KR101015552B1 - Bonding apparatus for semiconductor device and bonding method using the same - Google Patents

Abstract

The present invention relates to an apparatus for bonding a semiconductor chip cut from a wafer to a mounting plate. In accordance with another aspect of the present invention, a semiconductor chip bonding apparatus includes a support part supporting a mounting plate; A bonding part for pressing the semiconductor chip seated on the mounting plate; A pressing force measuring unit installed on the supporting unit and measuring an intensity of the pressing force by the bonding unit; And a control unit which receives the measured value of the pressing force measuring unit and compares it with a preset reference value range to adjust or maintain the pressing force strength of the bonding unit according to a comparison result.

According to the present invention, it is possible to check the pressing force strength of the bonding portion at predetermined intervals and to adjust the pressing force strength of the bonding portion automatically if there is an abnormality in the pressing force strength, thereby reducing the loss of manpower and operating time of the equipment. It is possible to reduce, thereby improving the quality of the product and the output per hour by maintaining the pressure strength of the bonding portion at all times.

Semiconductor chip bonding device, die bonder, bonding method

Description

Bonding apparatus for semiconductor device and bonding method using the same

The present invention relates to a semiconductor chip bonding apparatus and a semiconductor chip bonding method using the same. More particularly, the present invention relates to a semiconductor chip bonding apparatus and a semiconductor chip bonding method using the same in which the strength of the pressing force of the bonding unit can be properly maintained at all times. will be.

In a general semiconductor post-process, a semiconductor chip formed on a wafer is subjected to a test process, cut into each semiconductor chip unit, and then a mounting board such as a lead frame or a printed circuit board (PCB). Bonded to and then the semiconductor chip and the mounting plate are electrically connected.

Thereafter, the semiconductor device formed by bonding the semiconductor chip to the mounting plate is completed into a semiconductor package through a molding process, a cutting and sorting process, and the like.

In such a post-semiconductor process, the process of bonding each semiconductor chip formed on the wafer to the mounting plate includes a wafer support on which the wafer cut in semiconductor chip units is seated, a picker for picking up the semiconductor chip, and mounting with an adhesive material applied thereto. A supply part for supplying a plate, a support part on which the supplied mounting plate is located, a conveying part for transferring the picked-up semiconductor chip to be seated on the mounting plate, a bonding part for pressurizing the semiconductor chip to be bonded to the mounting plate, and a heating plate during the bonding operation. It is performed by a semiconductor chip bonding apparatus including a heating plate installed in the support portion.

The operation description of the semiconductor chip bonding apparatus is as follows.

When the wafer cut by each semiconductor chip is supplied to and positioned on the wafer support, the picker picks up the semiconductor chip at a predetermined position. On the other hand, the supply unit supplies the mounting plate coated with the adhesive material to the support unit located below the bonding unit so that the semiconductor chip is seated and bonded.

The semiconductor chip picked up by the picker is transported by the transfer unit and seated on the mounting plate, the heating plate heats the mounting plate, and the bonding unit applies the pressing force to the semiconductor chip, thereby bonding the semiconductor chip to the mounting plate. Be sure to

On the other hand, when all the semiconductor chips are seated and bonded to the mounting plate supplied to the support, the supply unit discharges the mounting plate and supplies a new mounting plate to the support.

Thereafter, the following operations of semiconductor chip pick-up, transfer, mounting and bonding are sequentially performed on the following semiconductor chips.

In such a semiconductor chip bonding operation, if the strength of the pressing force applied to the semiconductor chip is less than the appropriate strength, the bonding may not be firmly bonded to the mounting plate and thus, the bonding may not be firmly bonded or stably bonded in parallel. Defects may occur, and thus errors may occur during subsequent processes, or the semiconductor chips may be separated from the mounting plate and broken.

On the contrary, when the strength of the pressing force applied to the semiconductor chip by the bonding portion is stronger than the proper strength, excessive pressure in the bonding operation may damage the semiconductor chip or the mounting plate or damage the contact portion of the bonding portion applying the pressing force.

Therefore, in the semiconductor chip bonding operation, it is essential to check that the bonding force applied to the semiconductor chip is maintained at an appropriate intensity.

In the conventional semiconductor chip bonding apparatus, such inspection work is performed by the operator detaching the heating plate from the support part, installing the pressure gauge at the position, and then operating the bonding part so that the bonding part applies the pressing force to the pressure gauge so that the strength of the pressing force is increased. It is carried out in a measuring manner.

