KR100935416B1 - Manufacturing method of metal pcb for prevention of over heating of environmental friendly led board - Google Patents

Manufacturing method of metal pcb for prevention of over heating of environmental friendly led board Download PDF

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KR100935416B1
KR100935416B1 KR1020090072786A KR20090072786A KR100935416B1 KR 100935416 B1 KR100935416 B1 KR 100935416B1 KR 1020090072786 A KR1020090072786 A KR 1020090072786A KR 20090072786 A KR20090072786 A KR 20090072786A KR 100935416 B1 KR100935416 B1 KR 100935416B1
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heat
metal pcb
adhesive layer
manufacturing
heat transfer
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KR1020090072786A
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Korean (ko)
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구자연
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케이피엘써키트(주)
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Abstract

PURPOSE: A method for manufacturing a metal PCB for preventing heat from an LED(Light Emitting Diode) board is provided to improve heat dissipation by forming a heat transmission adhesive layer between the metal PCB and a heat sink. CONSTITUTION: A heat transmission adhesive layer(20) is formed on a metal PCB(10) and is made of heat dissipation silicon. The heat dissipation silicon includes liquid silicon and a thermosetting agent. A heat sink(30) is adhered on the heat transmission adhesive layer. The heat transmission adhesive layer is cured at a temperature between 100 and 120 °C for 30 to 50 minutes. The thermosetting agent includes nano-fumed silica of 10 to 30 wt%, polysiloxane of 1 to 10 wt%, and copper powder of 60 to 80 wt%.

Description

친환경 ＬＥＤ 기판 열방지용 메탈 ＰＣＢ 제조방법{MANUFACTURING METHOD OF METAL PCB FOR PREVENTION OF OVER HEATING OF ENVIRONMENTAL FRIENDLY LED BOARD}MANUFACTURING METHOD OF METAL PCB FOR PREVENTION OF OVER HEATING OF ENVIRONMENTAL FRIENDLY LED BOARD}

본 발명은 LED 기판에 사용되는 메탈 PCB는 방열판과의 결합을 견고히 하고, 결합을 위해 사용하는 열경화제를 함유하는 액상실리콘(이하, '방열실리콘'이라 칭한다.)의 열전달기능을 향상시킴으로써 LED 기판에서 발생된 열이 효율적으로 방열될 수 있는 친환경 LED 기판 열방지용 메탈 PCB 제조방법에 관한 것이다.In the present invention, the metal PCB used for the LED substrate is to strengthen the bonding with the heat sink, and improve the heat transfer function of the liquid silicone (hereinafter referred to as 'heat dissipation silicon') containing the heat curing agent used for bonding LED substrate The present invention relates to an environmentally friendly LED substrate heat prevention metal PCB manufacturing method that can be efficiently radiated heat generated from.

반도체 발광소자로는 LED(Light Emitting Diode; 발광 다이오드)를 들 수 있는데, 이는 화합물 반도체의 특성을 이용해 전기 신호를 적외선, 가시광선 또는 자외선의 형태로 변환시켜 신호를 보내고 받는 데 사용되는 소자이다.A light emitting diode (LED) is a semiconductor light emitting device, which is a device used to send and receive a signal by converting an electric signal into a form of infrared light, visible light, or ultraviolet light using characteristics of a compound semiconductor.

보통 LED의 사용 범위는 가정용 가전제품, 리모콘, 전광판, 표시기, 각종 자동화 기기 등에 사용되고, 종류는 크게 IRED(Infrared Emitting Diode)와 VLED(Visible Light Emitting Diode)로 나뉘어 진다.Usually, the use range of LED is used in home appliances, remote controllers, electronic signs, indicators, and various automation devices, and the types are largely divided into Infrared Emitting Diode (IRD) and Visible Light Emitting Diode (VLED).

일반적으로 청색 LED는 사파이어 기판 상에 N형 GaN 층이 형성되고, 상기 N형 GaN 층 표면의 일측 상에 N-메탈이 있고, 상기 N-메탈이 형성된 영역 이외에 활성층이 형성되어 있다.In general, a blue LED has an N-type GaN layer formed on a sapphire substrate, an N-metal on one side of the surface of the N-type GaN layer, and an active layer other than the region where the N-metal is formed.

