KR101040974B1 - Transfer Device for Semi-conductor carrier - Google Patents

Transfer Device for Semi-conductor carrier Download PDF

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KR101040974B1
KR101040974B1 KR1020080068444A KR20080068444A KR101040974B1 KR 101040974 B1 KR101040974 B1 KR 101040974B1 KR 1020080068444 A KR1020080068444 A KR 1020080068444A KR 20080068444 A KR20080068444 A KR 20080068444A KR 101040974 B1 KR101040974 B1 KR 101040974B1
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carrier
present
semiconductor
conveyor
stacked
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KR1020080068444A
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KR20100008054A (en
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김경중
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김경중
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 캐리어를 적층하여 올려놓을 수 있도록 형성된 장전 틀; 상기 적층된 캐리어를 하나씩 내려놓도록 형성된 상/하부 핑거; 및 상기 내려진 캐리어를 이동시키기 위한 컨베이어;로 구성하여 이루어짐에 따라, 상기 캐리어를 다수 개 적층한 상태에서 아래로부터 하나씩 순차적으로 내리면서 이물질을 제거한 후 이송시키므로, 작업의 편리성과 효율성이 크게 향상될 수 있는 반도체용 캐리어 이송장치를 제공하게 된다.

Figure R1020080068444

캐리어, 핑거, 크린, 이물질제거, 순차이송

The present invention is a loading frame formed so that the carrier can be stacked on; Upper and lower fingers configured to lower the stacked carriers one by one; And a conveyor for moving the lowered carrier, so that the carrier is removed and transported while removing the foreign substances sequentially from the bottom one by one in a state of stacking a plurality of carriers, thereby greatly improving the convenience and efficiency of work. It is to provide a carrier transfer device for a semiconductor.

Figure R1020080068444

Carrier, Finger, Clean, Debris Removal, Sequential Transfer

Description

반도체용 캐리어 이송장치{Transfer Device for Semi-conductor carrier}Transfer device for semi-conductor carrier

본 발명은 반도체용 캐리어를 다수 개 적층한 상태에서 아래로부터 하나씩 순차적으로 내리면서 이물질을 제거한 후 이송시키도록 한 반도체용 캐리어 이송장치에 관한 것이다.The present invention relates to a carrier transporting device for semiconductors which is transported after removing foreign substances while sequentially lowering one by one from the state of stacking a plurality of carriers for semiconductors.

일반적으로 반도체를 생산하는 과정에서 여러 개의 반도체를 한꺼번에 옮기기 위한 목적으로 캐리어가 사용되고 있음은 주지된 사실이다.In general, it is well known that carriers are used for the purpose of transferring several semiconductors at once in the process of producing semiconductors.

이와 같은 캐리어의 윗면에는 반도체를 올려놓을 수 있도록 다수 개의 적재 면이 등 간격에 형성되고, 그 양 측면에는 손으로 들어올릴 수 있도록 걸림 홈이 형성된다.On the upper surface of the carrier, a plurality of loading surfaces are formed at equal intervals so as to place the semiconductor, and both sides of the carrier are formed with locking grooves to be lifted by hand.

또한, 이와 같은 캐리어는 위 아래로 적층 가능하도록 형성됨으로써, 최초 다수개의 캐리어를 위 아래로 적층하여 보관하고, 이를 사용하기 위해서는 하나씩 내려놓아야 한다. 또한, 이와 같이 내려진 캐리어에 반도체를 적재하기에 앞서 캐리어의 표면에 달라붙은 이물질을 제거해야 한다.In addition, such a carrier is formed to be stacked up and down, so that the first plurality of carriers are stacked and stored up and down, and in order to use them, they must be laid down one by one. In addition, the foreign matter adhering to the surface of the carrier must be removed prior to loading the semiconductor into the carrier thus lowered.

본 발명은 적층된 캐리어를 사용하기 위해서 하나씩 내려놓으면서 그 표면에 달라붙은 이물질을 제거하는 일련의 과정이 불편하고 순조롭지 못하게 이루어지는 문제점을 해결하기 위한 반도체용 캐리어 이송장치를 제공하려는 것이다.The present invention is to provide a carrier transfer device for a semiconductor to solve the problem that a series of processes to remove the foreign matter cling to the surface while laying down one by one to use the stacked carrier is inconvenient and smooth.