And, if there is an abnormality in the strength of the pressing force, the operator directly adjusts the actuator (bonder) of the bonding portion to adjust the strength of the pressing force to the appropriate strength. When this is done, the operator removes the pressure gauge, reassembles the heating plate on the support and resumes the bonding operation.

As described above, in the conventional semiconductor chip bonding apparatus, in order to check the pressure strength of the bonding portion, after the operation of the equipment is stopped, the heating plate is removed and a pressure measuring device is installed to check the pressure strength of the bonding portion. There is a need to adjust the actuator of the bonding part.

In addition, the worker has to perform the work once and check the work cycle, and since the operation of the equipment is stopped while the work is in progress, there is a big problem of manpower loss and production loss per hour. In addition, there is a drawback that a bonding error due to poor pressure strength of the bonding part may occur due to a worker misinterpreting or forgetting a work cycle.

In order to solve the problems as described above, the present invention, the pressing force strength check operation to measure the pressing force strength of the bonding portion, and adjust the pressing force strength in accordance with the measurement result can be performed quickly and automatically, whereby the pressing force of the bonding portion is An object of the present invention is to provide a semiconductor chip bonding apparatus and a semiconductor chip bonding method using the same.

In order to solve the above problems, the semiconductor chip bonding apparatus according to the present invention, the support for supporting the mounting plate; A bonding part for pressing the semiconductor chip seated on the mounting plate; A pressing force measuring unit installed on the supporting unit and measuring an intensity of the pressing force by the bonding unit; And a control unit which receives the measured value of the pressing force measuring unit and compares it with a preset reference value range to adjust or maintain the pressing force strength of the bonding unit according to a comparison result.

The controller may be configured to adjust the pressing force of the bonding part to be large when the measured value is less than a preset reference value range, and to adjust the pressing force of the bonding part to be smaller when the measured value is greater than the reference value range.

The preset reference value range may be a range corresponding to ± 5 to 10% of the preset reference value of the bonding unit.

The control unit may be provided to control the bonding unit and the pressing force measuring unit such that the bonding unit presses the pressing force measuring unit with one measurement interval per preset reference bonding number and the strength of the pressing force is measured.

The control unit may be provided to control the bonding unit and the pressing force measuring unit such that the bonding unit presses the pressing force measuring unit at one measurement period per preset reference working time to measure the strength of the pressing force.

In accordance with another aspect of the present invention, there is provided a method of bonding a semiconductor chip, the method including: mounting a plate coated with an adhesive material on a support unit, and mounting at least one semiconductor chip on the mounting plate; Bonding a bonding part to the mounting plate by pressing the semiconductor chip; And checking the pressing force strength of the bonding unit, wherein the checking of the pressing force strength of the bonding unit includes: pressing the bonding unit to press the pressing force measuring unit, and measuring the strength of the applied pressing force; And a control unit receiving the measured values of the pressing force measuring unit, comparing the preset pressure ranges with each other, and adjusting the pressing force intensities of the bonding units according to the comparison result.

The control unit adjusts the pressing force of the bonding part to be large when the measured value is less than a preset reference value range, and adjusts the pressing force of the bonding part to be smaller when the measured value is more than the preset reference value range.

The semiconductor chip bonding method may further include: checking, by the controller, whether the number of bondings performed by the bonding unit exceeds a preset reference bonding number; And if it is determined that the number of bondings performed by the bonding unit exceeds a predetermined reference bonding number, the step of checking the pressing force strength of the bonding unit may be performed again.

The semiconductor chip bonding method may further include: checking, by the controller, whether a work time of the bonding unit exceeds a preset reference work time; And when it is determined that the working time of the bonding unit exceeds a preset reference working time, the step of checking the pressing force strength of the bonding unit may be performed again.

According to the semiconductor chip bonding apparatus of the present invention and the semiconductor chip bonding method using the same, it is possible to automatically measure the pressing force strength of the bonding portion at predetermined intervals, and to adjust the pressing force strength of the bonding portion when there is an abnormality in the measured pressing force strength. It can be done automatically.

Therefore, it is possible to minimize the loss of manpower, there is no fear of poor pressure strength of the bonding portion due to misinterpretation or forgetting of the work cycle of the worker, thereby improving the quality of the product to always maintain the appropriate pressure strength of the bonding portion Can be.