그리고, 상기 활성층 상에 P형 GaN 층이 형성되고, 상기 P형 GaN 층 상에 P-메탈이 형성되어져 있다. 상기 활성층은 P-메탈을 통하여 전송되어 오는 정공과 N 메탈을 통하여 전송해오는 전자가 결합하여 광을 발생시키는 층이다.A P-type GaN layer is formed on the active layer, and a P-metal is formed on the P-type GaN layer. The active layer is a layer that generates light by combining holes transmitted through P-metal and electrons transmitted through N metal.

상기와 같은 LED는 출력되는 광의 세기에 따라, 가정용 가전 제품, 전광판 등에 사용되는데, 특히, LED는 정보 통신 기기의 소형화, 슬림(slim)화 추세에 있고, 주변 기기인 저항, 콘덴서, 노이즈 필터 등도 더욱 소형화되고 있다.Such LEDs are used in home appliances, electronic displays, and the like according to the intensity of light output. In particular, LEDs are becoming smaller and slimmer in information and communication devices, and peripheral devices such as resistors, capacitors and noise filters are also used. It is becoming smaller.

따라서, PCB(Printed Circuit Board: 이하 PCB라고 함) 기판에 직접 장착하기 위해서 표면실장소자(Surface Mount Device: 이하, SMD라 함) 형으로 만들어지고 있다. 이에 따라 표시소자로 사용되고 있는 LED 램프도 SMD 형으로 개발되고 있다.Therefore, it is made of a surface mount device (hereinafter referred to as SMD) type for mounting directly on a PCB (Printed Circuit Board) substrate. Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type.

그러나, 종래 LED의 경우에는 발생되는 열에 의해 접촉되어 있는 부품에서의 열에 의한 변형이 일어나 LED 제품의 사용에 많은 제약을 받아왔다.However, in the case of the conventional LED, the deformation caused by the heat in the parts that are in contact with the heat generated has been limited to the use of the LED product.

이와 같은 열방출 문제를 해결하기 위해, 부가적인 장치로서 팬을 설치하여 방열기능을 갖는 경우가 있으나, 이와 같은 경우에는 방열을 위한 부가적인 장치를 더 설치함으로써 비경제적이라는 문제가 있었다.In order to solve the heat dissipation problem, there is a case in which a fan is installed as an additional device to have a heat dissipation function, but in this case, there is a problem that it is uneconomical by installing an additional device for heat dissipation.

상기 문제를 해결하고자, 본 발명에서는 메탈 PCB와 방열판 사이에 열경화제를 사용하여 상기 메탈 PCB와 방열판을 접합함으로써, 상기 사용된 열경화제에 의한 방열효과에 의해 종래의 LED제품에 비해 10℃ 정도의 온도 낮춤 효과를 가질 수 있는 친환경 LED 기판 열방지용 메탈 PCB 제조방법을 제공하는 것을 발명의 목적으로 한다.In order to solve the above problems, in the present invention, by bonding the metal PCB and the heat sink using a heat curing agent between the metal PCB and the heat sink, by the heat radiation effect of the used heat curing agent of about 10 ℃ compared to conventional LED products It is an object of the present invention to provide a method for manufacturing an environmentally friendly LED substrate heat-resistant metal PCB that can have a temperature lowering effect.

