KR101159639B1 - 일체형 광센서 패키지 - Google Patents
일체형 광센서 패키지 Download PDFInfo
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- KR101159639B1 KR101159639B1 KR1020120042095A KR20120042095A KR101159639B1 KR 101159639 B1 KR101159639 B1 KR 101159639B1 KR 1020120042095 A KR1020120042095 A KR 1020120042095A KR 20120042095 A KR20120042095 A KR 20120042095A KR 101159639 B1 KR101159639 B1 KR 101159639B1
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- 230000003287 optical effect Effects 0.000 claims abstract description 36
- 238000005286 illumination Methods 0.000 claims abstract description 17
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- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000007257 malfunction Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
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- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000003199 nucleic acid amplification method Methods 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
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Abstract
Description
도 2는 본 발명에 따른 일체형 광센서 패키지를 도시한 측면도,
도 3은 본 발명에 따른 일체형 광센서 패키지를 도시한 내측 평면도,
도 4는 본 발명에 따른 일체형 광센서 패키지를 도시한 단면도이다.
21 : 제1실장부 22 : 제2실장부
23 : 제3실장부 24 : 제4실장부
30 : 조도센서 40 : 리모콘센서부
41, 41' : 리모콘소자 42 : 증폭소자
43 : 실드케이스 44 : 렌즈
441 : 제1렌즈 442 : 제2렌즈
Claims (5)
- IR대역의 광신호를 수신하여 전기적신호로 변환시켜 출력하는 하나 이상의 리모콘소자를 구비한 리모콘센서부;
가시광대역의 광신호를 수신하여 전기적신호로 변환시켜 출력하는 조도센서;
상기 리모콘소자와 조도센서가 각각 실장되는 하나 이상의 실장부가 구성되고, 상기 리모콘소자와 조도센서에서 출력되는 전기적신호를 외측으로 출력하는 하나 이상의 출력단자가 구비되는 리드프레임; 및
상기 리모콘센서부와 조도센서를 내측에 수용하도록 외관을 형성하는 하우징을 포함하고,
상기 리모콘소자는 IR대역만을 투과하고 그 이외의 광을 차단하는 IR코팅제가 코팅되고,
상기 조도센서는 가시광대역만을 투과시키고, 그 이외의 광을 차단하는 가시광코팅제가 코팅되는 것을 특징으로 하는 일체형 광센서 패키지. - 제1항에 있어서, 상기 리모콘센서부는
상기 하우징의 상면에서 상방으로 돌출되어 IR 대역의 광을 투과시키는 하나 이상의 렌즈와, 상기 하우징의 내측에서 외란광 및 전자파를 차폐시키는 실드케이스와, 상기 리모콘소자에서 출력된 전기적 신호를 증폭시키는 증폭소자를 더 포함하는 것을 특징으로 하는 일체형 광센서 패키지. - 제1항에 있어서, 상기 리드프레임은
상기 리모콘소자와 조도센서가 각각 실장되는 하나 이상의 실장부와, 상기 하나 이상의 실장부와 본딩되어 전기적신호를 외측으로 출력하는 하나 이상의 출력단자를 포함하되,
상기 출력단자는 상기 하우징의 전면에서 돌출되어 하면과 평행하도록 하향 절곡되어 연장되도록 형성되는 것을 특징으로 하는 일체형 광센서 패키지. - 제1항에 있어서, 상기 일체형 광센서 패키지는
표면 실장형인 것을 특징으로 하는 일체형 광센서 패키지. - 제1항에 있어서, 상기 하우징은
상기 조도센서의 직상방에 해당되는 위치의 상면에서 상방으로 돌출되는 볼록형의 렌즈를 더 포함하는 것을 특징으로 하는 일체형 광센서 패키지.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120042095A KR101159639B1 (ko) | 2012-04-23 | 2012-04-23 | 일체형 광센서 패키지 |
CN201280035055.5A CN103649697B (zh) | 2012-04-23 | 2012-07-17 | 一体型光传感器组件 |
JP2014520144A JP2014523140A (ja) | 2012-04-23 | 2012-07-17 | 一体型光センサーパッケージ |
