CN219538652U - Semiconductor refrigerating and fever reducing instrument - Google Patents
Semiconductor refrigerating and fever reducing instrument Download PDFInfo
- Publication number
- CN219538652U CN219538652U CN202320589488.0U CN202320589488U CN219538652U CN 219538652 U CN219538652 U CN 219538652U CN 202320589488 U CN202320589488 U CN 202320589488U CN 219538652 U CN219538652 U CN 219538652U
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- China
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- power supply
- sheet
- semiconductor refrigerating
- supply box
- silica gel
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
The utility model provides a semiconductor refrigerating and fever reducing instrument, which comprises: the device comprises a heat conduction silica gel piece, a semiconductor refrigerating piece, a power supply box, a radiator and a fixing belt, wherein the heat conduction silica gel piece is suitable for being attached to the forehead of a user; the semiconductor refrigerating sheets are stacked on the heat-conducting silica gel sheets and are suitable for conducting cold energy to the heat-conducting silica gel sheets; the power supply box is internally provided with a battery and is electrically connected with the semiconductor refrigerating sheet and is suitable for supplying power to the semiconductor refrigerating sheet; the two power supply boxes comprise a first power supply box and a second power supply box, and are symmetrically arranged on two sides of the heat conduction silica gel sheet and the semiconductor refrigeration sheet; the radiator is arranged on the semiconductor refrigerating sheet; the fixing belt is arranged on the power supply box and is suitable for fixing the heat conduction silica gel sheet with the forehead of a user. The semiconductor refrigerating fever reducing instrument provided by the utility model has a continuous refrigerating function, solves the problem that common fever reducing patches need to be replaced frequently, and has the advantages of reasonable structural arrangement, comfort in wearing and the like.
Description
Technical Field
The utility model belongs to the technical field of medical supplies, and particularly relates to a semiconductor refrigerating and fever reducing instrument.
Background
Fever is one of the most common manifestations of many diseases, and in severe cases can directly damage human brain cells. Fever generally includes two fever reducing modes clinically, namely, one of which is drug fever reducing and the other is physical temperature reducing. Drug fever abatement generally has side effects, especially for children whose viscera are not well developed, so fever symptoms are not serious, and fever is generally abated by physical cooling.
At present, most of fever reducing patches adopting physical cooling are disposable articles, and the fever reducing patches need to be checked and replaced frequently in the process of fever reducing, so that inconvenience is caused.
Disclosure of Invention
The utility model aims to provide a semiconductor refrigeration fever reducing instrument, which solves the technical problem that a disposable fever reducing patch in the prior art cannot continuously refrigerate.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
a semiconductor refrigeration antipyretic comprising:
the heat-conducting silica gel piece is suitable for being attached to the forehead of a user;
the semiconductor refrigerating sheet is overlapped on the heat-conducting silica gel sheet and is suitable for conducting cold energy to the heat-conducting silica gel sheet;
the power supply box is internally provided with a battery and is electrically connected with the semiconductor refrigerating sheet and is suitable for supplying power to the semiconductor refrigerating sheet; the two power supply boxes comprise a first power supply box and a second power supply box, and are symmetrically arranged on two sides of the heat conduction silica gel sheet and the semiconductor refrigeration sheet;
the radiator is arranged on the semiconductor refrigerating sheet;
the fixing belt is arranged on the power supply box and is suitable for fixing the heat conduction silica gel sheet with the forehead of a user.
Preferably, the heat conducting silica gel sheet and the semiconductor refrigerating sheet are fixedly connected through the power supply box.
Preferably, an adhesive surface is arranged on the power supply box, and the heat conduction silica gel sheet and the semiconductor refrigeration sheet are fixed through adhesion.
Preferably, the power supply box is provided with a fixing groove which is suitable for clamping the edges of the heat-conducting silica gel sheet and the semiconductor refrigerating sheet.
Preferably, the radiator is a fan; the radiator is electrically connected with the power supply box and is powered by the power supply box.
Preferably, the heat sink is connected to the semiconductor refrigeration sheet by one of soldering and gluing.
Preferably, one side of the heat conducting silica gel sheet is an arc surface, and the other side is a plane; the cambered surface is suitable for being attached to the forehead of a user, and the plane is suitable for being attached to the semiconductor refrigerating sheet.
