KR101155816B1 - 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 - Google Patents
3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 Download PDFInfo
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- KR101155816B1 KR101155816B1 KR1020097024679A KR20097024679A KR101155816B1 KR 101155816 B1 KR101155816 B1 KR 101155816B1 KR 1020097024679 A KR1020097024679 A KR 1020097024679A KR 20097024679 A KR20097024679 A KR 20097024679A KR 101155816 B1 KR101155816 B1 KR 101155816B1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2545—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with one projection direction and several detection directions, e.g. stereo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S5/00—Position-fixing by co-ordinating two or more direction or position line determinations; Position-fixing by co-ordinating two or more distance determinations
- G01S5/16—Position-fixing by co-ordinating two or more direction or position line determinations; Position-fixing by co-ordinating two or more distance determinations using electromagnetic waves other than radio waves
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T1/00—General purpose image data processing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/55—Depth or shape recovery from multiple images
- G06T7/593—Depth or shape recovery from multiple images from stereo images
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/46—Indirect determination of position data
- G01S17/48—Active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/04—Indexing scheme for image data processing or generation, in general involving 3D image data
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/24—Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
- G06T2207/10012—Stereo images
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20092—Interactive image processing based on input by user
- G06T2207/20104—Interactive definition of region of interest [ROI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Electromagnetism (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-177616 | 2005-06-17 | ||
JP2005177616 | 2005-06-17 | ||
PCT/JP2006/312099 WO2006135040A1 (fr) | 2005-06-17 | 2006-06-16 | Dispositif et procédé de traitement d'image effectuant une mesure tridimensionnelle |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067026852A Division KR20070088318A (ko) | 2005-06-17 | 2006-06-16 | 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100017396A KR20100017396A (ko) | 2010-02-16 |
KR101155816B1 true KR101155816B1 (ko) | 2012-06-12 |
Family
ID=37532393
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067026852A KR20070088318A (ko) | 2005-06-17 | 2006-06-16 | 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 |
KR1020097024679A KR101155816B1 (ko) | 2005-06-17 | 2006-06-16 | 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067026852A KR20070088318A (ko) | 2005-06-17 | 2006-06-16 | 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8233041B2 (fr) |
EP (1) | EP1788345B1 (fr) |
JP (1) | JP4811272B2 (fr) |
KR (2) | KR20070088318A (fr) |
CN (1) | CN100460807C (fr) |
WO (1) | WO2006135040A1 (fr) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4774824B2 (ja) * | 2005-06-17 | 2011-09-14 | オムロン株式会社 | 3次元計測処理の計測対象範囲の確認方法および計測対象範囲の設定方法ならびに各方法を実施する装置 |
JP4888013B2 (ja) * | 2006-09-28 | 2012-02-29 | 富士通株式会社 | 高さ制限算出装置、高さ制限算出方法および高さ制限算出プログラム |
US8497901B2 (en) * | 2007-04-03 | 2013-07-30 | Hexagon Metrology Ab | Method and device for exact measurement of objects |
JP4492654B2 (ja) * | 2007-08-29 | 2010-06-30 | オムロン株式会社 | 3次元計測方法および3次元計測装置 |
JP4935606B2 (ja) * | 2007-09-28 | 2012-05-23 | オムロン株式会社 | 撮像システム |
