CN217339074U - Liquid-cooled cold compress appearance based on semiconductor refrigeration - Google Patents

Abstract

The utility model discloses a liquid cooling type cold compress appearance based on semiconductor refrigeration, including liquid cooling pad subassembly, first connecting pipe, second connecting pipe and semiconductor refrigeration device, semiconductor refrigeration device is used for cooling liquid and forms the coolant liquid to let in the coolant liquid to fill up the subassembly with the liquid cooling, and the liquid cooling pad subassembly is used for detachably cover to locate user's cold compress position, and carries out the cold compress to the cold compress position through the coolant liquid that holds in the inside of liquid cooling pad subassembly; the semiconductor refrigerating device comprises a liquid storage tank, a cold guide box, a liquid pump and a semiconductor refrigerating module which are sequentially connected through pipelines; the semiconductor refrigeration module is provided with a semiconductor refrigeration piece, and the cold end face of the semiconductor refrigeration piece is attached to the cold guide box. The liquid-cooled cold compress instrument based on semiconductor refrigeration can effectively solve the technical problems of poor continuity, more replacement times and low cold compress effect caused by the existing disposable cold compress article, and has simple and reasonable structure and convenient and rapid use.

Description

Liquid-cooled cold compress appearance based on semiconductor refrigeration

Technical Field

The utility model relates to a cold compress appearance technical field especially relates to a liquid cooling type cold compress appearance based on semiconductor refrigeration.

Background

Along with the continuous improvement of living standard, people pay more and more attention to the health of people, but the more common diseases such as fever, cold and the like can bring trouble to the study and work life of people often.

In order to reduce discomfort caused by fever, people generally use an antipyretic patch, a cold wet towel or a cold compress sheet and the like to be applied on the forehead for local physical cooling to reduce the discomfort caused by fever, but because the antipyretic patch, the cold wet towel or the cold compress sheet and other cold compress articles are all disposable, the cold compress articles need to be continuously replaced to ensure the cold compress effect, and the use process is very complicated; and if the user is a young child, the young child often moves around, so that the cold wet towel falls off or the fever cooling patch and the cold compress patch are difficult to be stably attached.

In addition, the sprain and other patients are usually cold dressed with ice cubes to achieve the effects of relieving swelling and pain, but because the ice cubes have edges and corners, the cold dressing with ice cubes cannot well contact the skin to achieve the purpose of cold dressing, and people may feel uncomfortable in the cold dressing process; in addition, the cold compress process using the ice block needs to continuously press the cold block by hands, so that the ice block is prevented from falling off, the water after the ice block is melted also needs to be treated in time, the operation is very troublesome, and the use satisfaction of a user is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a liquid cooling type cold compress appearance based on semiconductor refrigeration, can effectively solve the technical problem that the continuation that current disposable cold compress articles for use brought is poor, the change number of times is many, the cold compress effect is low, simple structure is reasonable, and convenient to use is swift to overcome the weak point among the prior art.

To achieve the purpose, the utility model adopts the following technical proposal:

a liquid cooling type cold compress instrument based on semiconductor refrigeration comprises a liquid cooling pad assembly, a first connecting pipe, a second connecting pipe and a semiconductor refrigeration device, wherein a liquid outlet of the semiconductor refrigeration device is connected with a liquid inlet nozzle of the liquid cooling pad assembly through the first connecting pipe, a liquid outlet nozzle of the liquid cooling pad assembly is connected with a liquid inlet of the semiconductor refrigeration device through the second connecting pipe, the semiconductor refrigeration device is used for cooling liquid to form cooling liquid and introducing the cooling liquid into the liquid cooling pad assembly, and the liquid cooling pad assembly is detachably sleeved at a cold compress position of a user and is used for cold compress of the cold compress position through the cooling liquid contained in the liquid cooling pad assembly;

the semiconductor refrigerating device comprises a liquid storage box, a cold guide box, a liquid pump and a semiconductor refrigerating module, wherein the cold guide box, the liquid storage box and the liquid pump are sequentially connected through pipelines, and the interiors of the cold guide box, the liquid storage box and the liquid pump are mutually communicated; the liquid outlet is communicated with the cold guide box, and the liquid inlet is communicated with the liquid storage box; the semiconductor refrigeration module is close to lead cold box setting, just the semiconductor refrigeration module is equipped with the semiconductor refrigeration piece, the cold terminal surface of semiconductor refrigeration piece with lead cold box and laminate each other.

Preferably, the semiconductor refrigeration module further comprises a heat dissipation assembly, the semiconductor refrigeration piece is provided with the cold end face and the hot end face, and the hot end face is attached to the heat dissipation face of the heat dissipation assembly.

