KR101043173B1

KR101043173B1 - Zero phase current transformer and method of manufacturing the same

Info

Publication number: KR101043173B1
Application number: KR1020100110443A
Authority: KR
Inventors: 임장수
Original assignee: 임장수
Priority date: 2010-11-08
Filing date: 2010-11-08
Publication date: 2011-06-20

Abstract

The present invention relates to an image current transformer and a method of manufacturing the improved welding force, in particular, a lower surface pin insertion step (S10) of inserting a pair of conducting pins 20 upward from the bottom of the through hole 12 of the case 10 and; A wire dipping process for seating the winding coil 30 on the central column 11 and wiring both ends of the winding coil 30 to the upper side of the conduction pin 20 to form a dipping portion 40 which is dipped by soldering. (S20); The pin bending step (S30) of forming the bending pin 21 by bending the upper side of the conducting pin 20, the dipping portion 40 is formed inward, and the synthetic resin on the upper surface of the bending pin 21 and the case 10 Characterized in that it comprises a molding step (S40) for forming a molding unit 50 for molding by injecting,
By forming a bottom pin insertion process for inserting the conduction pin from the lower part of the through-hole of the case to the upper side, it prevents the occurrence of debris and burrs of the injection molding and eliminates the need for a separate process to remove them, thereby greatly improving productivity. Forming a pin bending process to form the bending pin by bending the upper side of the conduction pin inward to prevent the conduction pin from penetrating the molding part of the epoxy due to physical impact or high temperature, and deforming the conduction pin in the case. It is perfectly fixed to prevent deformation or damage of the power supply pin in advance, and the molding part can be conveniently used in the field by molding the color differently according to the type of video current transformer.

Description

Zero phase current transformer and method of manufacturing the same

The present invention relates to an image current transformer and a method of manufacturing the improved welding force, and in particular, a separate process for removing the debris and variance of the injection molding by forming a lower surface pin insertion process for inserting the conduction pin from the bottom of the through hole of the case to the upper side This eliminates the need for a significant increase in productivity, and forms a bending pin that bends the upper side of the conduction pin inwards, thereby improving adhesion to prevent the conduction pin from penetrating or deforming the molding part of the epoxy. An image transformer and a method of manufacturing the same.

In general, a transformer for an instrument is divided into a current transformer and a voltage transformer. Among the current transformers, a video current transformer is a leakage circuit breaker that blocks a short circuit in a home appliance such as a bidet, a water heater, a dryer, or various industrial purposes. It is used to sense or monitor microcurrent.

The image current transformer is connected to a circuit board of the controller and detects a short circuit and adjusts the trip coil formed therein to automatically turn off the knob.

FIG. 5 is a current imager used in the related art, which is a registered method of manufacturing a current transformer.

In the method for manufacturing an image current transformer of the Patent No. 2000-00262284, as shown in FIG. 5, the pins 4 having a predetermined length from the upper side to the lower side are formed in two through holes 3 formed in the case 1. After bonding the core 5 to the center of the case 3, the coil wire is wound around the upper part of the pin 4, and dipped, the pin 4 is pressed through the case 3 and the epoxy 6 ) Is injected and molded.

However, the conventional method of manufacturing a current transformer is a problem that the productivity is reduced by the need for a separate process to remove the debris and variance of the injection generated by inserting a pair of conducting pins from the upper through hole of the case to the lower side There was this.

In addition, when the bending pins are molded with epoxy on the upper surface of the case, when the conductive pins are inserted into the circuit board, the conductive pins may penetrate or deform the epoxy molding part due to physical impact or high temperature.

In addition, the conventional image current transformer manufacturing method has a problem that the molding part of the image current transformer is uniformly formed, so that two image current transformers may be used in the field.

The present invention was created to solve the problems of the prior art as described above, and the object of the video current transformer and its manufacturing method to improve the fusion force according to the present invention,

By forming a lower surface pin insertion process for inserting the conduction pin from the lower part of the through-hole of the cylindrical case to the upper side, it is possible to prevent the occurrence of debris and variance of the injection molding caused by inserting the conduction pin from the upper side to the lower part of the through-hole. This eliminates the need for a separate process to eliminate this, and greatly improves the productivity. A physical bending process is formed by inserting a conduction pin into a circuit board by forming a pin bending process to form a bending pin by bending the upper side of the conduction pin inward. It is possible to prevent the conduction pin from penetrating or deforming the molding part of epoxy due to impact or high temperature.The conduction pin is perfectly fixed to the case to prevent deformation or damage of the conduction pin. Colors are molded differently according to the type of current transformer to improve the welding strength for convenient use in the field The present invention provides a phase transformer and a method of manufacturing the same.

Image current transformer and improved manufacturing method of the present invention to achieve the above object to achieve the above object is formed a central column protruding to the upper side and a pair of through-holes are formed on one side, the upper side of the cylindrical case is formed And a bottom pin insertion step of inserting a pair of energizing pins upward from a lower portion of the through hole of the case 10, and mounting winding coils on the central pillar, and wiring both ends of the winding coils on top of the energizing pins. Wiring dipping process for forming a dipping portion which is dipped by soldering, a pin bending process of forming a bending pin by bending an upper side of the conducting pin on which the dipping portion is formed, and injecting and molding a synthetic resin into the upper surface of the bending pin and the case. Characterized in that the molding process for forming a molding portion.

The image current transformer and the manufacturing method of the present invention with improved welding strength having the configuration as described above has the following effects.

First, by forming a lower surface pin insertion process for inserting a pair of energizing pins from the lower part of the through-hole of the cylindrical case with an open upper side to the upper side, it is possible to remove the debris of the injection molding generated by inserting the energizing pins from the upper part of the through-hole to the lower part. By preventing the occurrence of the barrier in advance, there is no need for a separate process to remove it has the effect of significantly improving the production line.

