainly of SiO ₂ to form a liquid abrasive, pore An impregnated sponge forming step of forming an impregnated sponge body by impregnating the fluidized grindstone particles into a sponge member formed of a resin having a resin; and a solidifying step of evaporating the liquid constituting the impregnated sponge body and solidifying an organic bond material. And a sintering step of sintering the subsequent impregnated sponge body to oxidize the organic bond material and the sponge member, and sintering the grindstone particles with the non-lipid bond material to form a sintered body having pores.

In the impregnated sponge body forming step, the grindstone particles are preferably formed by mixing green carborundum and white alundum filler into diamond grindstone particles having a particle diameter of 2 µm or less. In the impregnated sponge body forming step, the liquid is preferably composed of 55% by weight of water and 10% by weight of alcohol, and the organic bond material is preferably 5% by weight of acrylic bond material.

In the solidification step, it is preferable that the impregnated bond body is heated at 50 ° C for 2 hours to evaporate the liquid, and the organic bond material is heated at 120 ° C for 2 hours to sinter.

In the sintering step, it is preferable that the impregnated sponge body after the solidification step is sintered at 400 ° C for 1 hour to oxidize the organic bond material and the sponge member, and to be sintered at 700 ° C for 4 hours to form a sintered body.

After a sintering process, a sintered compact may be cut and shape | molded by a cutting blade, and may be used as the grindstone fixed to a grinding wheel.

EMBODIMENT OF THE INVENTION Hereinafter, one Example of this invention is described, referring drawings.

First, fluidized grindstone particles are formed by kneading a liquid such as a non-bonded bond material composed mainly of SiO ₂ , an organic bond material composed of an acrylic resin, or the like, whetstone particles, and a liquid. Examples of the grindstone particles include diamond grindstone particles. In the fluid grindstone particles, fillers such as green carborundum (green silicon carbide) and white alumderm (white alumina) may be further mixed. Liquids include water and alcohols.

As shown in FIG. 1, a sponge body (hereinafter referred to as an impregnated sponge body) impregnated with the flowable grindstone particles is formed in a sponge member 1 having pores and formed of synthetic resin such as urethane (impregnated sponge). Sieve formation process). For example, as shown in FIG. 2, the fluid grindstone particles 2 are collected in the container 3, and the sponge member 1 is immersed in the fluid grindstone particles 2 to thereby form the fluid grindstone in the sponge member 1. Impregnate the particles. The flowable grindstone particles have fluidity, and since the sponge member 1 has pores to every corner of the inside, the flowable grindstone particles can penetrate to every corner of the pores, so that the flowable grindstone particles evenly spread to the inside. .

On the other hand, although the sponge member 1 is a thin plate-shaped rectangular parallelepiped shape, since it becomes substantially circular of the bite of the bonded bond grindstone formed later, it is preferable to form it in the shape of a desired grindstone or the shape which is easy to process.

Subsequently, the liquid constituting the sponge member 1 impregnated with the fluid grindstone particles 2 is evaporated by heating, and then the organic substance bond material contained in the impregnated sponge body is solidified again (solidification step). By solidifying the organic bond material, the organic bond material binds the whetstone particles to the sponge member 1 so that the whetstone particles do not fall from the sponge member 1. Further, the liquid is evaporated by the solidification step to sinter the impregnated sponge body in which the organic bond material is solidified. As a result, a sintered body having pores is formed, and the sintered body becomes a bite-bonded grinding wheel.

For example, as shown in FIG. 3, the formed non-bonded grinding wheel 4 cuts the cutting blade 5 which rotates at high speed horizontally along the some cutting line 6, and forms it as an individual rectangular piece. It is shaped, and it becomes the several segment shaped bite bond grinding wheel 7.

The plurality of segmented bite-bonded grindstones 7 are arranged in a substantially annular shape on the lower surface of the grinding wheel 814 shown in FIG. And the grinding wheel 814 is used for the grinding apparatus 8 shown in FIG. 5, for example.

This grinding apparatus 8 is provided with the chuck table 80 hold | maintained in a to-be-processed object, and the grinding means 81 which grinds the to-be-processed object held by the chuck table 80. FIG. The grinding means 81 is rotatably supported by the housing 810 so that the motor 812 is connected to the upper end of the spindle 811 having an axis in the vertical direction, and a wheel mount installed at the lower end of the spindle 811 ( The grinding wheel 814 is attached to 813. As described above, the grinding wheel 814 is fixed in plural segment shape non-bonded grinding wheels 7, and the grinding wheel 814 is also rotated by the rotation of the motor 812.

The housing 810 is supported by a support portion 821 connected to the elevating plate 820, and the elevating plate 820 is slidably connected to the guide rail 822 installed in the vertical direction, and has an internal nut (not shown). ) Is screwed into the ball screw 823 installed in the vertical direction. One end of the ball screw 823 is connected to the pulse motor 824. As the ball screw 823 rotates by the rotation of the pulse motor 824, the lifting plate 820 is guided to the guide rail 822 to move up and down. As the elevating plate 820 moves up and down, the grinding means 81 also moves up and down.