Preferably, the radiating assembly comprises a radiating block, a radiating cover and a radiating fan which are connected in sequence, the radiating block is close to the semiconductor refrigerating sheet, and the radiating fan is erected on the back face of the radiating block through the radiating cover.

Preferably, the radiating block includes heating panel and a plurality of radiating fin, the front of heating panel is the cooling surface, the back mounted of heating panel has the interval to set up radiating fin, just radiating fin's extending direction orientation radiator fan.

Preferably, the semiconductor refrigeration module further comprises a first heat preservation piece and a second heat preservation piece;

the first heat preservation piece is positioned between the cold conduction box and the heat dissipation assembly, and the middle part of the first heat preservation piece is provided with a mounting through hole which is used for mounting the semiconductor refrigeration piece;

the second keeps warm and covers and is located the outside of cold terminal surface, just semiconductor refrigeration piece with leave between the second keeps warm and is used for holding lead the accommodation space of cold box.

Preferably, the liquid storage tank comprises a tank body and a cover body, and the cover body is used for opening and closing an opening of the tank body;

the blow vent has been seted up to the lid and has been annotated the liquid mouth, the blow vent is used for realizing the inside and outside atmospheric pressure of liquid reserve tank is balanced, annotate the liquid mouth and be used for injecting into liquid and discharge the box.

Preferably, the semiconductor refrigeration device further comprises a housing, the semiconductor refrigeration device is mounted inside the housing, and the first connecting pipe and the second connecting pipe penetrate through the housing and then are connected with the liquid cooling pad assembly;

the shell comprises a base, a shell and a handle, wherein the shell is detachably mounted on the base, the shell and the base jointly enclose a containing cavity for mounting the semiconductor refrigerating device, the handle is mounted at the top of the shell, and the handle is used for lifting the shell.

Preferably, the side wall of the shell is provided with a first avoidance position and a second avoidance position, the side wall of the box body is provided with a liquid level display area, the opening position of the first avoidance position is close to the liquid level display area, and the first avoidance position is used for avoiding the liquid level display area; the opening position of the second avoidance position is close to the heat dissipation assembly, and the second avoidance position is used for discharging heat out of the shell;

a third avoidance position is arranged at the top of the shell, the position of the third avoidance position is close to the cover body, and the third avoidance position is used for avoiding the air vent and the liquid injection port;

the shell further comprises a sealing element, the sealing element is installed at the third avoidance position, and the sealing element is used for opening and closing the third avoidance position.

Preferably, the semiconductor refrigeration device further comprises a control panel, wherein the control panel is installed on the top of the housing, and the control panel is electrically coupled to the semiconductor refrigeration device.

Preferably, the liquid cooling pad assembly comprises a liquid cooling pad and a fixing band, a bag cavity used for containing cooling liquid is arranged inside the liquid cooling pad, two ends of the fixing band are connected with the liquid cooling pad, and the liquid cooling pad is detachably sleeved on the cold compress position of a user through the fixing band.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

1. utilize the semiconductor refrigeration mode to cool down the liquid and form the coolant liquid, semiconductor refrigerating plant 4 lets in the liquid cooling pad subassembly with the coolant liquid, and the liquid cooling pad subassembly carries out the cold compress through holding in the inside coolant liquid of liquid cooling pad subassembly to the cold compress position, and the coolant liquid after the heat absorption gets back to semiconductor refrigerating plant again and continues the refrigeration to this circulation that reciprocates is favorable to ensureing the cooling effect of liquid cooling pad subassembly.

2. The liquid pump pumps the liquid stored in the liquid storage tank to the cold guide box, the cold guide box transmits the cold energy generated by the semiconductor refrigeration module to the liquid contained in the cold guide box, the liquid is changed into cooling liquid after being refrigerated, the cooling liquid is output to the liquid cooling pad assembly through the first connecting pipe to carry out cold compress on a cold compress position, the cooling liquid absorbing heat returns to the liquid storage tank through the second connecting pipe, and the liquid circulation system is formed through the reciprocating circulation, thereby keeping the liquid in the liquid cooling pad assembly at low temperature, being beneficial to the liquid in the liquid cooling type cold compress instrument to be recycled and continuously radiated, satisfying the use physical examination of users, avoiding worrying about the temperature rise and the cold compress effect reduction caused by the long-time use of the liquid cooling pad assembly, and the cold compress articles for use that use in the cold compress appearance of this scheme is not only disposable cold compress effect, consequently need not to change the cold compress articles for use, and it is more convenient and high-efficient to use.