상기 목적을 달성하고자, To achieve the above object,

본 발명은 열경화제와 액상실리콘의 혼합으로 조성된 방열실리콘을 메탈 PCB의 면에 실크스크린 공정에 의해 도포함으로써 열전달접착층을 형성하는 실리콘도포단계와,The present invention is a silicone coating step of forming a heat transfer adhesive layer by applying a heat-dissipating silicone composition formed by mixing a thermosetting agent and liquid silicone to the surface of the metal PCB by a silk screen process,

상기 실리콘도포단계의 열전달접착층 상부로 방열판을 접착시켜 메탈 PCB와 방열판을 일체화시키는 방열판부가단계와,A heat sink attaching step of integrating the heat sink to the heat transfer adhesive layer of the silicon coating step to integrate the metal PCB and the heat sink;

상기 방열판부가단계의 열전달접착층으로 100 ~ 120℃의 열을 30 ~ 50분 동안 가하여 액상실리콘을 경화시키는 열경화단계를 거쳐 이루어지는 친환경 LED 기판 열방지용 메탈 PCB 제조방법을 주요 기술적 구성으로 한다.The main technical configuration of the method of manufacturing an environmentally friendly LED substrate heat prevention metal PCB made through a heat curing step of curing the liquid silicon by applying heat of 100 ~ 120 ℃ for 30 ~ 50 minutes to the heat transfer adhesive layer of the heat sink.

그리고, 상기 방열실리콘은 액상실리콘과 열경화제를 1:1 중량비율로 혼합ㅎ여 조성된 것으로, 상기 열경화제는 열경화제는 표면특성이 친수성이며 피표면적 200 ㎡/g, 평균입자크기가 12nm인 나도 흄드 실리카 10 ~ 30wt%와, 폴리실록산(polysiloxane) 1 ~ 10wt%와, 구리분말 60 ~ 80wt%의 혼합으로 조성된 것임을 특징으로 한다.In addition, the heat dissipating silicon is a liquid silicone and a thermosetting agent is mixed by a 1: 1 weight ratio, the thermosetting agent is a thermosetting surface of the hydrophilic properties of the surface characteristics of 200 ㎡ / g, the average particle size of 12nm I also characterized in that it is composed of a mixture of fumed silica 10 ~ 30wt%, polysiloxane 1 ~ 10wt%, and copper powder 60 ~ 80wt%.

또한, 상기 구리분말은 물(H2O) 30 ~ 40wt%에 황산구리(CuSO4·5H2O) 20 ~ 30wt%를 녹인 후, 28% 암모니아수(NH4OH) 15 ~ 25wt%를 첨가하고, 여기에 환원제인 아스코르브산(Ascorbic Acid) 15 ~ 30wt%를 첨가하여 황산구리(CuSO4·5H2O)를 Cu로 환원시켜 제조된 것으로, 0.3 ~ 10㎛의 입도분포를 가지는 구형의 입자임을 특징으로 한다.In addition, the copper powder was dissolved 20-30 wt% of copper sulfate (CuSO 4 · 5H 2 O) in 30-40 wt% of water (H 2 O), and then 15-25 wt% of 28% aqueous ammonia (NH 4 OH) was added thereto. 15 to 30 wt% of ascorbic acid as a reducing agent was added thereto to reduce copper sulfate (CuSO 4 · 5H 2 O) to Cu, and characterized in that it is a spherical particle having a particle size distribution of 0.3 to 10 μm. do.

이상에서 살펴본 바와 같이, 본 발명의 제조방법에 의해 제조된 LED 기판 열방지용 메탈 PCB는 구리분말을 함유하여 열전달효과를 높일 수 있는 열경화제를 사용하여 메탈 PCB와 방열판을 접합함으로써, LED 기판에서 발생된 열이 방열판을 통해 쉽게 외부로 빠져나감으로써 종래의 LED 기판에서 발생되던 열을 10℃ 정도로 낮춤으로써, 열에 의해 사용수명이 민감하게 결정되는 LED 사용수명을 연장할 수 있는 LED 기판 열방지용 메탈 PCB를 제공하는 효과를 갖는다.As described above, the LED substrate heat-prevention metal PCB produced by the manufacturing method of the present invention by using a heat curing agent that can increase the heat transfer effect by containing a copper powder, it is generated in the LED substrate by bonding the metal PCB and the heat sink LED board heat-resistant metal PCB that extends the service life of the LED, which is determined to be sensitive to the service life by heat by lowering the heat generated from the conventional LED substrate by about 10 ° C by easily draining the heat to the outside through the heat sink easily. Has the effect of providing.

