KR100985431B1 - 레지스트용 수지, 포지티브형 레지스트 조성물 및 레지스트패턴 형성 방법 - Google Patents
레지스트용 수지, 포지티브형 레지스트 조성물 및 레지스트패턴 형성 방법 Download PDFInfo
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- XVDUJVGUHUELGP-LHIURRSHSA-N C(C1)C2[C@@H](CCCC3)C3=C1C2 Chemical compound C(C1)C2[C@@H](CCCC3)C3=C1C2 XVDUJVGUHUELGP-LHIURRSHSA-N 0.000 description 1
- 0 CC(**1C(OC)=O)C(*)[C@@]1C=*C Chemical compound CC(**1C(OC)=O)C(*)[C@@]1C=*C 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/282—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing two or more oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Abstract
Description
(a11) | (a12) | (a13) | (a14) | (a21) | (a22) | (a31) | (a32) | 분자량 | |
합성예 1 (X1) | 40 | 40 | 20 | 10000 | |||||
합성예 2 (X2) | 40 | 40 | 20 | 10000 | |||||
합성예 3 (X3) | 40 | 40 | 20 | 10000 | |||||
비교합성예 1 (Y1) | 40 | 40 | 20 | 10000 | |||||
비교합성예 2 (Y2) | 40 | 40 | 20 | 10000 |
(A) | (B) | (D) | (C) | 기타 | |
실시예 1 | X1 (100) |
PAG1 (2.0) PAG2 (0.8) |
AMINE1 (0.25) |
PGMEA/EL=8/2 (900) |
γ-부티로락톤 (25) |
실시예 2 | X2 (100) |
PAG1 (2.0) PAG2 (0.8) |
AMINE1 (0.25) |
PGMEA/EL=8/2 (900) |
γ-부티로락톤 (25) |
실시예 3 | X3 (100) |
PAG3 (2.0) | AMINE1 (0.1) |
PGMEA/EL=8/2 (1200) |
- |
비교예 1 | Y1 (100) |
PAG1 (2.0) PAG2 (0.8) |
AMINE1 (0.25) |
PGMEA/EL=8/2 (900) |
γ-부티로락톤 (25) |
비교예 2 | Y2 (100) |
PAG3 (2.0) | AMINE1 (0.1) |
PGMEA/EL=8/2 (1200) |
- |
기판 | 반사 방지막 | 레지스트 막두께 | PAB | PEB | 광원 | |
실시예 1 | 8인치 Si | ARC29A (77nm) | 300nm | 115℃/90초 | 115℃/90초 | ArF |
실시예 2 | 8인치 Si | ARC29A (77nm) | 300nm | 115℃/90초 | 115℃/90초 | ArF |
실시예 3 | 8인치 Si | ARC29A (77nm) | 200nm | 115℃/90초 | 105℃/90초 | ArF |
비교예 1 | 8인치 Si | ARC29A (77nm) | 300nm | 130℃/90초 | 130℃/90초 | ArF |
비교예 2 | 8인치 Si | ARC29A (77nm) | 200nm | 120℃/90초 | 110℃/90초 | ArF |
감도 | 한계 해상력 | DOF | MEF | LER | |
실시예 1 | 31mJ/㎠ | 110nm 트렌치 패턴 | 600nm | 0.96 | 4.3nm |
실시예 2 | 33mJ/㎠ | 110nm 트렌치 패턴 | 500nm | 0.86 | 5.3nm |
비교예 1 | 29mJ/㎠ | 110nm 트렌치 패턴 | 400nm | 0.66 | 6.5nm |
실시예 3 | 25mJ/㎠ | 130nm 홀 패턴 | 500nm | 1.65 | - |
비교예 2 | 30mJ/㎠ | 130nm 홀 패턴 | 400nm | 1.97 | - |
Claims (6)
- (A) 산의 작용에 의해 알칼리 가용성이 증대되는 레지스트용 수지 성분, 및 (B) 노광에 의해 산을 발생하는 산발생제 성분을 함유하는 포지티브형 레지스트 조성물로서,상기 (A) 성분은, (α-탄소수 1 내지 5의 알킬)아크릴산에스테르로부터 유도되는 구성 단위 (a) 를 주성분으로 하고, 상기 구성 단위 (a) 가, 산해리성 용해 억제기를 함유하는 (α-탄소수 1 내지 5의 알킬)아크릴산에스테르로부터 유도되는 구성 단위 (a1), 하기 식 (VI)(식 중, R 은 수소 원자 또는 탄소수 1 내지 5의 알킬기를 나타낸다.) 로 표시되는 락톤 함유 다환식기를 함유하는 (α-탄소수 1 내지 5의 알킬)아크릴산에스테르로부터 유도되는 구성 단위 (a2), 및극성기 함유 지방족 탄화수소기를 함유하는 (α-저급 알킬)아크릴산에스테르로부터 유도되는 구성 단위 (a3) 를 갖고,상기 (a3) 는 하기 일반식 (VIII)(식 중, R 은 수소 원자 또는 탄소수 1 내지 5 의 알킬기이고, -OH 기는 아다만틸기의 3 위치에 결합되며, n 은 1 이다.) 로 표시되는 극성기 함유 지방족 탄화수소기를 함유하는 (α-탄소수 1 내지 5의 알킬)아크릴산에스테르로부터 유도되는 구성 단위를 갖고, 또한상기 구성 단위 (a3) 는, 상기 일반식 (VIII) 에서 n 이 2 이상인 극성기 함유 지방족 탄화수소기를 함유하는 (α-탄소수 1 내지 5 의 알킬)아크릴산에스테르로부터 유도되는 구성 단위를 갖지 않는 것이며,상기 구성 단위 (a1) 는, 하기 일반식 (a1-2-1)[식 중, R12 는 탄소수 1 내지 8의 직쇄 또는 분지상의 알킬기를 나타내고, X 는 R12 가 결합하는 탄소원자와 함께 탄소수 4 내지 8의 단환식 시클로알칸으로부터 1개의 수소 원자를 제외한 기를 형성하는 기를 함유하고, 또한 폴리시클로알칸으로부터의 1개의 수소원자를 제외한 기를 함유하지 않는 산해리성 용해 억제기를 나타낸다] 로 표시되는 메타크릴산에스테르로부터 유도되는 구성 단위 (a1-2-1) 를 갖는 것을 특징으로 하는 포지티브형 레지스트 조성물.
