KR100997760B1 - Illuminating device - Google Patents

Abstract

Luminaires are disclosed. The luminaire includes a light source for irradiating light; A heat pipe type heat dissipation unit for dissipating heat transferred from the light source, wherein the heat pipe type heat dissipation unit is configured to inject a working fluid therein, and has a spiral pipe loop radially disposed with respect to the light source so that the central area is opened. It is characterized by including.

Description

Lighting fixtures {ILLUMINATING DEVICE}

The present invention relates to a lighting device, and more particularly, to a lighting device employing a heat pipe type heat dissipation unit.

Recently, luminaires using a light emitting diode (LED) as a light source have emerged. This luminaire has the advantage of low power consumption, good power saving effect, and durability because it can be used semi-permanently due to the characteristics of the LED. On the other hand, since the luminaire uses a high output LED composed of a chip of high current, high brightness, there is a problem that a lot of heat is generated during lighting.

In order to solve this problem, a lighting fixture employing a heat radiation fin type heat dissipation unit is known.

However, a conventional lighting fixture employing a heat radiation fin type heat dissipation unit has a disadvantage of heavy weight and high manufacturing cost. There is also a risk of falling if it is installed in a high place such as a ceiling.

In addition, there is a disadvantage that the heat radiation efficiency is reduced due to the functional limitation of the heat radiation fin type heat dissipation unit.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a light fixture having a light weight and high heat dissipation efficiency.

In order to achieve the above object, a lighting device according to the present invention includes a light source for irradiating light; A heat pipe type heat dissipation unit for dissipating heat transferred from the light source, wherein the heat pipe type heat dissipation unit is configured to inject a working fluid therein, and is disposed radially with respect to the light source such that a central area is opened; And a pipe loop.

The pipe loop may form one closed or open loop.

The luminaire according to the present invention may further include a heat absorbing plate disposed between the pipe loop and the light source.

The luminaire according to the present invention may further include a housing in which the light source and the heat pipe type heat dissipation unit are built-in, and an air flow port is formed, and heat generated from the light source passes through the heat pipe type heat dissipation unit. It can be discharged to the outside through the flow port.

The housing includes a socket coupling portion coupled to the electrical socket; Connected to the socket coupling portion, it may include a main body portion formed with the air flow port.

The luminaire according to the present invention may further include a substrate embedded in the housing, and the light source may include a plurality of light emitting diodes mounted on the substrate.

The lighting apparatus according to the present invention may further include a converter which is applied to the light emitting diode by converting and adjusting the AC power embedded in the housing and input to DC power.

The luminaire according to the present invention may further include an optical member disposed in front of the light source and coupled to the housing, and an air flow port may be formed in the optical member and the substrate, respectively.

The heat pipe type heat dissipation unit may be disposed between the substrate and the converter.

The luminaire according to the present invention may further include a partition member for dividing a space in the housing into an outer space and an inner space, wherein the heat pipe type heat dissipation unit is provided in the outer space, and the converter is provided in the inner space, respectively. Can be.

The partition member may have a hollow truncated cone shape having both ends open, and may be disposed such that the diameter of one end facing the converter is larger than the diameter of the other end facing the substrate.

The substrate may include a plurality of substrates that are stacked to be spaced apart from each other and each of the air flow holes are formed at corresponding positions, and the plurality of light emitting diodes may be separately mounted on the plurality of substrates. The substrate disposed on the upper layer of the substrate may be formed with a light transmitting portion through which light emitted from the light emitting diode mounted on the substrate disposed on the lower layer passes.

The luminaire according to the present invention has the following effects.

First, by adopting a heat pipe type heat dissipation unit, it is possible to reduce the weight of the lighting fixture and increase heat dissipation efficiency.

Second, by adopting a radial heat pipe type heat dissipation unit, heat can be evenly distributed in all directions.

Third, by incorporating a heat pipe type heat dissipation unit, the exterior can be simplified and the space inside the housing can be effectively used.