Drawings

Fig. 1 is a schematic structural view of the liquid-cooled cold compress instrument based on semiconductor refrigeration of the present invention.

Fig. 2 is an explosion diagram of the liquid-cooled cold compress instrument based on semiconductor refrigeration.

Fig. 3 is a schematic view of a partial structure of a liquid-cooled cold compress instrument based on semiconductor refrigeration of the present invention.

Fig. 4 is a schematic view of a partial structure of a liquid-cooled cold compress instrument based on semiconductor refrigeration of the present invention.

Fig. 5 is a schematic view of a partial structure of a liquid-cooled cold compress instrument based on semiconductor refrigeration according to the present invention.

Wherein: the liquid cooling pad assembly 1, the liquid cooling pad 11, the fixing band 12, the first connecting tube 2, the second connecting tube 3, the semiconductor refrigerating device 4, the liquid storage tank 41, the box 411, the liquid level display area 4111, the cover 412, the vent 4121, the liquid injection port 4122, the cold guide box 42, the liquid pump 43, the semiconductor refrigerating module 44, the semiconductor refrigerating sheet 441, the cold end surface 4411, the heat dissipation assembly 442, the heat dissipation block 4421, the heat dissipation plate 44211, the heat dissipation fin 44212, the heat dissipation cover 4422, the heat dissipation fan 4423, the first heat preservation member 443, the installation through hole 4431, the second heat preservation member 444, the accommodating space 4441, the housing 5, the base 51, the housing 52, the handle 53, the sealing member 54, the first avoidance position 501, the second avoidance position 502, the third avoidance position 503, and the control panel 6.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The technical scheme provides a liquid-cooled cold compress instrument based on semiconductor refrigeration, which comprises a liquid-cooled cushion component 1, a first connecting pipe 2, a second connecting pipe 3 and a semiconductor refrigerating device 4, wherein a liquid outlet of the semiconductor refrigerating device 4 is connected with a liquid inlet nozzle of the liquid-cooled cushion component 1 through the first connecting pipe 2, a liquid outlet nozzle of the liquid-cooled cushion component 1 is connected with a liquid inlet of the semiconductor refrigerating device 4 through the second connecting pipe 3, the semiconductor refrigerating device 4 is used for cooling liquid to form cooling liquid and introducing the cooling liquid into the liquid-cooled cushion component 1, the liquid-cooled cushion component 1 is detachably sleeved at a cold compress position of a user, and the cold compress position is subjected to cold compress through the cooling liquid contained in the liquid-cooled cushion component 1;

the semiconductor refrigerating device 4 comprises a liquid storage box 41, a cold guide box 42, a liquid pump 43 and a semiconductor refrigerating module 44, wherein the cold guide box 42, the liquid storage box 41 and the liquid pump 43 are sequentially connected through a pipeline, and the interiors of the cold guide box 42, the liquid storage box 41 and the liquid pump 43 are mutually communicated; the liquid outlet is communicated with the cold guide box 42, and the liquid inlet is communicated with the liquid storage box 41; the semiconductor refrigeration module 44 is arranged close to the cold guide box 42, the semiconductor refrigeration module 44 is provided with a semiconductor refrigeration piece 441, and a cold end surface 4411 of the semiconductor refrigeration piece 441 is attached to the cold guide box 42.

In order to reduce discomfort caused by fever, people generally use an antipyretic patch, a cold wet towel or a cold compress sheet and the like to be applied on the forehead for local physical cooling to reduce the discomfort caused by fever, but because the antipyretic patch, the cold wet towel or the cold compress sheet and other cold compress articles are all disposable, the cold compress articles need to be continuously replaced to ensure the cold compress effect, and the use process is very complicated; and if the user is a young child, the young child often moves around, so that the cold wet towel is easy to fall off or the cooling patch and the cold compress patch are difficult to be stably attached.

In addition, the sprain and other patients are usually cold dressed with ice cubes to achieve the effects of relieving swelling and pain, but because the ice cubes have edges and corners, the cold dressing with ice cubes cannot well contact the skin to achieve the purpose of cold dressing, and people may feel uncomfortable in the cold dressing process; in addition, the cold block is continuously pressed by hands in the cold compress process of using the ice block, so that the ice block is prevented from falling off, water after the ice block is melted also needs to be treated in time, the operation is very troublesome, and the use satisfaction of a user is low.

