KR100969395B1 - 유전체 잉크, 이를 이용한 유전체 박막 및 유기박막트랜지스터 - Google Patents
유전체 잉크, 이를 이용한 유전체 박막 및 유기박막트랜지스터 Download PDFInfo
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- KR100969395B1 KR100969395B1 KR1020080042271A KR20080042271A KR100969395B1 KR 100969395 B1 KR100969395 B1 KR 100969395B1 KR 1020080042271 A KR1020080042271 A KR 1020080042271A KR 20080042271 A KR20080042271 A KR 20080042271A KR 100969395 B1 KR100969395 B1 KR 100969395B1
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- alcohol
- dielectric
- glycol
- solvent
- thin film
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- 239000010409 thin film Substances 0.000 title claims abstract description 38
- 239000002904 solvent Substances 0.000 claims abstract description 62
- 239000002243 precursor Substances 0.000 claims abstract description 23
- 238000007641 inkjet printing Methods 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 239000010408 film Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 24
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 23
- 238000001704 evaporation Methods 0.000 claims description 18
- 230000008020 evaporation Effects 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 12
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 7
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 7
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims description 6
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 6
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 6
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 5
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 4
- 235000019441 ethanol Nutrition 0.000 claims description 4
- DDJRDPDQTDWHJM-UHFFFAOYSA-N ethoxy-(2-ethyl-1,1-diphenylbutoxy)-hexoxysilane Chemical compound C1(=CC=CC=C1)C(C(CC)CC)(O[SiH](OCC)OCCCCCC)C1=CC=CC=C1 DDJRDPDQTDWHJM-UHFFFAOYSA-N 0.000 claims description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical group CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 4
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 4
- 239000012498 ultrapure water Substances 0.000 claims description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 3
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 229940051250 hexylene glycol Drugs 0.000 claims description 3
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 claims description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- UCRXQUVKDMVBBM-UHFFFAOYSA-N benzyl 2-amino-3-(4-phenylmethoxyphenyl)propanoate Chemical compound C=1C=CC=CC=1COC(=O)C(N)CC(C=C1)=CC=C1OCC1=CC=CC=C1 UCRXQUVKDMVBBM-UHFFFAOYSA-N 0.000 claims description 2
- CKEGKURXFKLBDX-UHFFFAOYSA-N butan-1-ol;hafnium Chemical compound [Hf].CCCCO.CCCCO.CCCCO.CCCCO CKEGKURXFKLBDX-UHFFFAOYSA-N 0.000 claims description 2
- PVZMSIQWTGPSHJ-UHFFFAOYSA-N butan-1-ol;tantalum Chemical compound [Ta].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO PVZMSIQWTGPSHJ-UHFFFAOYSA-N 0.000 claims description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 2
- UARGAUQGVANXCB-UHFFFAOYSA-N ethanol;zirconium Chemical compound [Zr].CCO.CCO.CCO.CCO UARGAUQGVANXCB-UHFFFAOYSA-N 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- LVNAMAOHFNPWJB-UHFFFAOYSA-N methanol;tantalum Chemical compound [Ta].OC.OC.OC.OC.OC LVNAMAOHFNPWJB-UHFFFAOYSA-N 0.000 claims description 2
- ZEIWWVGGEOHESL-UHFFFAOYSA-N methanol;titanium Chemical compound [Ti].OC.OC.OC.OC ZEIWWVGGEOHESL-UHFFFAOYSA-N 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 claims description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- 150000003624 transition metals Chemical class 0.000 claims description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 4