Preferably, the semiconductor refrigerating sheet is a cuboid, the length of the cuboid is 5-15 cm, the width of the cuboid is 3-5 cm, and the thickness of the cuboid is 0.1-0.5 cm.
Preferably, one end of the fixing strap is connected with the first power supply box, and the other end of the fixing strap is connected with the second power supply box.
Preferably, the fixing band is an elastic band.
The scheme of the utility model at least comprises the following beneficial effects:
(1) The utility model relates to a semiconductor refrigerating and fever reducing instrument, which comprises: the device comprises a heat conduction silica gel piece, a semiconductor refrigerating piece, a power supply box, a radiator and a fixing belt, wherein the heat conduction silica gel piece is suitable for being attached to the forehead of a user; the semiconductor refrigerating sheets are stacked on the heat-conducting silica gel sheets and are suitable for conducting cold energy to the heat-conducting silica gel sheets; the power supply box is internally provided with a battery and is electrically connected with the semiconductor refrigerating sheet and is suitable for supplying power to the semiconductor refrigerating sheet; the two power supply boxes comprise a first power supply box and a second power supply box, and are symmetrically arranged on two sides of the heat conduction silica gel sheet and the semiconductor refrigeration sheet; the radiator is arranged on the semiconductor refrigerating sheet; the fixing belt is arranged on the power supply box and is suitable for fixing the heat conduction silica gel sheet with the forehead of a user. According to the semiconductor refrigeration antipyretic instrument disclosed by the utility model, the heat-conducting silica gel sheet is fixed on the forehead of a user through the fixing belt; after the semiconductor refrigerating sheet is electrified, one surface connected with the heat-conducting silica gel sheet discharges cold energy and is conducted to the forehead of a user through the heat-conducting silica gel sheet, so that the aim of physical cooling is fulfilled; the semiconductor refrigerating sheet emits heat from one surface connected with the radiator and dissipates the heat through the radiator, so that the continuous operation of the semiconductor refrigerating antipyretic instrument is ensured; the semiconductor refrigerating sheet and the radiator are powered by the power supply box, so that continuous refrigeration of the semiconductor refrigerating antipyretic instrument is realized, replacement is not needed in the cooling process, and the burden of a user or a caretaker is reduced.
(2) According to the semiconductor refrigeration antipyretic instrument disclosed by the utility model, the heat-conducting silica gel sheet and the semiconductor refrigeration sheet are fixedly connected through the power supply box, and the power supply box is used for supplying electric energy and simultaneously also has the function of fixing the heat-conducting silica gel sheet and the semiconductor refrigeration sheet, so that the design is simple and practical.
(3) According to the semiconductor refrigeration antipyretic instrument disclosed by the utility model, one side of the heat-conducting silica gel sheet, which is attached to the forehead of a user, is an arc surface, so that the semiconductor refrigeration antipyretic instrument accords with an ergonomic structure and improves the comfort level of the user.
Drawings
FIG. 1 is a schematic diagram of the semiconductor refrigerating antipyretic apparatus according to the present utility model;
fig. 2 is a structural diagram of a power supply box of the semiconductor refrigeration antipyretic apparatus according to the present utility model;
fig. 3 is a perspective view of the power supply box of the semiconductor refrigerating and cooling device according to the utility model;
1, a heat-conducting silica gel sheet; 2. a semiconductor refrigeration sheet; 3. a power supply box; 31. a first power supply box; 311. a battery; 32. a second power supply box; 33. an adhesive surface; 4. a heat sink; 5. a fixing belt.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
An embodiment of the present utility model provides a semiconductor refrigerating and fever reducing apparatus, as shown in fig. 1 to 3, including:
the heat conduction silica gel piece 1, wherein the heat conduction silica gel piece 1 is suitable for being attached to the forehead of a user;
the semiconductor refrigerating sheet 2 is stacked on the heat-conducting silica gel sheet 1 and is suitable for conducting cold energy to the heat-conducting silica gel sheet 1;
the power supply box 3 is internally provided with a battery 311, is electrically connected with the semiconductor refrigeration piece 2 and is suitable for supplying power to the semiconductor refrigeration piece 2; the two power supply boxes 3 comprise a first power supply box 31 and a second power supply box 32 which are symmetrically arranged on two sides of the heat conduction silica gel sheet 1 and the semiconductor refrigeration sheet 2;
a radiator 4, wherein the radiator 4 is arranged on the semiconductor refrigerating sheet 2;
and the fixing belt 5 is arranged on the power supply box 3 and is suitable for fixing the heat conduction silica gel sheet 1 with the forehead of a user.
