KR100992766B1 - Head cool fomenting pack using thermoelectric element - Google Patents

Abstract

PURPOSE: A head fomentation pack using a thermoelectric semiconductor is provided, which can reduce the temperature of the head effectively. CONSTITUTION: A head fomentation pack using a thermoelectric semiconductor comprises: a pad(10) placed on the head; a heat absorption and radiation unit(20) which is installed in a pad and absorbs or radiates heat of the pad; a power supply unit(30) supplying the power to the heat absorption and radiation unit; and a controller(40) controlling the power provided to the heat absorption and radiation unit from the power supply unit. The pad is filled with refrigerant of gel or sol phase. To both ends of the pad, a band is connected.

Description

Head cool fomenting pack using thermoelectric element}

The present invention relates to a hair pack pack, and more particularly, to a hair pack pack using a thermoelectric semiconductor that can enable continuous cold pack using a thermoelectric semiconductor.

In winter, children are often cold because they are immune to outdoor activities, neglect exercise, and dry. In particular, more and more children have a cold due to the emergence of new viruses such as the H1N1 flu.

In young children, a cold often accompanies a high fever. At this time, if a high fever, for example about 39 ~ 40 ℃ high fever lasts for more than several ten minutes, brain cells may be damaged. As a result, when a child has a high fever, most parents apply cold compresses to cool the fever.

Cold packs are usually made by placing wet wipes on the head of a child, and the wipes cool the head. If the towel warms over time, soak the towel again and lower the temperature and repeat the cold pack.

However, in the case of children, even if cold cold does not fall well because of high fever while cold night was frequent. In this case, the nursing person (parent) suffers from lack of sleep and fatigue, which impairs daily life.

In addition, if the child sleeps briefly during cold treatment, the child is left with a high fever, in which case a fatal condition such as damage to the brain cells may come.

The present invention has been made in order to solve the above problems, it is possible to reduce the temperature of the head effectively by enabling a continuous cold cold, and the head using a thermoelectric semiconductor that can allow the caregiver to sleep even briefly The purpose is to provide a poultice pack.

Another object of the present invention, to prevent falling from the hair during poultry, to provide a hair pack pack using a thermoelectric semiconductor that can effectively cold head the hair.

In order to achieve the above object, the hair steam pack using the thermoelectric semiconductor according to the present invention, the pad 10 is placed on the head, the pad 10 is installed on the pad 10 to absorb and heat the heat of the pad 10 Endothermic heat dissipation unit 20, a power supply unit 30 for supplying power to the endothermic heat dissipation unit 20, and a control unit for controlling the power supplied from the power supply unit 30 to the endothermic heat dissipation unit 20 In the hair pack using a thermoelectric semiconductor comprising a 40, the pad 10 is filled with a gel or a sol-like refrigerant (C); The pad 10 is wrapped by a face cover 50; A band 60 is connected to both ends of the pad 10 so as to wrap the head so that the pad 10 does not fall off the head; The pad (10) is composed of a first pad (11) having a fitting portion (12) and a second pad (13) coupled to and integrated by thermal bonding to the first pad (11); The heat absorbing heat dissipation part 20 may include a body 21 fitted to the fitting part 12, a conductive plate 22 positioned between the first pad 11 and the second pad 13, and A conductive block 23 coupled to the upper portion of the conductive plate 22 in the body 21, a thermoelectric conductor 24 in close contact with the upper portion of the conductive block 23, and an upper portion of the thermoconductor 24. A heat dissipation block 25 in close contact with the fan and a fan 26 installed on the heat dissipation block 25; The conductive plate 22 has a curved surface formed such that the pad 10 has a curved surface shape as a whole; The body 21 is provided with a first removable terminal 31 is electrically connected to the thermoelectric semiconductor 24 and the fan 26; The power supply unit 30 is attached to and detached from the first removable terminal 31, the second removable terminal 32 is connected to the wire 30a is installed;
In the present invention. The endothermic heat dissipation unit 20 may further include a sensor 27 measuring the temperature of the pad 10 to generate a corresponding temperature signal and to transmit the corresponding temperature signal to the control unit 40.

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In the present invention, the control unit 40 further includes a timer unit 45 for setting the supply time of the power supplied to the thermoelectric semiconductor 24 and the fan 26.

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According to the hair pack using the thermoelectric semiconductor according to the present application, it is possible to continuously maintain the cold pack temperature can effectively lower the high heat, thereby maximizing the poultice effect.

In addition, during the steaming, it is not necessary to reduce the temperature by repeatedly dampening the wet towel as in the prior art, it is possible to enable more comfortable nursing and to take a proper sleep.

And, since the hair pack pack does not fall from the head during poultice, it may be possible to enable a more effective poultice.

Hereinafter, the hair pack according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a hair pack using a thermoelectric semiconductor according to the invention, Figure 2 is a view for explaining the configuration of the hair pack pack of Figure 1, Figure 3 is a cross-sectional view along the line III-III 'of Figure 1, 4 is a view for explaining that the hair pack pack of Figure 1 includes a face cover and a band.

