KR100965831B1 - Apparatus for coating adhesive - Google Patents

Abstract

An adhesive application device is disclosed. The apparatus for applying an adhesive may include a stencil mask module including a body and first and second stencil mask portions formed on the body, a first fixing table corresponding to the first stencil mask and fixing the substrate, and a second stencil mask. A substrate fixing module including a second fixing table for fixing a substrate, position information of the substrates disposed on the stencil mask module and fixed to the first and second fixing tables, and the first and second stencil masks A position information providing module for providing position information of the first position, a first alignment unit for aligning the substrate to the first stencil mask according to the position information, and a second alignment unit to align the substrate with the second stencil mask according to the position information. An alignment module comprising two alignment units and at least one blade reciprocating on the stencil mask module Adhesive print module having a chip.

Description

Adhesive coating device {APPARATUS FOR COATING ADHESIVE}

The present invention relates to an adhesive application device.

In recent years, semiconductor packages including semiconductor chips and semiconductor chips capable of storing massive data and processing data in a short time have been developed.

Manufacturing a semiconductor package includes preparing a substrate such as a printed circuit board, applying an adhesive to the substrate, attaching the semiconductor chip to the substrate using the adhesive, molding the semiconductor chip into the molding member, and the like. do.

A stencil mask is used to apply an adhesive to a substrate during the process of manufacturing a semiconductor package. According to the related art, there is a limitation in that an adhesive is applied to one substrate using one stencil mask.

SUMMARY OF THE INVENTION An object of the present invention is to provide an adhesive applying apparatus in which the adhesive is applied to at least two substrates simultaneously using one stencil mask to greatly improve the productivity of the semiconductor package.

Adhesive applying apparatus according to the present invention is a stencil mask module including a body and the first and second stencil mask portion formed on the body, a first fixing table and the second stencil corresponding to the first stencil mask and fixing the substrate A substrate fixing module including a second fixing table corresponding to the mask and fixing the substrate, position information of the substrates disposed on the stencil mask module and fixed to the first and second fixing tables, and the first and second fixing tables. A position information providing module for providing position information of second stencil masks, a first alignment unit for aligning the substrate to the first stencil mask according to the position information, and the substrate to the second stencil mask according to the position information An alignment module comprising a second alignment unit for aligning and writing down and reciprocating on the stencil mask module It comprises an adhesive printing module having a single blade.

The substrate fixing module of the adhesive application device includes first and second up-down units for up / down the first and second fixing tables, respectively.

The position information providing module of the adhesive applying apparatus includes an image photographing unit and a conveying unit for conveying the image photographing unit.

The adhesive print module of the adhesive application device includes a first blade, a first blade drive unit to up-down the first blade, a second blade and a second blade drive unit to up-down the second blade.

The adhesive application device further includes a loader module for providing the substrates to the first fixing table and the second fixing table, respectively.

The loader module of the adhesive application device includes a magazine for accommodating the substrates, a first feeder rail corresponding to the first fixing table, a second feeder rail corresponding to the second fixing table, and the substrate being the first and second. A pick-up unit serving the feeder rails.

An adhesive application device is disposed adjacent to the first feeder rail and adjacent to the first feed rail module and the second feeder rail for loading the substrate with a first fixed table and unloading the substrate from the first fixed table. And a second transfer rail module for loading the substrate into the second fixed table and unloading the substrate from the second fixed table.

The first transfer rail module of the adhesive applying device includes a first rail, a second rail and a third rail disposed in parallel with each other, the first fixing table is disposed in the second rail, and the second transfer rail The module includes a fourth rail, a fifth rail and a sixth rail disposed in parallel with each other, and the second fixed table is disposed in the fifth rail.

The first rail, third rail, fourth rail and sixth rail of the adhesive application device each comprise a rail width adjustment unit.

An adhesive applying device is a stopper unit disposed between the first and second rails, between the second and third rails, between the fourth and fifth rails, and between the fifth and sixth rails. It includes.

The adhesive applying apparatus further includes a cleaning device interposed between the stencil mask module and the substrate fixing module to remove the adhesive on the rear surface of the stencil mask module by using volatile organic substances dissolving the adhesive.