The heat conduction silica gel sheet 1 and the semiconductor refrigeration sheet 2 are fixedly connected through the power supply box 3. The first power supply box 31 and the second power supply box 32 which are symmetrically arranged on two sides of the heat conduction silica gel sheet 1 and the semiconductor refrigerating sheet 2 can realize stable connection of the heat conduction silica gel sheet 1 and the semiconductor refrigerating sheet 2. The manner of fixing the thermally conductive silicone sheet 1 and the semiconductor cooling sheet 2 by the power supply box 3 is not unique to the achievement of the object of the present utility model. In the present embodiment, the power supply box 3 is structured as shown in fig. 2, and the internal structure is shown in fig. 3. The power supply box 3 is provided with an adhesive surface 33, and the heat conduction silica gel sheet 1 and the semiconductor refrigeration sheet 2 are fixed through adhesion. As an alternative implementation manner of this embodiment, the power supply box 3 may further be provided with a fixing groove, which is adapted to be embedded in the edges of the thermal silicon sheet 1 and the semiconductor refrigeration sheet 2, so as to fix the thermal silicon sheet 1 and the semiconductor refrigeration sheet 2.
As a preferred implementation of this embodiment, the heat sink 4 is a fan; the semiconductor refrigerating sheet 2 emits heat when working on the surface connected with the radiator 4, and dissipates through the radiator 4, so that the continuous working of the semiconductor refrigerating antipyretic instrument is ensured.
The radiator 4 is electrically connected with the power supply box 3, and is powered by the power supply box 3. The number of the power supply boxes 3 is two, and the power supply boxes comprise a first power supply box 31 and a second power supply box 32, and are suitable for supplying electric energy to the semiconductor refrigeration piece 2 and the radiator 4. For achieving the object of the present utility model, the electrical connection relationship between the power supply box 3 and the semiconductor refrigeration sheet 2 and the heat sink 4 is not unique, and may be, for example: the first power supply box 31 is electrically connected with the semiconductor refrigeration piece 2 and provides electric energy for the semiconductor refrigeration piece 2; the second power supply box 32 is electrically connected to the heat sink 4, and provides electric energy for the heat sink 4.
The heat sink 4 is connected to the semiconductor refrigeration sheet 2 by one of soldering and gluing.
One side of the heat-conducting silica gel sheet 1 is an arc surface, and the other side is a plane; the cambered surface is suitable for being attached to the forehead of a user, and the plane is suitable for being attached to the semiconductor refrigeration piece 2. The heat conduction silica gel piece 1 is a cambered surface on one side attached to the forehead of a user, accords with an ergonomic structure, and improves the comfort level of the user.
The semiconductor refrigerating sheet 2 may be a peltier semiconductor, one side is a refrigerating side and is connected to the heat conducting silicone sheet 1, and the other side is a heat dissipating side and is connected to the heat sink 4. In this embodiment, the semiconductor refrigeration sheet 2 is a cuboid, the length of the cuboid is 5-15 cm, the width of the cuboid is 3-5 cm, and the thickness of the cuboid is 0.1-0.5 cm. In order to facilitate the connection between the heat-conducting silica gel sheet 1 and the semiconductor refrigerating sheet 2, the size of the heat-conducting silica gel sheet 1 can be adapted to the semiconductor refrigerating sheet 2, that is, one side of the plane of the heat-conducting silica gel sheet 1 can be rectangular with the length of 5-15 cm and the width of 3-5 cm.
One end of the fixing strap 5 is connected with the first power supply box 31, and the other end is connected with the second power supply box 32.
As a preferred implementation manner of this embodiment, the fixing strap 5 is an elastic strap, so that it is convenient for users with different head circumferences to wear.