As shown, the hair pack pack according to the present invention, the pad 10 is filled with a gel or sol-like refrigerant (C) on the inside as being mounted on the head; An endothermic heat dissipation unit 20 installed on the pad 10 to absorb and dissipate heat of the pad 10; A power supply unit 30 for supplying power to the endothermic heat dissipation unit 20; And a controller 40 for controlling the power supplied from the power supply unit 30 to the endothermic heat dissipation unit 20. In addition, the hair pack pack may further include a face cover 50 surrounding the pad 10. In addition, the hair pack pack may further include a band 60 to close the pad 10 so as not to fall off the head of the child during the steaming.

The pad 10 is implemented by filling a refrigerant in a pack made of a resin material having a size that is placed on the head of a child. In this case, it is preferable to maintain the colloidal phase by implementing a refrigerant filled with pure water, a non-freezing substance such as glycerin or propylene glycol, and a super absorbent polymer that absorbs water up to 50 to 100 times. . These refrigerants contain a lot of superabsorbent polymer particles of water, and thus have excellent cold storage properties.

The pad 10 may include a first pad 11 having a fitting portion 12 in which the body 21 of the heat absorbing heat radiating portion 20 is fitted in order to fix the heat absorbing heat radiating portion 20 to be described later, and a first pad 11. The second pad 13 is coupled to and integrated with the first pad 11. At this time, it is preferable that the edges 11a and 13a of the first pad 11 and the second pad 13 are integrated with each other. The first pad 11 and the second pad 12 is an independent configuration filled with the refrigerant (C), and thus the body 21 is fitted to the fitting portion 12 of the first pad 11 Even if the conductive plate 22 to be described later is positioned and bonded between the first and second pads 11 and 12, the coolant C does not leak from the pad 10.

The endothermic heat dissipation part 20 includes a body 21 fitted over an upper portion of the pad 10, more preferably a fitting portion 12 of the first pad 11, a first pad 11 and a second pad. A conductive plate 22 positioned between the conductive plate 22, a conductive block 23 coupled to an upper portion of the conductive plate 22 in the body 21, and a thermal conductive conductor in close contact with the upper portion of the conductive block 23. 24, a heat radiation block 25 in close contact with the upper portion of the thermoelectric semiconductor 24, a fan 26 installed on the upper portion of the heat radiation block 25, and a temperature signal corresponding to the temperature of the pad 10 are measured. It includes a sensor 27 for generating and transmitting to the control unit 40.

Body 21 is formed with a plurality of air holes (21a), when the fan 26 is rotated to the outside air is introduced to radiate the heat radiation block 25.

The conductive plate 22 is in the form of a plate widely disposed between the first pad 11 and the second pad 13, and the conductive block 23 is coupled to the conductive plate 22. By this coupling structure, the heat of the pad 10 is conducted to the conductive block 23 through the conductive plate 22.

At this time, the conductive plate 22 is preferably a structure having a curved surface, the pad 10 by the conductive plate 22 of the curved surface structure is a form having a curved surface as a whole, accordingly the head of the pad 10 When placed on the head, the area of contact with the head increases. That is, since the forehead of the head has a curved surface, the pad 10 may have a corresponding curved surface, thereby increasing the contact area with the forehead of the head.

The thermoelectric semiconductor 24 is a semiconductor device in which heat is generated and one side is cooled and the other side is heated when a power is applied. As used herein, the thermoconductor 24 uses one having a width of 3 cm. Since thermoelectric semiconductors are currently widely used in various fields, detailed descriptions thereof will be omitted.

The heat dissipation block 25 is in close contact with the heat dissipation surface of the thermoelectric semiconductor 24, and the fan 26 is in close contact with the heat dissipation block 25. By this structure, the heat of the thermoelectric semiconductor 24 is conducted to the heat dissipation block 25, the fan 26 heats the heat conducted to the heat dissipation block 25 to the outside.

The sensor 27 senses the temperature of the pad 10, generates a corresponding temperature signal, and transmits the generated temperature signal to the controller 40. That is, the sensor 27 continuously senses the temperature of the pad 10 and transmits it to the control unit 40, whereby the control unit 40 controls the power applied to the thermoelectric semiconductor 24. The temperature in 10) can be maintained at the set temperature.

The power supply unit 30 is separated from the heat absorbing heat dissipating unit 20 and supplies power to the heat absorbing heat dissipating unit 20 through an electric wire. The power supply unit 30 is implemented in a structure in which a large capacity battery, preferably a rechargeable large capacity battery, or a built-in adapter for decompressing 220V power to several V.

The pad 10 to which the endothermic heat dissipation unit 20 is fixed is manufactured in a small size for placing on the head. And since the hair steaming proceeds for several tens of minutes to several hours, sufficient power should be supplied to the hair steaming pack, and accordingly, the power supply unit 30 employs a large capacity battery to supply sufficient power to the hair steaming pack, and the size and weight It must be big. Therefore, the power supply unit 30 should be a structure that is separated from the pad 10.

