KR100955149B1 - Laser processing apparatus - Google Patents

Abstract

In the laser processing apparatus of simultaneous multi-point irradiation type, the laser processing apparatus which can aim at the improvement of processing quality by reducing the difference of the processing quality by two laser beams is obtained.

, Lβ)으로 분광하는 제1 편광 수단(21)과; 레이저 광(L

)의 광로상에 배치되고, XY 테이블(11)상의 제1 방향으로 레이저 광(L

)을 주사하는 갈바노 스캐너(galvano scanner; 23a)와; 레이저 광(Lβ)의 광로상에 배치되고, XY 테이블(11)상의 제1 방향과는 다른 제2 방향으로 레이저 광(Lβ)을 주사하는 갈바노 스캐너(23b)와; 2 개의 레이저 광(L

, Lβ)을 혼합하는 제2 편광 수단(25)과; 레이저 광(L

, Lβ)을 XY 테이블(11)상의 상이한 제3과 제4 방향으로 주사하는 한 쌍의 메인 갈바노 스캐너(26)와; 메인 갈바노 스캐너(26)로부터의 레이저 광(L

, Lβ)을 피가공물(12)상의 소정 위치에 각각 집광시키는 fθ 렌즈(28)를 구비한다.One laser light (L) and two laser lights (L) with different light paths

First polarizing means 21 for spectroscopy with L β ; Laser light (L

) Is disposed on the optical path, and the laser light L in the first direction on the XY table 11

Galvano scanner (23a) for injecting; Laser light (L β) is disposed on the optical path, XY table 11, the first direction is a galvanometer scanner (23b) for scanning the laser light (L β) in a second direction on the other and; 2 laser lights (L

Second polarizing means 25 for mixing L β ); Laser light (L

A pair of main galvano scanners 26 for scanning L β ) in different third and fourth directions on the XY table 11; Laser light (L) from main galvano scanner 26

, L β are provided with a fθ lens 28 for condensing each of the workpieces 12 at a predetermined position.

Description

Laser processing device {LASER PROCESSING APPARATUS}

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a laser processing apparatus whose main purpose is to punch holes for a workpiece such as a printed board, and more particularly, to a laser processing apparatus of a simultaneous multi-point irradiation type for the purpose of improving productivity.

Background Art Conventionally, a laser processing apparatus capable of simultaneously processing two holes by spectroscopy two laser beams from a laser light source in order to improve productivity (for example, refer to Patent Document 1). In this laser processing apparatus, one laser beam is spectroscopically analyzed by two laser beams by the first polarizing means, and guided to the second polarizing means which substantially matches the optical paths of these two laser beams. At this time, one of the laser lights (hereinafter referred to as a main beam) of the laser light spectroscopy by the first polarizing means is led to the second polarizing means via one set of mirrors (bend mirrior). In addition, the other laser light (hereinafter referred to as a sub-beam) is guided to the second polarization means and mixed after being scanned in a pair of first galvano scanner groups in biaxial directions that are not parallel to each other. The two laser lights that have passed through the second polarization means are scanned in biaxial directions that are not parallel to each other in the pair of second galvano scanner groups, enter the f? Lens, and irradiate the workpiece on the table. Here, since the sub-beams are scanned by the first galvano scanner group, there is a slight deviation in their angles compared to the main beams that have passed through a set of mirrors, so that the main and sub-beams after passing through the fθ lens Will be examined at different locations on the table. Thereby, two holes can be processed simultaneously by one f (theta) lens, and productivity improves.

In addition, one laser beam is spectroscopically analyzed by two laser beams by the first polarization means, and each laser beam is scanned in a biaxial direction by a pair of galvano scanners, and the two laser beams are guided by the second polarization means. Then, the laser processing apparatus which improved the productivity by simultaneously processing two holes with one f (theta) lens is also proposed (for example, refer patent document 2).

Moreover, in the laser processing apparatus shown by patent document 1, the technique of generating the angle command value of each galvano scanner for processing a hole in a target position is also known (for example, refer patent document 3). ).

Patent Document 1: International Publication No. O3 / O419O4 Pamphlet

Patent Document 2: Japanese Patent Application Laid-Open No. 2005-230872

Patent Document 3: International Publication No. O3 / O8 O283 Pamphlet

By the way, in the laser processing apparatus of patent document 1, the spectroscopic one sub beam side will pass through two galvano scanners compared with two sets (namely four) in total, and one set (two units) on the main beam side. Since the galvano scanner is used by rotating the mirror portion, it is unstable compared with the case of passing through the fixed mirror, and thus, the sub beam passing through the galvano scanner has a problem in that the processing quality tends to be poor.

In addition, in the sub beam, the beam is scanned by the first galvano scanner group provided at a position away from the pre-focus position of the fθ lens (beam scanning abnormal position before the fθ lens). Therefore, the farther the distance from the full focal position of the fθ lens to the first galvano scanner group, the poorer the processing hole quality, such as the processing hole roundness and the focus margin, is due to the characteristics of the fθ lens. As a result, there is a problem that the quality of the processing hole for the workpiece is also worsened.

Moreover, in the laser processing apparatus of patent document 2, it is the structure by which all the laser light spectroscopically speculated by the 1st polarizing means are scanned via a galvano scanner instead of a fixed mirror, and a 2nd between a f (theta) lens and a galvano scanner Since a space for providing the polarizing means is required, any laser light is scanned at a position away from the full focal position of the fθ lens. As a result, there was a problem that the quality of the processing hole deteriorated in either laser light.

Moreover, since the optical system is complicated in the same structure as the laser processing apparatus of patent document 1, in the calibration operation | work, such as the angle command value of each galvano scanner required in order to control the beam position of patent document 3, it is a test. There was also a problem that a large number of points are required for processing and it takes time.

This invention is made | formed in view of the above, Comprising: It aims at obtaining the laser processing apparatus which can aim at the improvement of processing quality by reducing the difference of the processing quality by two laser beams in the simultaneous multi-point irradiation type laser processing apparatus. In addition, another object of the present invention is to obtain a laser processing apparatus capable of facilitating a calibration operation necessary for controlling a processing position for irradiating laser light.

In order to achieve the above object, the laser processing apparatus according to the present invention is a laser processing apparatus in which a laser beam is irradiated to two or more points on a workpiece placed on a table at the same time for processing. First polarizing means for spectroscopy with other first and second laser lights; A first galvano scanner disposed on an optical path of the first laser light and scanning the first laser light in a first direction on the table; A second galvano scanner disposed on an optical path of the second laser light and scanning the second laser light in a second direction different from the first direction on the table; Second polarization means for mixing the first and second laser lights; A main galvano scanner comprising a pair of third and fourth galvano scanners that scan the mixed first and second laser light in different third and fourth directions on the table; And a f? Lens for focusing the first and second laser light from the main galvano scanner at predetermined positions on the workpiece.

According to the present invention, since any laser light spectroscopically analyzed by the first polarization means is configured to pass through three galvano scanners, it has an effect that the processing quality can be improved while maintaining the productivity of simultaneous multi-point irradiation.

EMBODIMENT OF THE INVENTION Below, with reference to an accompanying drawing, preferable embodiment of the laser processing apparatus which concerns on this invention is described in detail. In addition, this invention is not limited by these embodiment.

Embodiment 1.

Before explaining the laser processing apparatus by this invention, the outline | summary of the structure of the conventional laser processing apparatus is demonstrated. It is a figure which shows the conventional example of the structure of the laser processing apparatus of simultaneous multi-point irradiation type. The laser processing apparatus mounts a workpiece 212 such as a printed board, moves an XY table 211 in a horizontal plane (XY plane), and a laser light L emitted from a laser oscillator (not shown). The optical system for irradiating the workpiece 212 on the XY table 211 is provided. In addition, in this figure, the surface of the XY table 211 which mounts the to-be-processed object 212 is made into the horizontal plane, and two axes orthogonal to each other in this horizontal plane are made into the X-axis and the Y-axis, and these X-axis and Y-axis The axis perpendicular to both sides of the axis is the Z axis.

The optical system includes first polarizing means 222 made of a polarizing beam splitter or the like for spectroscopy of laser light L emitted from a laser oscillator (not shown) into two laser lights La and Lb, and a first polarized light. A second polarization means 223 composed of a polarizing beam splitter or the like, which is mixed (mixed) with two laser lights La and Lb that have been spectroscopically conducted by the means 222 and has advanced to another optical path, A f? Lens 228 for condensing the mixed laser light La, Lb from the two polarizing means 223 on the workpiece 212 is provided. In addition, the two laser lights La and Lb spectroscopy between the first polarizing means 222 and the second polarizing means 223 are configured to have the same optical path length. Further, the reason for mixing the two laser lights La and Lb in the second polarizing means 223 is to simultaneously process two holes using one f? Lens 228.

