KR101002348B1 - Device for grinding liquid crystal display panel - Google Patents

Abstract

The present invention discloses a polishing apparatus configured to simplify an LCD panel manufacturing line and shorten working time. To this end, the present invention introduces a cut unit LCD panel, the first transfer unit is configured to inspect the dimensions and degree of cutting of the LCD panel; A second transfer unit for continuously transferring the LCD panel from the first transfer unit; And it is provided adjacent to the second conveying portion and provides a polishing apparatus for an LCD panel consisting of a polishing portion configured to polish the conveyed LCD panel.

LCD, Polishing Equipment

Description

Polishing apparatus for LCD panels {DEVICE FOR GRINDING LIQUID CRYSTAL DISPLAY PANEL}

1 is an exploded perspective view showing the structure of a typical LCD panel;

2 is a flowchart showing a manufacturing process of an LCD panel;

3 is a schematic diagram showing a typical LCD panel manufacturing system;

4 is a schematic view showing a polishing apparatus for an LCD panel according to the present invention; And

5 is a plan view showing a polishing apparatus for an LCD panel according to the present invention.

The present invention relates to a liquid crystal display panel (hereinafter, referred to as a liquid crystal display), and more particularly, to an apparatus for polishing the LCD panel.

In general, LCD panels have characteristics such as low voltage driving, low power consumption, full color implementation, and light weight and small size, and are therefore widely used in watches, calculators, PC monitors, notebooks, and the like. Usage is becoming diversified. The general structure of such an LCD panel is shown in FIG.

As shown, the LCD panel includes a lower substrate 1 and an upper substrate 2 bonded to each other with a predetermined space, and a liquid crystal layer 3 injected between the lower substrate 1 and the upper substrate 2. Consists of.

More specifically, the lower substrate 1 has a plurality of gate lines 4 arranged in one direction at regular intervals to define the pixel region P, and in a direction perpendicular to the gate lines 4. A plurality of data lines 5 are arranged at regular intervals, and a pixel electrode 6 is formed in each pixel region P where the gate line 4 and the data line 5 intersect, and each gate line The thin film transistor T is formed at a portion where (4) and the data line 5 intersect.

The upper substrate 2 includes a black matrix layer 7 for blocking light in portions other than the pixel region P, an R, G, B color filter layer 8 for expressing color colors, and an image. The common electrode 9 is formed to implement.

The thin film transistor T may include a gate electrode protruding from the gate line 4, a gate insulating film (not shown) formed on the front surface, an active layer formed on the gate insulating film above the gate electrode, and the data. A source electrode protruding from the line 5 and a drain electrode facing the source electrode. The pixel electrode 6 uses a transparent conductive metal having a relatively high light transmittance, such as indium-tin-oxide (ITO).

In the above-described LCD panel, the liquid crystal layer 3 located on the pixel electrode 6 is oriented by a signal applied from the thin film transistor T, and the liquid crystal layer 3 according to the degree of alignment of the liquid crystal layer 3. ), The image can be expressed by adjusting the amount of light passing through.                         

Referring to Figure 2 will be described a manufacturing method of a general LCD panel as follows.

First, a cassette (not shown) on which a plurality of TFT substrates are loaded and a cassette (not shown) on which a plurality of color filter substrates are loaded are respectively loaded on each port by a loader. It is seated.

The TFT substrate (ie, the lower substrate 1) is arranged with a plurality of gate lines arranged in one direction at regular intervals by an array process and at regular intervals in a direction perpendicular to the respective gate lines. A plurality of thin film transistors and pixel electrodes are respectively formed in a plurality of data lines and a matrix pixel area defined by the gate line and the data line. In addition, a black matrix layer, a color filter layer, a common electrode, and the like are formed on the color filter substrate (ie, the upper substrate 2) to block light in portions except the pixel region.

Subsequently, the TFT substrate and the color filter substrate are selected using a robot arm programmed to select one of the plurality of TFT substrates and the plurality of color filter substrates, respectively. Subsequently, after the alignment material is applied onto the selected TFT substrate and the color filter substrate, an alignment process S10 is performed in which the liquid crystal molecules have uniform orientation. The alignment process (S10) proceeds in order of washing before coating the alignment film, alignment film printing, alignment film firing, alignment film inspection, rubbing process.