Fourth, by forming an air flow port in the housing, the optical member, the substrate can increase the heat radiation efficiency by natural convection.

Fifth, the heat generated by the light source and the heat generated by the converter may be independently released by partitioning the inner space of the housing.

Sixth, by dividing the light source into a plurality of substrates, it is possible to reduce the number of light sources mounted on one substrate and to increase the spacing between neighboring light sources, thereby reducing thermal interference, thereby increasing heat dissipation efficiency.

Hereinafter, a lighting device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. When describing different embodiments, the same or similar elements may be omitted as necessary.

1 and 2 are respectively an exploded perspective view and a cross-sectional view showing a lighting device according to a first embodiment of the present invention.

Referring to the drawings, a lighting device according to a first embodiment of the present invention includes a light source 10 for irradiating light; A heat pipe type heat dissipation unit 100 for dissipating heat generated from the light source 10 is included.

The light source 10 is preferably implemented with a plurality of light emitting diodes (LEDs) 11, but is not limited thereto, and may be implemented with various types of light sources known in the art. The light emitting diode 11 has a modular configuration in the form of a semiconductor chip. AC power or DC power may be applied to the light emitting diodes 11.

The heat pipe type heat dissipation unit 100 is configured to inject a working fluid 111 together with bubbles 115 therein, and is disposed radially with respect to the light source 10, and has a central pipe opening 101. It is configured to include). The pipe loop 101 may form one closed loop or an open loop as a whole. In order to maximize the heat dissipation area, the individual spiral loops constituting the pipe loop 101 are disposed adjacent to each other.

Pipe loop 101 is a high thermal conductivity, such as copper, aluminum or alloys thereof, so that the heat generated from the light source 10 can be conducted at a high speed and quickly cause a volume change of bubbles injected therein. It may be made of a metal material.

The pipe loop 101 includes a heat absorbing portion 101a and a heat generating portion 101b. The heat absorbing portion 101a is disposed adjacent to the light source 10 and absorbs heat generated by the light source 10. The heat radiating portion 101b communicates with the heat absorbing portion 101a and discharges heat transferred from the heat absorbing portion 101a to the outside.

The heat pipe type heat dissipation unit 100 may further include a heat absorbing plate 103 provided in the heat absorbing portion 101a and in contact with the light source 10. The heat absorbing plate 103 primarily absorbs heat radiated from the light source 10 and transfers the heat absorbing plate 101 to the heat absorbing unit 101a and also fixes the pipe loop 101. The heat absorbing plate 103 may be made of a metal material such as copper, aluminum, or an alloy thereof having high thermal conductivity.

The heat pipe type heat dissipation unit 100 is a fluid dynamic pressure (FDP) type and employs, for example, a vibrating tubular heat pipe mechanism. Hereinafter, the basic operation principle of the vibrating tubular heat pipe will be described.

The vibrating tubular heat pipe has a structure in which the working fluid 111 and the bubble 115 are injected into the tubule at a predetermined ratio and the inside of the tubule is sealed from the outside. The heat pipe has a heat transfer mechanism for transporting a large amount of heat in latent heat by volume expansion and contraction of the working fluid 111 and the bubble 115.

Looking at the basic principle, in the heat absorbing portion (101a) is generated by the nuclear boiling (Nucleate Boiling) by the amount of heat absorbed by the bubbles located in the heat absorbing portion (101a) is a volume expansion. At this time, since the tubule maintains a constant internal volume, the bubbles located in the heat dissipating portion 101b contract as the bubbles located in the heat absorbing portion 101a have a volume expansion. Therefore, as the pressure balance in the tubule collapses, the heat pipe is accompanied by a flow including vibrations of the working fluid 111 and the bubbles 115. As such, the latent heat is transported by the volume change of the bubble 115 to perform a heat dissipation function.