이하, 상기의 기술적 구성에 대한 구체적인 내용을 도면과 함께 살펴보고자 한다.Hereinafter, a detailed description of the technical configuration will be described with reference to the accompanying drawings.

본 발명의 친환경 LED 기판 열방지용 메탈 PCB는 도 1 및 도 2에 도시된 바와 같이, 메탈 PCB(10)의 방열판과의 접착면에 방열실리콘을 도포하여 열전달접착층(20)을 형성하고, 이와 같이 형성된 열전달접착층(20) 상부로 방열판(30)을 접착시킴으로써, 메탈 PCB(10)와 방열판(30)이 접착에 의해 일체화된 구조를 갖는 방열기능의 메탈 PCB를 제공하게 된다.As shown in FIGS. 1 and 2, the eco-friendly LED substrate thermally preventive metal PCB of the present invention forms a heat transfer adhesive layer 20 by applying a heat dissipating silicon to an adhesive surface with a heat sink of the metal PCB 10. By adhering the heat dissipation plate 30 to the formed heat transfer adhesive layer 20, the metal PCB 10 and the heat dissipation plate 30 are provided to provide a heat dissipation metal PCB having a structure integrated by adhesion.

본 발명에서는 상기 열전달접착층(20)을 이루고 있는 구성이 중요하게 작용하며, 이는 LED 기판에서 발생한 열이 메탈 PCB(10)를 거쳐 열전달접착층(20)으로 전달되고, 다시 방열판(30)에 전달되어 방열되기 때문인 것으로, 상기 열전달접착층(20)의 열전달기능이 떨어진다면 전체적인 방열효과는 떨어지게 되며, 방열판(30)을 설치하더라도 큰 방열효과를 기대하기가 어렵다. 따라서, 상기 열전달접착층(20)은 열전달 기능과 메탈 PCB(10)와 방열판(30)의 접착력을 강하게 유지할 수 있는 기능성이 부여되어야 한다.In the present invention, the configuration constituting the heat transfer adhesive layer 20 plays an important role, and heat generated from the LED substrate is transferred to the heat transfer adhesive layer 20 via the metal PCB 10, and then transferred to the heat sink 30 again. This is because the heat dissipation, if the heat transfer function of the heat transfer adhesive layer 20 falls, the overall heat dissipation effect is reduced, even if the heat sink 30 is difficult to expect a large heat dissipation effect. Therefore, the heat transfer adhesive layer 20 should be given a heat transfer function and a function capable of strongly maintaining the adhesion between the metal PCB 10 and the heat sink 30.

상기 열전달접착층(20)은 열경화제을 함유하고 있는 액상실리콘이며, 열경화 제와 액상실리콘은 1:1의 중량비율로 혼합된다. 상기 열경화제는 열전달접착층(20)에서 중요한 기능을 갖게 되며, 열경화제를 통한 열경화성질과 열전달기능을 함께 갖을 수 있도록 구성되어야 한다.The heat transfer adhesive layer 20 is a liquid silicone containing a thermosetting agent, and the thermosetting agent and the liquid silicone are mixed in a weight ratio of 1: 1. The thermosetting agent has an important function in the heat transfer adhesive layer 20, and should be configured to have both a thermosetting property and a heat transfer function through the thermosetting agent.

상기 열경화제는 표면특성이 친수성이며 피표면적 200 ㎡/g, 평균입자크기가 12nm인 나도 흄드 실리카 10 ~ 30wt%와, 폴리실록산(polysiloxane) 1 ~ 10wt%와, 구리분말 60 ~ 80wt%의 혼합으로 조성된 것을 사용하며, 더욱 구체적으로는 나도 흄드 실리카 15wt%, 폴리실록산(polysiloxane) 5wt%, 구리분말 80wt%의 혼합으로 조성한다.The thermosetting agent is a hydrophilic surface property of 200 m 2 / g, surface area 200 m 2 / g, average particle size of 12 nm Nado fumed silica 10 ~ 30wt%, polysiloxane (polysiloxane) 1 ~ 10wt%, copper powder 60 ~ 80wt% by mixing The composition is used, and more specifically, I also prepare a mixture of fumed silica 15 wt%, polysiloxane 5 wt%, and copper powder 80 wt%.