KR100941978B1 (ko) * | 2008-02-26 | 2010-02-11 | 울산대학교 산학협력단 | 씨씨디 카메라와 레이저 빔을 이용한 물체의 3차원위치정보 측정방법 및 장치 |
CN101960253B (zh) | 2008-02-26 | 2013-05-01 | 株式会社高永科技 | 三维形状测量装置及测量方法 |
BRPI0913037A2 (pt) * | 2008-05-22 | 2015-10-13 | Matrix Electronic Measuring L P | sistema e método de medição estereoscópica |
DE102009040649A1 (de) * | 2008-09-11 | 2010-05-20 | Schott Ag | Verfahren und Vorrichtung zur Erzeugung von digitalen Einzelbildern von scheibenförmigen Elementen in einem Herstellungsprozess |
JP5353154B2 (ja) * | 2008-09-25 | 2013-11-27 | オムロン株式会社 | 画像処理装置およびそれにおける画像処理方法 |
CN101729737B (zh) * | 2008-10-29 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 影像校正系统及方法 |
JP2010210585A (ja) * | 2009-03-12 | 2010-09-24 | Omron Corp | 3次元視覚センサにおけるモデル表示方法および3次元視覚センサ |
JP5257375B2 (ja) * | 2009-03-13 | 2013-08-07 | オムロン株式会社 | 画像処理装置および画像処理方法 |
CN101887030A (zh) * | 2009-05-15 | 2010-11-17 | 圣戈本玻璃法国公司 | 用于检测透明基板表面和/或其内部的缺陷的方法及系统 |
US9533418B2 (en) * | 2009-05-29 | 2017-01-03 | Cognex Corporation | Methods and apparatus for practical 3D vision system |
JP5392731B2 (ja) * | 2009-10-05 | 2014-01-22 | 川崎重工業株式会社 | 超音波探傷検査の判定支援装置、判定支援方法、判定支援プログラム、及び該判定支援プログラムを記録したコンピュータ読取可能な記録媒体 |
JP5476943B2 (ja) * | 2009-11-20 | 2014-04-23 | オムロン株式会社 | 姿勢認識方法およびこの方法を用いた3次元視覚センサ |
JP5257335B2 (ja) * | 2009-11-24 | 2013-08-07 | オムロン株式会社 | 3次元視覚センサにおける計測有効領域の表示方法および3次元視覚センサ |
JP5713159B2 (ja) * | 2010-03-24 | 2015-05-07 | 独立行政法人産業技術総合研究所 | ステレオ画像による3次元位置姿勢計測装置、方法およびプログラム |
JP5018980B2 (ja) * | 2010-04-08 | 2012-09-05 | カシオ計算機株式会社 | 撮像装置、長さ測定方法、及びプログラム |
JP5365645B2 (ja) * | 2011-01-17 | 2013-12-11 | オムロン株式会社 | 基板検査装置および基板検査システムならびに基板検査結果の確認用画面の表示方法 |
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JP2012187651A (ja) * | 2011-03-09 | 2012-10-04 | Omron Corp | 画像処理装置および画像処理システム、ならびにそれらに向けられたガイダンス装置 |
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CN102628693A (zh) * | 2012-04-16 | 2012-08-08 | 中国航空无线电电子研究所 | 一种用于摄像机主轴与激光束进行平行配准的方法 |
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JP6198312B2 (ja) * | 2013-09-30 | 2017-09-20 | Jukiオートメーションシステムズ株式会社 | 3次元測定装置、3次元測定方法および基板の製造方法 |
JP6303867B2 (ja) * | 2014-06-27 | 2018-04-04 | オムロン株式会社 | 基板検査装置及びその制御方法 |
US9885563B2 (en) | 2014-10-10 | 2018-02-06 | Georgia Tech Research Corporation | Dynamic digital fringe projection techniques for measuring warpage |
US10334209B2 (en) * | 2015-12-17 | 2019-06-25 | Nike, Inc. | Image stitching for footwear component processing |
CN107328331B (zh) * | 2017-08-25 | 2023-05-23 | 郑州市质量技术监督检验测试中心 | 基于视觉的分布式钢直尺检定装置及其方法 |
DE102017009153B4 (de) * | 2017-09-29 | 2021-12-09 | Baumer Inspection Gmbh | Anordnung und Verfahren zur Inspektion von bewegten plattenförmigen Objekten |
CN109118480B (zh) * | 2018-07-26 | 2021-01-05 | 北京东软医疗设备有限公司 | 一种调节方法及装置 |
WO2020067168A1 (fr) | 2018-09-28 | 2020-04-02 | パナソニックIpマネジメント株式会社 | Dispositif et procédé de mesure |
DE102020101191A1 (de) * | 2020-01-20 | 2021-07-22 | Carl Zeiss Microscopy Gmbh | Mikroskop und Verfahren zum Ermitteln eines Messortes eines Mikroskops |
CN112082481B (zh) * | 2020-09-09 | 2022-04-19 | 易思维(杭州)科技有限公司 | 用于检测螺纹特征的视觉检测系统的精度评价方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1137736A (ja) * | 1997-05-20 | 1999-02-12 | Ricoh Co Ltd | 3次元形状計測方法及び3次元形状計測装置 |
JP2004046772A (ja) * | 2002-05-13 | 2004-02-12 | 3D Media Co Ltd | 画像処理方法、画像処理システム、及び画像処理装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4972494A (en) * | 1988-02-26 | 1990-11-20 | R. J. Reynolds Tobacco Company | Package inspection system |
NO178909C (no) * | 1993-04-19 | 1996-06-26 | Toni Rydningen | Måleanordning |
JP3855244B2 (ja) * | 1996-08-09 | 2006-12-06 | 株式会社テクノホロン | 顕微鏡を用いた3次元画像認識装置 |