US14/232,782 US10224352B2 (en) | 2012-04-23 | 2012-07-17 | Integral optical sensor package |
PCT/KR2012/005683 WO2013162125A1 (ko) | 2012-04-23 | 2012-07-17 | 일체형 광센서 패키지 |
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KR1020120042095A KR101159639B1 (ko) | 2012-04-23 | 2012-04-23 | 일체형 광센서 패키지 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101248878B1 (ko) | 2012-06-19 | 2013-04-02 | 이현영 | 일체형 광센서 패키지 |
WO2014077485A1 (ko) * | 2012-11-16 | 2014-05-22 | 레이트론(주) | 투명하우징을 이용한 광센서 패키지 |
KR20160104781A (ko) * | 2015-02-26 | 2016-09-06 | 주식회사원광전자 | 커넥터 일체형 광센서 패키지 및 그 제조 방법 |
US9666503B2 (en) | 2013-03-11 | 2017-05-30 | Samsung Electronics Co., Ltd. | Semiconductor package and electronic system including the same |
KR101914542B1 (ko) | 2017-10-16 | 2018-12-28 | (주)파트론 | 이미지센서 패키지 |
KR101911854B1 (ko) * | 2017-03-08 | 2018-12-28 | 레이트론(주) | 다중 주파수를 수신 가능한 외란광 감지 센서 내장형 리모콘 패키지 |
KR102005523B1 (ko) * | 2018-09-12 | 2019-07-30 | 레이트론(주) | 광센서 패키지 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08159871A (ja) * | 1994-12-04 | 1996-06-21 | Horiba Ltd | 焦電型赤外線検出器 |
JP2001264161A (ja) | 2000-03-17 | 2001-09-26 | Niles Parts Co Ltd | 光センサの構造 |
KR100564947B1 (ko) | 2004-09-25 | 2006-03-30 | (주)원반도체 | 적외선 수신 모듈 및 이의 제조 방법 |
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2012
- 2012-04-23 KR KR1020120042095A patent/KR101159639B1/ko active IP Right Review Request
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08159871A (ja) * | 1994-12-04 | 1996-06-21 | Horiba Ltd | 焦電型赤外線検出器 |
JP2001264161A (ja) | 2000-03-17 | 2001-09-26 | Niles Parts Co Ltd | 光センサの構造 |
KR100564947B1 (ko) | 2004-09-25 | 2006-03-30 | (주)원반도체 | 적외선 수신 모듈 및 이의 제조 방법 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101248878B1 (ko) | 2012-06-19 | 2013-04-02 | 이현영 | 일체형 광센서 패키지 |
WO2014077485A1 (ko) * | 2012-11-16 | 2014-05-22 | 레이트론(주) | 투명하우징을 이용한 광센서 패키지 |
KR101430713B1 (ko) * | 2012-11-16 | 2014-08-14 | 레이트론(주) | 투명하우징을 이용한 광센서 패키지 |
US9666503B2 (en) | 2013-03-11 | 2017-05-30 | Samsung Electronics Co., Ltd. | Semiconductor package and electronic system including the same |
KR20160104781A (ko) * | 2015-02-26 | 2016-09-06 | 주식회사원광전자 | 커넥터 일체형 광센서 패키지 및 그 제조 방법 |
KR101681051B1 (ko) * | 2015-02-26 | 2016-12-01 | 주식회사원광전자 | 커넥터 일체형 광센서 패키지 및 그 제조 방법 |
KR101911854B1 (ko) * | 2017-03-08 | 2018-12-28 | 레이트론(주) | 다중 주파수를 수신 가능한 외란광 감지 센서 내장형 리모콘 패키지 |
KR101914542B1 (ko) | 2017-10-16 | 2018-12-28 | (주)파트론 | 이미지센서 패키지 |
KR102005523B1 (ko) * | 2018-09-12 | 2019-07-30 | 레이트론(주) | 광센서 패키지 제조방법 |
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