For the sake of simplicity, the optical paths of the laser lights L, La, and Lb are arranged on the optical paths of the laser lights L, La, and Lb such that they are substantially parallel to any one of the X, Y, and Z axes set above. The case where the mirrors 221a-221d and the galvano scanners 224a, 224b, 226a, and 226b are arrange | positioned is demonstrated. In this case, the mirrors 221a to 221d disposed on the optical path tilt (reflect) the optical path of the laser light L at an angle of 90 degrees. It is arranged at an angle. In addition, on the optical path of the laser light Lb reflected by the first polarization means 222, a pair of galvano scanners for scanning the laser light Lb in the biaxial direction to guide the second polarization means 223 ( 224a and 224b are provided. The galvano scanner 224a is arranged so that the rotation axis of the mirror 225a is in the X-axis direction, and the galvano scanner 224b is arranged so that the rotation axis of the mirror 225b is in the Y-axis direction. The laser light Lb can be scanned in the X-axis direction on the XY table 211 by scanning the galvano scanner 224a, and the laser light Lb is scanned by scanning the galvano scanner 224b. It can scan in the Y-axis direction on the XY table 211.

Further, between the second polarizing means 223 and the fθ lens 228, the mixed laser light La, Lb from the second polarizing means 223 is scanned in the biaxial direction to guide the workpiece 212. Pairs of galvano scanners 226a and 226b are provided. The galvano scanner 226a is arranged so that the rotation axis of the mirror 227a is in the Z-axis direction, and the galvano scanner 226b is arranged so that the rotation axis of the mirror 227b is in the X-axis direction. The laser light La, Lb can be scanned in the X-axis direction on the XY table 211 by scanning the galvano scanner 226a, and the laser light La, by scanning the galvano scanner 226b. Lb) can be scanned in the Y-axis direction on the XY table 211.

Here, the operation | movement of the laser processing apparatus of such a structure is demonstrated. The laser light L emitted from the laser oscillator (not shown) is adjusted in the polarization direction in the direction of 45 degrees, is reflected by the two mirrors 221a and 221b, and enters the first polarization means 222. In the first polarization means 222, the polarized light is spectroscopically laser beam of P-wave perpendicular to the incident surface and the S-wave laser light of the polarization direction parallel to the incident surface.

The laser light (hereinafter referred to as the main beam, La) transmitted through the first polarization means 222 is guided to the second polarization means 223 via two mirrors 221c and 221d. On the other hand, the laser light reflected by the first polarization means 222 (hereinafter referred to as a sub beam, Lb) is scanned in the biaxial direction from the galvano scanners 224a and 224b, and then to the second polarization means 223. Induced. Here, the main beam La is always guided to the second polarization means 223 at the same position, but the sub beam Lb controls the angle of movement of the galvano scanners 224a and 224b, thereby providing a second polarization. The position or angle incident on the means 223 is adjusted.

Thereafter, the main beam La is reflected by the second polarization means 223, and the sub beam Lb is transmitted by the second polarization means 223, whereby two laser lights La and Lb are almost The same light path is led to galvano scanners 226a and 226b. After scanning in the biaxial direction by the galvano scanners 226a and 226b, they are guided to the f? Lens 228 and are focused at predetermined positions on the workpiece 212 and processed. At this time, the main beam La and the sub beam Lb can be irradiated to any other two points on the workpiece 212 by scanning the galvano scanners 224a, 224b, 226a, and 226b. . After the processing of all the holes in the scanning area is finished, the next scanning area can be processed by moving the XY table 211 in the XY direction in the drawing.

Here, when the first set of galvano scanners 224a and 224b are set at an angle, the same position is processed by the spectroscopic laser light Lb drawing the same trajectory after the second polarization means 223. If there are two hole positions that are sufficiently close to be processed at present, first, the first two sets of galvano scanners 226a and 226b are used in the biaxial direction so that the hole positions of one of them (for example) are processed. When scanning, the main beam La cuts a hole in the position. Subsequently, in the first set of galvano scanners 224a and 224b, the sub-beam Lb processes another position hole inner part by further scanning in the biaxial direction from the hole position side to another hole position in my direction. .

As described above, in the laser processing apparatus having the configuration shown in Fig. 14, the second set of galvano scanners 226a and 226b is the main scan, and the first set of the galvano scanners 224a and 224b are the hole positions. From the point of view, it can be thought of as a role of differential scanning like the pore position, and the structure was intuitively understood. In addition, as it actually does, the movement angle scanned by the first set of galvano scanners 224a and 224b is smaller than the movement angle scanned by the second set of galvano scanners 226a and 226b.

However, in such a laser processing apparatus, one spectroscopic sub-beam Lb passes through many galvano scanners 224a, 224b, 226a, and 226b of two sets (that is, four units) in total. Since the galvano scanner rotates the mirror and uses it, it is unstable compared with the case of passing through the fixed mirror, and the processing by the sub-beam Lb is the processing quality (the machining quality here refers to the roundness of holes in the scanning area. There is a problem in that it is easy to deteriorate). In addition, the long distance from the full focal position of the fθ lens 228 to the farthest galvano scanner 224a for beam scanning was also one of the causes of poor processing quality (particularly, processing hole quality).

Therefore, in this invention, although the processing quality of two laser beams becomes worse than the processing quality of a main beam in the conventional laser processing apparatus, the laser processing apparatus provided with the structure which can make it better than the processing quality of a sub beam is provided. EMBODIMENT OF THE INVENTION Below, the laser processing apparatus which concerns on this invention is demonstrated.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of Embodiment 1 of the laser processing apparatus concerning this invention, and FIG. 2 is a figure which shows the arrangement relationship of the galvano scanner in the vicinity of the full-focus position of the f (theta) lens of the laser processing apparatus of FIG. The laser processing apparatus includes an XY table 11 on which workpieces such as a printed board and the like are placed, and which are movable in a horizontal plane (XY plane); A laser oscillator 20 which emits laser light L; An optical system for irradiating the workpiece 12 on the XY table 11 with the laser light L emitted from the laser oscillator 20; Imaging means 29 such as a CCD (Charge-Coupled Device) camera for imaging the machining position on the XY table 11 during the trial machining; The control part 30 which controls the mirror angle of the laser oscillator 20 and the galvano scanner 23a, 23b, 26a, 26b mentioned later which comprise an optical system, and the imaging means 29 is provided. In addition, in this figure, the surface of the XY table 11 which mounts the to-be-processed object 12 is made into the horizontal plane, and two axes orthogonal to each other in this horizontal plane are made into the X-axis and the Y-axis, and these X-axis and Y The axis perpendicular to both sides of the axis is the Z axis.

, Lβ)을 반사시켜 광로로 유도하는 복수의 미러(22a ~ 22f)와, 각각의 광로의 레이저 광(L

, Lβ)을 XY 테이블(11)상에서 상이한 방향으로 주사하는 갈바노 스캐너(23a, 23b, 이하에서는 이들 갈바노 스캐너(23a, 23b)를 서브 갈바노 스캐너(23a, 23b)라고도 함)와, 제1 편광 수단(21)에서 분광되어 다른 광로를 진행해 온 2 개의 레이저 광(L

, Lβ)을 혼합하여, 거의 동일한 광로로 유도하는 편광 빔 스플리터 등으로 이루어진 제2 편광 수단(25)과, 제2 편광 수단(25)으로부터의 혼합된 레이저 광(L

, Lβ)을 XY 테이블(11)상에서 상이한 방향으로 주사하는 갈바노 스캐 너(26a, 26b, 이하에서는 이들 갈바노 스캐너(26a, 26b)를 메인 갈바노 스캐너(26)라고도 함)와, 혼합된 레이저 광(L

, Lβ)을 피가공물(12)상에 집광시키는 fθ 렌즈(28)를 구비한다. 여기서, 서브 갈바노 스캐너(23a, 23b)는 특허청구의 범위에 있어서 제1과 제2 갈바노 스캐너에 대응하고, 메인 갈바노 스캐너(26a, 26b)는 마찬 가지로 제3과 제4 갈바노 스캐너에 대응한다.The optical system includes first polarizing means 21 made of a polarizing beam splitter or the like for spectroscopy laser light L emitted from the laser oscillator 20, and the spectroscopic laser light L

, A plurality of mirrors 22a to 22f for reflecting L β and leading them to the optical path, and the laser light L of each optical path.

, Galvano scanners 23a and 23b for scanning L β in different directions on the XY table 11 (hereinafter, these galvano scanners 23a and 23b are also referred to as sub galvano scanners 23a and 23b), Two laser lights (L) which have been spectroscopically polarized by the first polarization means 21 and traveled through different optical paths.