상기 실리카는 적정양을 사용하게 되면 열전달접착층(20)의 내구성을 증진시키며, 열전달접착층의 흐름성에 관여하여 접착성을 보강하는 기능을 갖게 되는 것으로, 열경화제 전체 중량에 대해 10wt% 미만으로 사용하게 되는 경우에는 열전달접착층(20)의 내구성이 떨어지게 되고, 30wt%를 초과하여 사용하게 되는 경우에는 접착력이 떨어질 수 있으므로 상기 실리카는 열경화제 전체 중량에 대해 10 ~ 30wt%의 범위 내에서 사용하는 것이 바람직하다.The silica increases the durability of the heat transfer adhesive layer 20 when the appropriate amount is used, and has a function of reinforcing adhesiveness by being involved in the flowability of the heat transfer adhesive layer, so that the silica may be used at less than 10 wt% based on the total weight of the heat curing agent. When the durability of the heat transfer adhesive layer 20 is lowered, and when used in excess of 30wt%, the adhesive force may fall, so the silica is preferably used within the range of 10 to 30wt% with respect to the total weight of the thermosetting agent. Do.

상기 폴리실록산(polysiloxane)은 유동성을 부여하는 것으로, 열경화제 전체 중량에 대해 1wt% 미만으로 사용하게 되는 경우에는 유동성이 떨어지며, 10wt%를 초과하여 사용하게 되는 경우에는 열전도율이 떨어져 방열기능이 떨어질 수 있으므로, 상기 실록산은 열경화제 전체 중량에 대해 1 ~ 10wt%의 범위 내에서 사용하는 것이 바람직하다.The polysiloxane is to impart fluidity, and when used in less than 1wt% with respect to the total weight of the thermosetting agent, the fluidity is inferior, and when used in excess of 10wt%, the thermal conductivity is lowered, so that the heat dissipation may deteriorate. , The siloxane is preferably used in the range of 1 to 10wt% based on the total weight of the thermosetting agent.

상기 구리분말은 상기 열전달접착층(20)에 함유되어 열전달에 의한 방열기능을 높이는 기능을 갖는 것으로서 분말 형태에 의한 분산된 형태를 유지하는 것이 바람직하다. 상기 구리분말은 열경화제 전체 중량에 대해 60wt% 미만으로 사용하게 되는 경우에는 메탈 PCB의 방열기능의 큰 향상을 기대하기 어렵고, 80wt%를 초과하여 사용하게 되는 경우에는 열전달접착층(20)의 경화 또는 접착성의 문제가 일어날 수 있기 때문에, 상기 구리분말은 열경화제 전체 중량에 대해 60 ~ 80wt%의 범위 내에서 사용하는 것이 바람직하다.The copper powder is contained in the heat transfer adhesive layer 20 and has a function of enhancing a heat dissipation function by heat transfer, and preferably maintains a dispersed form in powder form. When the copper powder is used at less than 60wt% of the total weight of the thermosetting agent, it is difficult to expect a large improvement in the heat dissipation function of the metal PCB, and when the copper powder is used in excess of 80wt%, the hardening of the heat transfer adhesive layer 20 or Since the problem of adhesion may occur, it is preferable to use the copper powder in the range of 60 to 80wt% with respect to the total weight of the thermosetting agent.

상기 열경화제의 구체적인 예를 실시 예를 통해 살펴보고자 한다.Specific examples of the thermosetting agent will be described through examples.

