KR101058556B1

KR101058556B1 - Light Emitting Diode Package

Info

Publication number: KR101058556B1
Application number: KR1020090040186A
Authority: KR
Inventors: 정춘목
Original assignee: 주식회사 미광전자
Priority date: 2009-05-08
Filing date: 2009-05-08
Publication date: 2011-08-23
Also published as: KR20100121159A

Abstract

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package including a reflector for focusing the light emitted from the light emitting diode and a light transmitting lens capable of changing the feeling of light emission.

The light emitting diode package according to the present invention includes a metal base, an insulating layer formed on an upper surface of the metal base, an LED chip, a pair of electrode layers, a wire electrically connecting the electrode layer and the LED chip, and an upper surface of the electrode layer. A solder mask which is formed on the solder mask so as to surround the LED chip mounting portion, and a side surface of which is formed on an inclined surface to guide light emitted from the LED chip to an open upper side; And a light transmitting lens provided with a space surrounding the LED chip mounting portion and a holding means for supporting the reflector and the light transmitting lens while being fixed on the solder mask.

LED, package, reflection, lens

Description

Light Emitting Diode Package {LED PACKAGE}

In general, a light emitting diode (LED) is a device in which electrons and holes meet and emit light at a PN junction by applying an electric current, and are generally manufactured in a package structure in which an LED chip is mounted. It is called a "light emitting diode package."

In general, a light emitting diode package is mounted on an LED chip on a printed circuit board (PCB), and the LED chip is configured to emit light by receiving a current from an electrode formed on the printed circuit board.

At this time, the mold lens is formed to cover the LED chip in order to ensure the straightness and diffusivity in the traveling direction with respect to the light emitted from the LED chip.

Alternatively, a recess may be formed on the printed circuit board to form an inclined surface, and an LED chip may be mounted on the bottom of the recess to reflect light to the side of the recess, thereby inducing a light traveling direction.

However, even by such a lens, a concave groove, there is a limit in guiding the light or adjusting the feeling of light.

The present invention has been made to solve the above problems of the conventional light emitting diode package, and an object thereof is to provide a light emitting diode package that can change the light emitting feeling while further improving the focusing and guiding of light.

In order to solve the above problems, the light emitting diode package according to the present invention, a flat metal base; An insulation layer formed on an upper surface of the metal base; An LED chip mounted on an upper surface of the insulating layer; A pair of electrode layers electrically insulated from each other formed on an upper surface of the insulating layer and spaced apart from left and right sides by separating areas including mounting portions of the LED chip; A wire electrically connecting an end of the electrode layer adjacent to the LED chip and the LED chip; A solder mask formed on a region of the upper surface of the electrode layer except for a region connected to an external electrode and a region connected to the wire; A reflector formed on the solder mask to surround the LED chip mounting portion, the reflector configured to guide the light emitted from the LED chip toward an upper side of the opening by forming an inclined side surface; A light transmission lens formed inside the reflector and having a space portion covering and covering the LED chip mounting portion at a bottom thereof; And holding means fixed to the solder mask to support the reflector and the light transmitting lens.

Alternatively, the light emitting diode package according to the present invention includes a metal base having a flat plate shape and a concave groove having a side surface thereof inclined at a central portion thereof; An LED chip mounted on the bottom surface of the concave groove so as not to be electrically connected to the metal base; An insulation layer formed on an upper surface of the metal base except for the recess; A pair of electrode layers formed on an upper surface of the insulating layer and spaced apart from left and right sides by separating areas including the concave groove forming portions; A wire electrically connecting an end of the electrode layer adjacent to the LED chip and the LED chip; A solder mask formed on a region of the upper surface of the electrode layer except for a region connected to an external electrode and a region connected to the wire; A reflecting mirror formed on the solder mask to surround the concave groove forming portion, and having a side surface thereof inclined to guide light emitted from the LED chip to an open upper side; A light transmission lens formed inside the reflector and having a space portion formed around the concave groove forming portion at a bottom thereof; And holding means fixed to the solder mask to support the reflector and the light transmitting lens.

In the above-described light emitting diode package, the holding means includes: a cylindrical sidewall attached and fixed to the solder mask so as to surround the outer side of the reflector, and the upper outer side of the reflector adhered to the upper inner side; And an annular edge cover coupled to an upper end of the side wall and supporting the upper edge of the reflector and the upper edge of the light transmitting lens in close contact with a bottom surface thereof.