, L β ) and the mixed laser light L from the second polarizing means 25 and the second polarizing means 25, which are made of a polarizing beam splitter or the like that leads to almost the same optical path.

, Galvano scanners 26a, 26b for scanning L β in different directions on the XY table 11 (hereinafter, these galvano scanners 26a, 26b are also referred to as main galvano scanners 26), and mixing Laser light (L

, L β is provided with a fθ lens 28 for condensing on the workpiece 12. Here, the sub galvano scanners 23a and 23b correspond to the first and second galvano scanners in the scope of the claims, and the main galvano scanners 26a and 26b are similar to the third and fourth galvano. Corresponds to the scanner.

, Lβ)의 광로를 X축, Y축 및 Z축 중 어느 하나와 거의 평행으로 되도록, 레이저 광(L, L

, Lβ)을 90도의 각도로 기울일(반사시킬) 목적으로, 예를 들어 도면에 나타나는 XYZ 좌표계 중 어느 축에 대하여 45도의 각도를 이루어서 배치되는 경우로 설명한다. 또, 제1 편광 수단(21)에서 투과한 쪽의 레이저 광(L

)은 제2 편광 수단(25)에서는 반사하고, 제1 편광 수단(21)에서 반사한 측의 레이저 광(Lβ)은 제2 편광 수단(25)에서 투과하도록 광로가 구성된다. 제1 편광 수단(21)과 제2 편광 수단(25) 사이에서 분광한 각각의 레이저 광(L

, Lβ)의 광로 길이는 동일하게 되도록 구성되어 있다.In addition, for the sake of simplicity, the mirrors 22a to 22f and the galvano scanners 23a, 23b, 26a, and 26b disposed on the optical path are laser lights L and L.

, L β so that the optical path is substantially parallel to any one of the X-, Y- and Z-axes.

, L β ) will be described as a case where it is arranged at an angle of 45 degrees with respect to any axis of the XYZ coordinate system shown in the drawing, for example, for the purpose of tilting (reflecting) the angle at 90 degrees. Moreover, the laser light L of the one which permeate | transmitted by the 1st polarizing means 21

) Is reflected by the second polarization means 25, and the optical path is configured such that the laser light L β on the side reflected by the first polarization means 21 is transmitted by the second polarization means 25. Each laser light L spectroscopically interposed between the first polarization means 21 and the second polarization means 25.

, L β ) is configured to be the same in length.

, Lβ)의 광로상에 배치되는 미러(22a ~ 22f)의 수와 갈바노 스캐너(23a, 23b)의 수는 모두 2 개의 광로에서 동일하게 되도록 배치되어 있다. 또, 2 개의 레이저 광(L

, Lβ)에서 특성의 차가 나지 않도록, 갈바노 스캐너의 배치 방법도 연구되어 있다. 즉, fθ 렌즈로부터 갈바노 스캐너(23a, 23b)의 배치 위치까지의 광로 길이는 모두 2 개의 광로에서 동일하게 되도록 설계되어 있다.In the first embodiment, two laser lights L spectroscopically obtained by the first polarizing means 21.

, L β are arranged such that the number of mirrors 22a to 22f and the number of galvano scanners 23a and 23b are the same in both optical paths. In addition, two laser lights (L

, L β ) has also been studied how to arrange galvano scanners. That is, the optical path lengths from the fθ lens to the arrangement positions of the galvano scanners 23a and 23b are designed to be the same in both optical paths.

빔이라고 함) L

의 제2 편광 수단(25)까지의 광로상에는 n(n은 자연수) 매의 미러(22a ~ 22c)와 1 개의 갈바노 스캐너(23a)가 마련되어 있다. 또, 제1 편광 수단(21)에서 반사한 레이저 광(이하 β 빔이라고 함) Lβ의 제2 편광 수단(25)까지의 광로상에는 n 매의 미러(22d ~ 22f)와 1 개의 갈바노 스캐너(23b)가 마련되어 있다. 단, 이 도 1의 경우에서는 n=3 매이다. 이와 같은 구성에 의해, 2 개의 광로상에는 동일한 수의 미러와 갈바노 미러가 배치되므로, 2 개의 광로상을 통과하는 레이저 광의 품질은 동일하게 된다.That is, the laser light transmitted by the first polarizing means 21 (hereinafter referred to as

L)

On the optical path to the second polarizing means 25, n (n is a natural number) mirrors 22a to 22c and one galvano scanner 23a are provided. In addition, on the optical path from the first polarizing means 21 to the second polarizing means 25 of laser light (hereinafter referred to as β beam) L β , n mirrors 22d to 22f and one galvano scanner are used. 23b is provided. However, in this case, n = 3 sheets. With this configuration, since the same number of mirrors and galvano mirrors are arranged on the two optical paths, the quality of the laser light passing through the two optical paths is the same.

In addition, in this Embodiment 1, as shown, for example in FIG. 1 and FIG. 2, the main galvano scanner 26a is arrange | positioned so that the rotation axis of the mirror 27a may become a Z-axis direction, and the main galvano scanner 26b is carried out. It is conceivable to arrange so that the rotation axis of the mirror 27b is in the X-axis direction.

Preferably, the mirrors 27a and 27b of the galvano scanners 26a and 26b for scanning a laser are at the full focal position F of the fθ lens 28. In practice, however, it is impossible to place a plurality of mirrors in the same position, so it is conceivable to approach this situation as much as possible. In other words, the mirror 27a of the galvano scanner 26a and the mirror 27b of the galvano scanner 26b are close to the full focal position F of the fθ lens 28 and the mirror of the galvano scanner 26a. The main galvano scanners 26a and 26b are arranged so that the midpoint of the line connecting the center position of the 27a and the center position of the mirror 27b of the galvano scanner 26b is the full focal position F of the fθ lens 28. do. At this time, in consideration of the rotation of the mirrors 27a and 27b of the main galvano scanners 26a and 26b, the two mirrors 27a and 27b; galvano so that the mirrors 27a and 27b do not interfere with each other. The distance 2Y between the scanners 26a and 26b) should be selected.

, Lβ)의 fθ 렌즈(28)로의 입사 위치가 Y축 방향을 따라 바뀐다. 반대로, 갈바노 스캐너(26b)의 미러(27b)의 회전을 고정하고, 갈바노 스캐너(26a)를 회전시킨 경우를 생각하면, 레이저 광(L

, Lβ)의 fθ 렌즈(28)로의 입사 위치가 X축 방향을 따라 바뀐다. 이와 같이, 갈바노 스캐너(26a, 26b)를 주사시키는 것에 의해, fθ 렌즈(28)로의 레이저 광(L

, Lβ)의 입사 위치(입사 각도)를 바꿀 수 있다.By the way, in the example shown in FIG. 2, considering the case where the rotation of the mirror 27a of the galvano scanner 26a is fixed and the galvano scanner 26b is rotated, the laser light L

, L β ), the incident position to the fθ lens 28 is changed along the Y-axis direction. On the contrary, considering the case where the rotation of the mirror 27b of the galvano scanner 26b is fixed and the galvano scanner 26a is rotated, the laser light L

, L β ) is incident along the X-axis direction to the fθ lens 28. Thus, the laser beam L to the f-theta lens 28 is scanned by scanning the galvano scanners 26a and 26b.

, The incident position (incidence angle) of L β can be changed.

빔 L

용 갈바노 스캐너(23a)와, β빔 Lβ용 갈바노 스캐너(23b)의 주사 방향이 동일하게 되지 않도록 결정된다. 이 도 1의 예에 있어서는 (이상적인 fθ 렌즈를 가정하면)

빔 L

용 갈바노 스캐너(23a)의 주사 방향은 직후에 X 방향이며 XY 테이블(11)상에서는 X방향으로 되도록, 미러(24a)의 회전축이 Z축 방향으로 되도록 갈바노 스캐너(23a)가 배치된다. 또, β빔 Lβ용 갈바노 스캐너(23b)의 주사 방향은 직후에 Z방향이며 XY 테이블(11)상에서는 Y방향으로 되도록, 미러(24b)의 회전축이 Y축 방향으로 되도록 갈바노 스캐너(23b)는 배치된다. 즉, 갈바노 스캐너(23a)를 주사하는 것에 의해, 레이저 광(L

)을 XY 테이블(11)상의 X축 방향으로 주사할 수 있고, 갈바노 스캐너(23b)를 주사하는 것에 의해 레이저 광(Lβ)을 XY 테이블(11)상의 Y축 방향으로 주사할 수 있다.In addition, the optical system, as shown in Figure 1,

Beam L

The scanning directions of the galvano scanner 23a for use and the galvano scanner 23b for β beam L β are determined not to be the same. In the example of FIG. 1 (assuming an ideal fθ lens)

Beam L

The galvano scanner 23a is arrange | positioned so that the rotational axis of the mirror 24a may become a Z-axis direction so that the scanning direction of the galvano scanner 23a for power will be X direction immediately on the XY table 11 on the XY table 11 immediately afterwards. Further, the scanning direction of the β- beam L β galvano scanner 23b is immediately in the Z-direction and on the XY table 11 so that the rotational axis of the mirror 24b is in the Y-axis direction. ) Is placed. That is, by scanning the galvano scanner 23a, the laser light L

) Can be scanned in the X-axis direction on the XY table 11, and the laser light L β can be scanned in the Y-axis direction on the XY table 11 by scanning the galvano scanner 23b.

