KR101149028B1 - Led package and manufacturing method of the same - Google Patents

Abstract

The present invention, the first conductive layer formed on the LED patterning layer; An insulating layer formed to bury the first conductive layer on the LED patterning layer; A second conductive layer formed on an outer surface of the insulating layer; And a wire or bump layer formed inside the insulating layer to electrically connect the first conductive layer and the second conductive layer. Thereby, by using the existing wire bonding or bump forming technology, it is possible to more easily secure the desired thickness of the LED substrate can increase the processing cost and productivity.

Description

LED package and its manufacturing method {LED PACKAGE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to an LED package and a method of manufacturing the same. More specifically, the present invention relates to an LED package and a method of manufacturing the same, which can increase the processing cost and productivity by easily securing the desired thickness of the LED substrate using existing wire bonding or bump forming techniques.

A light emitting diode is a semiconductor device that emits light when a voltage is applied in the forward direction. Also called LED (Light Emitting Diode). The luminous principle utilizes the electroluminescent effect. In addition, the service life is considerably longer than incandescent bulbs. The emission color varies depending on the material used, and it can be produced to emit light from the ultraviolet region to the visible and infrared region. It was first developed in 1962 by Nick Horoniak of the University of Illinois. In addition, it has been used for various purposes to this day and is expected to be a light source to replace a fluorescent lamp or a bulb in the future.

These LED chips must be packaged in order to be mounted on a PCB board like a general semiconductor chip. As LED PKG becomes smaller and thinner, there is a movement to reduce material cost, process cost and investment cost by changing from wafer level (WL) to chip scale (CS). As a result, Si boards (or AlN boards or LTCC boards, etc.) are different from PKG by connecting the lead frame and LED chip with W / B (wire bonding) and D / B (die bonding). A method of reducing the process step by changing the PKG shape to wafer to wafer bonding using the method has been proposed. In particular, in the wafer-to-wafer bonding method, a technique for forming an insulating layer and a circuit layer according to a printing technique has been developed so as to enhance adhesion without voids between the substrate and the LED.

1A is a cross-sectional view of an LED package manufactured by a conventional printing technique, and FIG. 1B is a cross-sectional view of a process of manufacturing an LED package by a conventional printing technique. 1A and 1B, as shown, the conductivity over the LED patterning layer 110 formed on the sapphire wafer 100 (the figure shows the process direction down to facilitate understanding of the process). A patterning layer (hereinafter referred to as a first conductive layer) 120 is formed, and an insulating layer 130, a third conductive layer 150 and a second conductive layer 140 are formed thereon by using a printing method. Specifically, the LED patterning layer 110 is electrically connected to the second conductive layer 140 by sequentially printing the insulating layer 130, the third 150, and the second conductive layer 140. In addition, after the bonding of the first conductive layer 120 and the substrate 130, the sapphire substrate 100 is removed by a laser lift off process.

However, this technique prints the material of the insulating layer material and the conductive layers for constituting the substrate using ink or paste, and there is a difficulty in forming the entire thickness of the desired substrate. For example, in order to form both the conductive layer and the insulator using only a printing technique, the thickness of the conductive layer and the insulator can be secured by performing repeated printing / curing processes or printing / drying processes several times.

As a result, various problems such as resolution, bleeding properties, drying / curing conditions, thickness securing, and processing time necessary for the printing technology have occurred.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to replace the formation of the conductive layer inside the insulating layer with conventional wire bonding or bump forming techniques, so that work can be performed regardless of the resolution and the required thickness can be obtained. The present invention provides an easily obtained LED package and a method of manufacturing the same.

The structure of an LED package according to an embodiment of the present invention, the first conductive layer formed on the LED patterning layer; An insulating layer formed to bury the first conductive layer on the LED patterning layer; A second conductive layer formed on an outer surface of the insulating layer; And a wire or bump layer formed inside the insulating layer to electrically connect the first conductive layer and the second conductive layer.

Here, the LED package may further include a molding part formed under the LED patterning layer. In this case, the molding part preferably contains a phosphor or has a lens shape.

The LED package manufacturing method according to the present invention comprises the steps of: (a) forming a first conductive layer on the LED patterning layer; (b) forming a bump layer or bonding wires on the first conductive layer; (c) forming an insulating layer filling the bump layer or the wire; (d) reducing the thickness of the insulating layer to expose a portion of the bump layer or wire; And (e) forming a second conductive layer on the exposed bump layer or wire, so that work can be performed regardless of the resolution and the required thickness can be easily obtained.

In particular, step (c) is a step of forming an insulating layer for embedding the bump layer or wire by applying and curing a liquid insulating material on the LED patterning layer and the first conductive layer, Sufficient thickness can be easily formed before obtaining the desired thickness.

Here, the step (c), it is preferable to reduce the thickness of the insulating layer by a lapping or polishing (Polishing) process.

The LED package manufacturing method may further include (f) forming a molding part under the LED patterning layer, in which case, the step (f) may include forming a molding part containing a phosphor or a lens shape. It is preferable that the forming part of the step.

According to the present invention, it is possible to improve the processing cost and productivity by more easily securing the desired thickness of the LED substrate using existing wire bonding or bump forming techniques.