본 발명은 캐리어의 검사가 불편하고 어려운 문제점을 해결하기 위한 반도체용 캐리어 이송장치를 제공하려는 것이다.The present invention is to provide a carrier transfer device for a semiconductor for solving the problem that the inspection of the carrier is inconvenient and difficult.

본 발명의 반도체용 캐리어 이송장치는 윗면에는 반도체를 올려놓을 수 있도록 다수 개의 적재 면이 등 간격에 형성되고, 그 양 측면에는 손으로 들어올릴 수 있도록 걸림 홈이 형성된 캐리어를 적층하여 올려놓을 수 있도록 형성된 장전 틀; 상기 장전 틀 하부의 양 측면에 각각 상하로 설치되어 최하층 캐리어와 그 위층 캐리어의 걸림홈으로 번갈아 출입하면서 적층된 캐리어를 하나씩 내려놓도록 형성된 상/하부 핑거; 및 상기 상/하부 핑거의 하부에 설치되어 내려진 캐리어를 이동시키기 위한 컨베이어;로 구성하여 이루어진다.In the carrier transport apparatus for a semiconductor of the present invention, a plurality of loading surfaces are formed at equal intervals so as to place a semiconductor on the upper surface, and carriers having a locking groove are stacked on both sides so as to be lifted by hand. Formed loading frame; Upper and lower fingers installed on both sides of the lower side of the loading frame, respectively, and configured to put down the stacked carriers one by one while alternately entering and exiting the locking grooves of the lowermost carrier and the upper carrier; And a conveyor for moving the carrier installed on the lower portion of the upper and lower fingers.

이때, 상기 컨베이어에 올려져 이동하는 캐리어 상의 이물질을 흡입하여 제거하도록 형성된 진공 흡입실;을 구성하여 이루어진다.At this time, the vacuum suction chamber is formed to suck and remove the foreign matter on the carrier is mounted on the conveyor.

또한, 상기 진공 흡입실을 통과한 캐리어를 검사하기 위한 카메라; 및 상기 카메라에 의해 촬영된 영상을 출력하기 위한 모니터;를 구성하여 이루어진다.In addition, the camera for inspecting the carrier passed through the vacuum suction chamber; And a monitor for outputting an image photographed by the camera.

본 발명의 반도체용 캐리어 이송장치에 의하면 캐리어를 다수 개 적층한 상태에서 아래로부터 하나씩 순차적으로 내리면서 이물질을 제거한 후 이송시킴으로써, 작업의 편리성이 크게 향상되는 매우 유용한 효과가 발휘된다.According to the carrier carrier device for semiconductors of the present invention, by removing the foreign substances while sequentially lowering one by one in a state where a plurality of carriers are stacked, and then transport, there is a very useful effect that greatly improves the convenience of work.

본 발명의 반도체용 캐리어 이송장치에 의하면 이물질이 제거된 상태로 이동하는 캐리어의 표면 상태를 실시간 확인하면서 불량을 제거할 수 있으므로 작업의 신뢰성이 더욱 향상되는 매우 유용한 효과가 발휘된다.According to the carrier transfer device for semiconductors of the present invention, defects can be eliminated while checking the surface state of the carrier moving in the state in which foreign substances have been removed, thereby exhibiting a very useful effect of further improving the reliability of the work.

본 발명의 바람직한 실시 예를 첨부된 도면에 의거 구체적으로 살펴본다.A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 정면도, 도 2는 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 평면도, 도 3은 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 측면도, 도 4는 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 작용도이다.1 is a front view showing a carrier transfer apparatus for a semiconductor to which the present invention is applied, FIG. 2 is a plan view showing a carrier transfer apparatus for a semiconductor to which the present invention is applied, and FIG. 3 shows a carrier transfer apparatus for a semiconductor to which the present invention is applied. Side view, Figure 4 is a functional diagram showing a carrier transfer device for a semiconductor to which the present invention is applied.