The cleaning apparatus of the adhesive applying apparatus includes a cleaning member wound on a pair of winding rolls, a rotating unit for rotating the winding rolls, an organic material spraying unit for providing the volatile organic material to the cleaning member, and the cleaning member as the stencil mask module. And a conveying unit for conveying.

The adhesive application device further includes an unloader module for receiving the substrates unloaded from the first fixed table and the second fixed table.

The unloader module of the adhesive application device includes a third feeder rail corresponding to the first fixed table, a fourth feeder rail corresponding to the second fixed table, and storage containers corresponding to the third and fourth feeder rails. Include.

The adhesive applying apparatus further includes a plasma cleaning unit disposed in front of the substrate fixing module and treating the substrate with plasma to clean the surface of the substrate.

The adhesive applying apparatus according to the present invention has the effect of aligning one stencil mask on at least two substrates and then simultaneously applying the adhesive to the surfaces of the at least two substrates to greatly improve productivity.

Hereinafter, the adhesive coating apparatus according to the embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to the following embodiments, and those skilled in the art The present invention may be embodied in various other forms without departing from the spirit of the invention.

1 is a plan view showing an adhesive coating device according to an embodiment of the present invention.

Referring to FIG. 1, the adhesive applying apparatus 900 includes a stencil mask module 100, a substrate fixing module 200, a location information providing module 300, an alignment module 400, and an adhesive print module 500. .

FIG. 2 is a plan view of the stencil mask module shown in FIG. 1.

Referring to FIG. 2, the stencil mask module 100 includes a body 110, a first stencil mask part 120, and a second stencil mask part 130.

In this embodiment, one substrate to which the adhesive is applied includes a plurality of unit substrates, and each unit substrate is provided with a slit-shaped window, and adhesive application regions are formed on both sides of the window.

The body 110 has a rectangular shape when viewed on a plane. The first stencil mask part 120 and the second stencil mask part 130 are formed together in the body 110, and the first and second stencil mask parts 120 are coated with adhesive formed on both sides of the window oil of each unit substrate. It has openings corresponding to the area.

At least one alignment mark (not shown) used to align the first and second stencil mask parts 120 and 130 and the substrates to be described later is disposed around the first and second stencil mask parts 120 and 130.

Although the stencil mask module 100 includes the first and second stencil mask parts 120 and 130 in the present embodiment, the stencil mask module 100 may include at least three stencil mask parts.

FIG. 3 is a conceptual diagram illustrating a vertical arrangement of the components constituting the adhesive applying device shown in FIG. 1.

1 and 3, the substrate fixing module 200 is disposed under the stencil mask module 100.

In this embodiment, the substrate holding module 200 includes at least two holding tables. In the present embodiment, the number of fixed tables is equal to the number of stencil mask portions of the stencil mask module 100.

When the stencil mask module 100 includes the first and second stencil mask parts 120 and 130, the substrate fixing module 200 may include the first fixing table 210 and the first fixing table 210 corresponding to the first stencil mask part 120. And a second fixing table 220 corresponding to the two stencil mask portions 130.

The first fixing table 210 is disposed at a position corresponding to the first stencil mask portion 120, and the second fixing table 220 is disposed at a position corresponding to the second stencil mask portion 130.

Substrates are disposed on the first fixing table 210 and the second fixing table 220, respectively. Each substrate includes alignment marks (not shown) for aligning the substrate and the stencil mask module 100.

The first fixing table 210 and the second fixing table 220 may include a vacuum hole (not shown) to which a vacuum pressure is applied to adsorb the substrate under vacuum pressure.

Meanwhile, the first fixed table 210 includes a first up-down unit 215, and the second fixed table 220 includes a second up-down unit 225.

The first up-down unit 215 raises the first fixing table 210 toward the first stencil mask portion 120 or spaces the first fixing table 210 from the lower portion of the first stencil mask portion 120. Let's do it.

The second up-down unit 225 raises the second fixing table 220 toward the second stencil mask portion 130 or moves the second fixing table 220 toward the lower portion of the second stencil mask portion 130. Lower in the direction.

In the present embodiment, the first and second up-down units 215 and 225 may adjust heights of the first fixing table 210 and the second fixing table 220 differently.

