KR100989137B1 - Donor Substrate For Laser Induced Thermal Imaging, The Fabricating Method Of The Same and The Method Of Fabricating Orgnic Light Emitting Display Device Using the Same - Google Patents

Abstract

The present invention provides a laser thermal transfer donor substrate, a method of manufacturing the same, and a method of manufacturing an organic light emitting display device using the same; A light-to-heat conversion layer on the base film; A transfer layer on the light-to-heat conversion layer; And a protective film positioned on an upper portion of the base film including the transfer layer, wherein the protective film is attached to a base film and a part of an edge thereof to provide a donor substrate for laser thermal transfer.

Donor substrate, laser thermal transfer method

Description

Donor Substrate For Laser Induced Thermal Imaging, The Fabricating Method Of The Same and The Method Of Fabricating Orgnic Light Emitting Display Device Using the Same}

The present invention relates to a donor substrate, a method for manufacturing the same, and a method for manufacturing an organic light emitting display device using the same.

Among the flat panel display devices, the organic light emitting display device has a high response speed with a response speed of 1 ms or less, low power consumption, and no self-illumination, so there is no problem in viewing angle, and thus it is advantageous as a moving image display medium regardless of the device size. . In addition, low-temperature manufacturing is possible, and the manufacturing process is simple based on the existing semiconductor process technology has attracted attention as a next-generation flat panel display device in the future.

The organic light emitting display device can be broadly classified into a polymer type device using a wet process and a low molecular type device using a deposition process according to materials and processes used as an organic light emitting device.

In the inkjet printing method of the patterning method of the polymer or the low molecular weight light emitting layer, the materials of the organic layers other than the light emitting layer are limited, and there is a need to form a structure for inkjet printing on the substrate. In addition, when the light emitting layer is patterned by the deposition process, there is a difficulty in manufacturing a large device due to the use of a metal mask.

Recently, the laser induced thermal imaging (LITI) has been developed as a technique to replace the above patterning method.

The laser thermal transfer method converts a laser beam from a light source into thermal energy, and transfers a pattern forming material to a target substrate using the thermal energy to form a pattern. For this method, a donor substrate, a light source, and a subject having a transfer layer are formed. Phosphorus substrate is required.

At this time, after the alignment of the donor substrate on the pixel region where the pixel is defined on the substrate, air is compressed in the edge region of the pixel region in the process of transferring the transfer layer on the donor substrate. In addition, when the transfer material is pushed toward the substrate, the air is compressed and the edge part is blown out. Therefore, there is a problem that a defect occurs in the laser thermal transfer process.

In addition, when the conventional laser thermal transfer method is performed, a problem arises in that the light emitting layer or the organic film material is oxidized or contaminated, thereby deteriorating device performance.

In order to solve the above problems, the present invention provides a method of manufacturing an organic light emitting display device by a laser thermal transfer method in a vacuum state by providing a donor substrate for laser thermal transfer in the form of an envelope.

The present invention provides a donor substrate, a method for manufacturing the same, and a method for manufacturing an organic light emitting display device using the same, including: a base film; A light-to-heat conversion layer on the base film; A transfer layer on the light-to-heat conversion layer; And a protective film positioned on an upper portion of the base film including the transfer layer, wherein the protective film is attached to a base film and a part of an edge thereof to provide a donor substrate for laser thermal transfer.

And, preparing a base film, to form a light-heat conversion layer on the base film, to form a transfer layer on the light-heat conversion layer, the protective film located on the base film including the transfer layer Forming, but the base film and the protective film provides a method of manufacturing a donor substrate for laser thermal transfer, characterized in that to form a bag form by attaching only a portion of the edge.

Further, a substrate is formed, a first electrode positioned on the substrate is formed, a pixel definition film is formed on the first electrode, and the substrate is disposed in an envelope-type donor substrate including a base film having a transfer layer formed thereon. Air in the envelope-type donor substrate is evacuated, and a laser is irradiated to the donor substrate to transfer the transfer layer onto the substrate, and the substrate is separated from the envelope-type donor substrate, and on the substrate. A method of manufacturing an organic light emitting display device is provided, wherein the second electrode is formed.

Then, a substrate is prepared, a first electrode is formed on the substrate, and a laser thermal transfer donor substrate having a transfer layer is disposed on the first electrode to align the aligned substrate and the laser thermal transfer. A donor substrate is placed in a vacuum bag to intake and formed in a vacuum state. A laser is irradiated onto the laser thermal transfer donor substrate to transfer a transfer layer to the substrate, the vacuum bag is removed, and a second layer is placed on the substrate. Provided is a method of manufacturing an organic light emitting display device, characterized in that an electrode is formed.