Therefore, in order to solve the technical problems of poor continuity, multiple replacement times and low cold compress effect caused by the existing disposable cold compress product, the technical scheme provides a liquid-cooled cold compress instrument based on semiconductor refrigeration, as shown in fig. 1-5, which comprises a liquid cooling pad assembly 1, a first connecting pipe 2, a second connecting pipe 3 and a semiconductor refrigeration device 4, wherein a liquid outlet of the semiconductor refrigeration device 4 is connected with a liquid inlet nozzle of the liquid cooling pad assembly 1 through the first connecting pipe 2, so that cooling liquid is introduced into the liquid cooling pad assembly 1 from the semiconductor refrigeration device 4 through the first connecting pipe 2; the liquid cooling fills up and links to each other through second connecting pipe 3 between the liquid outlet nozzle of subassembly 1 and the inlet of semiconductor refrigerating plant 4, make the coolant liquid after the absorbed heat get back to semiconductor refrigerating plant 4 from liquid cooling pad subassembly 1 through second connecting pipe 3 and continue to refrigerate, semiconductor refrigerating plant 4 is used for cooling liquid and forms the coolant liquid, and let in the coolant liquid and fill up subassembly 1, liquid cooling pad subassembly 1 is used for detachably cover to locate user's cold compress position, and carry out the cold compress to the cold compress position through holding in the coolant liquid that liquid cooling pad subassembly 1 is inside. The cold compress appearance that this scheme provided is liquid cooling cold compress appearance to utilize the semiconductor refrigeration mode to cool down the liquid and form the coolant liquid, semiconductor refrigerating plant 4 lets in the coolant liquid cooling pad subassembly 1 with the coolant liquid, the liquid cooling pad subassembly 1 carries out the cold compress to the cold compress position through holding in the coolant liquid that liquid cooling pad subassembly 1 is inside, the coolant liquid after the absorbed heat gets back to semiconductor refrigerating plant 4 again and continues to refrigerate, with this reciprocating cycle, be favorable to guaranteeing the cooling effect of liquid cooling pad subassembly 1.

Preferably, the first connecting pipe 2 and the second connecting pipe 3 can be detachably connected in the scheme, and the first connecting pipe 2 and the second connecting pipe 3 with different lengths are replaced, so that the cold compress requirements of a user under different conditions can be met, and the universality of the cold compress instrument is improved; in addition, the detachable first connecting pipe 2 and the detachable second connecting pipe 3 are also beneficial to cleaning and replacing by a user, thereby being convenient for prolonging the service life of the cold compress instrument.

More preferably, first connecting pipe 2 and/or second connecting pipe 3 in this scheme can adopt the silica gel hose to increase sponge insulating tube or cotton etc. in its outside and keep warm, thereby ensure the cold compress effect of cold compress appearance.

Further, the semiconductor refrigeration device 4 in the present embodiment includes a liquid storage box 41, a cold conducting box 42, a liquid pump 43 and a semiconductor refrigeration module 44, the cold conducting box 42, the liquid storage box 41 and the liquid pump 43 are connected in sequence through a pipeline, and the interiors of the cold conducting box 42, the liquid storage box 41 and the liquid pump 43 are communicated with each other; the liquid outlet is communicated with the cold guide box 42, and the liquid inlet is communicated with the liquid storage tank 41; the semiconductor refrigeration module 44 is arranged close to the cold guide box 42, the semiconductor refrigeration module 44 is provided with a semiconductor refrigeration piece 441, and the cold end surface 4411 of the semiconductor refrigeration piece 441 is attached to the cold guide box 42. The liquid storage tank 41 is used for storing liquid. The cold conducting box 42 is used for transferring cold energy generated by the semiconductor refrigeration module 44 to liquid contained in the cold conducting box, so that the liquid is changed into cooling liquid after being refrigerated; preferably, the inside of the cooling conducting box 42 may be provided with a containing cavity (not shown in the figure) for containing liquid, the inside of the cooling conducting box 42 may also be provided with a cooling pipe (not shown in the figure) for passing the liquid, and the cooling conducting box 42 transfers the cooling energy generated by the semiconductor refrigeration module 44 to the cooling pipe, so that the liquid in the cooling pipe is changed into cooling liquid after refrigeration, which is not limited herein; more preferably, the material of the cold conducting box 42 may be metal; the cooling pipe arranged in the cold guide box 42 can be U-shaped or S-shaped, so that the contact area between the cooling pipe and the cold guide box 42 is increased conveniently, and the cooling effect is ensured; a temperature sensor (not shown) for monitoring the temperature of the cooling liquid may be further disposed in the accommodating cavity of the cold guiding box 42, so as to improve the controllability of the cold compress apparatus. The liquid pump 43 provides motive force for liquid flow. The semiconductor refrigerating sheet 441 is used for refrigerating and is manufactured by using the peltier effect, wherein the peltier effect is a phenomenon that when direct current passes through a galvanic couple formed by two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration piece 441 is made of two semiconductor materials to form a hot end and a cold end, wherein the cold end continuously absorbs heat to realize refrigeration, and the hot end continuously releases heat.

