KR101037537B1 - Method of manufacturing outward form of printed circuit board - Google Patents

Abstract

The present invention relates to a method of processing an external shape of a printed circuit board, and after preparing a processing member for processing the external shape of the printed circuit board, the processing member is connected to an ultrasonic wave generator to be driven by ultrasonic application, and the ultrasonic wave And driving the processing member through ultrasonic waves applied from the generator to process the outer shape of the printed circuit board.

Printed Circuit Board, Ultrasonic Generator, Ultrasonic Processing, Machining Member

Description

External processing method of printed circuit board {Method of manufacturing outward form of printed circuit board}

The present invention relates to a method for processing the appearance of a printed circuit board (PCB). More specifically, the present invention manufactures a processing member based on the printed circuit board appearance, and attaches the processing member to the ultrasonic processing apparatus, and then processes the printed circuit board exterior by using ultrasonic waves, thereby processing the external processing of the printed circuit board. It relates to an external processing method of a printed circuit board that can be easily implemented.

Recently, as society's demand for high performance and miniaturization of electronic products increases, printed circuit boards, which are an essential component of electronic products, have also become increasingly high performance and miniaturized. Therefore, research on the processing method of the printed circuit board appearance as well as research on the processing method of the printed circuit board is being actively conducted.

As the appearance of printed circuit boards is getting smaller, the number of pieces per unit area of printed circuit boards is increasing, and there is a need for a method for more easily processing the appearance of printed circuit boards.

Hereinafter, a method of external appearance processing of a printed circuit board according to the related art will be described with reference to FIGS. 8 and 9.

8 illustrates a drill processing method of the external processing method of a printed circuit board according to the prior art. First, the printed circuit board 10 is fixed on the work table 30, and the mark of the printed circuit board 10 is recognized. After confirming the position, the outline of the printed circuit board 10 is processed using the drill 20 according to the outline processing data.

However, in the above-described drill processing method, when the size of the printed circuit board 10 is small or complicated in shape, the machining length is increased and productivity is reduced. In addition, when processing the appearance of the printed circuit board 10 by using the drill 20, various problems occur, such as a burr or roughened processing surface on the printed circuit board 10.

Meanwhile, FIG. 9 illustrates a mold processing method of an external shape processing method of a printed circuit board according to the prior art. First, a jig 60 into which the printed circuit board 10 can be inserted is mounted inside the press mechanism 40. Thereafter, the printed circuit board 10 is inserted into the jig 60, and the press mechanism 40 is operated to process the outer shape of the printed circuit board 10 using the processing unit 50.

However, the mold processing method as described above has a variety of problems, first of all, the mold manufacturing cost is expensive, the processed surface of the printed circuit board 10 after the processing is often rough and burrs (burr) or processing residues are often generated. In addition, the pad (pad) may fall on the processed surface, there were various problems such as additionally required for the pre-mold processing step for processing the size of the sheet.

As described above, the external processing method of a printed circuit board according to the prior art, such as a drill processing method or a mold processing method, generates burrs or debris from processing materials on the processing surface, and the processing surface is not smooth. Not many problems, such as expensive processing.

Therefore, there is an urgent need to improve the appearance processing method of the printed circuit board, which can not only process the appearance of the printed circuit board more neatly and easily, but also increase the productivity and reduce the processing cost.

Accordingly, in the present invention, as a result of extensive research to solve the above problems, after manufacturing the processing member based on the printed circuit board appearance and attaching the processing member to the ultrasonic processing device, the appearance of the printed circuit board using ultrasonic waves The present invention has been found to facilitate the external processing of a printed circuit board by processing the present invention.

The external processing method of the printed circuit board according to the preferred embodiment of the present invention is:

Preparing a processing member for processing the appearance of the printed circuit board;

Connecting the processing member to an ultrasonic generator so as to be driven by ultrasonic application; And

Driving the processing member through ultrasonic waves applied from the ultrasonic wave generator to process an outer shape of the printed circuit board;

Characterized in that it comprises a.

In the above method,

The processing member includes an ultrasonic wave transmitting part and an acute angle part, and the ultrasonic wave transmitting part transmits the ultrasonic wave generated from the ultrasonic wave generating device to the acute angle part to process the external shape of the printed circuit board.

The processing member, preferably,

The processing member is formed on a panel-shaped ultrasonic wave transmitting portion and the ultrasonic wave transmitting portion, characterized in that it has an acute angle of the shape corresponding to the outer shape of the printed circuit board.

The processing member is characterized in that it has a rotatable cylindrical ultrasonic transmission portion and an acute angle mounted to the ultrasonic transmission portion.

In addition, the processing member is attached to the head portion of the ultrasonic generator, characterized in that the ultrasonic wave generated from the ultrasonic generator is applied to the processing member through the head portion.

In addition, the processing member is inserted into the groove of the head portion of the ultrasonic generator is rotatably mounted, characterized in that the ultrasonic wave generated from the ultrasonic generator is applied to the processing member through the head portion.