, Lβ)을 조사하기 위한 메인 갈바노 스캐너(26)와 서브 갈바노 스캐너(23a, 23b)의 미러 각도를 제어하는 기능을 갖는다. 또한, 이 제어부(30)에 의한 캘리브레이션 작업과 가공 제어 작업에 대해서는 실시 형태 4에서 설명한다.The control unit 30 performs a calibration operation for obtaining the positional relationship between the mirror angles and the processing holes of the main galvano scanners 26a and 26b and the sub galvano scanners 23a and 23b, and the laser light L at the position of the processing holes.

, L β ) has a function of controlling the mirror angles of the main galvano scanner 26 and the sub galvano scanners 23a and 23b. In addition, the calibration operation and the process control operation by this control part 30 are demonstrated in Embodiment 4. FIG.

)과 반사측의 레이저 광(Lβ)으로 분광된다. 투과측의 레이저 광(즉

빔; L

)은 몇 개의 고정 미러(22a ~ 22c)와 1 개의

빔용 갈바노 스캐너(23a)를 경유하여 제2 편광 수단(25)으로 유도된다. 동양(同樣)으로, 반사측의 레이저 광(즉 β빔; Lβ)도 다른 몇 개의 고정 미러(22d ~ 22f)와 1 개의 β빔용 갈바노 스캐너(23b)를 경유하여 제2 편광 수단(25)으로 유도된다. 제2 편광 수단(25)을 경유한 각각의 레이저 광(L

, Lβ)은 메인 갈바노 스캐너(26a, 26b)로 주사되어 fθ 렌즈(28)를 통과하는 것에 의해 피가공물(12)상의 2점에 조사된다. 그리고, 피가공물(12)이 가공된다. 이 때, 서브 갈바노 스캐너(23a, 23b)와 메인 갈바노 스캐너(26a, 26b)는 모두 제어부(30)에 의해서 미리 설정된 가공 정보에 기초하여 미러 각도가 제어된다.Next, operation | movement of the laser processing apparatus which has such a structure is demonstrated. The laser light L oscillated from the laser oscillator 20 is the laser light L on the transmission side in the first polarizing means 21.

) And the laser light L β on the reflection side. Laser light on the transmission side (i.e.

beam; L

) Shows several fixed mirrors (22a to 22c) and one

Guided to the second polarization means 25 via the beam galvano scanner 23a. On the other hand, the second polarization means 25 via some fixed mirrors 22d to 22f and another one of the galvano scanners 23b for the β beam, which also have the laser beam on the reflection side (that is, the β beam; L β ). Is induced. Each laser light L via the second polarization means 25

, L β are scanned by the main galvano scanners 26a and 26b and irradiated to the two points on the workpiece 12 by passing through the fθ lens 28. And the to-be-processed object 12 is processed. At this time, the sub-galvano scanners 23a and 23b and the main galvano scanners 26a and 26b both control the mirror angle on the basis of processing information preset by the control unit 30.

, Lβ)의 품질은 같은 수의 미러와 갈바노 미러를 통과하는 것에 의해 동일하게 된다. 이에 의해, 가공점 위치 정밀도의 편차와 가공 구멍 품질의 2점이 개선된다.Here, the reason why processing quality can be improved by the laser processing apparatus by this Embodiment 1 is demonstrated. Two laser lights L spectroscopically interposed between the first polarization means 21 and the second polarization means 25.

, L β ) become the same by passing through the same number of mirrors and galvano mirrors. This improves the two points of the deviation of the machining point position accuracy and the machining hole quality.

빔 L

와 β빔 Lβ는 각각 3 대의 갈바노 스캐너를 경유하고 있고, 종래예의 서브 빔(Lb)이 경유하는 4 대보다 적기 때문에 가공 위치 정밀도의 편차는 개선된다.The deviation of the machining point position precision is the position deviation at the machining point, and the error deviation to the abnormal position. The main cause of this processing point position accuracy deviation is due to the angular deviation during scanning of the galvano scanner, and the smaller the number of galvano scanners passing through one laser light, the better. According to this first embodiment,

Beam L

And β beam L β are each passed through three galvano scanners, and since there are fewer than four via the subbeam Lb of the conventional example, the variation in the machining position accuracy is improved.

One processing hole quality represents the degree of roundness of the processing hole when the galvano scanner is scanned and processed in the scanning area while varying the Z axis height. Usually, when the roundness ratio of a hole is more than a predetermined value, it will be judged that the processing hole quality is good, and it is considered that the larger the Z-axis range where this processing hole quality is judged to be, the wider the focus margin is and the processing hole quality is better. You lose. Here, the Z axis includes the sub galvano scanners 23a and 23b, the second polarizing means 25, the main galvano scanners 26a and 26b, and the fθ lens 28, and the XY table 11 It is a component group which has a mechanism which moves to a direction parallel to the direction (Z-axis direction) perpendicular | vertical with respect to the upper surface of ().

In general, the larger the number of mirrors inserted into the optical path to the processing point, the worse the quality (roundness) of the propagated laser light, and the beam quality at the processing point tends to be worse. As a result, the machining hole quality also worsens. This is because the surface of the mirror is often rigorously separate from the horizontal and vertical, and the laser beam propagating a plurality of such mirrors has the beam diffusion angle and the Z position of the converging point. Because it will be very different. In particular, the mirror of the galvano scanner is a mirror having a special shape, and the planarity is relatively poor, so that when there are a plurality of galvano scanners on the optical path, the beam quality deterioration at the processing point becomes very large.

FIG. 3A is a diagram schematically showing a state in which machining hole quality is good, and FIG. 3B is a diagram schematically showing a state in which machining hole quality is poor. As shown in FIG. 3A, when the number of mirrors or galvano mirrors propagated by the laser light L is small, the shape when the laser light L is cut into the XZ plane and the YZ plane based on the coordinate axis shown in the drawing Since the focal height is the same, the beam is always circular, and the laser light L is round no matter where the Z axis near the focal position is cut. However, as shown in FIG. 3B, when the number of mirrors and galvano mirrors through which the laser light L propagates is large, the laser light L is cut into the XZ plane and the YZ plane based on the coordinate axis shown in the drawing. The shapes do not match. That is, the focal height (Z axis) is different. As a result, when the laser light L is cut in the direction perpendicular to the Z axis near the focal position, an elliptic shape is obtained. In FIG. 3B, there is a case where the horizontal ellipse is changed from the vertical ellipse because the beam is enlarged or the light condensing position is different in the horizontal length of the laser light L.

It is a figure which shows an example of the evaluation method of a process hole quality. The evaluation method of the processing hole quality evaluates by calculating | requiring the Z-axis range in which the roundness of the shape of the processing hole at the time of forming by changing Z-axis height becomes more than a predetermined percentage. That is, this Z-axis range becomes a range where the processing hole quality is considered good. In addition, the wider the Z-axis range, the easier it is to process.