In addition, a grid-shaped groove may be formed on an upper surface of the light transmitting lens.

In addition, the upper surface of the space portion may have a convex shape downward on the center.

In addition, the phosphor formed to cover the LED chip and the wire; And a mold lens formed to cover the phosphor.

In addition, the first circular pattern is formed by silk-screen printing on the solder mask to surround the LED chip mounting portion in the region within the space; A phosphor formed to cover the LED chip and the wire in an area within the first circular pattern; A second circular pattern formed by silkscreen printing on the solder mask to surround the first circular pattern in a region within the space part; And a mold lens formed to cover the phosphor in a region in the second circular pattern.

According to the present invention, since the reflector is further included, light converging and guiding in the light traveling direction is easy, thereby maximizing light emission efficiency.

In addition, a light transmitting lens is further included in the reflector, and a grid groove or the like is formed on the surface of the light transmitting lens to change the feeling of light emitted.

In addition, there is an advantage that it is easy to assemble the reflector and the light transmitting lens by the holding means attached to the solder mask.

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which the same reference numerals denote the same members or the same geometrical features having the same function.

1 is a plan view of a light emitting diode package according to an embodiment of the present invention, FIG. 2 is a sectional view of the light emitting diode package shown in FIG. 1, FIG. 3 is a plan view of a light emitting diode package according to another embodiment of the present invention, and FIG. Is a cross-sectional view of the light emitting diode package shown in FIG.

1 and 2, the light emitting diode package 1 according to the exemplary embodiment of the present invention includes a metal base 100, an insulating layer 110, an LED chip 120, and an electrode layer 130 as shown. , A wire 140, a solder mask, a reflector 200, a light transmitting lens 300, and a holding means 400 are included.

The metal base 100 is made of a metal material having excellent thermal conductivity and has a flat plate shape so as to discharge heat generated from the LED chip 120.

The insulating layer 110 is formed on the upper surface of the metal base 100 and is made of an insulating material, and also made of a material having excellent thermal conductivity in consideration of the emission efficiency of heat generated from the LED chip 120 to be described later. In addition, the electrode layer 130 and the metal base 100 are interposed between the electrode layer 130 to be described later and the metal base 100, so that the electrode layer 130 and the metal base 100 are not directly connected to each other.

The LED chip 120 is mounted on the top surface of the insulating layer 110, and an example in which the LED chip 120 is mounted on the top surface of the insulating layer 110, which is a central portion of the metal base 100, is shown. . The LED chip 120 is mounted on the insulating layer 110 and electrically insulated from the metal base 100.

The electrode layer 130 is connected to an external electrode and is also electrically connected to the LED chip 120 to allow the LED chip 120 to receive power. The electrode layer 130 is composed of a pair of electrode layers 130 having a cathode electrode and an anode electrode, and the pair of electrode layers 130 are not electrically connected directly to each other. Specifically, the pair of electrode layers 130 are formed on the upper surface of the insulating layer 110 while being spaced apart from the left and right while leaving the separation region 135 including the LED chip 120 mounting portion as shown. In addition, an end portion region 132 of the electrode layer 130 proximate to the LED chip 120 by the wire 140 to be described later is connected to the LED chip 120 in order to improve electrical conductivity. Not shown).

The wire 140 is configured to electrically connect the LED chip 120 and the electrode layer 130. Specifically, the wire 140 is bonded between the end of the electrode layer 130 adjacent to the LED chip 120 and the LED chip 120 to make an electrical connection. Will be achieved.

A solder mask is formed on the upper surface of the electrode layer 130. Specifically, in the region except for the region 131 connected to the external electrode and the region 132 connected to the wire 140, the upper surface region of the electrode layer 130 is connected. A solder mask is formed.

The reflector 200 focuses and guides the light emitted from the LED chip 120. Specifically, the reflector 200 is formed on the solder mask to surround the mounting portion of the LED chip 120, the side is formed to have an inclined surface, the inner surface is a metal material to form a surface that can reflect light and other various It is made of material. And the upper side is open so that the light reflected through the inner surface is guided upward and can be emitted through the opened upper side.