Preferably, a plurality of cold guiding boxes 42 may be provided in the present embodiment, and the plurality of cold guiding boxes 42, the liquid storage tank 41 and the liquid pump 43 are connected by a pipeline having branches, so as to further improve the refrigeration efficiency of the semiconductor refrigeration sheet 441.

Preferably, the number of the semiconductor cooling pieces 441 in the scheme can be multiple, and the cold end surfaces 4411 of the multiple semiconductor cooling pieces 441 are attached to the cold guide box 42, so that the cooling efficiency of the semiconductor cooling pieces 441 is further improved.

The working flow of the semiconductor refrigerating device 4 in the scheme is as follows:

the liquid pump 43 pumps the liquid stored in the liquid storage tank 41 to the cold guide box 42, the cold guide box 42 transfers the cold generated by the semiconductor refrigeration module 44 to the liquid contained in the liquid storage tank, the liquid is refrigerated and then changed into cooling liquid, the cooling liquid is output to the liquid cooling pad assembly 1 through the first connecting pipe 2 to carry out cold compress on the cold compress position, the cooling liquid absorbing heat returns to the liquid storage tank 41 through the second connecting pipe 3, and the liquid is circulated to form a liquid circulation system, so that the liquid in the liquid cooling pad assembly 1 keeps low temperature, the liquid in the liquid cooling type cold compress instrument can be recycled and continuously radiated, the use physical examination of a user is met, the temperature rise caused by long-time use of the liquid cooling pad assembly 1 is avoided, the cold compress effect is reduced, and the cold compress article used in the cold compress instrument of the scheme is not only provided with a one-time cold compress effect, so the cold compress article does not need to be replaced, the use is more convenient and efficient.

More specifically, the semiconductor refrigeration module 44 further includes a heat dissipation assembly 442, and the semiconductor refrigeration sheet 441 has the cold end surface 4411 and a hot end surface, and the hot end surface is attached to the heat dissipation surface of the heat dissipation assembly 442.

Because the cold compress appearance in this scheme uses the semiconductor refrigeration mode to refrigerate liquid, in order to ensure that the produced heat of the hot junction of semiconductor refrigeration piece 441 can in time scatter and disappear for the refrigeration efficiency of semiconductor refrigeration module 44, this scheme adds radiator unit 442 and dissipates the heat that the hot junction face of semiconductor refrigeration piece 441 produced fast, and the hot terminal face laminates with radiator unit 442's cooling surface each other, the direct conduction of the heat of being convenient for, further accelerates the dissipation of heat.

More specifically, the heat sink assembly 442 includes a heat sink 4421, a heat sink 4422 and a heat sink fan 4423, which are connected in sequence, the heat sink 4421 is disposed near the semiconductor cooling plate 441, and the heat sink fan 4423 is mounted on the back surface of the heat sink 4421 through the heat sink 4422.

In an embodiment of the present disclosure, the heat dissipation assembly 442 includes a heat dissipation block 4421, a heat dissipation cover 4422 and a heat dissipation fan 4423, which are sequentially connected, the heat dissipation block 4421 is disposed near the semiconductor cooling plate 441, the heat dissipation fan 4423 is erected on the back of the heat dissipation block 4421 through the heat dissipation cover 4422, and the heat dissipation fan 4423 is disposed to effectively accelerate air flow, so as to improve the heat dissipation efficiency of the semiconductor cooling module 44.

The heat dissipation fan 443 in the present embodiment may be an axial flow fan or a vortex flow fan, and is not limited herein.

Further, the heat slug 4421 includes a heat dissipating plate 44211 and a plurality of heat dissipating fins 44212, the front surface of the heat dissipating plate 44211 is the heat dissipating surface, the heat dissipating fins 44212 are mounted on the back surface of the heat dissipating plate 44211 at intervals, and the extending direction of the heat dissipating fins 44212 faces the heat dissipating fan 4423.

Radiating block 4421 in this scheme includes heating panel 44211 and a plurality of radiating fin 44212, the front and the hot terminal surface of heating panel 44211 paste mutually, radiating fin 44212 that the interval set up is installed to the back of heating panel 44211, form between a plurality of radiating fin 44212 and link up the runner and the air conservancy diversion, be convenient for increase air and radiating block 4421's area of contact, promote the radiating effect, and radiating fin 44212's extending direction is towards radiator fan 4423, the radiator fan 4423 of being convenient for drives near the air in radiating block 4421 and smoothly flows between radiator fan 4423, further promote the radiating effect.