빔과 β빔의 가공 구멍 품질이 좋다고 판단되는 범위의 일례를 나타내는 도면이다. 우선, 도 5a에 나타난 바와 같이, 메인 빔(La)에서는 레이저 광이 전파하는 갈바노 스캐너(226a, 226b)의 수가 2개로 적으나, 서브 빔(Lb)에서는 레이저 광이 전파하는 갈바노 스캐너(224a, 224b, 226a, 226b)의 수가 4개로 많다. 그렇기 때문에, 2 개의 갈바노 스캐너(226a, 226b)밖에 전파하지 않는 메인 빔(La)의 가공 구멍 품질은 높으나, 4 개의 갈바노 스캐너(224a, 224b, 226a, 226b)를 전파하는 서브 빔(Lb)의 가공 구멍 품질은 극단적으로 낮아져 있다. 이에 대하여, 도 5b에 나타난 바와 같이, 레이저 광이 전파하는 갈바노 스캐너의 수가 3개로 되는

빔 L

와 β빔 Lβ는 모두 도 5a에 나타나는 종래의 레이저 가공 장치의 서브 빔(Lb)의 가공 구멍 품질보다 좋은 가공 구멍 품질로 되어 있다. 그리고, 2 개의 레이저 광의 가공 구멍 품질이 좋다고 판정되는 범위는 거의 동등하고, 양자가 겹치는 범위, 즉 2 개의 레이저 광으로 가공되는 가공 구멍의 품질이 양호해지는 Z축 범위는 도 5a의 종래의 레이저 가공 장치의 경우보다 넓어져 있다. 즉, 한 쪽의 빔 품질이 나쁜 레이저 광의 빔 품질을 개선하는 것에 의해, 레이저 가공 장치 전체의 가공 구멍 품질을 개선하는 것이 가능하게 된 다. 또, 가공 구멍 품질은 도 1에 나타낸 서브 갈바노 스캐너(23a, 23b)의 fθ 렌즈(28)의 전 초점 위치 F로부터의 배치 거리가 짧을수록 개선된다. 즉, 도 1에 나타난 바와 같이, 이 실시 형태 1의 구성에 의하면,

빔 L

와 β빔 Lβ가 전파하는 각각의 광로에 1개씩 서브 갈바노 스캐너(23a, 23b)가 배치되고, 그 배치 위치를 전 초점 위치 F에 접근시킬 수 있기 때문에 가공 구멍 품질을 개선할 수 있다. 이에 덧붙여, 전 초점 위치 F로부터 각각의 서브 갈바노 스캐너(23a, 23b)의 설치 거리가 동일하기 때문에, 2 개의 레이저 광(L

, Lβ)에 의한 가공 구멍 품질은 동등하게 된다.FIG. 5A is a view showing an example of a range in which the processing hole quality of the main beam and the sub-beam is good in the conventional laser processing apparatus of FIG. 14, and FIG. 5B is the laser processing apparatus of this Embodiment 1

It is a figure which shows an example of the range in which the processing hole quality of a beam and a ( beta) beam is judged to be good. First, as shown in FIG. 5A, the number of galvano scanners 226a and 226b through which the laser light propagates in the main beam La is reduced to two, but the galvano scanner through which the laser light propagates in the sub beam Lb. 224a, 224b, 226a, and 226b) are four. Therefore, the processing hole quality of the main beam La which propagates only two galvano scanners 226a and 226b is high, but the sub beam Lb propagating four galvano scanners 224a, 224b, 226a and 226b. ), The hole quality is extremely low. In contrast, as shown in Fig. 5B, the number of galvano scanners through which laser light propagates is three.

Beam L

And β beam L β are both the processing hole quality better than the processing hole quality of the sub-beam Lb of the conventional laser processing apparatus shown in FIG. 5A. The range where the quality of the processing holes of the two laser lights is determined to be good is almost the same, and the range where the two overlap, that is, the Z-axis range in which the quality of the processing holes processed with the two laser lights is good, is the conventional laser processing of FIG. 5A. It is wider than that of the device. That is, by improving the beam quality of the laser light of which one beam quality is bad, it becomes possible to improve the process hole quality of the whole laser processing apparatus. Further, the processing hole quality is improved as the arrangement distance from the full focal position F of the fθ lens 28 of the sub galvano scanners 23a and 23b shown in FIG. 1 is shorter. That is, as shown in FIG. 1, according to the configuration of the first embodiment,

Beam L

And sub-galvano scanners 23a and 23b are arranged in each optical path propagated by the ? Beam L ? And the arrangement position can be brought closer to the focal position F, so that the machining hole quality can be improved. In addition, since the installation distances of the respective sub-galvano scanners 23a and 23b are the same from the focal point position F, two laser lights L

, L β ), the processing hole quality is equal.

, Lβ) 모두 3 대의 갈바노 스캐너밖에 경유하지 않아, fθ 렌즈(28)의 전 초점 위치 F로부터 빔 주사하는 가장 먼 서브 갈바노 스캐너(23a, 23b)까지의 거리도 짧아지게 되는 것에 의해, 종래의 동시 다점 조사형 레이저 가공 장치와 동양의 생산성을 유지한 채로 종래의 서브 빔의 가공 품질이 열화한다고 하는 문제점을 해소할 수 있다. 또, 2 개의 레이저 광(L

, Lβ)의 가공 품질이 동등하게 되므로, 가공 품질이 좋은 가공을 행할 수 있는 Z축 높이의 범위를 넓힐 수 있어, 종래의 레이저 가공 장치에 비해 보다 넓은 조건의 범위로의 가공을 행할 수 있다고 하는 효과를 갖는다.According to the first embodiment, all spectroscopic laser light L

, L β ) only pass through three galvano scanners, and the distance from the full focal position F of the fθ lens 28 to the furthest sub-galvano scanners 23a and 23b for beam scanning is also shortened. The problem that the processing quality of the conventional sub beam deteriorates while maintaining the conventional simultaneous multi-point irradiation type laser processing apparatus and the oriental productivity can be solved. In addition, two laser lights (L

Since the processing quality of L β is equal, the range of the Z-axis height that can perform the processing with good processing quality can be widened, and the processing can be performed in a wider range of conditions than the conventional laser processing apparatus. It has an effect.

Embodiment 2.

FIG. 6 is a diagram showing a configuration of Embodiment 2 of a laser processing apparatus according to the present invention, and FIG. 7A is a layout relationship when viewed in the X-axis direction of the sub galvano scanner and the main galvano scanner of the laser processing apparatus of FIG. 6. It is a figure which shows the arrangement | positioning relationship of the galvano scanner in the vicinity of the full-focus position of the f (theta) lens of the laser processing apparatus of FIG. In FIG. 1 of Embodiment 1, this laser processing apparatus is characterized by arranging the rotation axis of the mirror 27a of the galvano scanner 26a inclined by the angle θ with respect to the Z axis. In addition, with this, the sub galvano scanner 23a, 23b is also arrange | positioned inclined by the angle (theta) with respect to the position in the case of Embodiment 1, respectively. The rotation axes of the mirrors 24a, 24b, and 27a of the galvano scanners 23a, 23b, and 26a constitute the same rectangular coordinate system, respectively. In addition, the XYZ coordinate system shown in the figure between the mirror 22b and the sub-galvano scanner 23a in the two optical paths of the first embodiment, and between the mirror 22d and the sub-galvano scanner 23b is referred to as the XYZ coordinate system. Two mirrors 22g to 22j are arranged in each optical path for changing to a rectangular coordinate system inclined by an angle θ. The optical path on the side of the laser oscillator 20 than the mirrors 22g and 22i is configured to be parallel to any one of the X, Y, and Z axes of the XYZ rectangular coordinates provided on the basis of the XY table 11. This is because it is necessary to be perpendicular to the XY plane for the machining point height adjustment.

In the second embodiment, the galvano scanner 26a is arranged in an inclined state from the inclined lower side of the galvano scanner 26b. Specifically, as shown in FIGS. 7A to 7B, the galvano scanner 26a is inclined in the Y-axis positive direction in the YZ plane by an angle θ, compared to the arrangement position of Embodiment 1 shown in FIG. 2. have. By inclining in this way, considering the distance which both do not interfere from the movable range of the mirrors 27a and 27b, the distance between two mirrors 27a and 27b can be narrowed compared with the case of Embodiment 1. As shown in FIG. As a result, the distance Y between the prefocus position of the fθ lens 28 (the beam scanning abnormal position before the fθ lens 28) and the two mirrors 27a and 27b can also be made shorter than in the case of FIG. 2 of the first embodiment. It is possible to improve the processing hole quality of the laser light. In addition, as the galvano scanner 26a is inclined by the angle θ, the galvano scanners 23a and 23b are inclined in the positive Z-axis direction by θ in the YZ plane by the angle θ relative to the arrangement position of Embodiment 1 shown in FIG. 2. I place it.

, Lθ)의 주사 방향은 X축과 Y축에 평행한 방향으로 된다.When the galvano scanners 23a, 23b and 26a are inclined in this manner, the laser light L on the XY table 11 when the galvano scanners 23a, 23b, 26a and 26b are scanned.

, Lθ) is a direction parallel to the X and Y axes.

According to the second embodiment, in addition to the effect of the first embodiment, since the main galvano scanners 26a and 26b are arranged to approach the focal position F of the fθ lens 28, compared with the first embodiment, This has the effect of further improving the machining hole quality.

Embodiment 3.

In Embodiment 2, since the beam position does not change by the operation by the Z-axis up / down adjustment mechanism (the structure for adjusting the focus position by operating the machining head portion), an optical axis parallel to the Z axis is provided in the middle of the optical path. There was a problem that the number of mirrors after the first spectroscopy (first polarization means 21) increased by two or more for one optical path than the first embodiment. Therefore, this Embodiment 3 demonstrates the case where the number of mirrors after 1st spectroscopy is the same number as Embodiment 1. FIG.

