KR101030541B1 - Tool assembly in device for scribing /breaking liquid crystal display substrate - Google Patents

Abstract

The present invention discloses a tool assembly for an LCD substrate cutting device capable of uniform and accurate cutting. To this end, the present invention is a wheel configured to create a crack in the LCD substrate; A holder configured to rotatably support the wheel; And a head rotatably receiving the holder and movably installed in the LCD substrate cutting device. And it provides a tool assembly for the LCD substrate cutting device comprising a cover which is installed in the holder to prevent chips generated during the cutting of the LCD substrate between the holder and the head.

LCD, Cutting Device, Tool Assembly

Description

TOOL ASSEMBLY IN DEVICE FOR SCRIBING / BREAKING LIQUID CRYSTAL DISPLAY SUBSTRATE}

1 is an exploded perspective view showing the structure of a typical LCD panel;

2 is a flowchart illustrating a manufacturing process of a general LCD panel;

3A and 3B are partial cross-sectional and side views showing a scribe tool assembly of a typical LCD substrate cutting device;

4 is a schematic view showing an LCD substrate cutting device according to the present invention;

5 is an exploded perspective view showing a tool assembly of the LCD substrate cutting device according to the present invention;

6 is a side view showing a tool assembly of the LCD substrate cutting device according to the present invention;

7 is a plan view showing a tool assembly of the LCD substrate cutting device according to the present invention;

8 is a side sectional view showing a modification of the cover of the tool assembly according to the present invention; And

9 is a plan view showing another modification of the cover of the tool assembly according to the present invention.

The present invention relates to a liquid crystal display panel (hereinafter, referred to as a liquid crystal display), and more particularly, to an apparatus for cutting a bonded LCD substrate into predetermined unit panels.

In general, LCD panels have characteristics such as low voltage driving, low power consumption, full color implementation, and light weight and small size, and are therefore widely used in watches, calculators, PC monitors, notebooks, and the like. Usage is becoming diversified. The general structure of such an LCD panel is shown in FIG.

As shown, the LCD panel includes a lower substrate 1 and an upper substrate 2 bonded to each other with a predetermined space, and a liquid crystal layer 3 injected between the lower substrate 1 and the upper substrate 2. Consists of.

More specifically, the lower substrate 1 has a plurality of gate lines 4 arranged in one direction at regular intervals to define the pixel region P, and in a direction perpendicular to the gate lines 4. A plurality of data lines 5 are arranged at regular intervals, and a pixel electrode 6 is formed in each pixel region P where the gate line 4 and the data line 5 intersect, and each gate line The thin film transistor T is formed at a portion where (4) and the data line 5 intersect.

The upper substrate 2 includes a black matrix layer 7 for blocking light in portions other than the pixel region P, an R, G, B color filter layer 8 for expressing color colors, and an image. The common electrode 9 is formed to implement.

The thin film transistor T may include a gate electrode protruding from the gate line 4, a gate insulating film (not shown) formed on the front surface, an active layer formed on the gate insulating film above the gate electrode, and the data. A source electrode protruding from the line 5 and a drain electrode facing the source electrode. The pixel electrode 6 uses a transparent conductive metal having a relatively high light transmittance, such as indium-tin-oxide (ITO).

In the above-described LCD panel, the liquid crystal layer 3 located on the pixel electrode 6 is oriented by a signal applied from the thin film transistor T, and the liquid crystal layer 3 according to the degree of alignment of the liquid crystal layer 3. ), The image can be expressed by adjusting the amount of light passing through.

Referring to Figure 2 will be described a manufacturing method of a general LCD panel as follows.

First, a cassette (not shown) on which a plurality of TFT substrates are loaded and a cassette (not shown) on which a plurality of color filter substrates are loaded are respectively loaded on each port by a loader. It is seated.

The TFT substrate (ie, the lower substrate 1) is arranged with a plurality of gate lines arranged in one direction at regular intervals by an array process and at regular intervals in a direction perpendicular to the respective gate lines. A plurality of thin film transistors and pixel electrodes are respectively formed in a plurality of data lines and a matrix pixel area defined by the gate line and the data line. In addition, a black matrix layer, a color filter layer, a common electrode, and the like are formed on the color filter substrate (that is, the upper substrate 2) to block light in portions other than the pixel region.