More specifically, the semiconductor cooling module 44 further includes a first thermal insulation member 443 and a second thermal insulation member 444;

the first heat-insulating member 443 is positioned between the cold conducting box 42 and the heat dissipation assembly 442, a mounting through hole 4431 is formed in the middle of the first heat-insulating member 443, and the mounting through hole 4431 is used for mounting the semiconductor chilling plate 441;

the second heat insulating member 444 covers the outside of the cold end surface 4411, and an accommodating space 4441 for accommodating the cold conducting box 42 is reserved between the semiconductor refrigeration sheet 441 and the second heat insulating member 444.

In a preferred embodiment of the present solution, the semiconductor cooling module 44 further comprises a first thermal insulation 443 and a second thermal insulation 444.

Specifically, the first thermal insulation member 443 is located between the cooling conducting box 42 and the heat dissipation assembly 442, the middle portion of the first thermal insulation member 443 is provided with an installation through hole 4431 for installing the semiconductor chilling plate 441, and the first thermal insulation member 443 plays a role in positioning and installing the semiconductor chilling plate 441, and meanwhile, heat and cold generated by the semiconductor chilling plate 441 can be effectively prevented from being dissipated to the surrounding. Preferably, the first thermal insulation member 443 may be made of a thermal insulation sponge or the like.

More specifically, the second heat insulating member 444 covers the outside of the cold end surface 4411, an accommodating space 4441 for accommodating the cold conducting box 42 is reserved between the semiconductor chilling plate 441 and the second heat insulating member 444, the second heat insulating member 444 plays a role in accommodating and installing the cold conducting box 42, and meanwhile, the cold quantity transmitted to the cold conducting box 42 by the semiconductor chilling plate 441 can be effectively prevented from being dissipated to the periphery, the heat insulating effect on the cold conducting box 42 is achieved, and meanwhile, the refrigerating effect of the semiconductor chilling plate 441 on liquid is ensured.

To explain further, the liquid storage tank 41 includes a tank 411 and a cover 412, and the cover 412 is used for opening and closing an opening of the tank 411;

the cover 412 is opened with a vent hole 4121 and a liquid injection port 4122, the vent hole 4121 is used for balancing the air pressure inside and outside the liquid storage tank 41, and the liquid injection port 4122 is used for injecting and discharging liquid into and from the box 411.

In another preferred embodiment of the present invention, the liquid storage tank 41 includes a tank 411 and a cover 412, and the cover 412 is used for opening and closing an opening of the tank 411 to facilitate cleaning of the liquid storage tank 41. The cover body 412 is provided with an air vent 4121 and a liquid injection port 4122, the air vent 4121 is used for realizing balance of air pressure inside and outside the liquid storage tank 41 and ensuring smooth flow of liquid inside and outside the liquid storage tank 41, and the liquid injection port 4122 is used for injecting and discharging the liquid into and out of the tank body 411, so that a user can replace the liquid after long-time use, and the liquid is prevented from smelling.

Further, the liquid cooling pad further comprises a shell 5, the semiconductor refrigeration device 4 is installed inside the shell 5, and the first connecting pipe 2 and the second connecting pipe 3 are connected with the liquid cooling pad assembly 1 after penetrating through the shell 5;

the shell 5 comprises a base 51, a shell 52 and a handle 53, wherein the shell 52 is detachably mounted on the base 51, the shell 52 and the base 51 jointly enclose a containing cavity for mounting the semiconductor refrigerating device 4, the handle 53 is mounted on the top of the shell 52, and the handle 53 is used for lifting the shell 5.

Further, this scheme is based on liquid cooling type cold compress appearance of semiconductor refrigeration still is provided with shell 5, and semiconductor refrigerating plant 4 installs in the inside of shell 5, is convenient for play the guard action to it. The shell 5 in the scheme comprises a base 51, a shell 52 and a handle 53, wherein the shell 52 is detachably mounted on the base 51, the shell 52 and the base 51 jointly enclose a containing cavity for mounting the semiconductor refrigerating device 4, when the semiconductor refrigerating device 4 fails and cannot be normally used, the base 51 and the shell 52 of the shell 5 can be detached, and the semiconductor refrigerating device 4 in the shell can be checked and maintained; a handle 53 is mounted to the top of the housing 52 to facilitate removal and use of the cold compress apparatus.