- 125000005909 ethyl alcohol group Chemical group 0.000 claims 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 2
- 229920001451 polypropylene glycol Polymers 0.000 claims 2
- NGCRLFIYVFOUMZ-UHFFFAOYSA-N 2,3-dichloroquinoxaline-6-carbonyl chloride Chemical compound N1=C(Cl)C(Cl)=NC2=CC(C(=O)Cl)=CC=C21 NGCRLFIYVFOUMZ-UHFFFAOYSA-N 0.000 claims 1
- -1 diphenylsilane Diphenylsilanediol Chemical compound 0.000 claims 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 claims 1
- RXRIEAKKQPAUKB-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1.CO[Si](OC)(OC)CCCOCC1CO1 RXRIEAKKQPAUKB-UHFFFAOYSA-N 0.000 claims 1
- 239000000976 ink Substances 0.000 abstract description 41
- 230000000704 physical effect Effects 0.000 abstract description 8
- 239000012530 fluid Substances 0.000 abstract description 6
- 239000003989 dielectric material Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000007639 printing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000002454 metastable transfer emission spectrometry Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- KGJQHEPGNCWZRN-UHFFFAOYSA-N 2-hexyl-5-[5-[5-(5-hexylthiophen-2-yl)thiophen-2-yl]thiophen-2-yl]thiophene Chemical compound S1C(CCCCCC)=CC=C1C1=CC=C(C=2SC(=CC=2)C=2SC(CCCCCC)=CC=2)S1 KGJQHEPGNCWZRN-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- BXSKVUFDIDRTTL-UHFFFAOYSA-N [O-]CC.[O-]CC.[Ta+2] Chemical compound [O-]CC.[O-]CC.[Ta+2] BXSKVUFDIDRTTL-UHFFFAOYSA-N 0.000 description 1
- AIEIVYNMNCPADL-UHFFFAOYSA-N [O-]CCC.[Zr+4].[O-]CCC.[Zr+4] Chemical compound [O-]CCC.[Zr+4].[O-]CCC.[Zr+4] AIEIVYNMNCPADL-UHFFFAOYSA-N 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000000089 atomic force micrograph Methods 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000000349 chromosome Anatomy 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 description 1
- FFUUQWKRQSBSGU-UHFFFAOYSA-N dipropylsilicon Chemical compound CCC[Si]CCC FFUUQWKRQSBSGU-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012703 sol-gel precursor Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Thin Film Transistor (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
용매 | 점도 (mPas) |
표면 장력 (mN/m) |
끓는점 (oC) |
증기압 (mmHg) |
에틸렌 글리콜 | 19.0 | 48.5 | 198 | 0.09 |
프로필 알코올 | 1.9 | 23.7 | 97 | 21 |
2-메톡시 에탄올 | 1.5 | 30.0 | 125 | 6.17 |
Claims (13)
- 중심원소로서 실리콘을 가지는 전구체, 초순수, 및 촉매를 포함하는 솔-젤 용액과;용매로서 상기 솔-젤 용액을 안정적으로 분산시키는 주 용매와, 건조 속도가 상기 주 용매와는 다른 보조 용매를 포함하며,상기 주 용매는 에틸 알코올(ethyl alcohol), 메틸 알코올(methyl alcohol), 이소프로필 알코올(isopropyl alcohol), 아세톤(acetone), 2-메톡시 에탄올(2-methoxy ethanol), 프로필 알코올(propyl alcohol), 펜틸 알코올(pentyl alcohol), 헥실 알코올(hexyl alcohol), 부틸 알코올(butyl alcohol), 및 옥틸 알코올(octyl alcohol)중에서 선택된 적어도 하나의 물질로 이루어지고,상기 보조 용매는 에틸렌글리콜(ethylene glycol), 디에틸렌글리콜(diethylene glycol), 트리에틸렌글리콜(triethylene glycol), 폴리에틸렌 글리콜 (poly-ethylene glycol), 프로필렌 글리콜(propylene glycol), 디프로필렌 글리콜(dipropylene glycol), 헥실렌 글리콜(hexylene glycol), 글리세린(glycerine), 2-메톡시 에탄올(2-methoxy ethanol), 프로필 알코올(propyl alcohol), 펜틸 알코올(pentyl alcohol), 헥실 알코올(hexyl alcohol), 부틸 알코올(butyl alcohol), 옥틸 알코올(octyl alcohol), 포름 아미드(Form amide), 메틸 에틸 케톤(methyl ethyl ketone), 다이옥산 (dioxane), 다이메틸포름아마이드 (dimethylformamide), 터피놀 (terpinol), 폴리에틸렌 글리콜 (polyethylene glycol), 에탄올아민 (ethanolamine), 및 다이에탄올아민 (diethanolamine) 중에서 선택된 적어도 하나의 물질로 이루어지고,상기 보조 용매는 점도, 표면 장력 또는 증발 속도가 다른 둘 이상의 물질로 구성되는 것을 특징으로 하는유전체 잉크.