본 발명의 반도체용 캐리어 이송장치(100)에 의하면 도 1 내지 도 4에 도시된 바와 같이 크게, 캐리어(10)를 적층하여 올려놓을 수 있도록 형성된 장전 틀(120), 상기 적층된 캐리어를 하나씩 내려놓도록 형성된 상/하부 핑거(140a, 140b)) 및 상기 내려진 캐리어를 이동시키기 위한 컨베이어(160)로 구성된다.According to the carrier carrier device 100 for semiconductor of the present invention, as shown in FIGS. 1 to 4, the loading frame 120 formed so that the carrier 10 can be stacked and placed thereon, the stacked carriers are lowered one by one. Upper and lower fingers 140a and 140b formed to be placed) and a conveyor 160 for moving the lowered carrier.

먼저, 본 발명을 적용하기 위한 캐리어(10)는 도 2 및 도 4에 도시된 바와 같이 윗면에는 반도체를 올려놓을 수 있도록 다수 개의 적재 면(12)이 등 간격에 형성되고, 그 양 측면에는 손으로 들어올릴 수 있도록 걸림 홈(14)이 형성된 상태에서 상하 여러 개를 적재할 수 있도록 구성된다.First, in the carrier 10 for applying the present invention, as shown in FIGS. 2 and 4, a plurality of loading surfaces 12 are formed at equal intervals so that semiconductors can be placed on the upper surfaces thereof, and the hands on both sides thereof. It is configured to be able to load a plurality of up and down in the state in which the locking groove 14 is formed to be lifted.

상기 장전 틀(120)은 이와 같은 캐리어(10)를 적층하여 올려놓을 수 있도록 형성된다. 즉, 각 도면에 도시된 바와 같이 위로부터 캐리어(10)를 쌓아 올릴 수 있도록 하면서 전후좌우로 넘어지지 않도록 지지할 수 있도록 구성된다.The loading frame 120 is formed to stack and place such a carrier (10). That is, as shown in each figure is configured to be supported so as not to fall back and forth, left and right while stacking the carrier 10 from above.

상기 상/하부 핑거(140a, 140b)는 상기 장전 틀(120) 하부의 양 측면에 각각 상하로 설치되어 최하층 캐리어(10)와 그 바로 위에 적층된 캐리어(10)의 걸림 홈(14)으로 번갈아 출입하면서 전체 캐리어(10)를 하나씩 내려놓도록 형성된다.The upper and lower fingers 140a and 140b are alternately installed on both sides of the lower side of the loading frame 120 and alternately to the lowermost carrier 10 and the locking grooves 14 of the carrier 10 stacked thereon. It is formed to put down the whole carrier 10 one by one while entering and leaving.

즉, 도 4에 도시된 바와 같이 최초 실린더의 작동에 의해 상부 핑거(140a는 후퇴하고 하부 핑거(140b)는 전진한 상태로 걸림 홈(14)을 걸어 최하층의 캐리어(10)를 받쳐준다. 이어 상부 핑거(140a)가 전진하면서 최하층 캐리어(10) 바로 위에 있는 캐리어(10)의 걸림 (14)홈을 걸어 받쳐주면서 하부 핑거(140b)가 후퇴하여 최하층 캐리어(10)를 내려놓게 된다. 이와 같은 상태에서 다시 하부 핑거(140b)가 전진한 후 상부 핑거(140a)가 후퇴하면 적층된 캐리어(10)가 전체적으로 내려 않으면서 최초 하부 핑거(140b)에 안착된 상태로 반복되는 것이다. 이때, 상부 핑거(140a)에 받쳐진 캐리어(10) 전체를 하부 핑거(140b) 위에 내려놓는 과정에서 충격이 발생하고, 그 충격으로 인해 캐리어(10)에 달라붙은 이물질이 떨어져 나갈 수 있게 된다.That is, as shown in FIG. 4, the upper finger 140a is retracted by the operation of the initial cylinder, and the lower finger 140b is supported by the latch groove 14 while supporting the carrier 10 of the lowermost layer. As the upper finger 140a moves forward, the lower finger 140b retreats to support the hook 14 groove of the carrier 10 directly above the lowermost carrier 10 to lower the lowermost carrier 10. After the lower finger 140b moves forward in the state again, when the upper finger 140a retreats, the stacked carrier 10 is repeated while being seated on the first lower finger 140b without being lowered as a whole. An impact occurs in the process of laying down the entire carrier 10 supported by 140a on the lower finger 140b, and foreign matters stuck to the carrier 10 may fall out due to the impact.