The vibrating tubular heat pipe is easy to manufacture since it does not include a wick unlike a general heat pipe. In addition, the installation direction is less than that of a thermophonic heat pipe in which the heat dissipation unit must be located under the heat absorbing unit. In addition, the heat dissipation fin-type heat dissipation device is different from the heat transport method, so there is no structural limitation, and accordingly, the size or shape may be varied according to the type or shape of the heat generating source.

The lighting apparatus according to the present invention may further include a housing 30 in which the light source 10 and the heat pipe type heat dissipation unit 100 are embedded. The housing 30 includes a socket coupling portion 31 coupled to an electrical socket (not shown), and a main body portion 33 connected to the socket coupling portion 31 and having a light source 10 embedded therein. An air flow opening 35 is formed in the main body 33. 1 illustrates a configuration in which a plurality of air flow holes 35 are arranged in various layers throughout the main body portion 33 as an example. According to this configuration, heat generated from the light source 10 may be discharged to the outside through the air flow port 35 of the housing 30 via the heat pipe type heat dissipation unit 100.

The lighting apparatus according to the present invention may further include a light source 10, for example, a substrate 40 on which the plurality of light emitting diodes 11 are mounted. An air flow port 40a is formed in the central region of the substrate 40. Although one air flow port 40a is formed in the center region of the substrate 40 in FIG. 1, the number and position of the air flow port 40a may be appropriately changed according to design needs.

The luminaire according to the present invention may further include an optical member 50 coupled to the housing 30 in front of the light source 10. The optical member 50 may be formed of a transparent glass or plastic material, and focus or diverge the light irradiated from the light source 10 according to the processing form.

An air flow port 51 is formed in the optical member 50. The air flow port 51 may be formed in one of the central portion 50a of the optical member 50, or a plurality of air flow ports 51 may be formed in the peripheral portion 50b of the optical member 50. Alternatively, as shown in FIG. 1, the central portion 50a and the peripheral portion 50b may be formed together.

The position and number of the air flow port 51 may be appropriately changed according to the design needs, and may be designed to maximize the opening area of the air flow port 51 and minimize the degradation of the optical performance of the optical member 50. For example, when the optical member 50 focuses light, a plurality of air flow ports 51 may be formed in the peripheral portion 50b of the optical member 50, and when the optical member 50 emits light, One air flow port 51 may be formed in the central portion 50a of the optical member 50.

When a direct current power is applied to the light emitting diodes 11, the lighting device according to the present invention may further include a converter 60 embedded in the housing 30. The converter 60 converts and adjusts the input AC power into DC power and applies it to the light emitting diode 11. In this way, by incorporating the converter 60 into the housing 30, the lighting fixture according to the present invention can be easily applied to an environment to which an AC power is applied, for example, a household electric socket into which a conventional incandescent lamp is fitted.

The lighting device according to the present invention may further include a partition member 70 for dividing the space between the substrate 40 and the converter 60 in the housing 30 into the outer space 30a and the inner space 30b. In this case, the heat pipe type heat dissipation unit 100 is disposed in the outer space 30a, and the converter 60 is disposed in the inner space 30b.

The partition member 70 may have an open truncated conical cone shape at both ends thereof, and may be disposed so that the diameter of the other end opposite to the converter 60 is greater than the diameter of one end opposite to the substrate 40. In this case, the inner side of the radially arranged cylindrical pipe loop 101 may have a shape corresponding to the shape of the partition member 70, thereby improving the space efficiency inside the housing 30.

By separating the heat pipe type heat dissipation unit 100 and the converter 60 through the partition member 70 as described above, it is possible to prevent the heat discharged through the heat pipe type heat dissipation unit 100 toward the converter 60. Can be.

Heat generated by the converter 60 is the air flow port 51 of the optical member 50, the air flow port 40a of the substrate 40, the open central region of the heat pipe type heat dissipation unit 100, the partition member 70 It is released to the outside independently by natural convection by the flow of air through the open both ends of the, and the air flow port 35 of the housing 30. Here, an appropriate space may be formed between the converter 60 and the partition member 70 to smoothly flow the air, or an air flow port not shown in the converter 60 may be formed.