실시 예 1: 열경화제의 제조Example 1 Preparation of Thermosetting Agent

[ 구리분말 제조 ][Copper Powder Manufacturing]

구리분말의 제조는 먼저, 물(H2O) 290㎖에 황산구리(CuSO4·5H2O) 0.8mol을 녹여 과포화수용액을 만든다. 다음으로, 상기 과포화수용액에 28% 암모니아수(NH4OH) 200㎖를 첨가하고, 여기에 환원제인 아스코르브산(Ascorbic Acid) 1.20 mol을 첨가하여 황산구리(CuSO4·5H2O)를 Cu로 환원시켜 구리분말을 제조한다.Copper powder is first prepared by dissolving 0.8 mol of copper sulfate (CuSO 4 · 5H 2 O) in 290 ml of water (H 2 O) to form a supersaturated aqueous solution. Next, 200 ml of 28% aqueous ammonia (NH 4 OH) was added to the supersaturated aqueous solution, 1.20 mol of ascorbic acid as a reducing agent was added thereto, and copper sulfate (CuSO 4 · 5H 2 O) was reduced to Cu. Copper powder is prepared.

[ 열경화제의 제조 ][Production of thermosetting agent]

열경화제의 제조는 상기 제조된 구리분말을 이용하여 제조되는 것으로,The thermosetting agent is prepared using the copper powder prepared above,

피표면적 200 ㎡/g, 평균입자크기가 12nm인 나도 흄드 실리카 15g과, 폴리실록산(polysiloxane) 5g과, 상기 제조된 구리분말 80g을 혼합하여 제조한다. It is prepared by mixing 15 g of Nado fumed silica, a surface area of 200 m 2 / g and an average particle size of 12 nm, 5 g of polysiloxane, and 80 g of the copper powder prepared above.

실시 예 2 : 방열실리콘의 제조Example 2 Preparation of Heat Dissipation Silicon

본 발명에 따른 방열실리콘은 액상실리콘 50g과 상기 실시 예 1에서 제조된 열경화제 50g을 혼합하여 제조한다.The heat dissipating silicon according to the present invention is prepared by mixing 50 g of the liquid silicone and 50 g of the thermosetting agent prepared in Example 1.

다음으로는 방열실리콘을 이용하여 이루어지는 방열기능의 메탈 PCB의 구성과정을 구체적으로 살펴보면 다음의 실시 예 3과 같다.Next, the configuration process of the metal PCB of the heat dissipation function made using the heat dissipation silicon in detail as shown in Example 3.

실시 예 3 : 열방지용 메탈 PCBExample 3 Thermal PCB

본 발명에 따른 열방지용 메탈 PCB(10)의 제조는 상기 실시 예 2에서 제조된 방열실리콘을 실크스크린 도포방법에 의해 15㎛의 두께로 도포하여 열전달접착층(20)을 구성한다. 다음으로, 상기 열전달접착층(20)의 상부로 방열판(30)을 접착 시켜 메탈 PCB(10)와 방열판(30)을 일치시킨다.In the manufacturing of the thermally-resistant metal PCB 10 according to the present invention, the heat-dissipating silicon prepared in Example 2 is applied to a thickness of 15 μm by a silk screen coating method to form a heat transfer adhesive layer 20. Next, the heat sink 30 is bonded to the upper portion of the heat transfer adhesive layer 20 to match the metal PCB 10 and the heat sink 30.

이와 같이 열전달접착층(20)을 매개로 하여 메탈 PCB(10)와 방열판(30)을 일치시킨 후에는 완전한 접착을 이루기 위하여, 상기 열전달접착층(20)으로 열을 강하여 열전달접착층(20)이 경화되도록 한다. 상기 열에 의한 경화는 100℃의 열을 30분 동안 가함으로써 이루어진다.As such, after the metal PCB 10 and the heat sink 30 are matched with each other through the heat transfer adhesive layer 20, the heat transfer adhesive layer 20 is hardened by hardening the heat with the heat transfer adhesive layer 20 to achieve perfect adhesion. do. The heat curing is achieved by applying heat at 100 ° C. for 30 minutes.

제 1도는 본 발명에 따른 친환경 LED 기판 열방지용 메탈 PCB의 결합관계를 보인 단면도.1 is a cross-sectional view showing a coupling relationship of the environmentally friendly LED substrate thermal barrier metal PCB according to the present invention.