It is a figure which shows the structure of Embodiment 3 of the laser processing apparatus which concerns on this invention. This laser processing apparatus is characterized by arranging only the galvano scanner 26a in the inclined lower side of the galvano scanner 26b in FIG. 1 of the first embodiment. Since the arrangement position of this galvano scanner 26a is the same as that shown in FIG. 7B of Embodiment 2, the description is abbreviate | omitted.

In the third embodiment, only the galvano scanner 26a is inclined by an angle θ, and the other sub galvano scanners 23a and 23b and the mirrors 22g to 22j are the same as those of the first embodiment. It arrange | positions so that it may become parallel to any one of the X-axis, Y-axis, and Z-axis of the XYZ coordinate system based on the XY table 11. As shown in FIG. Thereby, it becomes possible to prevent a beam position from changing with the operation by the Z-axis up-down adjustment mechanism.

, Lβ)의 주사 방향은 X축과 Y축에 평행한 방향이 아니라, 직각이 아닌 소정 각도로 교차하는 2 개의 축에 평행한 방향으로 된다.In the case of the third embodiment, the laser light L on the XY table 11 when the galvano scanners 23a, 23b, 26a, and 26 are scanned.

, L β ) is not a direction parallel to the X-axis and the Y-axis, but a direction parallel to the two axes intersecting at a predetermined angle rather than at right angles.

According to the third embodiment, the scan coordinate systems of the main galvano scanners 26a and 26b after the second polarization means 25 are rectangular coordinate systems based on the XY table 11, but the sub-polarized galvano scanners 23a, The scanning coordinate system of 23b) is not orthogonal to have a certain angle θ, but because the number of mirrors after the first spectroscopy (first polarization means 21) ends in a smaller configuration as in the first embodiment, compared with the second embodiment. This has the effect of being able to suppress deterioration of the processing hole quality.

Embodiment 4.

빔 L

용 갈바노 스캐너(23a)와, β빔 Lβ용 갈바노 스캐너(23b)의 주사 방향이 직교하면, 직관적으로 알기 쉽고 주사 면적을 최대로 할 수 있다. 예를 들어, 실시 형태 1(도 1)에서는 이상적인 fθ 렌즈(28)를 상정하면,

빔 L

용 갈바노 스캐너(23a)의 주사 방향은 직후에 X축 방향이므로 XY 테이블(11)상에서는 X축 방향이고, 빔 Lβ용 갈바노 스캐너(23b)의 주사 방향은 직후에 Z 방향이므로 XY 테이블(11)상에서는 Y축 방향이다. 그러나, 실제로는 이상적인 fθ 렌즈(28)의 제작이 곤란한 것이나, 렌즈 장착 정밀도의 한계 등에 의해, 1 대의 갈바노 스캐너에 의한 주사 방향이 XY 테이블(11)상에서 직선으로는 되지 않는다. 또, 갈바노 스캐너의 주사 방법(제어 방법)에 따라 가공 구멍 위치를 제어할 수 있으므로, 실시 형태 2, 3에서 나타낸 바와 같이,

빔 L

용 갈바노 스캐너(23a)와 β빔 Lβ용 갈바노 스캐너(23b)의 주사 방향이 직교하지 않는 구성으로 하는 것도 가능하다. 따라서, 어느 경우로 하더라도, 목표의 구멍 좌표에 구멍 가공을 행할 수 있도록 각 갈바노 스캐너(23a, 23b, 26a, 26b)의 각도를 결정해야 한다. 따라서, 이 실시 형태 4에서는 목표의 구멍 좌표에 구멍 가공을 행하기 위한 갈바노 스캐너의 제어 방법에 대하여 설명한다.In Embodiments 1-3, the arrangement | positioning of a galvano scanner and a mirror in the laser processing apparatus was demonstrated. As described above, for example, in the optical system of Embodiment 1, as shown in FIG. 1,

Beam L

If the scanning directions of the galvano scanner 23a for use and the galvano scanner 23b for the beta beam L β are orthogonal to each other, the scanning area can be intuitively understood and the scanning area can be maximized. For example, in the first embodiment (FIG. 1), assuming the ideal fθ lens 28,

Beam L

For galvanometer, so the X-axis direction right after the scanning direction of the scanner (23a) and the XY table 11. On the X-axis direction, since the Z direction just after the scanning direction of the beam galvanometer scanner (23b) for L β XY table ( 11) is in the Y-axis direction. In reality, however, it is difficult to produce an ideal fθ lens 28, and due to limitations in lens mounting accuracy, the scanning direction by one galvano scanner does not become a straight line on the XY table 11. Moreover, since the processing hole position can be controlled by the scanning method (control method) of a galvano scanner, as shown in Embodiment 2, 3,

Beam L

The scanning direction of the galvano scanner 23a for a beam and the galvano scanner 23b for a beta beam L beta can also be set as a structure which is not orthogonal. Therefore, in either case, the angles of the galvano scanners 23a, 23b, 26a, and 26b should be determined so that the hole processing can be performed at the target hole coordinates. Therefore, this Embodiment 4 demonstrates the control method of a galvano scanner for performing a hole process to target hole coordinate.

It is the control part 30 as shown in FIG. 1, FIG. 6, FIG. 8 to control such a laser processing apparatus. This control part 30 calculates the relationship between the mirror angles of the galvano scanners 23a, 23b, 26a, and 26b and the position of the processing hole formed on the XY table 11, and the calibration function 31 About the model storage function 32 and the to-be-processed object 12 which store the model which calculates | requires the mirror angle of the galvano scanners 23a, 23b, 26a, and 26b for performing a hole process to the target position calculated | required by The processing information storing function 33 which stores processing information, such as the position to drill a process to be performed, and the processing information stored in the processing information storing function 33 are used with the model of the model storing function 32 using a galvano scanner ( 23a, 23b, 26a, 26b and the process control function 34 which controls the laser oscillator 20 are provided.

Below, the outline | summary of a control method in a laser processing apparatus is demonstrated first, and the calibration method for performing control is demonstrated next.

The angle (angle command value) of the galvano scanner 23a, 23b, 26a, 26b which should be present in order to implement the process with respect to the hole coordinate (target hole coordinate) on the XY table 11 which you want to process in a laser processing apparatus. The function to obtain is required.

FIG. 9 is a block diagram showing a coordinate relationship between a mirror angle of each galvano scanner and a hole to be machined in the conventional simultaneous multi-point irradiation type laser processing apparatus shown in FIG. 14. As shown in Fig. 9, in the conventional simultaneous multi-point irradiation laser processing apparatus, the coordinates a _x and a _y of the processing holes of the main beam La are obtained, and the coordinates of the processing holes of the sub-beam Lb (b). _x and b _y are obtained by a difference from the coordinates (a _x , a _y ) of the processing holes of the main beam La. That is, the coordinates (a _x , a _y ) of the processing holes of the main beam La are determined according to the mirror angles of the galvano scanners 226a and 226b of the second set. The coordinates (b _x , b _y ) of the machining holes of one subbeam Lb are added to the mirror angles of the galvano scanners 226a and 226b of the second set, and the galvano scanner of the first set ( Determine according to the mirror angle of 224a, 224b). However, when these main beams La and the sub beams Lb are put together, when the mirror angles of the four galvano scanners 224a, 224b, 226a, and 226b are determined, the coordinates (four coordinate components) of the two machining holes are determined. ) Is related to 4 input and 4 output. Thereby, these relationships can be grasped | ascertained as a relationship of thought (for more information, refer patent document 2).

By the way, in the laser processing apparatus according to the present invention, as described above, the two laser light spectroscopy by the first polarization means 21 do not have the superiority due to the beam quality by propagating the same number of galvano scanners. There is no classification of the main beam and the sub beam, but they are equivalent. That is, for the laser processing apparatus according to the present invention, a method for obtaining the mirror angles of four galvano scanners for determining the coordinates of two processing holes using the relation of the mapping as shown in FIG. 9 described above is applied. Since this cannot be done, a control method for newly defining the machining hole coordinates is required.