In addition, the pressing force measuring unit is installed in the support unit, and the pressing force strength checking operation for measuring and adjusting the pressing force intensity can be performed quickly during the bonding operation, thereby minimizing downtime of the equipment. Therefore, it is possible to reduce the operating time loss of the equipment to increase the production per hour.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

The semiconductor chip bonding apparatus according to the present invention is a device for mounting and bonding each cut semiconductor chip of a wafer to a mounting plate such as a lead frame or a printed circuit board.

Hereinafter, with reference to the accompanying Figures 1 to 2c, the configuration and operation effects of the semiconductor chip bonding apparatus according to a preferred embodiment of the present invention will be described in detail. The semiconductor chip bonding apparatus according to the preferred embodiment of the present invention includes a support part 100, a bonding part 200, a pressing force measuring part 300, and a control part 400.

The support part 100 serves as a support for supporting the mounting plate 20 on which the semiconductor chip 10 is mounted. The support part 100 is provided with a heating plate 30 to heat the mounting plate 20. When the bonding process is performed, the heating plate 30 may heat the mounting plate 20 to bond the semiconductor chip 10 to the mounting plate 20 by an adhesive material applied to the mounting plate 30.

The bonding part 200 presses the semiconductor chip 10 seated on the mounting plate 20 downward so that the semiconductor chip 10 may be bonded to the mounting plate 20. To this end, the bonding part 200 is provided with a contact module 210 for contacting the semiconductor chip 10 to apply a pressing force and a driving module 220 such as a pneumatic cylinder for elevating the contact module 210.

In addition, the bonding part 200 is provided on the upper side of the support part 100 so as to be horizontally conveyed and elevated. Therefore, the pressing force may be applied to each of the one or more semiconductor chips 10 positioned in the designated region of the mounting plate 20 positioned in the support part 100.

The pressing force measuring part 300 is provided on one side of the support part 100 to measure the strength of the pressing force of the bonding part 200. That is, as illustrated in FIGS. 2B and 2C, when the bonding part 200 is transferred to the upper side of the pressing force measuring unit 300 and lowered, the pressing force measuring unit 300 is applied to the pressing force measuring unit 300. ) Measures the strength of the applied force.

The pressing force measuring unit 300 transmits the measured value of the measured pressing force strength to the control unit 400. The pressing force measuring unit 300 may be provided with various types of weight sensors (load cells) available on the market, the type of the provided is not particularly limited.

The control unit 400 controls the bonding unit 200 and the pressing force measuring unit 300 so as to check the pressing force strength of the bonding unit 200 at predetermined intervals. Receives the pressure strength measurement value of the bonding unit 200 from) and compares with the preset reference value range, and maintains or adjusts the pressing force strength of the bonding unit 200 according to the comparison result.

That is, the control unit 400 is a predetermined period, the bonding unit 200 is transferred to the upper side of the pressing force measuring unit 300 to apply the pressing force to the pressing force measuring unit 300, according to the measured value of the pressing force strength Maintaining or adjusting the pressing force strength of the bonding unit 200.

Here, the predetermined period may be set to once per reference bonding number, such as once when the bonding unit 200 performs 1,000 bonding, or the bonding unit 200 may perform the bonding operation for 8 hours. It can also be set once per baseline work time, such as once.

In addition, the preset reference value range may be a range corresponding to ± 5 to 10% of the preset reference value of the bonding part 200, which is the strength of the pressing force suitable for the semiconductor chip 10 and the mounting plate 20. This is because when the range is set wider than this, a bonding error may occur due to poor pressure strength. For example, when the preset reference value range is X and the range is ± 5%, the preset reference value range is 0.95X to 1.05X.

The control unit 400 when the measured value received from the pressing force measuring unit 300 is within a predetermined reference value range corresponding to ± 5 ~ 10% of the predetermined reference value of the bonding unit is the current pressing force strength of the bonding unit 200 When the measured value transmitted from the pressing force measuring unit 300 is out of a preset reference value range, the pressing force intensity is adjusted by controlling the driving module 220 of the bonding unit 200.

In detail, when the measured value transmitted from the pressing force measuring unit 300 is less than the minimum value (0.95X in the above-described example) of the preset reference value range, the driving module 220 is controlled to increase the pressing force strength to the value. Adjust this to be X. On the other hand, when the measured value received from the pressure measuring unit 300 exceeds the maximum value (1.05X in the above-described example) of the preset reference value range, the driving module 220 is controlled to weaken the pressing force strength and the value is Adjust to X.

In a preferred embodiment of the present invention, the control unit 400 is implemented to compare the measured value received from the pressure measurement unit 300 with a predetermined reference value range, but is not limited thereto. For example, it may be implemented to compare the measured value with a specific preset reference value rather than a preset reference value range.