After the alignment process (S10), the TFT substrate and the color filter substrate are cleaned (S20), respectively, and then a silver dispensing device for electrical connection with the common electrode on the color filter substrate in a predetermined region on the TFT substrate. The silver (Ag) dot is applied using (S30). After spreading a spacer (S40) to maintain a constant cell gap on the TFT substrate (S40) and applying a yarn pattern to an outer portion of the color filter substrate (S50), the TFT Pressure is applied to the substrate and the color filter substrate to bond and cure (S60). That is, the TFT substrate and the color filter substrate are each manufactured in different lines, but the subsequent process is performed in a single line from the bonding process.

On the other hand, the TFT substrate and the color filter substrate are formed of a plurality of regions on a large glass substrate facing each other. In other words, a plurality of unit substrate regions are formed in a large area glass substrate, and separate pixel electrodes are formed in lower unit substrate regions of the unit substrate region. In addition, in the large area glass substrate including the upper unit substrate (color filter substrate) regions, a common electrode for driving a liquid crystal together with the pixel electrode is formed on the entire surface of the glass substrate. Therefore, the glass substrate is cut / processed by applying voltages corresponding to pixel electrodes of unit panels of a predetermined standard to produce respective unit panels according to transmittances corresponding to the respective unit panels (S70).

Thereafter, the liquid crystal layer is formed by injecting liquid crystal through the liquid crystal inlet into the individual unit panels processed as described above and encapsulating the liquid crystal inlet (S80). Subsequently, after the cut surface of each unit panel is polished, the manufacturing of the LCD panel is completed by performing external appearance and electrical defect inspection (S90) of the unit panel.

Such a series of manufacturing processes (ie, cell processes) are collectively processed by a system consisting of a plurality of devices 10-60 functionally linked together, as shown in FIG. 3. First, the bonding apparatus 10 combines a separately manufactured TFT substrate and a color filter substrate into one substrate. In the cutting device 20, cracks are formed to fit a predetermined unit panel by a scribing tool on the bonded substrate and separated into a plurality of unit panels by a breaking tool. Then, in the dimension inspection apparatus (so-called burr chenker) 30, the dimension and the degree of cutting of the cut unit LCD panels are inspected. Thereafter, each unit LCD panel inspected is put into the polishing apparatus 40 by the robot arm 40a and polished, and cleaned by the cleaning apparatus 50 to remove residual impurities. Finally, the LCD panel polished by the inspection device 60 is inspected for appearance and electrical defects.

In the LCD panel manufacturing system, the dimension inspection device 30 is installed as an independent device despite performing a relatively simple function. Thus, the system 10-60 takes up a lot of space unnecessarily as a whole. In addition, the process of loading or unloading the panel in the dimensional inspection apparatus 30 causes a substantial increase in working time.

The present invention has been devised to solve the above-described problems, and an object of the present invention is to provide a system for manufacturing an LCD, which has a simplified structure and requires less working time.

In order to achieve the above object, the present invention provides a cut unit LCD panel, a first transfer unit configured to inspect the dimensions and the degree of cutting of the LCD panel; A second transfer unit for continuously transferring the LCD panel from the first transfer unit; And it is provided adjacent to the second conveying portion and provides a polishing apparatus for an LCD panel consisting of a polishing portion configured to polish the conveyed LCD panel.

The first transfer part includes arms that are gripped on the transfer axis and the LCD panel to be polished and are movable on the transfer axis, and preferably further include an inspection device for measuring the size and cutting degree of the LCD panel.

Such an inspection apparatus is composed of a table which supports the LCD panel to be polished and is movably configured and an image acquisition device which photographs the LCD panel on the table to measure the dimensions and the degree of cutting. And practically the inspection apparatus is configured to inspect burrs formed on the cut surface of the cut LCD panel.

According to the present invention described above, the polishing apparatus can inspect the dimension and degree of the cut LCD panel, thereby simplifying the LCD panel manufacturing line and reducing the working time.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention in which the above objects can be specifically realized are described with reference to the accompanying drawings. In describing the present embodiment, the same name and the same reference numerals are used for the same configuration and additional description thereof will be omitted below.

4 is a schematic view showing an LCD panel polishing apparatus according to the present invention, Figure 5 is a plan view showing an LCD panel polishing apparatus according to the present invention.