- 제1항에 있어서, 상기 솔-젤 용액은 0.1 ~ 15 중량%로 함유되는 유전체 잉크.
- 제1항에 있어서, 상기 주 용매와 보조 용매의 비율은 중량비로 70:30 ~ 30:70의 범위인 유전체 잉크.
- 제1항에 있어서, 상기 촉매는 염산, 황산, 질산 중에서 선택되는 어느 하나인 유전체 잉크.
- 제1항에 있어서, 상기 전구체는 실리콘을 가지며 유기관능기를 갖는 제1전구체, 및 실리콘 또는 전이금속을 가지는 제2전구체를 포함하는 유전체 잉크.
- 제5항에 있어서, 상기 제1전구체는메틸트리메톡시실란 (methyltrimethoxysilane), 메틸트리에톡시실란 (methyltriethoxysilane), 페닐트리에톡시실란 (phenyltriethoxysilane),페닐트리메톡시실란 (phenyltrimethoxysilane), 다이페닐다이에틸헥실록시다이에톡시실란 (diphenyldiethylhexyloxydiethoxysilane), 메타크릴록시프로필트리메톡시실란 (3-methacryloxypropyltrimethoxysilane), 글리시딜록시프로필트리메톡시실란 (3-glycidyloxypropyltrimethoxysilane), 비닐트리메톡시실란 (vinyltrimethoxysilane), 머켑토프로필트리메톡시실란 (mercaptopropyltrimethoxysilane), 비닐트리메톡시실란 (vinyltrimethoxysilane), 머켑토프로필트리에톡시실란 (mercaptopropyltriethoxysilane) 중에서 선택된 적어도 하나의 물질로 이루어지는 유전체 잉크.
- 제5항에 있어서, 상기 제2전구체는메틸트리에톡시실란(methyltriethoxysilane), 메틸트리메톡시실란 (methyltrimethoxysilane), 에틸트리에틱시실란 (ethyltriethoxysilane), 에틸트리메톡시실란 (ethyltrimethoxysilane), 테트라에틸오쏘실리케이트(tetraethylorthosilicate), 페닐트리에톡시실란(phenyltriethoxysilane), 페닐트리메톡시실란(phenyltrimethoxysilane), 다이페닐다이에틸헥실록시다이에톡시실란 (diphenyldiethylhexyloxydiethoxysilane), 아미노프로필트리에톡시실란 (aminopropyltriethoxysilane), 아미노프로필트리메톡시실란 (aminopropyltrimethoxysilane), 다이페닐실란다이올 (diphenylsilanediol), 다이메틸다이메톡시실란 (dimethyldimethoxysilane), 지르코늄 에톡사이드 (zirconium ethoxide), 지르코늄 이소프로폭사이드 (zirconium isopropoxide), 지르코늄 프로폭사이드 (zirconium propoxide), 타이타늄 부톡사이드 (titanium butoxide), 타이타늄 에톡사이드 (titanium ethoxide), 타이타늄 이소프로폭사이드 (titanium isopropoxide), 타이타늄 프로폭사이드 (titanium propoxide), 타이타늄 메톡사이드 (titanium methoxide), 탄탈륨 부톡사이드 (tantalum butoxide), 탄탈륨 에톡사이드 (tantalum ethoxide), 탄탈륨 메톡사이드 (tantalum methoxide), 하프늄 터트뷰톡사이드 (hafnium tert-butoxide), 및 하프늄 뷰톡사이드 (hafnium N-butoxide) 중에서 선택된 적어도 하나의 물질로 이루어지는 유전체 잉크.