Subsequently, the TFT substrate and the color filter substrate are selected using a robot arm programmed to select one of the plurality of TFT substrates and the plurality of color filter substrates, respectively. Subsequently, after the alignment material is applied onto the selected TFT substrate and the color filter substrate, an alignment process S10 is performed in which the liquid crystal molecules have uniform orientation. The alignment process (S10) proceeds in order of washing before coating the alignment film, alignment film printing, alignment film firing, alignment film inspection, rubbing process.

After the alignment process (S10), the TFT substrate and the color filter substrate are cleaned (S20), respectively, and then a silver dispensing device for electrical connection with the common electrode on the color filter substrate in a predetermined region on the TFT substrate. The silver (Ag) dot is applied using (S30). After spreading a spacer (S40) to maintain a constant cell gap on the TFT substrate (S40) and applying a yarn pattern to an outer portion of the color filter substrate (S50), the TFT Pressure is applied to the substrate and the color filter substrate to bond and cure (S60). That is, the TFT substrate and the color filter substrate are each manufactured in different lines, but the subsequent process is performed in a single line from the bonding process.

On the other hand, the TFT substrate and the color filter substrate are formed of a plurality of regions on a large glass substrate facing each other. In other words, a plurality of unit substrate regions are formed in a large area glass substrate, and separate pixel electrodes are formed in lower unit substrate regions of the unit substrate region. In addition, in the large area glass substrate including the upper unit substrate (color filter substrate) regions, a common electrode for driving a liquid crystal together with the pixel electrode is formed on the entire surface of the glass substrate. Therefore, the glass substrate is cut / processed by applying voltages corresponding to pixel electrodes of unit panels of a predetermined standard to produce respective unit panels according to transmittances corresponding to the respective unit panels (S70).

Thereafter, the liquid crystal layer is formed by injecting liquid crystal through the liquid crystal inlet into the individual unit panels processed as described above and encapsulating the liquid crystal inlet (S80). Subsequently, after cutting the cut surface of each unit panel to produce a completed LCD panel, finally, the appearance and electrical failure inspection (S90) of the completed unit LCD panel is performed.

In the cutting step (S70) of the series of manufacturing processes, a cutting device (scribing / breaking device) designed to be suitable for cutting the bonded LCD substrate into a unit panel is used. The cutting device first forms a vertical crack in the bonded LCD substrate using the tool assembly shown in FIGS. 3A and 3B, precisely a scribe tool assembly. Thereafter, the cutting device uses a break bar (not shown) to apply a force to the cracked portion and grow the crack to separate the unit LCD panel having a predetermined size from the LCD substrate.

In such a cutting device, the tool assembly consists of a wheel 1, a holder 2, a pin 3 and a head 4 as shown. As shown in detail in FIG. 3A, the wheel 1 has an edge 1a that causes cracks in the bonded LCD substrate. The pins 3 connect these wheels 1 / holders 2 to mount the wheels 1 to the holders 2. The holder 2 is rotatably mounted to the head 4, and the head 4 is mounted to a moving mechanism of the LCD substrate cutting device so that the entire tool assembly can be transferred to a desired position.

In such a tool assembly, generally the holder 2 is properly rotated with respect to the head 4 during operation of the cutting device so that the wheel 1 can cause cracking according to the predetermined shape of the LCD panel. do. However, when the wheel 1 cracks the LCD substrate, a large amount of chips are generated from the LCD substrate, and these chips enter between the head 4 and the holder 2. Therefore, the rotation of the wheel 1 is not smoothly performed, so that the crack state worsens. In particular, this phenomenon occurs in the lower tool assembly which is likely to enter the chip between the head 4 and the holder 2. do. As a result, due to the formation of poor cracks, the cut state of the LCD substrate is also poor.

The present invention has been devised to solve the above problems, and an object of the present invention is to provide a tool assembly of an LCD substrate cutting device which prevents chips from entering between components.

In order to achieve the above object, the present invention is a wheel configured to create a crack in the LCD substrate; A holder configured to rotatably support the wheel; And a head rotatably receiving the holder and movably installed in the LCD substrate cutting device. And it provides a tool assembly for the LCD substrate cutting device comprising a cover which is installed in the holder to prevent chips generated during the cutting of the LCD substrate between the holder and the head.