Referring to FIG. 4, the polishing apparatus 100 of the present invention is installed to be directly connected to the cleaning apparatus 200. The cut unit LCD panel is polished in the polishing apparatus 100 and washed to remove chips generated during polishing while passing through the cleaning apparatus 200. In addition, the polishing apparatus 100 and the cleaning apparatus 200 are configured to receive the washing liquid independently during polishing and washing of the LCD panel, and to discharge the used washing liquid.

5 illustrates the polishing apparatus 100 of the present invention in more detail. Referring to this, the polishing apparatus 100 will be described in detail as follows.

As shown, the polishing apparatus 100 according to the present invention includes a first and second conveying parts 110 and 120 configured to continuously convey the LCD panel P to be polished as a whole and a polishing part disposed between the conveying parts 110 and 120. Is done.

First, the first transfer unit 110 serves to introduce into the polishing apparatus 100 to polish the unit LCD panel P cut through the previous processes. In general, prior to the polishing process, the LCD panel is separated from a single LCD substrate into a plurality of unit LCD panels in a scribe / break device to become a finished product. Therefore, the polishing apparatus 100 is installed adjacent to the cutting apparatus, and the first conveying unit 110 brings the completed LCD panel P from the cutting apparatus. Precisely, a robot arm is installed between the cutting device and the polishing device 100, and the unit LCD panel P from which the robot arm is cut from the cutting device is transferred to the first conveying unit 110 of the polishing device 100. Bring to In addition, the first transfer unit 110 moves the transferred LCD panel P into the polishing apparatus 100. To this end, the first transfer unit 110 is composed of a feed shaft 111 and the arms (112a, 112b) installed on the feed shaft (111). The conveying shaft 111 extends adjacent to the second conveying unit 120 with a sufficient length in the polishing apparatus 100 to guide the arms 112a and 112b. The arms 112a and 112b are installed on the feed shaft 111 so as to be movable by a predetermined driving device 113 such as a motor. The arms 112a and 112b are configured to grip the LCD panel P, respectively, and the LCD panel P is actually sandwiched between the arms 112a and 112b while both sides thereof are supported. In addition, the arms 112a and 112b may be moved to adjust the spacing therebetween, respectively, thereby holding a unit panel of any size. The first transfer unit 110 grips the LCD panel P to be polished and transfers it to the second transfer means 120.

The second transfer part 120 continuously transfers the LCD panel P transferred from the first transfer part 110 to pass through the polishing part. Various mechanisms may be used as the second transfer part 120, but in the present invention, preferably, the driving table has a simple structure. This drive table is installed on the linear motion guide together with the motor. The LCD panel P is placed on this drive table, and is continuously moved along the polishing portion while being guided by the LM guide together with the table by the motor. Therefore, the driving table can move accurately while supporting the LCD panel P stably.

Although not shown, the polishing unit basically includes a grinding tool disposed along the movement path of the second transfer unit 120. In more detail, a plurality of the grinding tools are installed at both sides of the movement path of the second transfer part 120 at predetermined intervals. The grinding tool is configured to polish the rough surface of the cut LCD panel P to be conveyed and is generally made of a grinding wheel. The polishing unit also has an injector for spraying the cleaning liquid. The injector sprays the cleaning liquid to cool the LCD panel P heated by the polishing and removes chips that are separated from the LCD panel P.

On the other hand, as mentioned above, since the cutting process and the polishing process of the LCD panel is carried out continuously, it is more efficient to check the dimensions and the degree of cutting of the LCD panel P cut directly from the polishing apparatus 100. . Furthermore, since the cut LCD panel P is directly put into the first transfer part 110, according to the present invention, the LCD panel P of which the first transfer part 110 of the polishing apparatus 100 is cut is inspected. It is configured to. In practice, the first transfer unit 110 includes a separate inspection device 114 for the inspection of the size and cutting degree of the cut LCD panel (P). More specifically, the inspection device 114 is composed of a table 114a and an image acquisition device 114b provided adjacent to the table 114a. The table 114a is installed on the LM guide together with the motor in the same manner as the second transfer part 120 described above. Therefore, the table 114a is moved by the LM guide together with the LCD panel P placed thereon to move past the image acquisition device 114b. Further, the table 114a is configured to rotate together with the LCD panel P during movement so that the image acquisition device 114b can obtain an image of the entire LCD panel P. FIG. The image acquisition device 114b photographs each portion of the moving LCD panel P and converts it to image data of a predetermined format. As such an image acquisition apparatus 114b, a scan camera is generally used. Using the image data, the dimensions of the LCD panel P and the accuracy of the cutting are examined and the good and the defective of the cut LCD panel P are determined. In practice, burrs are formed on the cut surfaces of the LCD panel P after the cutting process, making the dimensions of the LCD panel P inaccurate and preventing the cut surfaces from being even. Therefore, in the failure determination of the LCD panel P, the burrs formed at each cut portion are considered most important.