제 2도는 본 발명에 따른 친환경 LED 기판 열방지용 메탈 PCB의 결합관계를 보인 사시도.2 is a perspective view showing a coupling relationship of the environmentally friendly LED substrate thermal prevention metal PCB according to the present invention.

* 도면의 주요부분에 대한 부호 설명 *Explanation of symbols on the main parts of the drawings

10: 메탈 PCB10: metal PCB

20: 열전달접착층20: heat transfer adhesive layer

30: 방열판30: heat sink

Claims (5)

열경화제와 액상실리콘의 혼합으로 조성된 방열실리콘을 메탈 PCB(10)의 면에 실크스크린 공정에 의해 도포함으로써 열전달접착층(20)을 형성하는 실리콘도포단계와,A silicon coating step of forming a heat transfer adhesive layer 20 by applying a heat dissipating silicon formed by mixing a thermosetting agent and liquid silicon to the surface of the metal PCB 10 by a silk screen process; 상기 실리콘도포단계의 열전달접착층(20) 상부로 방열판(30)을 접착시켜 메탈 PCB(10)와 방열판(30)을 일체화시키는 방열판부가단계와,A heat sink addition step of integrating the heat sink 30 to the heat transfer adhesive layer 20 of the silicon coating step to integrate the metal PCB 10 and the heat sink 30; 상기 방열판부가단계의 열전달접착층(20)으로 100 ~ 120℃의 열을 30 ~ 50분 동안 가하여 액상실리콘을 경화시키는 열경화단계를 거쳐 이루어지는 것에 있어서,In the heat dissipation plate is added to the heat transfer adhesive layer 20 of the step of 100 to 120 ℃ heat for 30 to 50 minutes to undergo a heat curing step of curing the liquid silicone, 상기 열경화제는 표면특성이 친수성이며 피표면적 200 ㎡/g, 평균입자크기가 12nm인 나도 흄드 실리카 10 ~ 30wt%와,The thermosetting agent has a hydrophilic surface property of 10 ~ 30wt% Nado fumed silica having a surface area of 200 m 2 / g, an average particle size of 12nm, 폴리실록산(polysiloxane) 1 ~ 10wt%와,1 to 10 wt% of polysiloxane, 구리분말 60 ~ 80wt%의 혼합으로 조성된 것임을 특징으로 하는 친환경 LED 기판 열방지용 메탈 PCB 제조방법.Eco-friendly LED substrate heat prevention metal PCB manufacturing method, characterized in that the composition is composed of a mixture of 60 ~ 80wt% copper powder. 삭제delete 청구항 1에 있어서,The method according to claim 1, 구리분말은 물(H2O) 30 ~ 40wt%에 황산구리(CuSO4·5H2O) 20 ~ 30wt%를 녹인 후, 28%암모니아수(NH4OH) 15 ~ 25wt%를 첨가하고, 여기에 환원제인 아스코르브산(Ascorbic Acid) 15 ~ 30wt%를 첨가하여 황산구리(CuSO4·5H2O)를 Cu로 환원시켜 제조된 것임을 특징으로 하는 친환경 LED 기판 열방지용 메탈 PCB 제조방법.Copper powder was dissolved in 20-30 wt% of copper sulfate (CuSO 4 · 5H 2 O) in 30-40 wt% of water (H 2 O), and 15-25 wt% of 28% ammonia water (NH 4 OH) was added thereto. A method for manufacturing an environmentally friendly LED PCB for preventing heat of an eco-friendly LED substrate, characterized in that it is prepared by reducing copper sulfate (CuSO 4 · 5H 2 O) to Cu by adding 15 to 30 wt% of ascorbic acid. 청구항 1 또는 3항에 있어서,The method according to claim 1 or 3, 구리분말은 0.3 ~ 10㎛의 입도분포를 가지는 구형의 입자임을 특징으로 하는 친환경 LED 기판 열방지용 메탈 PCB 제조방법.Copper powder is a spherical particle having a particle size distribution of 0.3 ~ 10㎛ eco-friendly LED substrate heat treatment metal PCB manufacturing method. 삭제delete
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