상기 컨베이어(160)는 상기 상/하부 핑커(140a, 140b)의 하부에 설치되어 내려진 캐리어(10)를 이동시키도록 형성된다. 이때, 상기 컨베이어(160)는 각 도면에 도시된 바와 같이 캐리어(10)의 좌우 테두리가 안착된 상태로 전진하도록 좌우 한 쌍으로 구성될 수 있으며, 그 전 후 끝단에는 각 도면에 도시된 바와 같이 컨베이 어(160)의 장력을 조절하기 위한 통상의 장력조절장치(미설명 부호)가 구성될 수 있다.The conveyor 160 is formed to move the carrier 10 installed on the lower portion of the upper and lower pinkers 140a and 140b. At this time, the conveyor 160 may be configured in a pair of left and right so as to move forward in a state in which the left and right edges of the carrier 10 are seated, as shown in each drawing, and before and after the end as shown in each drawing Conventional tension control device (not shown) for adjusting the tension of the conveyor 160 may be configured.

한편, 본 발명의 반도체용 캐리어 이송장치(100)는 상기 컨베이어(160)에 올려져 이동하는 캐리어(10) 상의 이물질을 흡입하여 제거하도록 진공 흡입실(180)이 구성될 수 있다. 즉, 각 도면에 도시된 바와 같이 상기 진공 흡입실(180)은 장전 틀(120)로부터 컨베이어(160)에 올려진 캐리어(10) 주변에 공기를 뿌려 이물질을 떨어뜨린 후 이를 다시 흡입함으로써 이물질을 제거할 수 있도록 형성되는 것이다.Meanwhile, the semiconductor carrier transport apparatus 100 of the present invention may be configured with a vacuum suction chamber 180 to suck and remove foreign substances on the carrier 10 which is mounted on the conveyor 160 and moved. That is, as shown in each drawing, the vacuum suction chamber 180 sprays air around the carrier 10 mounted on the conveyor 160 from the loading frame 120 to drop foreign substances and sucks them again. It is formed to be removable.

아울러, 본 발명의 반도체용 캐리어 이송장치(100)는 도 1에 도시된 바와 같이 상기 진공 흡입실(180)을 통과한 캐리어(10)의 불량이나 이물질을 검사하기 위한 카메라(200) 및 상기 카메라(200)에 의해 촬영된 영상을 출력하기 위한 모니터(220)가 구성될 수 있다. 즉, 캐리어(10) 검사는 사람의 육안으로 이루어지는데, 이와 같은 작업이 간편하게 이루어질 수 있도록 카메라(200)와 모니터(220)가 구성되는 것이다.In addition, the carrier carrier for semiconductor 100 of the present invention is a camera 200 and the camera for inspecting the defect or foreign matter of the carrier 10 passed through the vacuum suction chamber 180 as shown in FIG. The monitor 220 for outputting the image photographed by the 200 may be configured. That is, the inspection of the carrier 10 is made by the human eye, and the camera 200 and the monitor 220 are configured to simplify the operation.

따라서 이와 같은 본 발명의 반도체용 캐리어 이송장치(100)에 의하면 캐리어(10)를 다수 개 적층한 상태에서 아래로부터 하나씩 순차적으로 내리면서 이물질을 제거한 후 이송시킴으로써 작업의 편리성이 크게 향상될 뿐만 아니라, 이물질이 제거된 상태로 이동하는 캐리어(10)의 표면 상태를 실시간 확인하면서 불량을 제거할 수 있으므로 작업의 신뢰성이 더욱 향상될 수 있게 된다.Therefore, according to the carrier carrier for semiconductor device 100 of the present invention as described above, in the state of stacking a plurality of carriers 10, one by one from the bottom, while removing the foreign matter and transported after removing the greatly improved work convenience as well as In addition, since the defect can be removed while checking the surface state of the carrier 10 moving in the state where the foreign matter is removed, the reliability of the work can be further improved.

이상 살펴본 바와 같은 본 발명은 도면에 도시된 일 실시 예를 참고로 설명되었으나 이는 예시적인 것에 불과하며 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적인 보호 범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.Although the present invention as described above has been described with reference to one embodiment shown in the drawings, this is merely exemplary and various modifications and equivalent other embodiments are possible to those skilled in the art. I will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

도 1은 본 발명이 바람직한 실시예의 반도체용 캐리어 이송장치를 도시한 정면도.1 is a front view showing a carrier transfer apparatus for a semiconductor of a preferred embodiment of the present invention.