As shown in the foregoing description, the polishing apparatus 100 according to the present invention is configured to also check the size and the degree of cutting of the cut LCD panel (P). Operation of the polishing apparatus 100 is described in detail below with reference to the related drawings for a more clear understanding of this invention.

Once the mother substrate including the plurality of unit LCD panels is completed, the finished mother substrate is cut into each unit LCD panel P again. This unit LCD panel P is fed to the polishing apparatus shown in Figs. 4 and 5 to trim the cut surface.

The input LCD panel P is first placed on the table 114a of the inspection apparatus 114, and passes between the image acquisition apparatuses 114b by the table 114a. At this time, the LCD panel P is rotated by the table 114a to obtain a finer image. The obtained image of the LCD panel P is inspected whether or not the LCD panel P cut using the predetermined analysis device associated with the image acquisition device 114b has the correct dimensions and the desired degree of cutting. The LCD panel P which is determined to be defective here is transferred to the outside of the polishing apparatus 100 by a transfer mechanism such as a robot arm, and is excluded from subsequent LCD manufacturing processes.

Meanwhile, in the case of a good LCD panel P, first, arms 112a and 112b of the first transfer unit 110 grip both sides of the inspected LCD panel P and move along the transfer shaft 111. The second transfer part 120 is placed on. Thereafter, the LCD panel P is moved upward in the drawing by the second transfer part 120, so that the grinding tool (not shown) of the polishing part disposed side by side on both sides of the movement path of the transfer part 120 is shown. Polished by More specifically, burrs at the edges of the panel P generated during the cutting process are removed to smooth the external appearance of the LCD panel P. FIG. In addition, the rough cut surface is a direct cause of cracking, and thus damage is prevented by the polishing process. In addition, the terminal for supplying power or transmitting data during the polishing process is also polished, thereby preventing a short circuit that may occur during use.

Thereafter, the polished LCD panel P is transferred to the cleaning apparatus 200 so that chips generated or remaining upon polishing by the cleaning liquid are once again removed and finally cleaned. Subsequently, the LCD panel P is dried by high pressure air injected from an air injector.

Although several embodiments have been described above, it will be apparent to those skilled in the art that the present invention may be embodied in many other forms without departing from the spirit and scope thereof. Accordingly, the described embodiments are to be considered as illustrative and not restrictive, and all embodiments within the scope of the appended claims and their equivalents are included within the scope of the present invention.

The polishing apparatus according to the present invention has a predetermined inspection device integrated with a conveying mechanism so that it can self inspect the dimensions and degree of cutting of the LCD panel before polishing. Therefore, the structure of the overall LCD panel manufacturing system is simplified, and the overall process and working time are shortened by eliminating the dimension inspection apparatus existing as a separate device from the manufacturing line. As a result, the polishing apparatus of the present invention results in a reduction in the production cost and productivity of the LCD panel.

Claims (7)

A first transfer part introducing a cut unit LCD panel and configured to inspect a dimension and a cutting degree of the LCD panel; A second transfer unit for continuously transferring the LCD panel from the first transfer unit; And A polishing unit installed adjacent to the second transfer unit to polish the transferred LCD panel, The first transfer unit And an inspection apparatus for measuring a dimension and a cutting degree of the LCD panel, and inspecting a burr formed on a cut surface of the LCD panel. delete The method of claim 1, The first transfer unit With feed shaft And an arm that is gripped to the LCD panel to be polished and is movably mounted on the transfer shaft. The method of claim 1, The first transfer unit And a table configured to move and support the LCD panel to be polished, and an image acquisition device for photographing the LCD panel on the table to measure dimensions and degree of cutting. The method of claim 4, wherein And the image acquisition device is a scan camera. delete The method of claim 1, And the second conveying part is a table configured to be continuously movable along the polishing part.

Images