3 is an exploded perspective view of a lighting device according to a second embodiment of the present invention.

Referring to the drawings, the substrate 40 may include a plurality of substrates 41 and 45 that are stacked and spaced apart from each other. The plurality of light emitting diodes 11 are separately mounted on the plurality of substrates 41 and 45, respectively.

A plurality of light emitting diodes 11a and a plurality of light transmitting portions 41a are alternately arranged in the substrate 41 disposed on the upper layer among the plurality of substrates. The light-transmitting portion 41a is a region through which light emitted from the plurality of light emitting diodes 11b mounted on the substrate 45 disposed below the plurality of substrates passes.

In this way, when the plurality of light emitting diodes 11 are divided and mounted on the plurality of substrates 41 and 45, the number of light emitting diodes mounted on one substrate may be reduced, and the gap between adjacent light emitting diodes may be kept wide so as to maintain heat. Interference can be reduced. Accordingly, the heat dissipation efficiency can be further improved.

The above embodiments are merely exemplary, and those skilled in the art may have various modifications and equivalent other embodiments. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.

1 is an exploded perspective view showing a lighting device according to a first embodiment of the present invention.

2 is a cross-sectional view showing a lighting device according to a first embodiment of the present invention.

Figure 3 is an exploded perspective view showing a lighting device according to a second embodiment of the present invention.

* List of Reference Numbers in Drawings

10: light source 30: housing

31: socket coupling portion 33: the main body

35: air flow port 40, 41, 45: substrate

40a: air flow port 50: optical member

51: air flow port 60: converter

70: partition member 100: heat pipe type heat dissipation unit

101: pipe loop 101a: heat absorbing portion

101b: heat dissipation unit 103: heat absorbing plate

111: working fluid 115: bubble

Claims (12)

In the luminaire, A light source for irradiating light; A heat pipe type heat dissipation unit for dissipating heat transferred from the light source, The heat pipe type heat dissipation unit is configured to inject a working fluid therein, the luminaire comprising a spiral pipe loop disposed radially to the light source so that the central area is opened. The method of claim 1, And said pipe loop forms one closed or open loop. The method of claim 2, And a heat absorbing plate disposed between the pipe loop and the light source. The method according to any one of claims 1 to 3, And a housing in which the light source and the heat pipe heat dissipation unit are built, and an air flow port is formed. And heat generated from the light source is discharged to the outside through the air flow port of the housing via the heat pipe type heat dissipation unit. The method of claim 4, wherein The housing, A socket coupling portion coupled to the electrical socket; Is connected to the socket coupling portion, the luminaire comprising a main body portion formed with the air flow port. The method of claim 5, Further comprising a substrate embedded in the housing, The light source includes a plurality of light emitting diodes mounted on the substrate. The method of claim 6, And a converter embedded in the housing, the converter converting and adjusting the input AC power into DC power and applying the same to the light emitting diodes. The method of claim 7, wherein An optical member disposed in front of the light source and coupled to the housing; Lighting device, characterized in that the air flow port is formed in the optical member and the substrate, respectively. The method of claim 8, And the heat pipe type heat dissipation unit is disposed between the substrate and the converter. 10. The method of claim 9, Further comprising a partition member for dividing the space in the housing into an outer space and an inner space, The heat pipe type heat dissipation unit is provided in the outer space, the converter is provided in the inner space. The method of claim 10, The partition member, A luminaire having a hollow truncated cone shape having open ends, wherein the diameter of one end facing the converter is larger than the diameter of the other end facing the substrate. The method of claim 11, The substrates are stacked to be spaced apart from each other, and include a plurality of substrates each of which the air flow port is formed in a mutually corresponding position, The plurality of light emitting diodes are separately mounted on the plurality of substrates, And a light transmitting portion through which light emitted from a light emitting diode mounted on a lower substrate is formed in a substrate disposed on an upper layer among the plurality of substrates.

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