도 2는 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 평면도.Figure 2 is a plan view showing a carrier transfer device for a semiconductor to which the present invention is applied.

도 3은 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 측면도.Figure 3 is a side view showing a carrier transfer device for semiconductor to which the present invention is applied.

도 4는 본 발명이 적용된 반도체용 캐리어 이송장치를 도시한 작용도.Figure 4 is a functional diagram showing a carrier transfer device for a semiconductor to which the present invention is applied.

<도면의 주요 부분에 대한 부호의 간단한 설명><Brief description of symbols for the main parts of the drawings>

10: 캐리어10: carrier

12: 적재 면12: loading surface

14: 걸림 홈14: jamming groove

100: 이송장치100: feeder

120: 장전 틀120: loading frame

140a, 140b: 상/하부 핑거140a, 140b: upper and lower fingers

160: 컨베이어160: conveyor

180: 진공 흡입실180: vacuum suction chamber

200: 카메라200: camera

220: 모니터220: monitor

Claims (3)

삭제delete 윗면에는 반도체를 올려놓을 수 있도록 다수 개의 적재 면이 등 간격에 형성되고, 그 양 측면에는 상/하부 핑거가 들어올릴 수 있도록 걸림 홈이 형성된 캐리어를 적층하여 올려놓을 수 있도록 형성된 장전 틀;A loading frame having a plurality of stacking surfaces formed at equal intervals so as to place semiconductors on the upper surface thereof, and stacked carriers formed on both sides of the carrier having a locking groove formed thereon so as to lift the upper / lower fingers; 상기 장전 틀 하부의 양 측면에 각각 상하로 설치되어 최하층 캐리어와 그 위층 캐리어의 걸림 홈으로 번갈아 출입하면서 적층된 캐리어를 하나씩 내려놓도록 형성된 상/하부 핑거; 및Upper and lower fingers respectively installed on both sides of the lower part of the loading frame and formed to lower the stacked carriers one by one while alternately entering and exiting into the locking grooves of the lowermost carrier and the upper carrier; And 상기 상/하부 핑거의 하부에 설치되어 내려진 캐리어를 이동시키도록 형성된 컨베이어; 상기 컨베이어에 올려져 이동하는 캐리어 상의 이물질을 흡입하여 제거하도록 형성된 진공 흡입실;을 구성하여 이루어진 것을 특징으로 하는 반도체용 캐리어 이송장치.A conveyor formed to move a carrier provided at a lower portion of the upper and lower fingers; And a vacuum suction chamber formed to suck and remove foreign substances on a carrier that is mounted on the conveyor. 제 2항에 있어서, 상기 진공 흡입실을 통과한 캐리어를 검사하기 위한 카메라; 및 상기 카메라에 의해 촬영된 영상을 출력하기 위한 모니터;를 구성하여 이루어진 것을 특징으로 하는 반도체용 캐리어 이송장치.The apparatus of claim 2, further comprising: a camera for inspecting a carrier passing through the vacuum suction chamber; And a monitor for outputting the image photographed by the camera.
KR1020080068444A 2008-07-15 2008-07-15 Transfer Device for Semi-conductor carrier KR101040974B1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126900U (en) * 1986-02-04 1987-08-12
JPH07172507A (en) * 1993-12-15 1995-07-11 Mitsubishi Electric Corp Taking-out device for magazine for accommodating semiconductor device and taking-out method thereof
JP2004031401A (en) 2002-06-21 2004-01-29 Daihen Corp Device for switching cover member and station with the same
JP2004277003A (en) 2002-05-07 2004-10-07 Corning Japan Kk Container for large-sized sheet and apparatus for loading and taking out large-sized sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126900U (en) * 1986-02-04 1987-08-12
JPH07172507A (en) * 1993-12-15 1995-07-11 Mitsubishi Electric Corp Taking-out device for magazine for accommodating semiconductor device and taking-out method thereof
JP2004277003A (en) 2002-05-07 2004-10-07 Corning Japan Kk Container for large-sized sheet and apparatus for loading and taking out large-sized sheet
JP2004031401A (en) 2002-06-21 2004-01-29 Daihen Corp Device for switching cover member and station with the same

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