When grinding the back surface of the wafer W to which the device protective protective tape T adhere | attached on the surface side as shown in the example shown in figure, the surface W to which the protective tape T adhere | attached is facing downward, and the wafer W Is held in the chuck table 80. Then, the chuck table 80 moves in the horizontal direction and is located directly under the grinding means 81, the chuck table 80 rotates, and the grinding wheel 81 rotates while the grinding means 81 descends. As a result, the rotating segmented bite-bonded grinding wheel 7 contacts the back surface of the wafer W, and the back surface is ground.

Since the segmented bite-bonded grindstone 7 is formed by impregnating fluid grindstone particles with a sponge member and sintering, a plurality of pores are formed therein. Therefore, the blockage of the pores is prevented, and the abrasive grains are likely to fall off, and the spontaneous spontaneous action is good. Thus, even when the wafer W is formed of a difficult material such as sapphire or silicon carbide, it can be efficiently ground. . In addition, since the spontaneous action is good, burned surfaces of the wafer do not burn, small defects or the like do not occur, and the quality of the wafer can be improved.

In addition, in the case of the self grind which grinds the chuck table 80, and coincides with the upper surface of the chuck table 80 and the lower surface (grinding surface) of the segment-shaped bitified bond grinding wheel 7, the chuck table ( Even if 80) is formed of a hard-cutting material such as silicon carbide, the chuck table 80 can be efficiently ground.

(Example)

Hereinafter, the example of the manufacturing method of a bitless bonded grinding wheel is shown. First, in the impregnated sponge body forming process, 35% diamond grindstone particles having a particle diameter of 2 μm or less, 5% fillers such as green carborundum and white alumder, and a non-liquid bond material composed mainly of SiO ₂ were used as the volume ratios. Kneading at a rate of 60% yields a powder mixture of 30% by weight. The powdered kneaded product having a weight ratio of 30% was kneaded with 5% acrylic bond material (organic bond material), 55% water by weight, and 10% alcohol by weight to form fluid grindstone particles having a weight ratio of 100%. The fluid grindstone particles are impregnated into the sponge member 1 to obtain an impregnated sponge body.

Subsequently, in the solidification step, the impregnated sponge body is heated at 50 ° C. for 2 hours to evaporate water and water. And an acrylic bond material is solidified by heating at 120 degreeC for 1 hour.

In the sintering step, the impregnated sponge body after the solidification step is heated at 400 ° C. for 1 hour to oxidize the organic bond material and the sponge member. Furthermore, it sinters at 700 degreeC for 4 hours, and forms a sintered compact. This sintered compact becomes a vitrified bond whetstone.

As described above, since the non-bonded grinding wheel of the present embodiment is sintered at low temperature, there is an effect that the inherent performance of the grinding wheel particles is easily exhibited.

In the present invention, by impregnating and sintering the fluid grindstone particles in the sponge member, since the non-bonded grindstone having pores therein is formed, the grindstone particles easily fall off due to the pores, and the spontaneous action is likely to occur. Therefore, clogging of holes is unlikely to occur and dressing does not need to be frequent, so that even a difficult material can be ground efficiently. In addition, since the spontaneous action is good, the grinding surface of the workpiece is not burned or a defect does not occur, and the quality of the workpiece can be improved.

Claims (7)

As a non-refined bond whetstone with pores, Flowable grindstone particles obtained by kneading an organic bond material, a whetstone particle, a liquid, and a non-lipid bond material composed mainly of SiO ₂ are impregnated into a sponge member formed of a resin to oxidize the organic bond material and the sponge member. A non-bonded abrasive grindstone obtained by sintering whetstone particles with the non-bonded bond material. As a method of manufacturing a non-refined bonded whetstone having pores, The organic bond material, the grindstone particles, the liquid, and the vitrified bond material containing SiO ₂ as a main component are kneaded to form flowable grindstone particles, and the impregnated sponge body is formed by impregnating the flowable grindstone particles into a sponge member formed of a resin having pores. An impregnated sponge body forming step to constitute; A solidification step of evaporating the liquid constituting the impregnated sponge body and solidifying the organic bond material; A sintering process comprising a sintering process of sintering the impregnated sponge body after the solidification process to oxidize the organic bond material and the sponge member, and sintering the whetstone particles with the bitless bond material to form a sintered body having pores. Process for the preparation of a bonded bond grinding wheel. The method of claim 2, In the impregnated sponge body forming process, the whetstone particle is a method of manufacturing a bit bonded bond whetstone, wherein green carborundum and white alumder filler are mixed into diamond whetstone particles having a particle diameter of 2 μm or less. delete The method of claim 2, In the solidification step, the impregnated bond body is heated at 50 ° C. for 2 hours to evaporate the liquid, and the organic bond material is heated at 120 ° C. for 2 hours for sintering. The method of claim 2, In the sintering step, the impregnated sponge body after the solidification step is sintered at 400 ° C. for 1 hour to oxidize the organic bond material and the sponge member, and the sintered body is sintered at 700 ° C. for 4 hours to form a bitless bonded whetstone. Way. The method of claim 2, A method for producing a bite bonded bond grindstone, in which, after the sintering step, the sintered body is cut with a cutting blade and shaped to form a grindstone fixed to a grinding wheel.

Images