JP3995030B2 (ja) | 1996-09-17 | 2007-10-24 | コグネックス・テクノロジー・アンド・インベストメント・コーポレーション | 半導体パッケージの検査装置 |
US6064759A (en) * | 1996-11-08 | 2000-05-16 | Buckley; B. Shawn | Computer aided inspection machine |
JPH10143660A (ja) * | 1996-11-11 | 1998-05-29 | Hitachi Ltd | 欠陥判定処理方法およびその装置 |
US6084663A (en) * | 1997-04-07 | 2000-07-04 | Hewlett-Packard Company | Method and an apparatus for inspection of a printed circuit board assembly |
US6118540A (en) * | 1997-07-11 | 2000-09-12 | Semiconductor Technologies & Instruments, Inc. | Method and apparatus for inspecting a workpiece |
US5978521A (en) * | 1997-09-25 | 1999-11-02 | Cognex Corporation | Machine vision methods using feedback to determine calibration locations of multiple cameras that image a common object |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
JPH11237210A (ja) * | 1998-02-19 | 1999-08-31 | Komatsu Ltd | 半導体パッケージの検査装置 |
JPH11259658A (ja) | 1998-03-11 | 1999-09-24 | Omron Corp | 物体認識方法およびその方法を用いた物体認識装置,車輌認識方法,車輌認識装置 |
GB9828109D0 (en) | 1998-12-19 | 1999-02-17 | Kestra Ltd | Inspection equipment and methods of inspection |
JP2000269700A (ja) | 1999-03-16 | 2000-09-29 | Matsushita Electric Ind Co Ltd | パターンマッチング認識方法 |
JP2001033236A (ja) | 1999-07-23 | 2001-02-09 | Mitsubishi Heavy Ind Ltd | ステレオ画像計測装置およびステレオ画像計測方法 |
JP2001165863A (ja) | 1999-09-30 | 2001-06-22 | Omron Corp | 画像処理装置 |
CN1115546C (zh) * | 1999-12-29 | 2003-07-23 | 宝山钢铁股份有限公司 | 表面三维形貌检测方法和装置 |
US7075565B1 (en) * | 2000-06-14 | 2006-07-11 | Landrex Technologies Co., Ltd. | Optical inspection system |
JP3618649B2 (ja) * | 2000-08-22 | 2005-02-09 | アジア航測株式会社 | 不定形窓を用いた画像間拡張イメージマッチング方法 |
US6445518B1 (en) * | 2000-11-28 | 2002-09-03 | Semiconductor Technologies & Instruments, Inc. | Three dimensional lead inspection system |
JP4688309B2 (ja) * | 2001-02-20 | 2011-05-25 | 成典 田中 | 3次元コンピュータグラフィックス作成支援装置、3次元コンピュータグラフィックス作成支援方法、及び3次元コンピュータグラフィックス作成支援プログラム |
CA2451659A1 (fr) * | 2001-06-29 | 2003-01-09 | Melvyn Lionel Smith | Systeme et procede aeriens de dimensionnement |
US7133560B2 (en) * | 2002-07-09 | 2006-11-07 | Lee Shih-Jong J | Generating processing sequences for image-based decision systems |
WO2005010495A2 (fr) * | 2003-07-22 | 2005-02-03 | Trestle Corporation | Systeme et procede de creation d'images numeriques a partir d'une lame de microscope |
US7015492B2 (en) * | 2003-08-15 | 2006-03-21 | Asm International N.V. | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
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2006
- 2006-06-16 KR KR1020067026852A patent/KR20070088318A/ko active Search and Examination
- 2006-06-16 US US11/630,631 patent/US8233041B2/en active Active
- 2006-06-16 CN CNB2006800006980A patent/CN100460807C/zh active Active
- 2006-06-16 KR KR1020097024679A patent/KR101155816B1/ko active IP Right Grant
- 2006-06-16 EP EP06757383.2A patent/EP1788345B1/fr active Active
- 2006-06-16 JP JP2006541746A patent/JP4811272B2/ja active Active
- 2006-06-16 WO PCT/JP2006/312099 patent/WO2006135040A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1137736A (ja) * | 1997-05-20 | 1999-02-12 | Ricoh Co Ltd | 3次元形状計測方法及び3次元形状計測装置 |
JP2004046772A (ja) * | 2002-05-13 | 2004-02-12 | 3D Media Co Ltd | 画像処理方法、画像処理システム、及び画像処理装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2006135040A1 (fr) | 2006-12-21 |
CN101010559A (zh) | 2007-08-01 |
KR20100017396A (ko) | 2010-02-16 |
JP4811272B2 (ja) | 2011-11-09 |
KR20070088318A (ko) | 2007-08-29 |
US20090128648A1 (en) | 2009-05-21 |
JPWO2006135040A1 (ja) | 2009-01-08 |
CN100460807C (zh) | 2009-02-11 |
EP1788345A1 (fr) | 2007-05-23 |
EP1788345A4 (fr) | 2010-09-01 |
EP1788345B1 (fr) | 2014-03-05 |
US8233041B2 (en) | 2012-07-31 |
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