Second, by forming a pin bending process to bend the upper side of the conducting pin formed with a dipping portion inwardly to form a bending pin, molding the bending pin with epoxy on the upper surface of the case to insert the conduction pin into the circuit board. There is an effect that can prevent the conduction pin from penetrating or deforming the epoxy molding.

Third, the winding pin is fixed between the wire dipping process and the pin bending process, and the conduction pin is additionally formed by additionally forming an insulation bonding process for adhering the adhesive tape to one side of the winding coil and the inside of the case so that the conduction pin is disconnected from the winding coil. It prevents the malfunction of electronic components by preventing the winding coil from being energized, and the pin is perfectly fixed to the case to prevent deformation or damage of the pin.

Easy to use if you want to work

Fourth, by molding the molding differently according to the type of the video current transformer, there is an effect that can be easily identified and used visually in the field.

1 is a manufacturing process chart showing a manufacturing process of a video current transformer according to the present invention.
2 is a process chart showing a step disconnection bonding process of the video current transformer according to the present invention.
3 is a perspective view of an image transformer according to an embodiment of the present invention.
4 is a front view of FIG. 3.
5 is a manufacturing process diagram of a conventional video current transformer.

Next, a description will be given of the current transformer and the manufacturing method of the present invention with improved welding strength having the configuration as described above.

According to an embodiment of the present invention, a method of manufacturing an image current transformer having improved welding strength may include a lower surface pin insertion step S10, a wiring dipping step S20, and a pin bending step S30 as shown in FIG. 1. And, the molding process (S40),

In the lower surface pin insertion step (S10), a central column 11 protruding upward from the center is formed, and a pair of through holes 12 are formed at one side thereof, and the upper side is formed of a cylindrical case 10 having an open side. By inserting a pair of energizing pins 20 from the lower part of the through-hole 12 of the case 10 to the upper side, the occurrence of debris and variance of the injection product generated by inserting the current-carrying pins from the upper side of the through-hole to the lower side is not known. There is no need for a separate process to prevent and remove it, thereby doubling the productivity.

In the wiring dipping step S20, the winding coil 30 is seated on the central pillar 11, and both ends of the winding coil 30 are wired on the upper side of the conduction pin 20 to be dipped by soldering. It is a process of forming the ping part 40.

In addition, in the pin bending process (S30), the upper side of the conductive pin 20, the dipping portion 40 is formed by bending the upper side to form a bending pin 21 to form the upper surface of the bending pin 21 and the case 10 By molding with the epoxy to insert the conductive pin 20 into the circuit board it can be prevented that the conductive pin 20 penetrates through the epoxy molding unit 50 or deformed due to physical impact or high temperature.

In addition, the bending angle of bending the conduction pin 20 inward in the pin bending process S30 is preferably 60 to 90 degrees, and the bending angle is preferably 80 degrees.

In addition, between the wire dipping step (S20) and the pin bending step (S30), as shown in Figure 2, the winding coil 30 is fixed, the conduction pin 20 is disconnected from the winding coil 30 By short-circuit bonding process (S31) is further formed to bond the adhesive tape 31 to one side of the winding coil 30 and the inner side of the case 10 so that the conduction pin 20 is blocked from energizing the winding coil In addition to preventing the malfunction of the electronic component in advance, the conduction pin 20 is completely fixed to the case 10 to prevent deformation or damage of the conduction pin in advance.

In addition, the synthetic resin injected into the molding unit 50 of the molding process S40 is formed of epoxy, and the epoxy may be easily identified and visually used in the field by molding different colors according to the type of the image current transformer. Will be.

Meanwhile, in FIGS. 3 and 4, the image current transformer is manufactured by the lower surface pin insertion step S10, the wire dipping step S20, the pin bending step S30, and the molding step S40. do.

The embodiment of the present invention is merely an embodiment of the technical idea of the present invention, and of course, other modifications are possible within the technical idea of the present invention.

10 case 11 center column
12: through hole 20: through pin
30: winding coil 31: adhesive tape
40: dipping portion 50: molding portion

Claims

A central column 11 having a central portion protruding upward is formed, and a pair of through holes 12 are formed at one side, and a cylindrical case 10 having an open upper side is formed, and the through holes 12 of the case 10 are formed. A lower surface pin insertion step (S10) of inserting a pair of energizing pins 20 into the upper side of the lower portion of the upper and lower surfaces of the pair;
Wire dipping to seat the winding coil 30 on the central pillar 11, wires both ends of the winding coil 30 to the upper side of the conducting pin 20 to form a dipping portion 40 which is dipped by soldering Step (S20);
A pin bending step (S30) of forming a bending pin 21 by bending the upper side of the conduction pin 20 on which the dipping portion 40 is formed;
It consists of a molding process (S40) for forming a molding unit 50 for molding by injecting a synthetic resin on the upper surface of the bending pin 21 and the case 10,
The winding coil 30 is fixed between the wire dipping step S20 and the pin bending step S30, and the adhesive tape 31 is attached to the winding coil 30 so that the conductive pin 20 is disconnected from the winding coil 30. 30 is further formed with a single-phase bonding step (S31) for adhering to one side of the case and the inside of the case 10,
The bending angle of bending the conduction pin 20 inward in the pin bending process S30 is formed at 60 to 90 degrees,
Synthetic resin injected into the molding unit 50 of the molding process (S40) is formed of an epoxy, the epoxy is a manufacturing method of the improved image current transformer, characterized in that the molding is different in color depending on the type of the current transformer. .

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