On the other hand, the light transmission lens 300 may be further included inside the reflector 200. The light transmitting lens 300 is formed in the traveling direction of the light emitted from the LED chip 120 and is configured to change the emission feeling while ensuring the diffusivity of the light passing through. Specifically, the light transmitting lens 300 may be made of a plastic material having good light transmittance, and a space portion 310 is formed at the bottom to cover the LED chip 120 mounting portion. And it is formed so as to fill the interior of the reflector 200, except the space portion 310. More specifically, the light transmitting lens 300 and the reflector 200 may be integrally formed with each other by insert injection or the like, or may be formed by mutual coupling by means of forced injection, or may be separately manufactured and then reflected by a reflector ( 200 may be coupled to each other by a variety of manufacturing methods such as fitting the light transmitting lens 300 into the interior. In addition, the light transmitting lens 300 may be detachably coupled to the inside of the reflector 200 so that the light transmitting lens 300 may be replaced.

In addition, the light transmission lens 300 may be manufactured to be transparent, or may be manufactured by adjusting transmittance to have a required light emitting feeling, or may be formed of a specific color to change the color of light emitted.

In addition, a lattice groove 320 or other various grooves may be formed on the upper surface of the light transmitting lens 300 to change the feeling of light emission.

In addition, the shape of the space portion 310 may be changed to give a change in the traveling direction of light. As an example, an example is provided in which a central portion of the upper surface of the space portion 310 has a convex shape downward. have.

As described above, the light emitting diode package 1 of the present exemplary embodiment has the advantage that it is not only easy to focus and guide light by the reflector 200 and the light transmitting lens 300 described above, but also give various changes to the feeling of light. do.

The above-described reflector 200 and the light transmitting lens 300 are supported by the holding means 400. The holding means 400 is fixed on the solder mask and is supported to maintain the reflector 200 and the light transmitting lens 300 in a disposed state.

As an example of the holding means, an example consisting of the side wall 410 and the edge cover 420 may be presented. The side wall 410 is formed in a cylindrical shape and is fixed on the solder mask to accommodate the reflector 200 as an inner space. As the fixing method, the side wall 410 may be attached by an adhesive 411. The side wall 410 may be formed to cover the outside of the reflector 200 and have a height equal to that of the reflector 200. In this case, an upper end of the side wall 410 and an upper end of the reflector 200 are the same. Although having a height, the upper outer surface of the reflector 200 is in close contact with the upper inner surface of the side wall 410.

Accordingly, the reflector 200 is accommodated into the inside of the side wall 410 fixed on the solder mask while the bottom surface is brought into contact with the solder mask, and the top outer side is brought into contact with the top inner side of the side wall 410. As a result, it may be supported without flowing inside the sidewall 410. However, since the side wall 410 may be allowed to flow upwardly, the holding means 400 further includes an edge cover 420 coupled to the top of the side wall 410.

The edge cover 420 has an annular shape and is coupled in various ways such as fitting, attachment, and the like at the top of the sidewall 410. The upper surface of the reflector 200 is tightly supported through the bottom surface of the edge cover 420 by forming a portion 421 extending inwardly. Therefore, the reflector 200 may be supported without flow in the holding means 400 not only in the horizontal direction but also in the vertical direction. In this case, the bottom surface of the edge cover 420 is preferably covered with the upper edge portion of the light transmitting lens 300 as well as the top of the reflector 200.

On the other hand, the light emitted from the LED chip 120 to cover the top of the LED chip 120 with a yellow phosphor 500 (phosphor) while using the blue light emitting LED chip 120 to form a white. As such, the light emitting diode package 1 of the present embodiment may include a phosphor 500 by selection, and the phosphor 500 is formed to cover the LED chip 120 and the wire 140. The phosphor 500 also functions to protect the LED chip 120 and the wire 140 from an external environment.

In addition, a mold lens 600 may be included to cover the phosphor 500 in order to improve the straightness and diffusivity of the emitted light and to protect the phosphor 500 from the external environment. The mold lens 600 is preferably made of a material having excellent light transmittance, and is preferably made of a material having low air permeability and moisture permeability to isolate the phosphor 500 from the external environment. For example, a silicon material may be used as the material of the mold lens 600. In addition, an example of a mold lens 600 having a substantially hemispherical shape is shown in the drawing.

The phosphor 500 and the mold lens 600 are formed by applying a liquid material during initial molding and gradually hardening, and may flow down to the surroundings in this process. Therefore, in the present embodiment, the phosphor 500 and the mold lens 600 are easily formed, and the first and second circular patterns 510 and 610 may be formed to maintain the initial applied shape and amount without flowing down. Can be.