On the other hand, if you do not use the hair pack of the present application, the power supply unit 30 and the endothermic heat dissipation unit 20 to be stored separately, if used, it should be electrically connected. To this end, the body 21 of the endothermic heat dissipation unit 20 is provided with a first detachable terminal 31 electrically connected to the thermoelectric semiconductor 24 and the fan 26, and the first detachable terminal is provided at the power supply unit 30. The second detachable terminal 32 connected to the electric wire 30a is attached to and detached from the 31.

The controller 40 controls the power supplied to the thermoelectric semiconductor 24 and the fan 26 in association with the temperature signal of the sensor 27, thereby allowing the pad 10 to maintain the set temperature.

On the other hand, the control unit 40 preferably includes a timer unit 45 for setting the supply time of the power supplied to the thermoelectric semiconductor 24 and the fan 26. In this case, since the poultice lasts for a predetermined time, more effective poultice and nursing may be enabled.

The face cover 50 is for preventing the pad 10 from directly touching the head. The face cover 50 should be attached to or detached from the pad 10 because it must be frequently used while washing. To this end, it is preferable that the Velcro 51 detachably attached to the face cover 50 is installed.

While the band 60 is steamed, the hair pack pack will not fall off the head. The band 60 is connected directly to the band coupling hole (10a) formed on both ends of the pad 10, it is a structure that is connected to both ends of the face cover (50). In the present exemplary embodiment, the pad 10 is connected to both ends of the pad 10.

Hair pack pack of the above structure can maintain the temperature of the pad 10 using a thermoelectric semiconductor at a set temperature, thereby enabling a continuous cold pack. Therefore, the poultice effect can be maximized, and furthermore, the caregiver can maintain nursing life by enabling nursing in a comfortable state.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

1 is a perspective view of a hair pack using a thermoelectric semiconductor according to the present invention,

2 is a view for explaining the configuration of the hair pack pack of Figure 1,

3 is a cross-sectional view along the line III-III 'of FIG.

Figure 4 is a view for explaining that the hair pack pack of Figure 1 includes a face cover and a band.

<Description of Signs of Major Parts of Drawings>

10 ... pad 10a ... band-bonding hole

11 ... First Pad 11a ... Geography

12 ... fittings 13 ... second pad

13a ... edge 20 ... endothermic

21 ... body 21a ... air hole

22 ... conduction plate 23 ... conduction block

24 ... thermoconductor 25 ... heat dissipation block

26 ... fan 27 ... sensor

30 ... power supply 31,32 ... 1, 2 removable terminal

40 ... control unit 45 ... timer unit

50 ... face cover 60 ... band

Claims (7)

A pad 10 mounted on the head, an endothermic heat dissipation unit 20 installed on the pad 10 to absorb and dissipate heat of the pad 10, and supplying power to the endothermic heat dissipation unit 20. In the hair pack using a thermoelectric semiconductor, characterized in that it comprises a power supply unit 30, and a control unit 40 for controlling the power supplied from the power supply unit 30 to the endothermic heat dissipation unit 20, Inside the pad 10 is filled with a gel or sol refrigerant (C); The pad 10 is wrapped by a face cover 50; A band 60 is connected to both ends of the pad 10 so as to wrap the head so that the pad 10 does not fall off the head; The pad (10) is composed of a first pad (11) having a fitting portion (12) and a second pad (13) coupled to and integrated by thermal bonding to the first pad (11); The heat absorbing heat dissipation part 20 may include a body 21 fitted to the fitting part 12, a conductive plate 22 positioned between the first pad 11 and the second pad 13, and A conductive block 23 coupled to the upper portion of the conductive plate 22 in the body 21, a thermoelectric conductor 24 in close contact with the upper portion of the conductive block 23, and an upper portion of the thermoconductor 24. A heat dissipation block 25 in close contact with the fan and a fan 26 installed on the heat dissipation block 25; The conductive plate 22 has a curved surface formed such that the pad 10 has a curved surface shape as a whole; The body 21 is provided with a first removable terminal 31 is electrically connected to the thermoelectric semiconductor 24 and the fan 26; The power supply unit 30 is installed in the first removable terminal 31, the second removable terminal 32 is connected to the wire (30a) is installed; the hair pack using a thermoelectric semiconductor, characterized in that. delete delete delete According to claim 1, wherein the endothermic heat dissipation unit 20, Hair pack pack using a thermoelectric semiconductor, characterized in that it further comprises a sensor 27 for measuring the temperature of the pad 10 to generate a corresponding temperature signal and transmit it to the control unit 40. delete The method of claim 1, wherein the control unit 40, Hair pack using a thermoelectric semiconductor, characterized in that it further comprises a timer (45) for setting the supply time of the power supplied to the thermoelectric semiconductor (24) and the fan (26).

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