- 제1항에 있어서, 상기 보조 용매는 주 용매와 표면 장력이 다른 것을 특징으로 하는 유전체 잉크.
- 삭제
- 삭제
- 삭제
- 중심원소로서 실리콘을 가지는 전구체, 초순수, 및 촉매를 포함하는 솔-젤 용액과; 용매로서 상기 솔-젤 용액을 안정적으로 분산시키는 주 용매와, 건조 속도가 상기 주 용매와는 다른 보조 용매를 포함하는 유전체 잉크를 사용하여 잉크젯 프린팅으로 형성하며,상기 주 용매는 에틸 알코올(ethyl alcohol), 메틸 알코올(methyl alcohol), 이소프로필 알코올(isopropyl alcohol), 아세톤(acetone), 2-메톡시 에탄올(2-methoxy ethanol), 프로필 알코올(propyl alcohol), 펜틸 알코올(pentyl alcohol), 헥실 알코올(hexyl alcohol), 부틸 알코올(butyl alcohol), 및 옥틸 알코올(octyl alcohol)중에서 선택된 적어도 하나의 물질로 이루어지고,상기 보조 용매는 에틸렌글리콜(ethylene glycol), 디에틸렌글리콜(diethylene glycol), 트리에틸렌글리콜(triethylene glycol), 폴리에틸렌 글리콜 (poly-ethylene glycol), 프로필렌 글리콜(propylene glycol), 디프로필렌 글리콜(dipropylene glycol), 헥실렌 글리콜(hexylene glycol), 글리세린(glycerine), 2-메톡시 에탄올(2-methoxy ethanol), 프로필 알코올(propyl alcohol), 펜틸 알코올(pentyl alcohol), 헥실 알코올(hexyl alcohol), 부틸 알코올(butyl alcohol), 옥틸 알코올(octyl alcohol), 포름 아미드(Form amide), 메틸 에틸 케톤(methyl ethyl ketone), 다이옥산 (dioxane), 다이메틸포름아마이드 (dimethylformamide), 터피놀 (terpinol), 폴리에틸렌 글리콜 (polyethylene glycol), 에탄올아민 (ethanolamine), 및 다이에탄올아민 (diethanolamine) 중에서 선택된 적어도 하나의 물질로 이루어지고,상기 보조 용매는 점도, 표면 장력 또는 증발 속도가 다른 둘 이상의 물질로 구성되는 것을 특징으로 하는유전체 박막.
- 청구항 12항의 유전체 박막을 게이트 절연막으로 구비하는 유기박막 트랜지스터.
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US6171645B1 (en) | 1995-11-16 | 2001-01-09 | Texas Instruments Incorporated | Polyol-based method for forming thin film aerogels on semiconductor substrates |
KR100779560B1 (ko) * | 2006-07-20 | 2007-11-29 | 연세대학교 산학협력단 | 유기 박막 트랜지스터용 자가 패턴성 유전체 박막, 그 제조 방법, 및 이를 구비한 유기 박막 트랜지스터 |
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US6171645B1 (en) | 1995-11-16 | 2001-01-09 | Texas Instruments Incorporated | Polyol-based method for forming thin film aerogels on semiconductor substrates |
WO1999042863A1 (fr) * | 1998-02-18 | 1999-08-26 | Seiko Epson Corporation | Procede de fabrication de miroir multicouche a reflexion repartie |
KR100779560B1 (ko) * | 2006-07-20 | 2007-11-29 | 연세대학교 산학협력단 | 유기 박막 트랜지스터용 자가 패턴성 유전체 박막, 그 제조 방법, 및 이를 구비한 유기 박막 트랜지스터 |
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