빔 L

에서는 메인 갈바노 스캐너(26a, 26b)의 미러 각도에 더하여

빔 L

의 광로상에 배치되는 서브 갈바노 스캐너(23a)의 미러 각도에 의해, 가공 구멍의 위치 좌표 (

_x,

_y)가 정 해진다. 또, β빔 Lβ에서도, 메인 갈바노 스캐너(26a, 26b)의 미러 각도에 더하여 β빔 Lβ의 광로상에 배치되는 서브 갈바노 스캐너(23b)의 미러 각도에 의해 가공 구멍의 위치 좌표 (β _x, β _y)가 정해진다. 그리고, 이들을 정리해 보면, 4 대 갈바노 스캐너(23a, 23b, 26a, 26b)의 미러 각도가 정해지면, 4 개의 가공 구멍 좌표 (

_x,

_y, β _x, β _y; 2 개의 구멍에서 각각 X 좌표와 Y 좌표가 있기 때문에 4 변수)가 정해진다고 하는 사상의 관계에 있음을 알 수 있다.10 is a block diagram showing the coordinate relationship between the mirror angle of each galvano scanner and the hole to be machined in the laser processing apparatus according to the present invention. As shown in Fig. 10, in the laser processing apparatus according to the present invention,

Beam L

In addition to the mirror angles of the main galvano scanners 26a and 26b,

Beam L

Position coordinates of the machining hole by the mirror angle of the sub-galvano scanner 23a disposed on the optical path of

_x ,

_y ) is determined. Also in the β beam L β , in addition to the mirror angles of the main galvano scanners 26a and 26b, the positional coordinates of the processing holes are determined by the mirror angle of the sub galvano scanner 23b disposed on the optical path of the β beam L β . β _x , β _y ) are determined. In summary, when the mirror angles of the four galvano scanners 23a, 23b, 26a, and 26b are determined, four machining hole coordinates (

_x ,

_y , β _x , β _y ; It can be seen that the two variables have an X- and Y-coordinate, respectively, so that the four variables are defined.

_x,

_y, β _x, β _y)의 4 입력에 대하여, 그 구멍 좌표 (

_x,

_y, β _x, β _y)에서의 가공을 실현하기 위하여 4 대 갈바노 스캐너(23a, 23b, 26a, 26b)의 미러 각도의 추정값(ga^e, gb^e, gc^e, gd^e)인 4 변수를 출력하는 4 입력 4 출력인 것을 특징으로 한다. 그리고, 이 실시 형태 4에서 사용되는 역사상 모델은 4 입력 4 출력의 다항식을 포함하는 다항식 모델을 사용하여, 4 대 갈바노 스캐너(23a, 23b, 26a, 26b)의 미러 각도로부터 4 개의 가공 구멍 좌표 (

_x,

_y, β _x, β _y)를 구하는 기능을 실현한다. 여기서, 다항식은 정수와 변수의 사칙 연산만으로 계산되는 수식을 말하고, 그 종류는 여러 가지로 생각할 수 있다.For this reason, in this Embodiment 4, in order to calculate the coordinates (components of four machining hole coordinates) of two machining holes, the inverse thought model of the idea shown by the block diagram of FIG. 10 is used, It is characterized by the above-mentioned. In Fig. 10, the target position coordinates of the two machining holes (

_x ,

_For 4 inputs of _y , β _x , β _y ), the hole coordinates (

_x ,

Four variables that are estimated values of the mirror angles (ga ^e , gb ^e , gc ^e , gd ^e ) of the four major galvano scanners 23a, 23b, 26a, and 26b to realize processing in _y , β _x , and β _y . It characterized in that it is 4 input 4 output. In addition, the historical model used in the fourth embodiment uses four polynomial models including four input four output polynomials, and four machining hole coordinates from the mirror angles of the four galvano scanners 23a, 23b, 26a, and 26b. (

_x ,

_y , β _x , β _y ). Here, the polynomial refers to an expression calculated by only arithmetic operations of integers and variables, and the types thereof can be considered in various ways.

When the historical model used in the fourth embodiment is represented by a mathematical formula using a determinant, the following equation (1) is obtained. Where B ^e is a matrix representing an estimated value of the mirror angles of the four major galvano scanners 23a, 23b, 26a, and 26b, and A is a matrix representing target hole coordinates represented by a polynomial model of order n (n is a natural number). , X is the coefficient matrix (or unknown parameter matrix) of the matrix A.

B ^e = AX ... (1)

For example, in the case of the first-order polynomial model, five terms are shown in the following equation (2), and in the case of the second-order polynomial model, the number of terms is fifteen terms. In the case of the third-order polynomial model, 35 terms are obtained as shown in Equation (4). Note that in addition to the polynomials shown here, for example, a polynomial model such as using a part of equation (4) can be considered.

The components k _{1 -l} , k _{1 -2} ,... In the above-described equation are coefficients of the polynomial, and are determined by a calibration method to be explained later in accordance with the characteristics of the optical system. As shown in these formulas (2) to (4), the matrix X is a matrix consisting of only coefficients of the polynomial. For example, in the first-order polynomial model, the coefficient matrix X is a matrix of 5x4, in the second-order polynomial model, the coefficient matrix X is a 15x4 matrix, and in the third-order polynomial model The coefficient matrix is a 35 × 4 matrix.

If the number of terms is increased by increasing the degree of the polynomial, more precise position control of the machining hole can be performed, but more data is required to obtain the coefficient matrix of the polynomial model. Any order polynomial can be used, but as a result of the experiment, in the case of a laser processing apparatus for drilling holes such as a printed board, if a polynomial model (number = 35) consisting of all terms of order 3 or less is used, It can be seen that a historical model of precision that satisfies

_x,

_y, β _x, β _y)로부터, 최소제곱법이나 가중최소제곱법 등의 방법을 사용하여 상기 다항식 모델의 계수(미지 파라미터)를 결정한다. 캘리브레이션 기능(31)으로 상기와 같이 하여 산출된 각 갈바노 스캐너의 미러 각도로부터 가공되는 2 개의 구멍 좌표 사상의 역사상 모델(다항식 모델)은 모델 격납 기능(32)에 격납된다.In order to obtain coefficients (unknown parameters) of the polynomial model described above, a calibration process is required. This calibration process is realized by the calibration function 31 of the control unit 30. In the calibration process, the mirror angles of the galvano scanners 23a, 23b, 26a, and 26b are assigned to several values to perform the test processing, and the actual processed hole coordinates are measured by an imaging means 29 such as a CCD camera. . Angle data g _a , g _b , g _c , g _{d of the} respective galvano scanners 23a, 23b, 26a, 26b, and the hole coordinate data processed at that time (

_x ,

_y , β _x , β _y ), coefficients (unknown parameters) of the polynomial model are determined using a method such as least square method or weighted least square method. The historical model (polynomial model) of two hole coordinate events processed from the mirror angle of each galvano scanner calculated as described above by the calibration function 31 is stored in the model storage function 32.

Also in this calibration process, the laser processing apparatus by this invention exhibits the remarkable effect that work time can be shortened compared with the conventional simultaneous multi-point irradiation type laser processing apparatus. This is shown by comparing the following simple examples.

빔 L

에 의해 형성된 가공 구멍의 위치를 나타내고 있고, 「×」표시는 서브 빔(Lb) 또는 β빔 Lβ에 의해서 형성된 가공 구멍의 위치를 나타내고 있다.In the present invention and the conventional calibration process, the first set of galvano scanners 23a, 23b, or 224a, 224b each have four mirror angles, and the second set of galvano scanners 26a, 26b, or 226a and 226b compare with the case where test processing is performed by assigning three mirror angles, respectively. It is a figure which shows the processing hole position at the time of using the conventional simultaneous multi-point irradiation type laser processing apparatus, and FIG. 12 shows the processing hole position at the time of using the laser processing apparatus by this invention. In addition, for the sake of simplicity, it is assumed here that the fθ lenses 28 and 228 are ideal, and it is assumed that they are scanned in a straight line on the XY tables 11 and 211. In these figures, the horizontal axis represents the X axis on the XY tables 11 and 211, and the vertical axis represents the Y axis on the XY tables 11 and 211. In addition, "○" display indicates a main beam La or

Beam L

The position of the processing hole formed by this is shown, and "x" mark has shown the position of the processing hole formed by the sub beam Lb or ( beta ) beam L ( beta ).

It is a figure which shows the number of the process hole required for calibration. When performing a test process with a conventional laser processing apparatus (FIG. 14), there are 3 x 3 x 4 x 4 = 144 combinations of mirror angles of the galvano scanner, but the laser light (La, Lb) is two. There are 288 things. However, due to the characteristics of the optical system, there is an overlap processed at the same position. For example, as can be seen from the block diagram of Fig. 9, the optical system of the main beam La is correlated with the mirror positions of the galvano scanners 224a and 224b in the simultaneous multi-point irradiation laser processing apparatus according to the prior art. Therefore, there are 3 x 3 = 9 things to confirm. In other words, if the positions are the same, there is no need for duplication, so the number of holes required to be confirmed is less than 288, which is 153.