The present invention provides a method for manufacturing an organic light emitting display device by performing a laser thermal transfer method in a vacuum state, thereby deteriorating a device due to edge open problems, oxidation, and contamination, which have occurred during the conventional laser thermal transfer method. There is an effect to solve the problems that occur in reducing the defects, and improve the yield of the product.

Hereinafter, the present invention will be described with reference to Examples.

≪ Example 1 >

1A is a view of a donor substrate for thermal transfer according to Embodiment 1 of the present invention.

Referring to FIG. 1A, edge portions of the base film 100 and the protective film 150 are adhered to each other in a form in which the protective film 150 faces the base film 100. Therefore, the base film 100 and the protective film 150 forms an envelope.

1B and 1C are cross-sectional views of the thermoelectric donor substrate according to the first embodiment, and FIG. 1A is another cross-sectional view in the I direction.

Referring to FIG. 1B, a light-to-heat conversion layer 102 is positioned on the base film 100, and a transfer layer 105 to be transferred onto the light-to-heat conversion layer 102 is positioned.

The base film 100 is made of a transparent polymer, and such polymers include polyester, such as polyethylene terephthalate, polyacryl, polyepoxy, polyethylene, polystyrene, and the like. Among them, polyethylene terephthalate film is mainly used. It is preferable that the thickness of a base film is 10-500 micrometers, and the role of this base film performs a role as a support film, and complex multiple systems can also be used.

The light-to-heat conversion layer 102 is formed of a light absorbing material having a property of absorbing light in the infrared-visible light region. As the film having such characteristics, there is a metal film made of aluminum, its oxide and sulfide, and an organic film made of a polymer to which carbon black, graphite or infrared dye is added. In this case, the metal film is formed to a thickness of 100 to 5,000 mm by vacuum deposition, electron beam deposition, or sputtering, and in the case of an organic film, extrusion, spin, and knife coating methods, which are general film coating methods, are used. 0.1 to 10 μm thick is preferred.

Then, the transfer layer 105 is formed on the light-to-heat conversion layer 102. The transfer layer 105 may be formed of an organic film of a polymer or a low molecular material, wherein the transfer layer may be formed by using a coating method, such as extrusion, spin, knife coating, vacuum deposition, or CVD, which is a general coating method. Coating 50,000 Å thick.

Referring to FIG. 1C, after the light-to-heat conversion layer 102 and the transfer layer 105 are formed on the base film 100 as described above, a protective film disposed on the front surface of the base film 100 ( 150). At this time, after facing the base film 100 and the protective film 150, by applying heat to the edge to complete the envelope form. The heat needs only to be applied to the base film 100 and the protective film 150 to be bonded to each other. When the edge is bonded, the heat is adhered to the substrate film 200 as much as the width to accommodate the substrate.

The protective film 150 is provided with a protrusion 150a. The protrusion 150a may serve as a passage through which air can pass during vacuum treatment, and the protective film 150 is a general vacuum packaging film. A film having a low gas permeability, such as a polyester film or nylon, can be used.

As described above, the laser thermal transfer donor substrate capable of transferring in a vacuum state is completed, and the laser thermal transfer method is performed in the same manner as described above.

1D and 1E illustrate a method of transferring a transfer layer using the laser thermal transfer donor substrate.

Referring to Figure 1d, for the laser thermal transfer of the envelope form formed as described above

In the donor substrate A, the substrate 200 on which the transfer layer is to be formed is positioned. In this case, the surface of the substrate 200 on which the transfer layer is to be formed is formed to face the transfer layer 105 to be transferred. Then, a vacuum is applied to the donor substrate (A) for laser thermal transfer in the envelope form.

Thereafter, a laser used in a conventional laser thermal transfer method is applied to transfer the transfer layer pattern 105a to be transferred onto the substrate 200.

Therefore, referring to FIG. 1E, the transfer layer pattern 150a is formed on the substrate 200 in the same manner as described above.

Example 2

2A to 2B are diagrams illustrating a donor substrate for laser thermal transfer and a method of transferring a transfer layer using the same, according to Embodiment 2 of the present invention.

Referring to FIG. 2A, the light-to-heat conversion layer 302 is formed on the base film 300. Then, a transfer layer 305 is formed on the light-to-heat conversion layer 302 to form a donor substrate for laser thermal transfer. The method of forming the base film 300, the light-to-heat conversion layer 302, and the transfer layer 305 is the same as in <Example 1>, and is omitted to avoid duplication. The donor substrate is completed by forming the base film 300 provided with the transfer layer 305 as described above.

Referring to FIG. 2B, the transfer layer 305 of the donor substrate formed of the substrate film 300 on which the light-to-heat conversion layer 302 and the transfer layer 305 are formed faces the substrate 400. Put in a vacuum bag (B) made of a protective film 500 of.