In this case, when the measured value is less than the predetermined reference value, the controller 400 controls the driving module 220 to increase the pressure intensity to become the specific reference value, and when the measured value is greater than the predetermined reference value. The driving module 220 is controlled to reduce the pressing force strength to become a corresponding specific reference value.

Through the operation of the control unit 400 as described above, the semiconductor chip bonding apparatus according to the present invention automatically and quickly measure the pressing force strength of the bonding unit 200 at predetermined intervals, and the measured value is a preset reference value range. Compared with and by controlling the driving module 220 to maintain the pressing force strength of the bonding unit 200 to an appropriate value it is possible to block the occurrence of a bonding error due to the poor pressure strength.

Hereinafter, a semiconductor chip bonding method according to a preferred embodiment of the present invention using the semiconductor chip bonding apparatus will be described in detail with reference to FIGS. 3A and 3B.

First, when the pressing force strength checking operation of the bonding unit 200 starts at a predetermined period, the bonding unit 200 is transferred to the upper side of the pressing force measuring unit 300 (S100). Next, when the bonding unit 200 descends to press the pressing force measuring unit 300, the pressing force measuring unit 300 measures the intensity of the applied pressing force (S200). Then, the pressing force measuring unit 300 transmits the measured value to the control unit 400 (s300).

Subsequently, the controller 400 compares the measured value transmitted from the force measuring unit 300 with a preset reference value range, and adjusts the force strength when the pressure intensity of the bonding unit 200 is not appropriate, If appropriate, the pressing force strength is maintained (S400).

Hereinafter, referring to FIG. 3B, the pressing force intensity adjusting method of the control unit 400 will be described in detail.

First, the control unit 400 checks whether the measured value transmitted from the pressure measuring unit 300 is less than the minimum value of the preset reference value range (S410). When the received measured value is less than the minimum value of the preset reference value range, the pressing force intensity is increased to be the preset reference value by controlling the driving module 220 of the bonding unit 200 (S420).

On the other hand, if the received measured value is not less than the minimum value of the preset reference value range, it is checked whether the measured value is greater than the maximum value of the preset reference value range (S430). When the received measured value exceeds the maximum value of the preset reference value range, the pressing force intensity is reduced to be the preset reference value by controlling the driving module 220 of the bonding unit 200 (S440).

On the contrary, when the measured measurement value is not greater than the maximum value of the preset reference value range, the measured value is included in the preset reference value range, thereby maintaining the current pressing force strength of the bonding unit 200 (S450).

In a preferred embodiment of the present invention, the pressing force intensity control method of the control unit 400 first checks whether the measured value received from the pressing force measuring unit 300 is less than the minimum value of the preset reference value range, and then the preset reference value range While it is implemented to check if the maximum value of is exceeded, this method is not limited thereto.

For example, it may be implemented to first check whether the measured value received from the force measurement unit 300 exceeds the maximum value of the preset reference value range, and then check whether the measured value is less than the minimum value of the preset reference value range, It may be implemented to first check whether it is included in a predetermined reference value range.

On the other hand, when the operation of confirming the pressing force strength of the control unit 400 is completed, the bonding unit 200 is transferred to the upper side of the supply position of the mounting plate 20 (s500), the mounting plate 20 coated with the adhesive material is the support unit Positioned at (100) (s600), the semiconductor chip 10 is seated at the bonding position of the mounting plate 20 (s700), the bonding portion 200 pressurize the semiconductor chip 10 to mount the mounting plate 20 Bonding operation is performed.

When the bonding operation is completed, the control unit 400 checks whether a cycle of the next pressing force strength check has been made (S900). For example, if the predetermined period is once per 1,000 times the preset number of reference bonding, the controller 400 checks whether the number of bondings performed by the bonding unit 200 exceeds 1,000 times the number of reference bonding.

If not exceeded, the controller 400 controls the bonding unit 200 to perform the bonding operation again, and if exceeded, controls the bonding unit 200 and the pressing force measuring unit 300 to perform the pressing force checking operation. do. If the workload is satisfied during the operation of checking the pressure strength check period, the operation of the equipment is terminated.

In a preferred embodiment of the present invention, the control unit 400 is implemented to perform the pressure-force check operation of the bonding unit 200 before the bonding operation by the bonding unit 200, the order is necessarily limited thereto. It doesn't happen. That is, the bonding operation may be performed first, and when the work cycle as described above is reached, the pressing force strength checking operation may be performed.