The ultrasonic generator, preferably,

A computer numerical control system (CNC) is provided.

In addition, when processing the outer shape of the printed circuit board, it characterized in that the processing by inserting the ceramic processing particles and the working liquid.

According to the present invention, by processing the external shape of the printed circuit board using the ultrasonic waves applied from the ultrasonic generator, unlike the conventional drill processing method or the mold processing method, the appearance of the printed circuit board more neat and easy to process and processing step You can also zoom out.

Accordingly, it is possible to provide an external processing method of a printed circuit board which not only facilitates the external processing of the printed circuit board but also increases productivity and reduces processing costs.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

Throughout the accompanying drawings, the same or corresponding components are referred to by the same or similar reference numerals, and redundant descriptions are omitted. In addition, in the following description of the present invention, specific descriptions of other well-known technologies may be omitted for the convenience of description while clarifying the features of the present invention. In this specification, terms such as first and second are used to distinguish one component from another component, and a component is not limited by the terms.

Hereinafter, with reference to the accompanying drawings of the present invention in more detail.

1 to 7 are views for explaining the external processing method of a printed circuit board using ultrasonic waves according to the present invention.

In general, the ultrasonic processing device is a device for processing an apparatus by ultrasonic vibration, and refers to a device for finely cutting an object by a momentary impact of a medium relative to a tool coupled to the vibration unit. The source of the ultrasonic processing device is manufactured by using the characteristics of ultrasonic waves, which are frequencies outside the range of human emotion, among sound waves (voice energy), which is a category of wave energy, and when the range is subdivided, it is divided into informational and dynamic aspects of ultrasonic waves. It can be made using the dynamic part of this.

Hereinafter, a method of processing an outline of a printed circuit board according to the present invention will be described with reference to FIGS. 1 to 7.

First, as a first step, the processing members 210 and 220 for processing the external shape of the printed circuit board 100 are prepared. The processing members 210 and 220 may be formed of a panel-shaped processing member 210 or a cylindrical processing member 220 according to the outer shape of the printed circuit board 100 (see S110 of FIG. 1).

That is, the panel-shaped processing member 210 according to the first embodiment is composed of a first ultrasonic wave transmitting unit 211 and a first acute angle unit 212, the first ultrasonic wave transmitting unit 211 from the first ultrasonic device The generated ultrasonic waves are transmitted to the first acute angle portion 212 via the first head portion 310 to process the external shape of the printed circuit board 100.

The cylindrical machining member 220 according to the second embodiment includes a second ultrasonic wave transmitting unit 221 and a second acute angle unit 222, and the second ultrasonic wave transmitting unit 221 is generated from the second ultrasonic wave generating device. The processed ultrasonic wave is transmitted to the second acute angle part 222 via the second head part 320 to process the external shape of the printed circuit board 100.

Next, as a second step, the processing members 210 and 220 are connected to the ultrasonic wave generator 300 so as to be driven by ultrasonic application (see S120 of FIG. 1).

That is, the panel-shaped processing member 210 according to the first embodiment is attached to the head portion 310 of the first ultrasonic wave generator. The first ultrasonic wave generator generates ultrasonic waves, and includes a computer numerical control system (CNC), so that the position and processing position of the printed circuit board 100 can be automatically recognized by the mark recognition of the printed circuit board 100. have.

The panel processing member 210 is attached to the lower portion of the first head 310 so that ultrasonic waves generated from the first ultrasonic generator are applied to the panel processing member 210 via the first head 310. Be sure to

According to another embodiment, the cylindrical machining member 220 is attached to the head portion 320 of the second ultrasonic generator. Similarly, the second ultrasonic wave generator generates ultrasonic waves, and includes a CNC so that the position and processing position of the printed circuit board 100 can be automatically recognized by mark recognition.

The cylindrical machining member 220 is rotatably mounted in a groove of the second head portion 320 of the second ultrasonic generator, and ultrasonic waves generated from the second ultrasonic generator are transmitted through the second head portion 320. It is to be applied to the cylindrical machining member 220.

Next, as a third step, the printed circuit board 100 is fixed to the work table 150 and the ultrasonic wave is applied to the processing members 210 and 220 from the ultrasonic wave generator 300 to process the outline of the printed circuit board 100 ( See S130 of FIG. 1).

The ultrasonic wave generating apparatus 300 may include a computer numerical control system (CNC). The ultrasonic wave generating apparatus 300 checks the mark of the printed circuit board 100 to determine the position of the printed circuit board 100 and processes the appearance.

In the first embodiment, as shown in Figures 2 to 4, the panel-shaped processing member 210 attached to the first ultrasonic wave generating head 310, the ultrasonic wave generated by the first ultrasonic wave generating apparatus 300 The printed circuit board 100 is processed by being applied through the first head 310. That is, the ultrasonic wave applied to the first head part 310 is transmitted to the first ultrasonic wave transmitting part 211 so that the first acute angle part 212 substantially processes the external shape of the printed circuit board 100 using pressure. In this case, in order to increase the workability, it is also possible to process the ceramic working particles such as alumina and the workpiece solution.

