KR100990513B1 - 태양전지 셀의 웨이퍼 제조장치 및 이를 이용한 웨이퍼제조방법 - Google Patents
태양전지 셀의 웨이퍼 제조장치 및 이를 이용한 웨이퍼제조방법 Download PDFInfo
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- KR100990513B1 KR100990513B1 KR1020080067240A KR20080067240A KR100990513B1 KR 100990513 B1 KR100990513 B1 KR 100990513B1 KR 1020080067240 A KR1020080067240 A KR 1020080067240A KR 20080067240 A KR20080067240 A KR 20080067240A KR 100990513 B1 KR100990513 B1 KR 100990513B1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000002994 raw material Substances 0.000 claims abstract description 62
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 230000003028 elevating effect Effects 0.000 claims abstract description 19
- 230000001965 increasing effect Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 14
- 239000010703 silicon Substances 0.000 abstract description 14
- 229910052710 silicon Inorganic materials 0.000 abstract description 14
- 238000010248 power generation Methods 0.000 abstract description 11
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 abstract 11
- 238000006243 chemical reaction Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007667 floating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (5)
- 태양전지 셀을 제조하기 위한 웨이퍼의 형상에 대응하는 주형틀이 형성된 금형과;상기 주형틀에 용융된 웨이퍼 원료가 충진되면, 상기 웨이퍼 원료를 상방으로 승강시킬 수 있도록 상기 금형에 승강 가능하게 설치되는 승강부재와;상기 승강부재를 승강 또는 하강시키는 액튜에이터와;상기 용융된 웨이퍼 원료가 경화되는 과정에서 압착되어 밀도가 높아지도록 상기 주형틀에 충진되어 상기 승강부재에 의해 상방으로 승강되는 웨이퍼 원료를 하방으로 가압하는 가압수단;을 구비하는 것을 특징으로 하는 태양전지 셀의 웨이퍼 제조장치.
- 제 1항에 있어서,상기 액튜에이터는 상기 승강부재의 승강높이를 조절할 수 있도록 형성되며,상기 금형에는 상기 주형틀에 충진되어 경화되는 웨이퍼 원료가 상기 가압수단에 의해 용이하게 가압될 수 있도록 히터가 설치되어 있는 것을 특징으로 하는 태양전지 셀의 웨이퍼 제조장치.
- 제 2항에 있어서,상기 가압수단은 상기 주형틀이 형성된 상기 금형의 상면을 따라 회전운동하여 상기 승강부재에 의해 승강된 웨이퍼 원료를 가압하는 가압롤러로 된 것을 특징 으로 하는 태양전지 셀의 웨이퍼 제조장치.
- 웨이퍼를 형성하기 위해 웨이퍼 원료를 용융시키는 용융원료 형성단계와;상기 용융된 웨이퍼 원료를 웨이퍼의 형상에 대응하는 주형틀을 갖는 금형에 충진하는 충진단계와;상기 금형에 충진된 용융된 웨이퍼 원료를 경화시키면서 상기 웨이퍼 원료의 밀도를 높이기 위해 상기 웨이퍼 원료를 하방으로 가압하는 가압수단을 통해 가압하는 가압 가공단계;를 포함하는 것을 특징으로 하는 태양전지 셀의 웨이퍼 제조방법.