The protective film 150 is provided with a protrusion 150a. The protrusion 150a may serve as a passage through which air can pass during vacuum treatment, and the protective film 150 is a general vacuum packaging film. A film having a low gas permeability, such as a polyester film or nylon, can be used.

Referring to FIGS. 2C and 2D, the substrate substrate 300 and the substrate 400 are placed in a vacuum bag (B) as described above to maintain a vacuum state by applying a vacuum, and then irradiate a laser onto the donor substrate to transfer the substrate. The transfer layer pattern 305a to be transferred is transferred onto the substrate 400.

Example 3

3 illustrates a method of manufacturing an organic light emitting display device according to the present invention. Referring to FIG. 3, a substrate 400 is formed, and a first electrode 410 is formed on the substrate 400. .

Thereafter, the substrate 400 including the first electrode 410 is subjected to a laser thermal transfer method using a donor substrate for laser thermal transfer (shown in FIG. 1C) according to <Example 1>, and then transferred. The organic layer 420 is formed on the first electrode 410 by the layer 420.

Then, a second electrode 430 is formed over the entire surface of the substrate 400 to complete the organic light emitting display device.

Although <Example 3> has been described as forming a transfer layer using the donor substrate of <Example 1>, it can also be formed using the laser thermal transfer method described in <Example 2>.

1A to 1C are diagrams illustrating a donor substrate for laser thermal transfer according to Embodiment 1 of the present invention.

1D and 1E illustrate a method of transferring a transfer layer using the donor substrate for laser thermal transfer.

2A to 2D are diagrams illustrating a donor substrate for laser thermal transfer and a transfer method of the transfer layer using the same, according to Embodiment 2 of the present invention.

3 is a view of a method of manufacturing an organic light emitting display device according to a third embodiment of the present invention.

Claims (13)

Base film; A light-to-heat conversion layer on the base film; A transfer layer on the light-to-heat conversion layer; And a protective film positioned on an upper portion of the base film including the transfer layer, wherein the protective film is attached to only a portion of the base film and an edge thereof to form an envelope. The method of claim 1, The protective film has a donor substrate for laser thermal transfer, characterized in that it comprises a projection. 3. The method of claim 2, The projection of the protective film is a donor substrate for laser thermal transfer, characterized in that located on the surface facing the base film. The method of claim 1, A donor substrate for laser thermal transfer, characterized in that the transfer layer and the protective film are separated. The method of claim 1, The protective film is a donor substrate for laser thermal transfer, characterized in that the film for vacuum packaging. Prepare the base film, Forming a light-heat conversion layer on the base film, Forming a transfer layer on the light-to-heat conversion layer, Forming a protective film positioned on the base film including the transfer layer, wherein the base film and the protective film is attached to a portion of the edge to form a donor substrate for laser thermal transfer, characterized in that formed to form an envelope Way. The method of claim 6, The transfer layer is separated from the protective film, the method of manufacturing a donor substrate for laser thermal transfer. The method of claim 6, The protective film is a method of manufacturing a donor substrate for laser thermal transfer, characterized in that it comprises a projection. The method of claim 8, The protective film is a method of manufacturing a donor substrate for laser thermal transfer, characterized in that the surface on which the projection is formed so as to face the base film, the base film and the edge is attached. The method of claim 6, One surface of the edge is not bonded, the method of manufacturing a donor substrate for laser thermal transfer. Forming a substrate, Forming a first electrode on the substrate, Forming a pixel defining layer on the first electrode, The substrate is disposed in an envelope-type donor substrate including a base film on which a transfer layer is formed so that the substrate faces the transfer layer. Air in the bag-shaped donor substrate is evacuated, Irradiating the donor substrate with a laser to transfer a transfer layer onto the substrate, Separating the substrate from the enveloped donor substrate, A method of manufacturing an organic light emitting display device, characterized in that to form a second electrode on the substrate. The method of claim 11, The envelope-type donor substrate is a base film; A light-to-heat conversion layer on the base film; A transfer layer on the light-to-heat conversion layer; An organic light emitting display device comprising: a protective film positioned on an upper portion of the base film including the transfer layer, wherein the protective film is a donor substrate for laser thermal transfer having only a portion of the base film and an edge attached thereto. Manufacturing method. Prepare the substrate, Forming a first electrode on the substrate, Arrange and align a donor substrate for laser thermal transfer having a transfer layer on the first electrode, The aligned substrate and the donor substrate for laser thermal transfer are placed in a vacuum bag and inhaled to form a vacuum state, Irradiating a laser onto the donor substrate for laser thermal transfer to transfer a transfer layer to the substrate, Remove the vacuum bag, A method of manufacturing an organic light emitting display device, characterized in that to form a second electrode on the substrate.

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