KR101025301B1 - 박막 실리콘 태양전지의 제조방법 - Google Patents
박막 실리콘 태양전지의 제조방법 Download PDFInfo
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- KR101025301B1 KR101025301B1 KR1020090013952A KR20090013952A KR101025301B1 KR 101025301 B1 KR101025301 B1 KR 101025301B1 KR 1020090013952 A KR1020090013952 A KR 1020090013952A KR 20090013952 A KR20090013952 A KR 20090013952A KR 101025301 B1 KR101025301 B1 KR 101025301B1
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- silicon
- protective layer
- single crystal
- strip
- solar cell
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 81
- 239000010703 silicon Substances 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000010409 thin film Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011241 protective layer Substances 0.000 claims abstract description 44
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 28
- 239000012535 impurity Substances 0.000 claims abstract description 27
- 238000002513 implantation Methods 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 20
- 238000002161 passivation Methods 0.000 claims description 10
- 239000013078 crystal Substances 0.000 abstract description 5
- 230000008021 deposition Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010017577 Gait disturbance Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- IIGJROFZMAKYMN-UHFFFAOYSA-N [C].FC(F)(F)F Chemical compound [C].FC(F)(F)F IIGJROFZMAKYMN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- VZWXIQHBIQLMPN-UHFFFAOYSA-N chromane Chemical compound C1=CC=C2CCCOC2=C1 VZWXIQHBIQLMPN-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000010779 crude oil Substances 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0543—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the refractive type, e.g. lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (7)
- 단결정 실리콘에 상기 단결정 실리콘과 평행한 방향으로 이격되어 적어도 하나 이상의 트렌치를 형성하는 트렌치 형성단계;상기 단결정 실리콘 상부 및 상기 트렌치의 내부를 따라 증착된 제 1보호층 증착단계;상기 제 1보호층을 보호하기 위해 상기 1보호층의 하부 영역을 제외한 내외부 측벽을 따라 제 2보호층을 증착하는 제 2보호층 증착단계;상기 제 l보호층의 하부영역을 제거하는 제 1보호층 하부 제거단계;상기 제 1보호층 하부의 횡 방향으로 채널을 형성하는 채널 형성단계;상기 채널에 따라 언더커트를 하여 상기 단결정 실리콘과 분리된 실리콘 스트립에 불순물을 주입하는 불순물 주입단계; 및,상기 실리콘 스트립 상부에 적어도 하나 이상의 마이크로 렌즈를 형성하는 마이크로 렌즈 형성단계를 포함하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제 1 항에 있어서,상기 제 1보호층 하부 제거단계에서는상기 트렌치의 하부 가로 폭과 동일하게 상기 제 1보호층 하부의 가로 폭을 제거하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제 1 항에 있어서,상기 불순물 주입단계에서는상기 실리콘 스트립의 중앙부분에 불순물을 주입하여 n형 실리콘 층을 상기 실리콘 스트립의 중앙부분에 형성하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제 1 항에 있어서,상기 불순물 주입단계에서는상기 실리콘 스트립의 일측에 불순물을 주입하여 n형 실리콘 층을 상기 실리콘 스트립의 일측에 형성하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제 3 항 또는 제4항에 있어서,상기 불순물 주입단계에서는상기 실리콘 스트립에 불순물을 주입한 후 상기 실리콘 스트립 상부에 p형 전극과 n형 전극을 서로 각각 번갈아가며 형성하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제 5 항에 있어서,상기 p형 전극은상기 실리콘 스트립의 상부 측면에 형성되어 태양광 입사시에 상기 p형 전극에 의한 태양광 가림 현상을 줄일 수 있는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제 1 항에 있어서,상기 마이크로 렌즈 형성단계에서는상기 언더커트로 분리된 각각의 상기 실리콘 스트립을 연결하기 위해 상기 실리콘 스트립의 사이에 연결전극을 형성하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
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KR1020090013952A KR101025301B1 (ko) | 2009-02-19 | 2009-02-19 | 박막 실리콘 태양전지의 제조방법 |
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KR1020090013952A KR101025301B1 (ko) | 2009-02-19 | 2009-02-19 | 박막 실리콘 태양전지의 제조방법 |
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KR20100094798A KR20100094798A (ko) | 2010-08-27 |
KR101025301B1 true KR101025301B1 (ko) | 2011-03-29 |
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WO2014017856A1 (ko) * | 2012-07-27 | 2014-01-30 | 주식회사 동진쎄미켐 | 터치패널의 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980055711A (ko) * | 1996-12-28 | 1998-09-25 | 김영환 | 트랜지스터 및 그 제조 방법 |
KR20000070285A (ko) * | 1997-01-21 | 2000-11-25 | 오리진 에너지 리테일 리미티드 | 실리콘 박막 제조 방법 |
KR20060077175A (ko) * | 2004-12-30 | 2006-07-05 | 매그나칩 반도체 유한회사 | 광 특성을 향상시킬 수 있는 이미지센서 및 그 제조 방법 |
KR100643475B1 (ko) * | 2005-09-28 | 2006-11-10 | 엘지전자 주식회사 | 광 모듈 및 그 제조 방법 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980055711A (ko) * | 1996-12-28 | 1998-09-25 | 김영환 | 트랜지스터 및 그 제조 방법 |
KR20000070285A (ko) * | 1997-01-21 | 2000-11-25 | 오리진 에너지 리테일 리미티드 | 실리콘 박막 제조 방법 |
KR20060077175A (ko) * | 2004-12-30 | 2006-07-05 | 매그나칩 반도체 유한회사 | 광 특성을 향상시킬 수 있는 이미지센서 및 그 제조 방법 |
KR100643475B1 (ko) * | 2005-09-28 | 2006-11-10 | 엘지전자 주식회사 | 광 모듈 및 그 제조 방법 |
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