- 제 4항에 있어서,상기 가압 가공단계는 상기 주형틀에 충진되어 경화되는 웨이퍼 원료를 상기 주형틀에 승강 가능하게 설치되는 승강부재 및 이 승강부재를 상하방향으로 이동시키는 액튜에이터를 통해 소정길이 상방으로 승강시키는 승강과정과,상기 승강부재에 의해 금형의 상부로 돌출된 웨이퍼 원료를 상기 가압수단을 통해 하방으로 가압하여 웨이퍼의 밀도를 높이는 가압과정을 포함하는 것을 특징으로 하는 태양전지 셀의 웨이퍼 제조방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080067240A KR100990513B1 (ko) | 2008-07-10 | 2008-07-10 | 태양전지 셀의 웨이퍼 제조장치 및 이를 이용한 웨이퍼제조방법 |
CN2009801268791A CN102089885B (zh) | 2008-07-10 | 2009-07-10 | 太阳能电池单元的晶圆制造装置及使用该装置的晶圆制造方法 |
PCT/KR2009/003798 WO2010005265A2 (ko) | 2008-07-10 | 2009-07-10 | 태양전지 셀의 웨이퍼 제조장치 및 이를 이용한 웨이퍼 제조방법 |
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KR1020080067240A KR100990513B1 (ko) | 2008-07-10 | 2008-07-10 | 태양전지 셀의 웨이퍼 제조장치 및 이를 이용한 웨이퍼제조방법 |
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KR20100006917A KR20100006917A (ko) | 2010-01-22 |
KR100990513B1 true KR100990513B1 (ko) | 2010-10-29 |
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KR1020080067240A KR100990513B1 (ko) | 2008-07-10 | 2008-07-10 | 태양전지 셀의 웨이퍼 제조장치 및 이를 이용한 웨이퍼제조방법 |
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KR (1) | KR100990513B1 (ko) |
CN (1) | CN102089885B (ko) |
WO (1) | WO2010005265A2 (ko) |
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CN108447950B (zh) * | 2018-05-21 | 2019-12-03 | 安徽省华腾农业科技有限公司 | 一种太阳能电池制造工艺 |
CN108649003B (zh) * | 2018-05-21 | 2020-09-11 | 厦门市信邦威科技有限公司 | 一种太阳能电池的晶圆制造装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001039774A (ja) | 1996-04-01 | 2001-02-13 | Saint Gobain Ceramics & Plastics Inc | セラミックウェーハーを作る方法 |
JP2007205862A (ja) | 2006-02-01 | 2007-08-16 | Tamagawa Seiki Co Ltd | ガスレートセンサの検出部構造 |
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KR100222917B1 (ko) * | 1996-09-18 | 1999-10-01 | 윤덕용 | 부상응고법을 이용한 실리콘박판 형성방법 및 장치 |
JP2002094098A (ja) * | 2000-09-19 | 2002-03-29 | Sharp Corp | 結晶薄板の製造方法および結晶薄板を用いた太陽電池 |
KR20050057838A (ko) * | 2003-12-11 | 2005-06-16 | 삼화전자공업 주식회사 | 태양전지용 Si웨이퍼 |
DK1548159T3 (da) * | 2003-12-22 | 2006-07-10 | Scheuten Glasgroep Bv | Fremgangsmåde til fremstilling af et Cu(In,Ga)Se2 monokrystallinsk pulver og monokornmembran-solcelle omfattende dette pulver |
JP4882385B2 (ja) * | 2006-01-19 | 2012-02-22 | ヤマハ株式会社 | 熱電素子及び熱電モジュールの製造方法 |
JP5060769B2 (ja) * | 2006-11-07 | 2012-10-31 | 株式会社エヌ・ピー・シー | ラミネート装置 |
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- 2008-07-10 KR KR1020080067240A patent/KR100990513B1/ko active IP Right Grant
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2009
- 2009-07-10 WO PCT/KR2009/003798 patent/WO2010005265A2/ko active Application Filing
- 2009-07-10 CN CN2009801268791A patent/CN102089885B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001039774A (ja) | 1996-04-01 | 2001-02-13 | Saint Gobain Ceramics & Plastics Inc | セラミックウェーハーを作る方法 |
JP2007205862A (ja) | 2006-02-01 | 2007-08-16 | Tamagawa Seiki Co Ltd | ガスレートセンサの検出部構造 |
Also Published As
Publication number | Publication date |
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KR20100006917A (ko) | 2010-01-22 |
WO2010005265A3 (ko) | 2010-04-29 |
CN102089885B (zh) | 2013-05-29 |
CN102089885A (zh) | 2011-06-08 |
WO2010005265A2 (ko) | 2010-01-14 |
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