The first circular pattern 510 is formed by silk screen printing on the solder mask so as to be an area within the space 310 and surround the mounting area of the LED chip 120. In addition, the phosphor 500 may cover the LED chip 120 and the wire 140 by coating molding in the region of the first circular pattern 510.

The second circular pattern 610 is formed by silkscreen printing on the solder mask to surround the first circular pattern 510, and the mold lens 600 is formed by coating in the region of the second circular pattern 610. do.

Therefore, the phosphor 500 and the mold lens 600 may be cured while maintaining the initial coating shape and amount without flowing down by the first and second circular patterns 510 and 610.

3 and 4 show a light emitting diode package 1 ′ of another preferred embodiment of the present invention. The description omitted in the following reference numerals in the drawings are replaced by the description in the above-described embodiment.

In the present embodiment, the concave groove 101 is formed in the central portion of the metal base 100 to further improve the focusing and guiding of the light. Specifically, the concave groove 101 has a side surface inclined to perform the function of focusing the light emitted from the LED chip 120 upward. At this time, the side and bottom surface of the concave groove 101 may be coated with a highly reflective metal material (eg, Ag) so that the light can be reflected well, or the metal base 100 itself is not only thermally conductive but also light reflectance In addition, the light reflection of the side and bottom of the concave groove 101 may be made by being made of a superior material.

The LED chip 120 is mounted on the bottom surface of the concave groove 101, and is mounted to be electrically insulated from the metal base 100.

In addition, the phosphor 500 may be formed to cover the LED chip 120 and the wire 140 while filling the concave groove 101, and the mold lens 600 may be formed to cover the phosphor 500. May be included.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It is not limited.

1 is a plan view of a light emitting diode package according to an embodiment of the present invention;

2 is a cross-sectional view of the light emitting diode package shown in FIG.

3 is a plan view of a light emitting diode package according to another embodiment of the present invention;

FIG. 4 is a cross-sectional view of the light emitting diode package shown in FIG. 3.

Explanation of symbols on main parts of drawing

1, 1 '; Light emitting diode package 100; Metal base

101; Recessed groove 110; Insulation layer

120; LED chip 130; Electrode layer

135; Isolation region 140; wire

200; Reflector 300; Light transmission lens
310; Space 320; home
400; Holding means 410; Sidewall
420; Border cover 500; Phosphor
510; First circular pattern 600; Mold lens
610; Second circular pattern

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Claims

Flat metal base;

An insulation layer formed on an upper surface of the metal base;

An LED chip mounted on an upper surface of the insulating layer;

A pair of electrode layers electrically insulated from each other formed on an upper surface of the insulating layer and spaced apart from left and right sides by separating areas including mounting portions of the LED chip;

A wire electrically connecting an end of the electrode layer adjacent to the LED chip and the LED chip;

A solder mask formed on a region of the upper surface of the electrode layer except for a region connected to an external electrode and a region connected to the wire;

A reflector formed on the solder mask to surround the LED chip mounting portion, the reflector configured to guide the light emitted from the LED chip toward an upper side of the opening by forming an inclined side surface;

A light transmission lens formed inside the reflector and having a space portion covering and covering the LED chip mounting portion at a bottom thereof;

A first circular pattern formed by silkscreen printing on the solder mask to surround the LED chip mounting portion in an area within the space part;

A phosphor formed to cover the LED chip and the wire in an area within the first circular pattern;

A second circular pattern formed by silkscreen printing on the solder mask to surround the first circular pattern in a region within the space part;

A mold lens formed to cover the phosphor in a region in the second circular pattern; And

And a holding means for holding the reflector and the light transmitting lens while being fixed on the solder mask.

The method according to claim 1,

The holding means,

A cylindrical sidewall attached and fixed to the solder mask so as to surround the outer side of the reflector, the upper side outer side of the reflector being closely attached to the upper inner side; And

And an annular edge cover coupled to an upper end of the side wall and supporting the upper edge of the reflector and the upper edge of the light transmitting lens in close contact with a bottom surface thereof.

The method according to claim 1,

The light emitting diode package, characterized in that the grating groove is formed on the upper surface of the light transmitting lens.

The method according to claim 1,

The upper surface of the space portion has a light emitting diode package, characterized in that the central portion is convex downward.

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