Referring again to FIGS. 1 and 3, the location information providing module 300 is disposed on the stencil mask module 100, and the location information providing module 300 is connected to the first and second fixed tables 210 and 220. Position information of the alignment marks of the fixed substrates and position information of the alignment marks of the first and second stencil mask parts 120 and 130 are provided, respectively.

The location information providing module 300 includes an image photographing unit 310 and a transfer unit 320.

The image capturing unit 310 is disposed above the stencil mask module 100. The image capturing unit 310 may be, for example, a CCD camera, and the image capturing unit 310 may generate an image generated by photographing alignment marks of the first and second stencil mask parts 120 and 130 and alignment marks of the substrates. To the image processing unit (not shown).

The image processing unit processes the image generated from the image capturing unit 310 to numerically calculate alignment error values between the alignment marks of the first and second stencil mask parts 120 and 130 and the alignment marks of the substrates. do.

The transfer unit 320 transfers the image photographing unit 310 to the alignment mark of the first and second stencil mask portions 120 and 130 and the alignment mark portion of the substrates that overlap each other. In the present embodiment, the transfer unit 320 may be, for example, an XY transfer table for transferring the image photographing unit 310 on the stencil mask module 100.

The alignment module 400 includes a first alignment unit 410 and a second alignment unit 420, and the alignment module 400 is disposed under the substrate fixing module 200. In this embodiment, the first alignment unit 410 is disposed at a position corresponding to the first fixed table 210, and the second alignment unit 420 is disposed at a position corresponding to the second fixed table 220. .

The first alignment unit 410 transfers the first fixed table 210 using the alignment error value calculated from the image processing unit.

The first alignment unit 410 moves the first fixing table 210 in at least one direction among the X-axis, the Y-axis, the Z-axis, and the θ-axis to mark the alignment marks of the substrate disposed on the first fixing table 210. The alignment mark of the first stencil mask part 120 is aligned.

The second alignment unit 420 transfers the second fixed table 220 using the alignment error value calculated from the image processing unit.

The second alignment unit 420 transfers the second fixing table 220 in at least one direction among the X-axis, the Y-axis, the Z-axis, and the θ-axis to mark the alignment marks of the substrate disposed on the second fixing table 220. Match the alignment mark of the second stencil mask portion 130.

In the present embodiment, when the substrate fixing module 200 includes at least two fixing tables, and the stencil mask module 100 includes at least two stencil mask portions, each of the fixing tables and the respective stencil mask portions may be accurately aligned. In order to align, the sorting module 400 includes sorting units having the same number as the fixed tables.

Referring back to FIGS. 1 and 3, the adhesive print module 500 is disposed on top of the stencil mask module 100. The adhesive print module 500 reciprocates along the upper surface of the stencil mask module 100, and uses the stencil mask module 100 to apply an adhesive including an epoxy resin to a designated position of the substrate.

The adhesive print module 500 includes a first blade 510, a first blade drive unit 520, a second blade 530, and a second blade drive unit 540.

The first blade 510 has a rectangular scraper shape having a width substantially the same as the width of the stencil mask module 100, and the first blade drive unit 520 up-downs the first blade 510. By adjusting the interval between the first blade 510 and the stencil mask module 100.

The second blade 530 has a rectangular parallelepiped shape having a width substantially the same as the width of the stencil mask module 100, and the second blade driving unit 540 moves the second blade 530 up and down to form the second blade 530. The gap between the blade 530 and the stencil mask module 100 is adjusted.

In the present embodiment, when the first blade 510 is transferred in the first direction, the first blade driving unit 520 places the first blade 510 adjacent to the stencil mask module 100, and the second blade When the 530 is transferred in the second direction opposite to the first direction, the first blade 510 is spaced apart from the stencil mask module 100, and the second blade 530 is the second blade driving unit 540. ) Adjacent to the stencil mask module 100.

Meanwhile, the adhesive applying device 900 illustrated in FIGS. 1 and 2 may further include a loader module 710.

The loader module 710 provides the substrate to which the adhesive is to be applied to the first fixing table 210 and the second fixing table 220 of the substrate fixing module 200, respectively.

The loader module 710 includes a magazine 701, a feeder rail 702 and a pickup unit 704.

The magazine 701 accommodates a plurality of substrates 709 to which an adhesive is to be applied.