Figure 1a is a cross-sectional view of the LED package produced by a conventional printing technique
Figure 1b is a cross-sectional view of a process for manufacturing an LED package by a conventional printing technique
2A is a cross-sectional view of a process of manufacturing an LED package according to an embodiment of the present invention.
2B is a cross-sectional view of a completed LED package according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a LED package and a method of manufacturing the same according to a preferred embodiment. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

In addition, the size of each component in the drawings may be exaggerated for the sake of explanation and does not mean a size actually applied.

2A is a cross-sectional view of a process of manufacturing an LED package according to an embodiment of the present invention. In particular, in this figure, it describes the process of completing the LED package is attached to the PCB to the downward direction, it should be understood that the process proceeds in sequence on the LED chip substantially. Referring to FIG. 2A, an LED chip in which the LED patterning layer 110 and the first conductive layer 120 are sequentially formed on the sapphire substrate 100 is prepared (S1). Next, the wire 150a is bonded on the first conductive layer 120 on the LED patterning layer 110 (left picture) or the conductor 150b is formed (right picture) by a bump forming technique (S2). In this case, the heights of the wire 150a and the bump layer 150b are higher than the thickness of the substrate to be formed. In addition, the insulating layer 130 filling the bump layer 150b or the wire 150a is formed (S3). Specifically, a liquid insulating material is applied so that the wire 150a is bonded or the bump layer 150b is embedded. Here, the coating method is possible by various processes such as general Dam & Fill, Transfer molding, Dispensing, the thickness of the coating is formed higher than the thickness of the substrate to be implemented. Thereafter, a substrate, that is, an insulating layer 130 is formed through a curing process.

The thickness of the insulating layer 130 is then reduced to achieve the desired thickness of the insulating layer, and after exposing the bump layer 150b or a portion of the wire 150a, the exposed bump layer 150b or wire ( A second conductive layer 140 is formed on 150a) (S4). More specifically, the thickness of the substrate 130 to be implemented by lapping or polishing techniques or the like is formed, and on the wire 150a or the bump layer 150b exposed by the substrate thus operated. The second conductive layer 140 is formed by printing or thin film processing. Thus, it is electrically connected to the LED patterning layer 110 by a wire 150a or bump layer 150b.

The sapphire substrate 100 may be lifted off according to the LED method, and a transparent molding material may be applied onto the LED patterning layer 100 to complete the LED package.

2B shows a cross-sectional view of a completed LED package according to one embodiment of the invention. The sapphire substrate 100 is lifted off and the molding unit 160 is formed on the LED patterning layer. The molding unit 160 protects the LED patterning layer 110 and increases the light efficiency. Here, the molding unit 160 may be implemented in various shapes such as a lens shape, and may include a phosphor for improving LED performance.

As a result, after forming the conductor (wire or bump layer) inside the substrate used for the LED package through the conventional printing technique by a conventional wire bonding or bump forming technique rather than a printing technique, various insulating materials are molded. By implementing the technique and reducing the thickness as desired, it is possible to secure the flatness and height of the substrate.

Moreover, compared to the prior art in which both the conductor and the insulator are formed by the printing technique, it is possible to prevent various problems such as resolution, bleeding, drying / curing condition, thickness securing, processing time, etc., and to work regardless of the resolution. In addition, it is possible to easily secure the thickness of the desired LED package.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

100: sapphire substrate 110: LED patterning layer
120: first conductive layer 130: insulating layer
140: second conductive layer 150a: wire
150b: bump layer 160: molding part

Claims (8)

A first conductive layer formed on the LED patterning layer;
An insulating layer formed to bury the first conductive layer on the LED patterning layer;
A second conductive layer formed on an outer surface of the insulating layer;
A wire or bump layer formed inside the insulating layer to electrically connect the first conductive layer and the second conductive layer; And
It includes a molding formed under the LED patterning layer,
The wire or bump layer is formed higher than the final height of the bump layer or the wire and the insulating layer is formed higher than the final thickness of the insulating layer, and then the thickness of the insulating layer is reduced to expose a portion of the bump layer or wire. ,
And the second conductive layer is formed on the exposed exposed wire or bump layer.
delete The method of claim 1,
The molding portion contains a phosphor or an LED package, characterized in that the lens.
In the method of manufacturing the LED package,
(a) forming a first conductive layer on the LED patterning layer;
(b) forming a bump layer or bonding a wire on the first conductive layer, forming a height of the bump layer and the wire higher than a final height of the bump layer and the wire in the LED package;
(c) forming an insulating layer filling the bump layer or wire higher than a final thickness of the insulating layer in the LED package;
(d) reducing the thickness of the insulating layer to expose a portion of the bump layer or wire; And
(e) forming a second conductive layer on the exposed bump layer or wire; And
(f) forming a molding under the LED patterning layer.
The method of claim 4, wherein
In step (c),
And forming an insulating layer for embedding the bump layer or the wire by applying and curing a liquid insulating material on the LED patterning layer and the first conductive layer.
The method according to claim 4 or 5,
In step (c),
A method of manufacturing an LED package, characterized in that the step of reducing the thickness of the insulating layer by a lapping or polishing (Polishing) process.
delete The method of claim 4, wherein
The step (f)
Forming a molding portion containing a phosphor, or forming a lens-shaped molding portion LED package manufacturing method characterized in that the step.

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