According to the semiconductor chip bonding method according to the present invention as described above, the control unit 400 automatically checks a predetermined period, and according to the period as well as quickly confirm the pressing force strength of the bonding unit 200, the confirmation According to the result, the driving module 220 is controlled to maintain the pressing force strength at an appropriate value, thereby preventing the occurrence of a bonding error due to the pressing force strength failure.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical spirit of the present invention, and such modifications and variations belong to the appended claims. will be.

1 is a perspective view of a semiconductor chip bonding apparatus according to a preferred embodiment of the present invention,

2A is a side view of a semiconductor chip bonding apparatus according to a preferred embodiment of the present invention;

2B is a side view illustrating a state in which a bonding part is transferred to an upper side of a pressing force measuring part in a semiconductor chip bonding apparatus according to a preferred embodiment of the present invention;

2C is a side view illustrating a state in which a bonding unit applies a pressing force to an upper surface of the pressing force measuring unit in the semiconductor chip bonding apparatus according to the preferred embodiment of the present invention;

3A is a flowchart schematically illustrating a semiconductor chip bonding method according to a preferred embodiment of the present invention;

3B is a flowchart illustrating a method of controlling a pressing force strength of a bonding part in a semiconductor chip bonding method according to an exemplary embodiment of the present invention.

＊ Explanation of symbols for main part of drawing ＊

10: semiconductor chip 20: mounting plate

30: heating plate 100: support part

200: bonding portion 210: contact module

220: drive module 300: pressing force measuring unit

400: control unit

Claims (9)

In the apparatus for bonding a semiconductor chip to the mounting plate, A support for supporting the mounting plate; A bonding part for pressing the semiconductor chip seated on the mounting plate; A pressing force measuring unit installed in the supporting unit and configured to measure the strength of the pressing force by the bonding unit when the bonding unit is transferred upward when the predetermined period is reached; And A control unit which receives the measured value of the pressing force measuring unit and compares it with a preset reference value range corresponding to ± 5 to 10% of the predetermined reference value of the bonding unit, and adjusts or maintains the pressing force strength of the bonding unit according to a comparison result; Semiconductor chip bonding apparatus comprising a. The method of claim 1, The control unit, And adjusting the pressing force of the bonding part to be large when the measured value is less than a preset reference value range, and adjusting the pressing force of the bonding part to be smaller when the measured value is greater than the reference value range. . delete The method of claim 2, The control unit, And the bonding unit and the pressing force measuring unit are configured to press the pressing force measuring unit at one measurement period per predetermined reference bonding number to measure the strength of the pressing force. The method of claim 2, The control unit, And the bonding unit and the pressing force measuring unit are configured to press the pressing force measuring unit at one measurement period per preset reference working time so that the strength of the pressing force is measured. In the method of bonding a semiconductor chip to a mounting plate, Placing the mounting plate coated with an adhesive material on a support, and mounting one or more of the semiconductor chips on the mounting plate; Bonding a bonding part to the mounting plate by pressing the semiconductor chip; And Checking the pressing force strength of the bonding portion; Including, Checking the pressing force strength of the bonding portion, Pressurizing the pressing force measuring unit by the bonding unit, and the pressing force measuring unit measuring the intensity of the applied pressing force; And A control unit receiving the measured value of the pressing force measuring unit, comparing a preset reference value range corresponding to ± 5 to 10% of the predetermined reference value of the bonding unit, and adjusting the pressing force strength of the bonding unit according to a comparison result; Semiconductor chip bonding method comprising a. The method of claim 6, The control unit, When the measured value is less than the predetermined reference value range is adjusted to increase the pressing force strength of the bonding portion, and if the measured value is greater than the predetermined reference value range is adjusted so that the pressing force strength of the bonding portion is smaller. Way. The method according to claim 6 or 7, Checking, by the controller, whether the number of bondings performed by the bonding unit exceeds a preset reference bonding number; And If it is determined that the number of bondings performed by the bonding unit exceeds a preset reference bonding number, the step of checking the pressing force strength of the bonding unit is performed again; The semiconductor chip bonding method further comprises. The method according to claim 6 or 7, Confirming, by the controller, whether a work time of the bonding unit exceeds a preset reference work time; And If it is determined that the working time of the bonding portion exceeds a preset reference working time, the step of checking the pressing force strength of the bonding portion is performed again; The semiconductor chip bonding method further comprises.

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