The cover is formed larger than a portion of the holder accommodated in the head, and thus is configured to cover the head. The cover is configured to isolate the head from the wheel while dividing between the wheel and the head.

Preferably, such a cover consists of a plate member extending substantially from the holder between the head and the wheel.

By the above-described present invention, the tool assembly enables accurate and uniform cutting, thereby lowering the defective rate and the production cost of the unit LCD panel produced.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention in which the above objects can be specifically realized are described with reference to the accompanying drawings. In describing the present embodiment, the same name and the same reference numerals are used for the same configuration and additional description thereof will be omitted below.

In the present invention, although the LCD panel cutting device is not shown, basically the LCD substrate entered into the loader unit 10, the LCD substrate entered in the loader unit 10 to enter the bonded substrate in order to proceed with the cutting unit unit substrate It consists of a scribe portion 20 to form a crack along the brake portion 30 to cut the substrate by applying a force to the crack formed in the scribe portion 20. The cutting device includes: an adsorption plate unit 40 for lifting and conveying the LCD substrate cut into unit panels at one time; a separation table 50 and substrates separated from the adsorption plate unit 40; It further includes an unloader unit 60 is moved for the next process.

The scribe portion 20 and the brake portion 30 are preferably the first and second scribe / brake portions 20a, 20b, 30a, 30b having the same function in order to efficiently perform the cutting operation of the LCD substrate Divided into. The suction plate unit 40 transfers the unit panels completely separated from the brake unit 30b to the separation table 50 while moving between the second brake unit 30b and the separation table 50. Also, during the cutting process, a transfer roller 70a and robots 70b for transporting the substrate to each work area are disposed in the cutting device.

In such a cutting device, the scribe portion 20 uses a tool assembly configured to form a crack in the LCD substrate, and the tool assembly will be described in detail as follows.

5 is an exploded perspective view showing a tool assembly of the LCD substrate cutting device according to the present invention. 6 is a side view showing the tool assembly of the LCD substrate cutting apparatus according to the present invention, Figure 7 is a plan view showing the tool assembly of the LCD substrate cutting apparatus according to the present invention.

As shown, the tool assembly 100 of the cutting device according to the invention consists entirely of a wheel 110 and a holder 120 and a head 130 for operably supporting the wheel 110.

Basically, the wheel 110 is configured to form a crack in the LCD substrate. In more detail, a cutting edge 111 is continuously formed on the outer circumference of the wheel 110, and the cutting edge 111 contacts with the LCD substrate with a predetermined load during rotation of the wheel 110 to crack. Generate. In addition, the wheel 110 includes a hole formed at the center thereof, and the pin 110a is inserted into the hole so that the wheel 110 is mounted to the holder 120. Such a wheel 110 is generally made of cemented carbide to have a higher hardness than the LCD substrate, and may include synthetic diamond particles for longer service life. In addition, irregularities may be formed in the edge 111 to generate deeper cracks, and such wheels 110 are called penet wheels.

The holder 120 is configured to rotatably support the wheel 110. The holder 120 is formed thereon and has a first mounting portion 121 that mounts substantially the entire tool assembly to the cutting device, precisely the scribe portion 20. The first mounting portion 121 is rotatably installed on the moving mechanism of the scribe portion 20, precisely, the head 130. More specifically, the head 130 is formed with a seat 131, as shown in Figures 5 and 7, the first mounting portion 121 is accommodated in the seat 131. Thus, the entire tool assembly is moved to a desired position on the LCD substrate by the movement mechanism of the scribe portion 20. In addition, the holder 120, that is, the first mounting portion 121 is rotated at a predetermined angle in the receiving portion 131 of the head 130, so that the wheel 110 is set in a predetermined shape on the LCD substrate. Cracks occur along the shape of the unit LCD panel. The first mounting portion 121 is provided with a bearing, so that the entire first mounting portion 121 is smoothly rotated in the receiving portion 131 of the head 130.

In addition, the holder 120 is formed with a second mounting portion 122 for mounting the wheel 110 to itself. More specifically, the second mounting portion 122 is composed of first and second arms 122a and 122b formed parallel to each other to accommodate the wheel 110, as shown in FIGS. 5 and 7. . Fins 120a are installed in the first and second arms 122a and 122b while penetrating the wheel 110, and thus the wheel 110 is rotatably installed in the holder 120.