In the second embodiment, as shown in FIGS. 5 to 7, the cylindrical processing member 220 inserted into the groove of the second head portion 320 and rotatably mounted is generated by the ultrasonic generator 300. Ultrasonic waves are applied through the second head part 320 to process the printed circuit board 100. That is, the ultrasonic wave applied through the second head part 320 is transmitted to the second ultrasonic wave transmitting unit 221, and the second acute angle portion 222 of the second ultrasonic wave transmitting unit 221 rotating at a constant pressure is substantially. The outer shape of the printed circuit board 100 is processed. In this case, when processing the outer shape of the printed circuit board 100, in order to increase the workability, it may be processed by inserting a ceramic working particles such as alumina and a work solution.

Since the external processing method of the printed circuit board according to the present invention uses ultrasonic waves, there is a significant possibility that a rough punched surface is generated or processing residues such as burrs are generated as compared with conventional drill processing or mold processing methods. Low dimension tolerance. In addition, by using the panel-shaped processing member 210 and the cylindrical processing member 220 can be processed the outer shape of the printed circuit board of the same shape.

In addition, the present invention can reduce the processing step because the sheet processing step included in the conventional method is unnecessary, and thus the processing time and processing cost are significantly reduced.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the external processing method of the printed circuit board according to the present invention is not limited thereto. It is apparent that modifications and improvements are possible by those skilled in the art.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of the present invention will be apparent from the appended claims.

1 is a process flowchart schematically shown to explain the external processing method of a printed circuit board according to the present invention.

Figure 2 is a schematic cross-sectional view for explaining the external processing method of a printed circuit board using a processing member according to an embodiment of the present invention.

3 is a cross-sectional view for explaining a state in which a processing member is mounted on a head portion of an ultrasonic wave generator in an external processing method of a printed circuit board according to an exemplary embodiment of the present invention.

4 is a cross-sectional view schematically illustrating a method of processing an outline of a printed circuit board according to an exemplary embodiment of the present disclosure.

FIG. 5 is a cross-sectional view schematically illustrating an external processing method of a printed circuit board using a processing member according to an exemplary embodiment of the present invention.

6 is a cross-sectional view illustrating a state in which a processing member is mounted on a head of an ultrasonic wave generating apparatus in the external processing method of a printed circuit board according to an exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view schematically illustrating the external processing method of a printed circuit board according to an exemplary embodiment of the present disclosure.

8 is a schematic view showing a drill processing method of the external processing method of a conventional printed circuit board.

9 is a schematic view showing a mold processing method of the external processing method of the conventional printed circuit board.

[Description of Reference Numerals]

100: printed circuit board 210: panel shape processing member

211: first ultrasonic wave transmitting unit 212: first acute angle unit

220: cylindrical cylindrical machining member 221: second ultrasonic wave transmission unit

222: second acute angle 310: head portion of the first ultrasonic generator

320: head portion of the second ultrasonic generator

Claims (8)

(a) preparing a processing member for cutting the contour of the printed circuit board; (b) connecting the processing member to an ultrasonic wave generator to be driven by ultrasonic application; And (c) cutting the external shape of the printed circuit board by driving the processing member through ultrasonic waves applied from the ultrasonic wave generating apparatus; Appearance processing method of a printed circuit board comprising a. The method according to claim 1, The processing member includes an ultrasonic wave transmitting portion and an acute angle portion, and the ultrasonic wave transmitting portion transmits the ultrasonic waves generated from the ultrasonic wave generating unit to the acute angle portion to process the external shape of the printed circuit board. Processing method. The method according to claim 2, The processing member is formed on a panel-shaped ultrasonic wave transmitting portion and the ultrasonic wave transmitting portion of the external processing method of the printed circuit board, characterized in that it has an acute angle of the shape corresponding to the external shape of the printed circuit board. The method according to claim 2, And the processing member has a rotatable cylindrical ultrasonic transfer unit and an acute angle portion mounted to the ultrasonic transfer unit. The method of claim 3, The processing member is attached to the head portion of the ultrasonic wave generating apparatus, the ultrasonic wave generated from the ultrasonic generator is applied to the processing member through the head portion, the external processing method of the printed circuit board. The method according to claim 4, The processing member is inserted into the groove of the head portion of the ultrasonic generator is rotatably mounted, and the ultrasonic wave generated from the ultrasonic generator is applied to the processing member through the head portion. The method according to claim 1, The ultrasonic wave generating apparatus includes a computer numerical control system (CNC). The method according to claim 1, When processing the external shape of the printed circuit board, the external processing method of the printed circuit board, characterized in that the processing by inserting the ceramic processing particles and the work solution.

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