The feeder rail 702 is disposed adjacent to the magazine 701, and the feeder rail 702 transfers the substrate 709 toward the first fixed table 210 or the second fixed table 220.

In this embodiment, the feeder rail 702 may include a feeder rail transfer unit (not shown) for transferring the substrate 709 to the first fixed table 210 and the second fixed table 220. Alternatively, the feeder rail 702 includes a first feeder rail providing the substrate 709 to the first fixation table 210 and a second feeder rail providing the substrate 709 to the second fixation table 210. can do.

The pickup unit 704 includes a picker 705 and a picker transfer unit 706.

The picker 705 picks up the substrate 709 stored in the magazine 701 using vacuum pressure, and the picker transfer unit 706 transfers the substrate 709 stored in the picker 705 to the feeder rail 702. Transfer.

In this embodiment, a plasma cleaning module (not shown) may be disposed at a portion corresponding to the feeder rail 702 to treat the surface of the substrate with plasma before applying the adhesive to the substrate.

Meanwhile, as illustrated in FIG. 1, the adhesive applying apparatus 900 further includes a first transfer rail module 810 and a second transfer rail module 820.

In the present exemplary embodiment, the first transfer rail module 810 and the second transfer rail module 820 are required to temporarily store a plurality of substrates and apply the adhesive to the substrate during the process of applying the adhesive to the substrate. This can greatly shorten the time required.

The first transfer rail module 810 includes a first rail 802, a second rail 804, and a third rail 806.

The first rail 802 is disposed between the feeder rail 702 and the first fixed table 210, the second rail 804 is disposed adjacent to the first rail 802, and the second rail 804 Inside the first fixed table 210 is disposed. The third rail 806 is disposed at a portion adjacent to the second rail 804.

The substrate 709 provided from the feather rail 702 is transported along the first rail 802, the second rail 804, and the third rail 806.

The second transfer rail module 820 includes a fourth rail 822, a fifth rail 824, and a sixth rail 826.

The fourth rail 822 is disposed between the feeder rail 702 and the second fixed table 220, the fifth rail 824 is disposed adjacent to the fourth rail 822, and the fifth rail 824 The second fixed table 220 is disposed inside. The sixth rail 826 is disposed at a portion adjacent to the fifth rail 824.

The substrate 709 provided from the feather rail 702 is transferred along the fourth rail 822, the fifth rail 824, and the sixth rail 826.

In this embodiment, the first to third rails 802, 804, 806 so that substrates 709 having different widths can be transferred using the first transfer rail module 810 and the second transfer rail module 820. ) And the fourth to sixth rails 822, 824, and 826 are provided with a rail width adjusting unit 830, respectively.

The rail width adjustment unit 830 includes at least one feed screw and a motor, and the rail width adjustment unit 830 includes the widths of the first to third rails 802, 804, 806 and the fourth to sixth rails 822, 824, 826. Precisely adjust the

Meanwhile, between the first and second rails 802 and 804, between the second and third rails 804 and 806, between the fourth and fifth rails 822 and 824, and the fifth and sixth rails 824 and 826. A stopper unit 840 is disposed to temporarily stop the transfer of the substrate 709.

Meanwhile, referring back to FIGS. 1 and 3, the adhesive applying apparatus 900 according to the present embodiment includes a cleaning device 600 for cleaning the stencil mask module 100.

The cleaning device 600 is interposed between the stencil mask module 100 and the substrate fixing module 200. The cleaning apparatus 600 cleans the stencil mask module 100 by dissolving and removing the adhesive on the rear surface of the stencil mask module 100 using volatile organic substances dissolving the adhesive.

The cleaning device 600 includes a cleaning member 610, a rotating unit 620, an organic matter spraying unit 630, and a transfer unit 640.

The cleaning member 610 is wound on a pair of winding rolls. For example, the cleaning member 610 may be paper or cloth having a long length. The rotating unit 620 rotates the take-up rolls, whereby the cleaning member 610 is wound on any one of the take-up rolls by the rotation of the rotating unit 620.

The organic spray unit 630 provides the volatile organics to the cleaning member 610.

The transfer unit 640 reciprocates along the lower surface of the stencil mask module 100 with the volatile organic substance-containing cleaning member 610 to dissolve the adhesive on the lower surface of the stencil mask module 100 with the organic substance to stencil mask. Remove from module 100.