- 제 1 항에 있어서,상기 구성 단위 (a1-2-1)에 있어서, R12 가 에틸기인 포지티브형 레지스트 조성물.
- 제 1 항에 있어서,상기 구성 단위 (a) 가, 추가로, 상기 구성 단위 (a2) 및 (a3) 이외의, 트리시클로데카닐기, 아다만틸기, 테트라시클로도데카닐기 및 이소보르닐기에서 선택되는 적어도 하나의 다환식의 지방족 탄화수소기를 함유하는 (α-탄소수 1 내지 5의 알킬)아크릴산에스테르로부터 유도되는 구성 단위 (a4) 를 갖는 포지티브형 레지스트 조성물.
- 삭제
- 제 1 항에 있어서,추가로 함질소 유기 화합물을 함유하는 포지티브형 레지스트 조성물.
- 제 1 항, 제 2 항, 제 3 항 또는 제 5 항 중 어느 한 항에 기재된 포지티브형 레지스트 조성물을 사용하여 기판 상에 포지티브형 레지스트막을 형성하고, 그 포지티브형 레지스트막에 대하여 선택적으로 노광 처리를 행한 후, 알칼리 현상하여 레지스트 패턴을 형성하는 것을 특징으로 하는 레지스트 패턴 형성 방법.
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KR1020077022028A KR100872019B1 (ko) | 2003-08-13 | 2004-08-10 | 레지스트용 수지, 포지티브형 레지스트 조성물 및 레지스트패턴 형성 방법 |
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EP (1) | EP1655315B1 (ko) |
JP (2) | JP4791184B2 (ko) |
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KR20060085723A (ko) * | 2005-01-25 | 2006-07-28 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 이용한 패턴 형성방법 |
JP5189260B2 (ja) * | 2006-08-25 | 2013-04-24 | 三菱レイヨン株式会社 | 重合体の製造方法 |
US8252503B2 (en) * | 2007-08-24 | 2012-08-28 | Az Electronic Materials Usa Corp. | Photoresist compositions |
JP5818710B2 (ja) * | 2012-02-10 | 2015-11-18 | 東京応化工業株式会社 | パターン形成方法 |
JP6097611B2 (ja) * | 2013-03-25 | 2017-03-15 | 東京応化工業株式会社 | レジスト組成物及びレジストパターン形成方法 |
CN113166327A (zh) | 2018-11-22 | 2021-07-23 | 富士胶片株式会社 | 感光化射线性或感放射线性树脂组合物、抗蚀剂膜、图案形成方法及电子器件的制造方法 |
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US6165678A (en) | 1997-09-12 | 2000-12-26 | International Business Machines Corporation | Lithographic photoresist composition and process for its use in the manufacture of integrated circuits |
US6280898B1 (en) * | 1998-09-25 | 2001-08-28 | Shin-Etsu Chemical Co., Ltd. | Lactone-containing compounds, polymers, resist compositions, and patterning method |
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Also Published As
Publication number | Publication date |
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WO2005016982A1 (ja) | 2005-02-24 |
KR100872019B1 (ko) | 2008-12-05 |
US20060183876A1 (en) | 2006-08-17 |
EP1655315A4 (en) | 2006-12-13 |
JP5470328B2 (ja) | 2014-04-16 |
JP4791184B2 (ja) | 2011-10-12 |
CN1832971A (zh) | 2006-09-13 |
KR20060060673A (ko) | 2006-06-05 |
EP1655315B1 (en) | 2012-07-04 |
EP1655315A1 (en) | 2006-05-10 |
CN100427519C (zh) | 2008-10-22 |
TWI300165B (en) | 2008-08-21 |
KR20070103784A (ko) | 2007-10-24 |
TW200506536A (en) | 2005-02-16 |
KR20080077034A (ko) | 2008-08-20 |
JPWO2005016982A1 (ja) | 2006-10-12 |
JP2011227509A (ja) | 2011-11-10 |
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