, Lβ)가 2개이므로 확인하는 것은 72 가지로 된다.On the other hand, when performing a test process with the laser processing apparatus by this invention, there are 3 * 3 * 4 = 36 combinations of the mirror angles of a galvano scanner, and laser light (L

, L β ) are two, so there are 72 types of things to check.

Even in this simple example, in the case of the laser processing apparatus according to the present invention, the number of holes for performing the calibration test machining can be reduced by 81 compared with the prior art. In the actual calibration process, it is necessary to assign the angle of the mirror of the galvano scanner in more detail, so that the difference in the number of holes from the prior art becomes remarkable. In the calibration process, the coordinates of this tested hole are measured by the imaging means 29. However, the larger the number of holes, the longer the time required for this measuring operation.

_x,

_y), (β _x, β _y)를 가공 정보 격납 기능(33)으로부터 취득하고, 모델 격납 기능(32)에 격납된 다항식 모델에 취득한 구멍을 뚫고 싶은 위치 좌표를 입력하여, 연산한 결과 얻어지는 갈바노 스캐너의 미러 각도(g_a, g_b, g_c, g_d)로 되도록 갈바노 스캐너(23a, 23b, 26a, 26b)의 미러 각도를 제어한다. 이상에 의해, 목표로 하는 피가공물(12)상의 위치에 구멍을 뚫을 수 있다.The coefficient matrix is obtained by the calibration process as described above, and the coefficients of the polynomial model are determined. And in the actual process, the process control function 34 of the control part 30 is a position which wants to drill the hole on the to-be-processed object 12, and coordinates on the XY table 11 (

_x ,

_y ), ( β _x , β _y ) are obtained from the machining information storage function 33, the position coordinates to be drilled into the polynomial model stored in the model storage function 32 are input, and the galvan obtained as a result of the calculation The mirror angles of the galvano scanners 23a, 23b, 26a, and 26b are controlled to be the mirror angles g _a , g _b , g _c , and g _{d of the} furnace scanner. By the above, a hole can be drilled in the position on the target to-be-processed object 12. FIG.

In the above description, the case of the laser processing apparatus of Embodiment 1 is taken as an example, but in the case of Embodiments 2 and 3, the mirror of the galvano scanners 23a, 23b, 26a, and 26b is also used by using a polynomial model. By controlling the position, the position of the processing hole can be controlled.

According to the fourth embodiment, since the same number of galvano scanners are arranged on the two optical paths which are spectroscopically analyzed by the first polarizing means 21, the number of processing holes required for the calibration process can be reduced, and the calibration process time can be greatly increased. It has a remarkable effect that it can be shortened. Moreover, the laser processing apparatus which has such an optical system has the effect that the position of a processing hole can be controlled by the historical model about the mapping from the mirror angle of four galvano scanners to the two hole coordinate processed.

In addition, in the above embodiments 1 to 4, an example in which three galvano scanners are arranged on each optical path of two spectroscopic laser beams is provided. However, if the same number is used in each optical path, any number of galvano scanners are arranged. You may also In addition, by applying the present idea, a method of spectroscopically analyzing two laser beams in two or a plurality of laser oscillators may be prepared to increase the number of simultaneous processing holes.

As mentioned above, the laser processing apparatus which concerns on this invention is useful when carrying out several hole processing simultaneously with favorable precision.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of Embodiment 1 of the laser processing apparatus by this invention.

It is a figure which shows the arrangement relationship of the galvano scanner in the vicinity of the full-focus position of the f (theta) lens of the laser processing apparatus of FIG.

It is a figure which shows typically the state in which the process hole quality is good.

It is a figure which shows typically the state in which a machining hole quality is bad.

It is a figure which shows an example of the evaluation method of a process hole quality.

It is a figure which shows an example of the range with which the processing hole quality of a main beam and a sub beam is judged good in the conventional laser processing apparatus.

빔과 β빔의 가공 구멍 품질이 좋다고 판단되는 범위의 일례를 나타내는 도면이다.5B shows the laser processing apparatus of the first embodiment.

It is a figure which shows an example of the range in which the processing hole quality of a beam and a ( beta) beam is judged to be good.

It is a figure which shows the structure of Embodiment 2 of the laser processing apparatus by this invention.

It is a figure which shows the arrangement relationship when it sees from the X-axis direction of the sub galvano scanner and main galvano scanner of the laser processing apparatus of FIG.

It is a figure which shows the arrangement relationship of the galvano scanner in the vicinity of the full-focus position of the f (theta) lens of the laser processing apparatus of FIG.

It is a figure which shows the structure of Embodiment 3 of the laser processing apparatus by this invention.

9 is a block diagram showing the coordinate relationship between the mirror angle of each galvano scanner and the hole to be machined in the conventional simultaneous multi-point irradiation laser processing apparatus.

10 is a block diagram showing the coordinate relationship between the mirror angle of each galvano scanner and the hole to be machined in the laser processing apparatus according to the present invention.

It is a figure which shows the processing hole position at the time of using the conventional simultaneous multi-point irradiation type laser processing apparatus.

It is a figure which shows the processing hole position at the time of using the laser processing apparatus by this invention.

It is a figure which shows the number of the process hole required for calibration.

It is a figure which shows the conventional example of the structure of the laser processing apparatus of simultaneous multi-point irradiation type.

<Description of the code>

11 XY table

12 Workpiece

2O laser oscillator

21 first polarization means

22a to 22j, 24a, 24b, 27a, 27b mirror

23a, 23b, 26, 26a, 26b galvano scanner

25 second polarization means

28 fθ lens

29 Imaging means

3O control unit

31 Calibration Function

32 model containment features

33 Machining information storage function

34 Machining Control Function

Claims (10)

In the laser processing apparatus which processes by irradiating a laser beam simultaneously to two or more points on the to-be-processed object arrange | positioned on a table, First polarizing means for spectroscopy one laser light into first and second laser lights having different optical paths; A first galvano scanner disposed on an optical path of the first laser light and scanning the first laser light in a first direction on the table; A second galvano scanner disposed on an optical path of the second laser light and scanning the second laser light in a second direction different from the first direction on the table; Second polarizing means for mixing the first and second laser lights; A main galvano scanner comprising a pair of third and fourth galvano scanners for scanning the mixed first and second laser light in different third and fourth directions on the table; And a f? Lens for condensing the first and second laser light from the main galvano scanner at a predetermined position on the workpiece, respectively. The method according to claim 1, And the first and second galvano scanners are arranged at positions where the optical path lengths from the focal point of the fθ lens are the same on each optical path through which the first and second laser lights propagate. Processing equipment. The method according to claim 1, In a case where the direction orthogonal to both of the first and second directions is set as the fifth direction, The first to fourth galvano scanners are arranged such that the rotation axis direction of the mirrors of the first to fourth galvano scanners is the same as any one of the first, second and fifth directions. Processing equipment. The method according to claim 1, In a case where the direction orthogonal to both of the first and second directions is set as the fifth direction, The first, second, and fourth galvano scanners have a rotation axis direction of the mirrors of the first, second, and fourth galvano scanners in the same direction as any one of the first, second, and fifth directions. Deployed, The third galvano scanner is disposed closer to the second polarizing means than the fourth galvano scanner, and the rotation axis direction of the mirror of the third galvano scanner is one of the first, second and fifth directions. Laser processing apparatus, characterized in that arranged to be inclined with respect to the predetermined angle. The method according to claim 1, And a number of galvano scanners arranged in two optical paths between the first and second polarizing means and a number of mirrors for guiding the first and second laser light in a predetermined direction. The method according to claim 1, On the basis of an arithmetic model indicating a relationship between the mirror angles of the first to fourth galvano scanners and the coordinates of the holes processed by the first and second laser lights irradiated on the table when the mirror angles are the mirror angles; And control means for calculating the mirror angles of the first to fourth galvano scanners and controlling the mirror angles of the first to fourth galvano scanners in correspondence with the target machining positions on the workpiece. The laser processing apparatus characterized by the above-mentioned. The method according to claim 6, And said computational model is an inverse speculation model of mapping from the mirror angles of said first to fourth galvano scanners to said coordinates on said table of said first and second laser lights. Processing equipment. The method according to claim 7, The historical model is represented by a polynomial model including a polynomial of four inputs and four outputs for inputting four components constituting the survey coordinates and outputting mirror angles of the first to fourth galvano scanners. Laser processing device characterized in that. The method according to claim 8, And said polynomial model is represented by a polynomial formula comprising terms of a third order or less of four components of said irradiation coordinates. The method according to claim 6, The control means measures four components of the table-shaped irradiation coordinates of the first and second laser lights when the mirror angles of each of the first to fourth galvano scanners are arbitrarily assigned, and the first to fourth And a function of calculating a calculation model indicating a relationship between the mirror angle of the galvano scanner and the four components of the irradiation coordinates.

Images