The working process of the semiconductor refrigeration antipyretic apparatus according to the embodiment is as follows: the operator wears the semiconductor refrigeration fever reducing instrument on the forehead through the fixing belt 5, adjusts to a proper position, enables the battery 311 in the power supply box 3 to be in a power supply state, conducts cold energy from the refrigeration side of the semiconductor refrigeration piece 2 to the heat conduction silica gel piece 1, cools the forehead of the operator, and dissipates heat from the heat dissipation side of the semiconductor refrigeration piece 2 through the radiator 4. After the use is finished, the battery 311 in the power supply box 3 is in a power-off state, and the semiconductor refrigeration antipyretic instrument is taken down.
While the foregoing is directed to the preferred embodiments of the present utility model, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the present utility model.
Claims (10)
1. A semiconductor refrigeration antipyretic apparatus comprising:
the thermal conduction silica gel piece (1), wherein the thermal conduction silica gel piece (1) is suitable for being attached to the forehead of a user;
the semiconductor refrigerating piece (2) is overlapped on the heat-conducting silica gel piece (1) and is suitable for conducting cold energy to the heat-conducting silica gel piece (1);
the power supply box (3) is internally provided with a battery and is electrically connected with the semiconductor refrigerating sheet (2) and is suitable for supplying power to the semiconductor refrigerating sheet (2); the two power supply boxes (3) comprise a first power supply box (31) and a second power supply box (32), and are symmetrically arranged on two sides of the heat conduction silica gel sheet (1) and the semiconductor refrigeration sheet (2);
a radiator (4), wherein the radiator (4) is arranged on the semiconductor refrigerating sheet (2);
the fixing belt (5) is arranged on the power supply box (3) and is suitable for fixing the heat conduction silica gel sheet (1) with the forehead of a user.
2. The semiconductor refrigeration antipyretic according to claim 1, wherein the thermally conductive silicone sheet (1) and the semiconductor refrigeration sheet (2) are fixedly connected by the power supply box (3).
3. The semiconductor refrigerating and cooling instrument according to claim 2, wherein the power supply box (3) is provided with an adhesive surface, and the heat conducting silicon sheet (1) and the semiconductor refrigerating sheet (2) are fixed by gluing.
4. The semiconductor refrigerating and fever reducing apparatus according to claim 2, wherein the power supply box (3) is provided with a fixing groove adapted to be clamped with the edges of the heat conducting silicon wafer (1) and the semiconductor refrigerating wafer (2).
5. The semiconductor refrigeration antipyretic according to claim 1, characterized in that the heat sink (4) is a fan; the radiator (4) is electrically connected with the power supply box (3), and power is supplied through the power supply box (3).
6. The semiconductor refrigerating and cooling device according to claim 1, wherein the radiator (4) and the semiconductor refrigerating sheet (2) are connected by one of welding and gluing.
7. The semiconductor refrigerating and cooling device according to claim 1, wherein one side of the heat conducting silica gel sheet (1) is a cambered surface, and the other side is a plane; the cambered surface is suitable for being attached to the forehead of a user, and the plane is suitable for being attached to the semiconductor refrigerating sheet (2).
8. The semiconductor refrigerating and fever reducing apparatus as defined in claim 6, wherein the semiconductor refrigerating sheet (2) is a rectangular parallelepiped having a length of 5 to 15cm, a width of 3 to 5cm, and a thickness of 0.1 to 0.5cm.
9. The semiconductor refrigerating and cooling device according to claim 1, wherein one end of the fixing belt (5) is connected with the first power supply box (31), and the other end is connected with the second power supply box (32).
10. The semiconductor refrigerating and fever reducing apparatus according to claim 1, characterized in that the fixing band (5) is an elastic band.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320589488.0U CN219538652U (en) | 2023-03-23 | 2023-03-23 | Semiconductor refrigerating and fever reducing instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320589488.0U CN219538652U (en) | 2023-03-23 | 2023-03-23 | Semiconductor refrigerating and fever reducing instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219538652U true CN219538652U (en) | 2023-08-18 |
Family
ID=87738232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320589488.0U Active CN219538652U (en) | 2023-03-23 | 2023-03-23 | Semiconductor refrigerating and fever reducing instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219538652U (en) |
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2023
- 2023-03-23 CN CN202320589488.0U patent/CN219538652U/en active Active
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