Further, a first avoidance position 501 and a second avoidance position 502 are disposed on a side wall of the housing 5, a liquid level display area 4111 is disposed on a side wall of the box 411, the position where the first avoidance position 501 is disposed is close to the liquid level display area 4111, and the first avoidance position 501 is used for avoiding the liquid level display area 4111; the second avoiding position 502 is provided close to the heat dissipating component 442, and the second avoiding position 502 is used for discharging heat out of the housing 5;

a third avoiding position 503 is formed at the top of the housing 5, the third avoiding position 503 is close to the cover 412, and the third avoiding position 503 is used for avoiding the vent 4121 and the liquid injection port 4122;

the housing 5 further includes a sealing member 54, the sealing member 54 is installed at the third avoiding portion 503, and the sealing member 54 is used for opening and closing the third avoiding portion 503.

Further, the housing 5 of the present solution is provided with a first avoidance position 501, a second avoidance position 502 and a third avoidance position 503.

Firstly, a liquid level display area 4111 is arranged on the side wall of the tank 411, and the opening position of the first avoidance position 501 is close to the liquid level display area 4111, so that a user can observe the liquid level condition in the liquid storage tank 41 through the liquid level display area 4111 conveniently, and the adding amount of liquid can be controlled. It should be noted that the liquid level display area 4111 in the liquid storage tank 41 may be made of a transparent material, so that a user can observe the liquid level inside the liquid storage tank 41 conveniently.

Secondly, the second avoiding position 502 is provided close to the heat dissipating component 442, and the second avoiding position 502 is more favorable for heat generated by the semiconductor refrigeration module 44 to be discharged out of the housing 5, so that heat accumulation inside the housing 5 is avoided, and normal operation of the semiconductor refrigeration module 44 is affected.

Thirdly, the third avoiding position 503 for avoiding the vent 4121 and the liquid injection port 4122 is provided at the top of the housing 5, and the housing 5 is further provided with a sealing member 54 for opening and closing the third avoiding position 503, so that the liquid in the liquid storage tank 41 is prevented from flowing into the housing 5, the normal operation of the semiconductor refrigeration module 44 is prevented from being affected, and the sealing performance and the safety of the liquid storage tank 41 are improved.

Further, a control panel 6 is included, the control panel 6 is mounted on the top of the housing 5, and the control panel 6 is electrically coupled to the semiconductor cooling device 4.

In a preferred embodiment of the present disclosure, the liquid-cooled cold compress instrument is further provided with a control panel 6, and the control panel 6 is electrically connected to the semiconductor refrigeration device 4, so as to facilitate improving controllability of the liquid-cooled cold compress instrument.

Specifically, the control panel 6 in the present embodiment may be electrically connected to the liquid pump 43 and the semiconductor cooling plate 441 in the semiconductor cooling device 4, so as to realize the opening and closing of the cold compress instrument and the adjustment of the cooling temperature of the semiconductor cooling plate 441.

In addition, but control panel 6 in this scheme electric connection in semiconductor refrigerating plant 4 liquid pump 43 and semiconductor refrigeration piece 441 to and be located the thermodetector that leads in the cold box 42 cavity, realize opening and closing of cold compress appearance and carry out the prerequisite of adjusting to the refrigeration temperature of semiconductor refrigeration piece 441 under, monitor the temperature variation condition of coolant liquid, thereby the person of facilitating the use in time adjusts the refrigeration temperature of semiconductor refrigeration piece 441, more can promote user's use experience.

It should be noted that the control panel 6 in the present embodiment may be powered by a battery or an external power source, which is not limited herein.

Further, the liquid cooling pad assembly 1 includes a liquid cooling pad 11 and a fixing band 12, a bag for containing cooling liquid is disposed inside the liquid cooling pad 11, two ends of the fixing band 12 are connected to the liquid cooling pad 11, and the liquid cooling pad 11 is detachably sleeved on a cold compress position of a user through the fixing band 12.

Liquid cooling pad subassembly 1 in this scheme includes liquid cooling pad 11 and fixed band 12, and the inside of liquid cooling pad 11 is equipped with the bag chamber that is used for holding the coolant liquid, and the both ends of fixed band 12 are filled up 11 with the liquid cooling and are linked to each other, and the liquid cooling pad 11 is located user's cold compress position, simple structure, convenient to use through fixed band 12 detachably cover.