Referring back to FIG. 1, the adhesive applying apparatus 900 according to the present embodiment may further include an unloader module 720.

The unloader module 720 includes a feeder rail 722 and receiving containers 724 and 725.

The feeder rail 722 is disposed adjacent to the third rail 806 or the sixth rail 826 and accommodates the substrate transferred to the third rail 806 or the sixth rail 826. The feeder rail 722 provides the substrate to the receptacles 724 and 725.

As described in detail above, after aligning one stencil mask on at least two substrates, an adhesive may be applied to the surfaces of the at least two substrates at the same time, thereby greatly improving productivity.

In the detailed description of the present invention described above with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge in the scope of the present invention described in the claims and It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.

1 is a plan view showing an adhesive coating device according to an embodiment of the present invention.

FIG. 2 is a plan view of the stencil mask module shown in FIG. 1.

FIG. 3 is a conceptual diagram illustrating a vertical arrangement of the components constituting the adhesive applying device shown in FIG. 1.

Claims (15)

A stencil mask module including a body and a first stencil mask portion formed on the body and a second stencil mask portion spaced apart in a first direction with respect to the first stencil mask portion; A first transfer rail module disposed along a second direction orthogonal to the first direction and transferring a first substrate to the first stencil mask; A second transfer rail module spaced apart from the first transfer rail module and disposed parallel to the second direction, and configured to transfer a second substrate to the second stencil mask; A substrate fixing module including a first fixing table corresponding to the first stencil mask and fixing the first substrate, and a second fixing table corresponding to the second stencil mask and fixing the second substrate; A position information providing module disposed on the stencil mask module and providing position information of the first and second substrates fixed to the first and second fixing tables and position information of the first and second stencil masks; ; An alignment comprising a first alignment unit to align the first substrate to the first stencil mask according to the positional information and a second alignment unit to align the second substrate to the second stencil mask according to the positional information module; And And an adhesive print module having at least one blade reciprocating on the stencil mask module. The method of claim 1, And the substrate holding module includes first and second up-down units for lifting and lowering the first and second holding tables, respectively. The method of claim 1, And the position information providing module includes an image photographing unit and a conveying unit for conveying the image photographing unit. The method of claim 1, Wherein the adhesive print module comprises a first blade, a first blade drive unit to up-down the first blade, a second blade and a second blade drive unit to up-down the second blade Application device. The method of claim 1, And a loader module for providing the first and second substrates to the first and second fixing tables, respectively. The method of claim 5, The loader module includes a magazine accommodating the first and second substrates, a feeder rail corresponding to any one of the first and second fixing tables, and a pickup unit providing the first and second substrates to the feeder rail. Adhesive coating device comprising a. delete The method of claim 1, The first transport rail module includes a first rail, a second rail and a third rail disposed in parallel to each other, the first fixing table is disposed in the second rail, and the second transport rail module is parallel to each other. And a fourth rail, a fifth rail, and a sixth rail, wherein the second fixing table is disposed in the fifth rail. The method of claim 8, And the first rail, the third rail, the fourth rail, and the sixth rail each comprise a rail width adjustment unit. The method of claim 8, And a stopper unit disposed between the first and second rails, between the second and third rails, between the fourth and fifth rails, and between the fifth and sixth rails. Adhesive applying apparatus characterized by the above-mentioned. The method of claim 1, And a cleaning device interposed between the stencil mask module and the substrate fixing module to remove the adhesive deposited on the rear surface of the stencil mask module using volatile organic substances dissolving the adhesive. The method of claim 11, The cleaning device includes a cleaning member wound around a pair of winding rolls, a rotating unit for rotating the winding roll, an organic material spraying unit for providing the volatile organic material to the cleaning member, and a transfer unit for transferring the cleaning member to the stencil mask module. Adhesive coating device comprising a. The method of claim 1, And an unloader module for receiving the substrates unloaded from the first fixing table and the second fixing table. The method of claim 13, And the unloader module includes a feeder rail corresponding to any one of the first and second fixing tables, and storage containers corresponding to the first and second transfer rail modules. The method of claim 1, And a plasma cleaning unit disposed in front of the substrate fixing module and configured to clean the surface of the first and second substrates by treating the first and second substrates with plasma.

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