As mentioned above, a large amount of chips are generated from the substrate while the wheel 110 cracks the LCD substrate so that the holder 120 does not rotate smoothly. ) And the head 130. Therefore, in the present invention, as shown in Figures 5 to 7, respectively, the holder 120 is provided with a cover 140. Basically, the cover 140 is formed to be larger than at least a portion of the holder 120 accommodated in the head 130 to prevent the introduction of the substrate chips. That is, the cover 140 is formed larger than the receiving portion 131 of the head 130 and the first mounting portion 121 of the holder 120 inserted therein. Therefore, the cover 140 covers the accommodating part 131 and the first mounting part 121. In addition, the cover 140 is divided between the wheel 110 and the head 130 so that the chip does not reach the inserted first mounting portion 121, and thus the head 130 to the wheel Configured to isolate from 110. The cover 120 is a plate member extending horizontally between the head 130 and the wheel 110 from the holder 120 as shown in the practical. The cover 120, which is a plate member, is preferable because it has a simple form and is easy to install.

Meanwhile, chips are continuously generated while the cutting device is operating, and accumulated in the cover 120. To this end, it is preferable that the inclined surface 141 of a predetermined angle is formed on the cover 140, as shown in FIG. The generated chips slide along the inclined surface 141 instead of being stacked on the cover 140 and fall around the head 130 so as not to flow between the first mounting portion 121 and the receiving portion 131. . In addition, preferably, the cover 140 may be formed with a cutout 142, as shown in FIG. 9. The holder 120 may be easily coupled to the cover 140 through the cutout 142 and may be easily separated from the cover 140. Furthermore, as shown, the cover 140 is adjacent to the holder 120 and the head 130, so that it may be damaged while interfering with them during the operation of the cutting device. Therefore, the cover 140 is preferably made of a material of a lower strength than the holder 120 and the head 130 to prevent such damage. In particular, when the cover 140 is made of a flexible material such as rubber, it is more advantageous because damage to adjacent members can be prevented and mounting and detachment of the cover 140 can be easily performed.

As a result, the cover 140 as described above is installed in the holder 120 to prevent the chip from entering between the first mounting portion 121 and the receiving portion 131. Therefore, the first mounting portion 121 can be smoothly rotated in any case within the receiving portion 131, so that the wheel 110 can accurately and uniformly form cracks in the LCD substrate. .

Although several embodiments have been described above, it will be apparent to those skilled in the art that the present invention may be embodied in many other forms without departing from the spirit and scope thereof. Accordingly, the described embodiments are to be considered as illustrative and not restrictive, and all embodiments within the scope of the appended claims and their equivalents are included within the scope of the present invention.

In the tool assembly of the LCD substrate cutting device according to the present invention, the cover is mounted on the holder, so that chips generated in the LCD substrate are not introduced between the holder and the head on which the holder is mounted. Therefore, the holder can rotate smoothly as desired during operation of the cutting device, so that the cracks are formed uniformly and uniformly by the wheels mounted on the holders on the LCD substrate, and the unit LCD panel is cut off from the LCD substrate. The condition is also good. As a result, the accurate and uniform cutting operation lowers the defective rate of the unit LCD panel and further reduces the production cost.

Claims (10)

A wheel configured to create a crack in the LCD substrate; A holder configured to rotatably support the wheel; A head rotatably accommodating the holder and movably installed in the LCD substrate cutting device; And A cover installed on the holder to prevent chips generated during cutting of the LCD substrate from entering between the holder and the head; And the cover includes a cutout portion formed to be separated from the holder. The method of claim 1, And the cover is formed to be larger than a portion of the holder accommodated in the head. The method of claim 1, And said cover is configured to cover said head. The method of claim 1, And the cover is configured to divide between the wheel and the head. The method of claim 1, And the cover is configured to isolate the head from the wheel. The method of claim 1, And the cover is a plate-shaped member extending between the head and the wheel from the holder. The method of claim 1, And the cover comprises an inclined surface formed to slide the chip down. delete The method of claim 1, And said cover is made of a material of lower strength than the adjacent holder and head. The method of claim 9, Tool cover for LCD substrate cutting device characterized in that the cover is made of a flexible material.

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