It should be noted that the liquid cooling pad 11 in the present embodiment may be made of a PU material with a flocked surface and hydrolysis resistance, and the bag cavity may form a liquid path through a press-fit pipeline to achieve a liquid cooling circulation effect, so that the liquid cooling pad 11 can be cooled uniformly; the fixed band 12 can adopt magic subsides, the relevant design that can adjust length such as elastic cord, adjusts the elasticity of fixed band 12 according to the cold compress position of difference to promote the suitability of liquid cooling pad subassembly 1.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (10)

1. A liquid cooling type cold compress appearance based on semiconductor refrigeration which characterized in that: the semiconductor refrigerating device is used for cooling liquid to form cooling liquid and introducing the cooling liquid into the liquid cooling pad assembly, and the liquid cooling pad assembly is detachably sleeved at a cold compress position of a user and used for refrigerating the cold compress position through the cooling liquid contained in the liquid cooling pad assembly;

the semiconductor refrigerating device comprises a liquid storage box, a cold guide box, a liquid pump and a semiconductor refrigerating module, wherein the cold guide box, the liquid storage box and the liquid pump are sequentially connected through pipelines, and the interiors of the cold guide box, the liquid storage box and the liquid pump are mutually communicated; the liquid outlet is communicated with the cold guide box, and the liquid inlet is communicated with the liquid storage box; the semiconductor refrigeration module is close to lead cold box setting, just the semiconductor refrigeration module is equipped with the semiconductor refrigeration piece, the cold terminal surface of semiconductor refrigeration piece with lead cold box and laminate each other.

2. The liquid-cooled cold compress appearance based on semiconductor refrigeration of claim 1, characterized in that: the semiconductor refrigeration module further comprises a heat dissipation assembly, the semiconductor refrigeration piece is provided with the cold end face and the hot end face, and the hot end face is attached to the heat dissipation face of the heat dissipation assembly.

3. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 2, wherein: the heat dissipation assembly comprises a heat dissipation block, a heat dissipation cover and a heat dissipation fan which are sequentially connected, the heat dissipation block is close to the semiconductor refrigeration sheet, and the heat dissipation fan is erected on the back face of the heat dissipation block through the heat dissipation cover.

4. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 3, wherein: the radiating block comprises a radiating plate and a plurality of radiating fins, the front surface of the radiating plate is the radiating surface, and the back surface of the radiating plate is provided with the radiating fins at intervals, and the extending direction of the radiating fins faces to the radiating fan.

5. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 2, wherein: the semiconductor refrigeration module further comprises a first heat preservation piece and a second heat preservation piece;

the first heat preservation piece is positioned between the cold conduction box and the heat dissipation assembly, and the middle part of the first heat preservation piece is provided with a mounting through hole which is used for mounting the semiconductor refrigeration piece;

the second heat preservation cover is arranged on the outer side of the cold end face, and an accommodating space for accommodating the cold conduction box is reserved between the semiconductor refrigeration piece and the second heat preservation cover.

6. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 2, wherein: the liquid storage tank comprises a tank body and a cover body, and the cover body is used for opening and closing an opening of the tank body;

the blow vent has been seted up to the lid and has been annotated the liquid mouth, the blow vent is used for realizing the inside and outside atmospheric pressure of liquid reserve tank is balanced, annotate the liquid mouth and be used for injecting into liquid and discharge the box.

7. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 6, wherein: the semiconductor refrigerating device is arranged in the shell, and the first connecting pipe and the second connecting pipe penetrate through the shell and then are connected with the liquid cooling pad assembly;

the shell comprises a base, a shell and a handle, wherein the shell is detachably mounted on the base, the shell and the base jointly enclose a containing cavity for mounting the semiconductor refrigerating device, the handle is mounted at the top of the shell, and the handle is used for lifting the shell.

8. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 7, wherein: a first avoidance position and a second avoidance position are formed in the side wall of the shell, a liquid level display area is formed in the side wall of the box body, the forming position of the first avoidance position is close to the liquid level display area, and the first avoidance position is used for avoiding the liquid level display area; the opening position of the second avoidance position is close to the heat dissipation assembly, and the second avoidance position is used for discharging heat out of the shell;

a third avoidance position is formed at the top of the shell, the third avoidance position is close to the cover body, and the third avoidance position is used for avoiding the vent and the liquid injection port;

the shell further comprises a sealing piece, the sealing piece is installed at the third avoidance position, and the sealing piece is used for opening and closing the third avoidance position.

9. The liquid-cooled cold compress appearance based on semiconductor refrigeration of claim 7, characterized in that: the semiconductor refrigeration device further comprises a control panel, wherein the control panel is installed at the top of the shell, and the control panel is electrically connected to the semiconductor refrigeration device.

10. The liquid-cooled cold compress instrument based on semiconductor refrigeration as claimed in claim 1, wherein: the liquid cooling pad assembly comprises a liquid cooling pad and a fixing band, a bag cavity used for containing cooling liquid is arranged inside the liquid cooling pad, the two ends of the fixing band are connected with the liquid cooling pad, and the liquid cooling pad is detachably sleeved on the cold compress position of a user through the fixing band.

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